EP2SGX30DF780C4N - Stratix II GX 30K LEs FPGA 780-FBGA | Altera
Артикул: EP2SGX30DF780C4N ⚠ Последняя закупка| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $171 | $171.000,00 |
EP2SGX30DF780C4N Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> high-performance transceiver FPGA. They are used wherever designers need parallel processing, custom I/O timing, hardware-accelerated DSP, or high-speed serial links that an ASIC, MCU, or DSP cannot economically deliver. The Stratix II GX family specifically targets applications that combine logic density with multi-gigabit transceivers (MGTs) for serial connectivity.
Key features include embedded transceiver blocks supporting multiple serial protocols, dedicated DSP blocks for high-throughput signal processing, TriMatrix on-chip memory up to ~1.37 Mbits, and support for source-synchronous and high-speed external memory interfaces (DDR/DDR2/QDR). The device integrates up to 12 transceivers depending on package variant, with per-channel data rates suitable for PCIe, XAUI, Serial RapidIO, and custom serial links. The 780-FBGA package provides 361 user I/Os and a flip-chip thermal path for reliable operation at high toggle rates.
Architecturally, Stratix II GX uses an ALM-based adaptive logic module that improves on prior 4-input LUT architectures, increasing effective logic density and reducing fabric congestion. The transceiver tiles are physically isolated and clocked independently from the core fabric, allowing parallel development of high-speed serial and parallel logic on the same die. Configuration is via SRAM, so the bitstream reloads from external flash or a host processor on every power-up.
Typical applications include telecommunications line cards, software-defined radio baseband processing, high-speed serial protocol bridging, ASIC prototyping, and high-performance DSP pipelines. Engineers select Stratix II GX for designs that demand both high logic capacity and integrated multi-gigabit serial I/O without the cost and risk of an ASIC.
When designing with this part, plan power-rail sequencing carefully because core (1.2 V), PLL analog, and transceiver supplies have separate tolerance bands; failure to sequence them can stress the transceivers during bring-up. Use the Quartus II design suite (legacy) or consult the Stratix II GX handbook for transceiver channel bonding and pre-emphasis settings. The device is now in legacy/EOL status, so verify long-term availability before committing to a new design.
This page synthesizes distributor pricing, drop-in alternatives, lifecycle notes, and practical design guidance that the manufacturer datasheet alone does not provide.
Аналоги без доработки для EP2SGX30DF780C4N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP2SGX30DF780C4N (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Speed Grade, RoHS Status, Mounting Type.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP2SGX30DF780C4
✅ Прямая замена✓ В наличии
$112 / шт.
Открыть даташит →EP2SGX30DF780C3N
✅ Прямая замена✓ В наличии
$95.5 / шт.
Открыть даташит →EP2SGX30DF780C3
✅ Прямая замена✓ В наличии
$797.98 / шт.
Открыть даташит →EP2SGX30CF780C4N
✅ Прямая замена✓ В наличии
$379 / шт.
Открыть даташит →EP2SGX30CF780C4
✅ Прямая замена✓ В наличии
$138 / шт.
Открыть даташит →EP2SGX30DF780C4N Максимальные параметры и электрические характеристики
| Family | Stratix II GX |
| Logic Elements (LEs) | 33,880 |
| Logic Array Blocks (LABs) | 1,694 |
| Total RAM Bits | 1,369,728 |
| User I/O Pins | 361 |
| Maximum Internal Frequency | 622 MHz |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Process Technology | 90 nm CMOS |
| Рабочая температура | -40C to +85C |
| Корпус | 780-FBGA (29 x 29 mm, 1.0 mm pitch) |
| Тип монтажа | Surface Mount (flip-chip BGA) |
| Lead-Free / RoHS | Lead-free (per FindIC datasheet) |
| Configuration Method | SRAM (volatile, external flash required) |
Руководство по цоколевке EP2SGX30DF780C4N в корпусе 780-fbga (29 x 29 mm, 1.0 mm pitch)
Цоколевка для EP2SGX30DF780C4N (корпус 780-fbga (29 x 29 mm, 1.0 mm pitch)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP2SGX30DF780C4N.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP2SGX30DF780C4N подходит для 6 применениеs: Telecommunications Line Cards, Software-Defined Radio Baseband, ASIC Prototyping, High-Speed Serial Protocol Bridging, High-Performance DSP Pipelines, Industrial Control and Test Instrumentation.
Telecommunications Line Cards
The EP2SGX30DF780C4N fits telecommunications line card designs that require both high logic capacity for protocol processing and integrated multi-gigabit transceivers for backplane and framer interconnect. With 33,880 logic elements and 1.37 Mbit of embedded RAM, designers can implement multi-channel packet processors, MAC/IP framing, and traffic shaping in a single device. The 361 user I/Os support numerous external PHY devices, SFP/SFP+ cages, and parallel LVDS links. Its 622 MHz fabric and embedded DSP blocks accelerate Reed-Solomon, CRC, and FEC forward-error-correction routines needed at line rate. The 780-FBGA package provides the thermal headroom required for continuous 10 Gbps operation in telecom chassis. Quartus II development flow with the Stratix II GX IP library speeds time-to-market for SONET/SDH, OTN, and Ethernet aggregation cards.
Рекомендуется
Software-Defined Radio Baseband
The EP2SGX30DF780C4N's combination of large TriMatrix memory (1.37 Mbit), dedicated DSP blocks, and multi-gigabit transceivers makes it a strong baseband-processing platform for software-defined radio (SDR). Engineers can instantiate digital up/down converters (DUC/DDC), FIR filters, and FFT engines directly in fabric to handle wideband ADC/DAC sample streams. The transceiver tiles link to high-speed ADCs/DACs and to RF front-end digitizers without an external PHY. Its 622 MHz internal frequency supports multi-carrier LTE, WiMAX, or military waveform processing in real time. The -40C to +85C commercial temperature range suits outdoor base-station enclosures. Long-term availability is critical here, so pair this device with an aftermarket sourcing plan.
Рекомендуется
ASIC Prototyping
ASIC prototyping workloads demand very high logic capacity plus abundant memory and I/O - exactly the profile of the EP2SGX30DF780C4N with 33,880 logic elements, 1.37 Mbit RAM, and 361 user I/Os. Design teams partition large ASIC RTL across multiple Stratix II GX devices using chip-bridge interfaces or Altera's HardCopy ASIC flow for volume production. The 780-FBGA package exposes hundreds of general-purpose I/Os plus dedicated high-speed serial links, allowing realistic timing closure and I/O validation pre-silicon. Embedded DSP blocks let prototyping teams exercise complex signal-processing paths months before tape-out. Quartus II synthesis and incremental compile shorten debug cycles.
Рекомендуется
High-Speed Serial Protocol Bridging
The EP2SGX30DF780C4N's embedded transceivers support PCIe, XAUI, Serial RapidIO, and other multi-gigabit standards, making it ideal for bridging between incompatible serial domains. Designs can implement PCIe-to-XAUI bridges, SATA controllers, or custom serial engines in fabric with minimal external glue logic. The 1.37 Mbit embedded RAM provides packet buffering to absorb rate mismatches between protocols. The 780-FBGA's 361 user I/Os connect to external QSFP/SFP cages, parallel buses, and legacy interfaces simultaneously. Quartus II IP cores accelerate protocol stack implementation. Drop-in C3 speed-grade variants are available if timing closure is tight.
Рекомендуется
High-Performance DSP Pipelines
Stratix II GX devices include dedicated DSP blocks optimized for high-throughput signal processing, and the EP2SGX30DF780C4N leverages them for radar, medical imaging, and test-and-measurement pipelines. With 33,880 logic elements and embedded multipliers, designers can implement parallel FIR filters, FFTs, and matrix operations at sample rates exceeding 200 MSPS in a single device. The on-chip TriMatrix memory provides dual-port buffers for overlapped sample processing. Transceivers stream digitized IF data to/from high-speed ADCs without bottlenecks. Quartus II DSP Builder integrates MathWorks Simulink designs for rapid algorithm development. Commercial temperature range and the robust 780-FBGA package suit industrial deployment.
Рекомендуется
Industrial Control and Test Instrumentation
The EP2SGX30DF780C4N supports industrial control and test-instrumentation designs that need both deterministic parallel logic and high-speed serial connectivity. Engineers use the 361 user I/Os to interface with parallel ADCs, DACs, motor-control PWMs, and custom sensor arrays, while transceivers link to industrial Ethernet, EtherCAT, or proprietary backplanes. The 1.37 Mbit RAM and embedded DSP blocks accelerate waveform generation, FFT analysis, and closed-loop control algorithms. The -40C to +85C operating range handles factory-floor environments without conformal coating requirements. Quartus II and the legacy HardCopy path allow seamless transition from prototype to volume production.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP2SGX30DF780C4N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP2SGX30DF780C4 | EP2SGX30DF780C3N | EP2SGX30DF780C3 | EP2SGX30CF780C4N | EP2SGX30CF780C4 |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Total RAM Bits | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 |
| User I/Os | 361 | 361 | 361 | 361 | 361 | 361 |
| Speed Grade | C4 | C4 | C3 (faster) | C3 (faster) | C4 | C4 |
| Lead-Free / RoHS | Yes (lead-free) | No (leaded) | Yes (lead-free) | No (leaded) | Yes (lead-free) | No (leaded) |
| Integrated Transceivers | Yes (Stratix II GX) | Yes | Yes | Yes | No (CF = transceiver-disabled) | No (CF = transceiver-disabled) |
| Lifecycle Status | Last-time-buy / legacy | Last-time-buy / legacy | Last-time-buy / legacy | Last-time-buy / legacy | Last-time-buy / legacy | Last-time-buy / legacy |
Ключевые отличия
- Lead-free RoHS-compliant terminal finish on identical die (против EP2SGX30DF780C4)
- Faster speed grade available in same package (против EP2SGX30DF780C3N)
- Transceiver-disabled logic-only variant available (против EP2SGX30CF780C4N)
Заметки по проектированию
Estimated: At a typical operating vector of 50% toggle rate and 25% logic utilization, the EP2SGX30DF780C4N core consumes roughly 4-6 W on the 1.2 V supply; transceivers add 0.5-1.5 W per active channel. Use the PowerPlay Early Power Estimator for your design vector and budget the regulator with at least 30% headroom. Sequence the core, PLL analog, and transceiver supplies per the Stratix II GX handbook to prevent latch-up during power-up.
The 780-FBGA flip-chip package requires a properly designed thermal land pattern and thermal vias under the die for heat extraction. Without sufficient copper pour and 0.3 mm thermal vias, the junction temperature can exceed 100 C at full load, triggering thermal slowdown. For chassis designs, mount a heatsink with thermal interface material or use forced-air cooling. Always validate with a thermal probe in the prototype before committing to production.
Use a 1.0 mm-pitch BGA land pattern with non-solder-mask-defined (NSMD) pads for reliable assembly. Route differential transceiver pairs with 100 ohm differential impedance, length matching within 0.127 mm, and continuous reference planes on adjacent layers. Decoupling: place 0.1 uF X7R capacitors within 2 mm of every power pin, plus bulk 47 uF to 100 uF tantalum or polymer caps per power rail. Minimize via stubs on high-speed serial traces by using back-drilling if link rate exceeds 3 Gbps.
Do not assume the lead-free (N-suffix) and leaded parts share solder-process profiles - the C4N requires SAC305 lead-free reflow at peak 245-260 C, while the C4 (leaded) prefers SnPb profile at peak 220-235 C. Mixing profiles can cause brittle joints or non-wets. Also, the EP2SGX30CF variants (transceiver-disabled) have different Quartus pin assignments even at the same BGA coordinates - confirm pinout files before layout reuse.
Keep all high-speed transceiver channels isolated from noisy digital regions with a guard trace tied to ground. Place the JTAG, configuration flash, and clock sources within 50 mm of the FPGA to avoid signal-integrity issues. Maintain 4-layer or higher stack-up with dedicated ground and power planes; never route signals over split planes. The 1.0 mm BGA pitch requires laser-drilled or micro-vias for inner-ball escape routing.
Информация о соответствии
Lead-free (N-suffix) variant confirmed via FindIC datasheet record. REACH, halogen-free, and conflict-minerals declarations not in verified web data - defaulting to 'unknown'. AEC-Q100 not applicable for FPGA grade parts. Confirm with Altera/Intel product compliance portal for full declarations.
