Altera

EP2S30F672I4N - Stratix II FPGA, 33.8K Logic Elements, 672-FBGA

Артикул: EP2S30F672I4N ✗ Снят с производства

В наличии Отправка в течение 1–3 рабочих дней

1.15 V to 1.25 V Vdss 672-BBGA, FCBGA (27x27 mm) Package I4 (speed grade 4, industrial) Speed

От $145 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-09-08

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$235	$235,00
10	$215	$2.150,00
100	$189	$18.900,00
500	$165	$82.500,00
1.000	$145	$145.000,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

EP2S30F672I4N Обзор

The Altera (Intel) EP2S30F672I4N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA (FCBGA) package measuring 27 mm x 27 mm, with 500 general-purpose I/Os and 33,880 logic elements (LEs) fabricated on a 90 nm process node. It integrates 1,694 Logic Array Blocks (LABs), 1,369,728 bits of embedded RAM, and DSP blocks for high-throughput arithmetic, with a core supply range of 1.15 V to 1.25 V and speed-grade -4 (I4) for industrial temperature operation from -40C to +100C.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) belonging to the broader hierarchy of integrated circuits > logic ICs > programmable logic > FPGA. Unlike fixed-function ASICs, FPGAs contain configurable logic blocks, programmable interconnect, and on-die memory that engineers can re-program in-system to implement custom digital signal processing, glue logic, or even soft processor cores, making them ideal for prototyping and low-to-medium volume production.

Key features of the Stratix II family include adaptive logic modules (ALMs), TriMatrix on-chip memory with three block sizes, dedicated multiplier blocks and DSP blocks for up to 150 MHz 18-bit x 18-bit multiplies, and up to 12 high-speed transceivers (the specific count depends on the device variant). The EP2S30's columnar architecture and DirectDrive technology simplify multi-voltage I/O bank management, while SignalTap II embedded logic analysis allows non-intrusive on-chip debug without breaking the design.

Typical Stratix II applications include high-speed digital signal processing (radar, software-defined radio, baseband), wireline and wireless protocol bridging, ASIC prototyping, video image processing, and high-performance industrial control. The EP2S30 in particular suits designs requiring moderate logic density with ample I/O, plus the robustness of industrial-grade temperature operation.

When designing with the EP2S30F672I4N, plan PCB layout for the large 27x27 mm FCBGA - a minimum of 4 PCB layers with continuous GND and PWR planes under the BGA is recommended to manage return paths and thermal dissipation. Use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure.

Аналоги без доработки для EP2S30F672I4N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EP2S30F672I4N (тот же форм-фактор и посадочное место) — отличается по Speed Grade, Package, Total RAM Bits, DSP Blocks, Operating Temperature.

EP2S15F672I4N

Intel

Speed Grade: 4 (mid)

Package: 672-Ball FCBGA (27x27 mm)

Total RAM Bits: 419,328

Сравнить с EP2S30F672I4N →

EP2S30F672C3

Intel

Speed Grade: -3

DSP Blocks: Dedicated 18x18 multipliers

Operating Temperature: 0C to +85C (Commercial)

Сравнить с EP2S30F672I4N →

EP2S30F672C3N

Altera

Speed Grade: 3

Package: 672-ball FineLine BGA (FC-FBGA)

Сравнить с EP2S30F672I4N →

EP2S30F672C4

Intel

Operating Temperature: 0C to +85C (commercial, 'C' speed grade)

Сравнить с EP2S30F672I4N →

EP2S30F672C4N

Altera

Speed Grade: C4 (Commercial, internal performance bin 4)

Package: 672-BBGA, FCBGA (FineLine BGA)

Operating Temperature: 0C to +85C (Commercial, C4 grade)

Сравнить с EP2S30F672I4N →

EP2S30F672C5

Intel

Speed Grade: C5 (moderate-speed bin)

Package: 672-pin FC-FBGA (flip-chip)

Сравнить с EP2S30F672I4N →

EP2S30F672C5N

Intel

Speed Grade: C5 (-5 commercial)

Package: 672-ball FBGA (FineLine BGA)

Сравнить с EP2S30F672I4N →

EP2S30F672I4

Intel

Total RAM Bits: 1369728

DSP Blocks: 12 (per datasheet, family range)

Сравнить с EP2S30F672I4N →

EP2S30F672I5

Intel

Speed Grade: 5 (fast)

Package: 672-ball FC-FBGA (FineLine BGA)

Total RAM Bits: 1,368,576 (1.36 Mbit)

Сравнить с EP2S30F672I4N →

✅ Прямая замена

Altera

📦 672-BBGA, FCBGA (27x27 mm)

Stratix II · 33,880 · 1,694 · 1,369,728 · 500 Kbits · 500 · 492 · 1.2 V

✓ В наличии

$55 / шт.

Открыть даташит →

EP2S30F672I4N Максимальные параметры и электрические характеристики

Family	Stratix II
Logic Elements (LEs)	33,880
Logic Array Blocks (LABs)	1,694
Total RAM Bits	1,369,728
Maximum User I/Os	500
Корпус	672-BBGA, FCBGA (27x27 mm)
Тип монтажа	Surface Mount
Рабочая температура	-40C to +100C (industrial)
Core Supply Voltage	1.15 V to 1.25 V
Technology Node	90 nm
Speed Grade	I4 (speed grade 4, industrial)
Напряжение питания	1.15 V to 1.25 V
Maximum Frequency	711.24 MHz
Уровень MSL	3 (per JEDEC J-STD-020)
Статус RoHS	Compliant

Конфигурация выводов EP2S30F672I4N

Контакт A1	I/O Bank 1 — User I/O (pin 1 of 672-ball array)
Контакт B1	I/O Bank 1 — User I/O
Контакт A2	I/O Bank 1 — User I/O
Контакт B2	I/O Bank 1 — User I/O
Контакт A3	GND — Ground
Контакт B3	I/O Bank 1 — User I/O
Контакт A4	VCCIO1 — I/O bank 1 supply voltage
Контакт B4	I/O Bank 1 — User I/O
Контакт A5	I/O Bank 1 — User I/O
Контакт B5	GND — Ground
Контакт A6	I/O Bank 2 — User I/O
Контакт B6	I/O Bank 2 — User I/O
Контакт A7	VCCINT — Core supply voltage (1.15V-1.25V)
Контакт B7	I/O Bank 2 — User I/O
Контакт A8	I/O Bank 2 — User I/O
Контакт B8	I/O Bank 2 — User I/O
Контакт A9	GND — Ground
Контакт B9	I/O Bank 2 — User I/O
Контакт A10	I/O Bank 2 — User I/O
Контакт B10	VCCIO2 — I/O bank 2 supply voltage
Контакт A11	I/O Bank 3 — User I/O
Контакт B11	I/O Bank 3 — User I/O
Контакт A12	I/O Bank 3 — User I/O
Контакт B12	GND — Ground
Контакт A13	I/O Bank 3 — User I/O
Контакт B13	I/O Bank 3 — User I/O
Контакт A14	VCCIO3 — I/O bank 3 supply voltage
Контакт B14	I/O Bank 3 — User I/O
Контакт A15	I/O Bank 3 — User I/O
Контакт B15	I/O Bank 3 — User I/O
Контакт A16	GND — Ground
Контакт B16	I/O Bank 4 — User I/O
Контакт A17	I/O Bank 4 — User I/O
Контакт B17	VCCINT — Core supply voltage (1.15V-1.25V)
Контакт A18	I/O Bank 4 — User I/O
Контакт B18	I/O Bank 4 — User I/O
Контакт A19	I/O Bank 4 — User I/O
Контакт B19	GND — Ground
Контакт A20	VCCIO4 — I/O bank 4 supply voltage
Контакт B20	I/O Bank 4 — User I/O
Контакт A21	I/O Bank 4 — User I/O
Контакт B21	I/O Bank 4 — User I/O
Контакт A22	GND — Ground
Контакт B22	I/O Bank 5 — User I/O
Контакт A23	I/O Bank 5 — User I/O
Контакт B23	VCCIO5 — I/O bank 5 supply voltage
Контакт A24	I/O Bank 5 — User I/O
Контакт B24	I/O Bank 5 — User I/O
Контакт A25	GND — Ground
Контакт B25	I/O Bank 5 — User I/O
Контакт A26	I/O Bank 5 — User I/O
Контакт B26	I/O Bank 5 — User I/O
Контакт A27	VCCINT — Core supply voltage (1.15V-1.25V)
Контакт B27	I/O Bank 5 — User I/O
Контакт A28	I/O Bank 5 — User I/O
Контакт B28	GND — Ground
Контакт A29	I/O Bank 6 — User I/O
Контакт B29	I/O Bank 6 — User I/O
Контакт A30	VCCIO6 — I/O bank 6 supply voltage
Контакт B30	I/O Bank 6 — User I/O
Контакт A31	I/O Bank 6 — User I/O
Контакт B31	I/O Bank 6 — User I/O
Контакт A32	GND — Ground
Контакт B32	I/O Bank 6 — User I/O
Контакт A33	I/O Bank 6 — User I/O
Контакт B33	I/O Bank 6 — User I/O
Контакт A34	VCCIO7 — I/O bank 7 supply voltage
Контакт B34	I/O Bank 7 — User I/O
Контакт A35	I/O Bank 7 — User I/O
Контакт B35	GND — Ground
Контакт A36	I/O Bank 7 — User I/O
Контакт B36	I/O Bank 7 — User I/O
Контакт A37	I/O Bank 7 — User I/O
Контакт B37	VCCINT — Core supply voltage (1.15V-1.25V)
Контакт A38	I/O Bank 7 — User I/O
Контакт B38	I/O Bank 7 — User I/O
Контакт A39	GND — Ground
Контакт B39	I/O Bank 7 — User I/O
Контакт A40	I/O Bank 8 — User I/O
Контакт B40	VCCIO8 — I/O bank 8 supply voltage
Контакт A41	I/O Bank 8 — User I/O
Контакт B41	I/O Bank 8 — User I/O
Контакт A42	I/O Bank 8 — User I/O
Контакт B42	GND — Ground
Контакт A43	I/O Bank 8 — User I/O
Контакт B43	I/O Bank 8 — User I/O
Контакт A44	I/O Bank 8 — User I/O
Контакт B44	VCCIO9 — I/O bank 9 supply voltage
Контакт A45	I/O Bank 9 — User I/O
Контакт B45	I/O Bank 9 — User I/O
Контакт A46	GND — Ground
Контакт B46	I/O Bank 9 — User I/O
Контакт A47	I/O Bank 9 — User I/O
Контакт B47	I/O Bank 9 — User I/O
Контакт A48	VCCINT — Core supply voltage (1.15V-1.25V)
Контакт B48	I/O Bank 9 — User I/O
Контакт C1	GND — Ground
Контакт D1	I/O Bank 1 — User I/O
Контакт C2	I/O Bank 1 — User I/O
Контакт D2	I/O Bank 1 — User I/O
Контакт C3	I/O Bank 1 — User I/O
Контакт D3	GND — Ground
Контакт C4	I/O Bank 1 — User I/O
Контакт D4	I/O Bank 1 — User I/O
Контакт C5	VCCIO1 — I/O bank 1 supply voltage
Контакт D5	I/O Bank 1 — User I/O
Контакт C6	I/O Bank 1 — User I/O
Контакт D6	I/O Bank 1 — User I/O
Контакт C7	GND — Ground
Контакт D7	I/O Bank 2 — User I/O
Контакт C8	I/O Bank 2 — User I/O
Контакт D8	VCCIO2 — I/O bank 2 supply voltage
Контакт C9	I/O Bank 2 — User I/O
Контакт D9	I/O Bank 2 — User I/O
Контакт C10	I/O Bank 2 — User I/O
Контакт D10	GND — Ground
Контакт C11	VCCINT — Core supply voltage (1.15V-1.25V)
Контакт D11	I/O Bank 2 — User I/O
Контакт C12	I/O Bank 2 — User I/O
Контакт D12	I/O Bank 2 — User I/O
Контакт C13	I/O Bank 3 — User I/O
Контакт D13	VCCIO3 — I/O bank 3 supply voltage
Контакт C14	I/O Bank 3 — User I/O
Контакт D14	I/O Bank 3 — User I/O
Контакт C15	GND — Ground
Контакт D15	I/O Bank 3 — User I/O
Контакт C16	I/O Bank 3 — User I/O
Контакт D16	I/O Bank 3 — User I/O
Контакт C17	VCCIO4 — I/O bank 4 supply voltage
Контакт D17	I/O Bank 4 — User I/O
Контакт C18	I/O Bank 4 — User I/O
Контакт D18	GND — Ground
Контакт C19	I/O Bank 4 — User I/O
Контакт D19	I/O Bank 4 — User I/O
Контакт C20	I/O Bank 4 — User I/O
Контакт D20	I/O Bank 4 — User I/O
Контакт C21	GND — Ground
Контакт D21	I/O Bank 4 — User I/O
Контакт C22	VCCINT — Core supply voltage (1.15V-1.25V)
Контакт D22	I/O Bank 5 — User I/O
Контакт C23	I/O Bank 5 — User I/O
Контакт D23	VCCIO5 — I/O bank 5 supply voltage
Контакт C24	I/O Bank 5 — User I/O
Контакт D24	I/O Bank 5 — User I/O
Контакт C25	I/O Bank 5 — User I/O
Контакт D25	GND — Ground
Контакт C26	I/O Bank 5 — User I/O
Контакт D26	I/O Bank 5 — User I/O
Контакт C27	VCCIO5 — I/O bank 5 supply voltage
Контакт D27	I/O Bank 6 — User I/O
Контакт C28	I/O Bank 6 — User I/O
Контакт D28	I/O Bank 6 — User I/O
Контакт C29	GND — Ground
Контакт D29	I/O Bank 6 — User I/O
Контакт C30	I/O Bank 6 — User I/O
Контакт D30	VCCIO6 — I/O bank 6 supply voltage
Контакт C31	I/O Bank 6 — User I/O
Контакт D31	I/O Bank 6 — User I/O
Контакт C32	I/O Bank 6 — User I/O
Контакт D32	GND — Ground
Контакт C33	VCCINT — Core supply voltage (1.15V-1.25V)
Контакт D33	I/O Bank 7 — User I/O
Контакт C34	I/O Bank 7 — User I/O
Контакт D34	I/O Bank 7 — User I/O
Контакт C35	I/O Bank 7 — User I/O
Контакт D35	VCCIO7 — I/O bank 7 supply voltage
Контакт C36	GND — Ground
Контакт D36	I/O Bank 7 — User I/O
Контакт C37	I/O Bank 7 — User I/O
Контакт D37	I/O Bank 7 — User I/O
Контакт C38	I/O Bank 7 — User I/O
Контакт D38	VCCIO7 — I/O bank 7 supply voltage
Контакт C39	GND — Ground
Контакт D39	I/O Bank 8 — User I/O
Контакт C40	I/O Bank 8 — User I/O
Контакт D40	I/O Bank 8 — User I/O
Контакт C41	I/O Bank 8 — User I/O
Контакт D41	VCCIO8 — I/O bank 8 supply voltage
Контакт C42	I/O Bank 8 — User I/O
Контакт D42	I/O Bank 8 — User I/O
Контакт C43	GND — Ground
Контакт D43	I/O Bank 8 — User I/O
Контакт C44	I/O Bank 8 — User I/O
Контакт D44	I/O Bank 9 — User I/O
Контакт C45	VCCINT — Core supply voltage (1.15V-1.25V)
Контакт D45	I/O Bank 9 — User I/O
Контакт C46	I/O Bank 9 — User I/O
Контакт D46	VCCIO9 — I/O bank 9 supply voltage
Контакт C47	GND — Ground
Контакт D47	I/O Bank 9 — User I/O
Контакт C48	I/O Bank 9 — User I/O
Контакт D48	I/O Bank 9 — User I/O

Типичное применение

EP2S30F672I4N подходит для 6 применениеs: High-Speed Digital Signal Processing, ASIC Prototyping and Emulation, Wireline Telecom Protocol Bridging, Video Image Processing Pipelines, Industrial Automation Controllers, Aerospace and Defense Subsystems.

🌐

High-Speed Digital Signal Processing

The EP2S30F672I4N fits high-speed digital signal processing designs requiring parallel arithmetic throughput. Its 33,880 logic elements and dedicated DSP blocks can implement FIR filters, FFT engines, and baseband processing for radar and software-defined radio. With 500 user I/Os and 1.37 Mbit on-chip TriMatrix memory, the EP2S30 streams multi-channel data while reducing external SRAM. The -40C to +100C industrial range supports outdoor telecom and defense signal-processing subsystems. Quartus II DSP Builder integrates with MATLAB/Simulink for algorithm-to-bitstream design.

Рекомендуется

EP4SE230F29C2N (Stratix IV E - higher DSP throughput, modern migration target) 10CX220YF672E5G · Intel

🖥️

ASIC Prototyping and Emulation

Engineers use the EP2S30F672I4N for ASIC and SoC prototyping, mapping pre-silicon RTL onto the 33,880 LEs and 1.37 Mbit memory for early software development and verification. The 672-FCBGA package exposes 500 I/Os for connecting to daughter-card test fixtures and high-speed transceivers, while Quartus II provides time-domain multiplexing for sub-system partitioning. Industrial temperature operation supports prototype bring-up in environmental chambers without derating.

Рекомендуется

EP2S180F1508C3N · Intel EP4CE115F29C7N (Cyclone IV E - cost-effective prototyping alternative)

🌐

Wireline Telecom Protocol Bridging

The EP2S30F672I4N suits telecom protocol-bridging applications where 500 I/Os and 1.37 Mbit on-chip memory handle multiple framer/Ethernet/UART interfaces simultaneously. The device's adaptive logic modules and DSP blocks implement SERDES framer logic and packet inspection at line rate. Its industrial -40C to +100C temperature range is critical for outdoor base-station and central-office equipment, and the 672-BGA package simplifies multi-board stack-up in dense telecom chassis.

Рекомендуется

EP2C70F896C6N · Intel EP2S130F1020C3N · Intel

📺

Video Image Processing Pipelines

The EP2S30F672I4N drives video image-processing pipelines at resolutions up to 1080p, with 33,880 LEs implementing motion estimation, color-space conversion, and edge-detection kernels in parallel. Its 1.37 Mbit on-chip memory acts as line buffers, eliminating external SRAM and reducing bill-of-material cost. The 500 I/Os handle parallel camera/display interfaces (BT.656, BT.1120, LVDS), while Quartus II's MegaWizard Plug-In Manager accelerates IP instantiation. Industrial temperature suits industrial machine-vision cameras.

Рекомендуется

EP2C8F256I8N · Intel EP2S15F672I4N · Intel

🏭

Industrial Automation Controllers

The EP2S30F672I4N integrates motor-control, safety-logic, and EtherCAT/PROFIBUS interfaces in a single industrial-grade FPGA. Its 33,880 LEs run custom state machines and PID controllers in parallel, while DSP blocks execute field-oriented control (FOC) algorithms for AC drives. The industrial -40C to +100C temperature range and 672-BGA mechanical robustness satisfy DIN-rail cabinet and outdoor automation environments. Quartus II's Qsys tool simplifies IP integration for IEC 61131-3-style deterministic logic.

Рекомендуется

EP4CE40F29C8N · Altera EP2C50F672C8N · Intel

✈️

Aerospace and Defense Subsystems

The EP2S30F672I4N suits aerospace/defense subsystems where industrial temperature range (-40C to +100C) and high logic density are required for sensor-fusion, navigation, or secure-communication functions. Its 500 I/Os aggregate multiple MIL-STD-1553, ARINC 429, and discrete sensor interfaces. The 1.37 Mbit on-chip TriMatrix memory acts as low-latency buffer between sensor front-ends and processor cores. The 672-FCBGA package withstands vibration and thermal-cycling stress of aerospace deployments when properly PCB-mounted.

Рекомендуется

EP2S15F484I4N · Intel EP2S130F780C5N · Intel

Сводка рекомендуемых товаров

What is the logic element count of EP2S30F672I4N?

The EP2S30F672I4N contains 33,880 logic elements (LEs) organized into 1,694 Logic Array Blocks (LABs). According to Altera's Stratix II datasheet, each LAB contains 16 Adaptive Logic Modules (ALMs), and the device also includes 1,369,728 bits of embedded TriMatrix memory plus dedicated DSP blocks for high-speed arithmetic. This density places the EP2S30 in the mid-range of the Stratix II family.

What package does the EP2S30F672I4N use?

The EP2S30F672I4N uses a 672-ball FineLine BGA (FCBGA) package measuring 27 mm x 27 mm, classified as a 672-BBGA. The large footprint accommodates 500 user I/Os and integrates on-chip decoupling. PCBs targeting this package require high-density interconnect (HDI) and at least 4-6 routing layers for fanout and signal integrity.

Is the EP2S30F672I4N still in production?

The EP2S30F672I4N is obsolete and no longer in production. Distributors such as Rochester Electronics list remaining stock, but lead times may be extended. According to Altera Community discussions, the recommended modern replacement is a Stratix V family device in a pin-compatible package, or migration to Cyclone V/Cyclone 10 GX for cost-sensitive applications.

Where can I download the EP2S30F672I4N datasheet PDF?

The official Altera/Intel datasheet for the EP2S30F672I4N can be downloaded from the Altera Literature Center. The full device handbook is available as Stratix II Device Handbook (SII51002) covering all family variants including the EP2S30. Note that since the device is obsolete, Intel provides the datasheet for reference only without active engineering support.

What is the operating temperature range of EP2S30F672I4N?

The EP2S30F672I4N operates over the industrial temperature range of -40C to +100C junction temperature, as indicated by the I4 speed grade suffix. The 'I' in I4 denotes industrial-grade qualification per Altera's nomenclature. This range makes the device suitable for harsh environments including industrial automation, outdoor telecommunications, and aerospace subsystems.

Where to buy EP2S30F672I4N online at the best price?

The EP2S30F672I4N is available from authorized distributors including Rochester Electronics (franchised for legacy Altera parts), DigiKey, Mouser, and Arrow Electronics. As of 2026-09-09, Rochester Electronics is the primary franchise holder for obsolete Stratix II stock. Pricing typically ranges from $235 per unit at qty 1 down to $145 per unit at qty 1000, with lead times of 4-8 weeks depending on inventory.

What is the lead time for EP2S30F672I4N orders?

Lead time for the obsolete EP2S30F672I4N is typically 4-8 weeks when ordered from authorized distributors such as Rochester Electronics as of 2026-09-09. Remaining die-bank inventory limits flexibility, so bulk orders above 500 units may take 12-16 weeks. For new designs, Altera recommends migration to Stratix V or Cyclone 10 GX with shorter lead times.

EP2S30F672I4N vs EP2S30F672C5N - which is better for industrial use?

The EP2S30F672I4N is preferred for industrial applications because its I4 speed grade supports the -40C to +100C industrial temperature range, while the EP2S30F672C5N operates only over the commercial 0C to +85C range. Both share the same 672-FCBGA package, 33,880 LEs, and pinout, so the I4N can serve as a drop-in replacement when commercial-grade parts fail temperature spec. Choose I4N for any non-room-temperature deployment.

What is the best drop-in replacement for EP2S30F672I4N?

The best drop-in replacement for the EP2S30F672I4N within the Stratix II family is the EP2S30F672I4 (same I4 speed grade, same 672-FCBGA package, same pinout - but without the lead-free manufacturing suffix). For modern migration, the Stratix V 5SGXEA7K2F40C2N offers higher density and transceivers but requires a different package. Within the same footprint, the EP2S30F672C5N is pin-compatible but only commercial temperature grade.

Can the EP2S30F672I4N be replaced by a Xilinx or Lattice FPGA?

The EP2S30F672I4N cannot be directly replaced by a Xilinx or Lattice FPGA without PCB redesign, because competing devices such as Xilinx Virtex-4 LX40 or Lattice ECP2M-50 use different package ballouts and BGA footprints. Cross-brand migration requires a new PCB layout, re-synthesis of HDL code for the new vendor toolchain, and re-qualification. Within Altera, the EP2S30F672I4 or EP2S30F672C5N serve as drop-in alternatives.

When should I choose EP2S30F672I4N over a Cyclone series FPGA?

Choose the EP2S30F672I4N over Cyclone-series FPGAs when the design requires higher logic density, dedicated DSP blocks for signal processing, TriMatrix on-chip memory, and a 672-BGA package with 500 I/Os. Cyclone II/IV/10 devices top out at lower densities and fewer DSP multipliers. For new designs needing Stratix II performance with active lifecycle support, consider Cyclone 10 GX or Arria 10 instead.

What is the maximum I/O count of the EP2S30F672I4N?

The EP2S30F672I4N provides 500 general-purpose user I/Os across its 672-FCBGA package. The remaining balls are dedicated to power, ground, JTAG, configuration, and high-speed transceiver signals. This I/O count supports wide parallel buses such as 32-bit DDR2 interfaces and multi-channel LVDS links typical of Stratix II designs in telecom and video processing.

Is the EP2S30F672I4N RoHS compliant?

Yes, the EP2S30F672I4N is RoHS compliant per Altera's product declaration. The lead-free manufacturing is indicated by the 'N' suffix in the part number per Altera/Intel nomenclature. The device also complies with REACH regulation. Note that the obsolete lifecycle status does not affect the original RoHS compliance of the silicon itself.

How much embedded memory does the EP2S30F672I4N have?

The EP2S30F672I4N integrates 1,369,728 bits of on-chip TriMatrix memory, distributed across M512, M4K, and M-RAM blocks of varying sizes. TriMatrix memory supports true dual-port and shift-register modes at up to 300 MHz, and is configurable as FIFOs, ROM, or single-port RAM. This eliminates external SRAM in many buffering applications and reduces board complexity.

What are the key specifications of EP2S30F672I4N that engineers should know?

The EP2S30F672I4N is a 33,880-LE Stratix II FPGA in 672-FCBGA with 500 I/Os, 1.37 Mbit embedded RAM, 1,694 LABs, 90 nm process, 1.15-1.25 V core supply, and -40C to +100C industrial temperature range. According to the Stratix II datasheet, the device features adaptive logic modules (ALMs), DSP blocks, and TriMatrix memory with up to 711 MHz internal operation. Lifecycle is obsolete - confirm availability before sourcing.

Справочные инженерные данные для EP2S30F672I4N — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose EP2S30F672I4N when the design requires industrial-grade (-40C to +100C) operation, RoHS lead-free compliance, and Stratix II features (DSP blocks, TriMatrix memory, ALMs) in a 672-FCBGA package. Within the Stratix II family, choose EP2S30F672I4 for non-RoHS industrial; EP2S30F672C5N/C5 for higher performance commercial 0-85C; EP2S30F672C4N/C4 for moderate-speed commercial. For new designs requiring active lifecycle support, consider Cyclone 10 GX 10CX220YF672E5G instead, but note it requires a different package footprint.

Сравнение с аналогами

Параметр	Этот товар	EP2S30F672I4	EP2S30F672C5N	EP2S30F672C4N
Package	672-BBGA, FCBGA (27x27 mm)	672-BBGA, FCBGA (27x27 mm) - same	672-BBGA, FCBGA (27x27 mm) - same	672-BBGA, FCBGA (27x27 mm) - same
Brand	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)
Logic Elements	33,880	33,880	33,880	33,880
Speed Grade	I4	I4	C5 (faster)	C4 (faster)
Operating Temperature	-40C to +100C (industrial)	-40C to +100C (industrial)	0C to +85C (commercial)	0C to +85C (commercial)
LABs	1,694	1,694	1,694	1,694
Total RAM Bits	1,369,728	1,369,728	1,369,728	1,369,728
Maximum User I/Os	500	500	500	500
RoHS Status	Compliant	Compliant (N suffix not marked)	Compliant	Compliant

Ключевые отличия

Industrial temperature grade with lead-free manufacturing (против EP2S30F672C5N)
I4 speed grade optimized for low-power industrial operation (против EP2S30F672C4N)
Same Stratix II architecture with Quartus II tool support (против Cyclone II EP2C70F672I8N)

Заметки по проектированию

The 672-FCBGA package at 27x27 mm requires high-density interconnect (HDI) PCB technology. Recommended: minimum 6 routing layers with continuous GND and PWR planes directly under the BGA. Use 1 oz copper on outer layers and 0.5 oz on inner layers. BGA pad pitch is 1.0 mm - verify your PCB fab house supports 4-mil laser-drilled microvias for fanout escape. Place 0.1uF and 0.01uF decoupling capacitors within 5 mm of each VCCINT and VCCIO ball cluster.

Estimated: at maximum toggle rate, the EP2S30F672I4N may dissipate up to 5-8 W with theta_JA around 14 C/W (typical 27x27 FCBGA). Provide thermal vias in a 4x4 array under the center thermal balls and connect them to an inner copper plane for heat spreading. Industrial temperature operation (-40C to +100C) requires the junction temperature to remain below 100C - derate by 20% if mounting near heat sources. Use a heatsink with thermal interface material if power dissipation exceeds 6 W.

Do not assume the EP2S30F672I4N and the EP2S30F672C5N are interchangeable - the I4 part operates from -40C to +100C while the C5N part is commercial 0C to +85C only. Using a C5N part in an industrial design will fail thermal qualification. Also note the 'N' suffix indicates lead-free manufacturing per Altera nomenclature, so dropping the N (e.g., EP2S30F672I4) may indicate a non-RoHS variant - verify RoHS status before sourcing for RoHS-required products.

Информация о соответствии

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Без свинца

Yes

Без галогенов

Unknown

Конфликтные минералы

Compliant

RoHS compliant per Altera product declaration (N suffix indicates lead-free). Not AEC-Q100 qualified - this is a commercial/industrial-grade FPGA, not an automotive part. Device is now obsolete - confirm availability before new design starts.

Данные проверены: 2026-09-09 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Altera Intel EP2S30F672I4N Stratix II FPGA Field-Programmable Gate Array Programmable Logic Device PLD FCBGA 672-BBGA FineLine BGA Logic Element Logic Array Block LAB ALM Adaptive Logic Module TriMatrix Memory DSP block Quartus II RoHS REACH JEDEC J-STD-020 industrial temperature grade lead-free Qsys