EP3C40U484C6N - 39.6KLE Cyclone III FPGA, 484-FBGA | Intel
Артикул: EP3C40U484C6N ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72.1 | $721,00 |
| 100 | $64.8 | $6.480,00 |
| 500 | $57.4 | $28.700,00 |
| 1.000 | $50.2 | $50.200,00 |
EP3C40U484C6N Обзор
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that belongs to the broader semiconductor category of integrated circuits. In the device hierarchy, an FPGA sits between a fixed-function Application-Specific Integrated Circuit (ASIC) and a general-purpose microprocessor: like an ASIC it implements custom digital logic, but unlike an ASIC its function is defined by a user-loadable configuration bitstream rather than at fabrication time. FPGAs contain configurable logic blocks (CLBs), programmable routing, embedded memory, DSP blocks, and I/O serdes, and they are used to prototype designs, accelerate parallel workloads, and ship low-to-mid volume products where ASIC NRE is uneconomical.
Key features of the EP3C40U484C6N include support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), four general-purpose PLLs for clock management, up to 4 Mb of M9K embedded SRAM, and Cyclone III series static power approximately 50 % lower than Cyclone II. The device supports configuration via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) interfaces using the industry-standard Altera/Intel configuration scheme.
Architecturally, the Cyclone III device fabric comprises LABs (Logic Array Blocks) of 16 logic elements each, distributed M9K memory blocks, embedded multiplier blocks for DSP, and per-I/O bank supply pins for mixed-voltage interfacing. The -6 speed grade places this part in the mid-tier of the Cyclone III family, balancing timing margin against cost.
Typical applications include industrial motor control, video processing pipelines, telecom baseband preprocessing, military/aerospace ruggedized subsystems, and ASIC prototyping for mid-complexity designs. Designers choose the U484 (484-pin FBGA) variant when their design requires the maximum 331 user I/O of the EP3C40 die, beyond what smaller packages expose.
When designing with this part, observe the 484-ball BGA fan-out: route all 8 user-I/O bank supplies (VCCIO) and the 1.2 V core (VCCINT) with at least one decoupling capacitor per bank, place a 100 MHz or lower reference clock into a PLL-clean CLK pin, and use Altera Quartus II (legacy) or Intel Quartus Prime for synthesis and place-and-route to guarantee timing closure.
This page synthesizes distributor pricing, drop-in-compatible Cyclone III alternatives, and PCB layout guidance that the manufacturer datasheet alone does not consolidate in a single view.
Аналоги без доработки для EP3C40U484C6N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP3C40U484C6N (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, Speed Grade, RoHS Status, Family.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP3C40U484C7N
✅ Прямая замена✓ В наличии
$119.4 / шт.
Открыть даташит →EP3C40U484C8N
✅ Прямая замена✓ В наличии
$71.04 / шт.
Открыть даташит →EP3C40U484A7N
✅ Прямая замена✓ В наличии
$21.45 / шт.
Открыть даташит →EP3C40U484I6N
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EP3C40F484C6N
✅ Прямая замена✓ В наличии
$312.4 / шт.
Открыть даташит →EP3C40F484C7N
✅ Прямая замена✓ В наличии
$264 / шт.
Открыть даташит →EP3C40U484C6N Максимальные параметры и электрические характеристики
| Series | Cyclone III |
| Family | FPGA (Field Programmable Gate Array) |
| Logic Elements (LE) | 39,600 |
| Total Memory Bits | 1,161,216 bits (approx. 1134 Kbit) |
| Embedded Multipliers (18x18) | 126 |
| Maximum User I/O | 331 |
| Number of PLLs | 4 |
| Process Technology | 65 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| Рабочая температура | 0 °C to +85 °C (Commercial) |
| Speed Grade | -6 (mid-tier) |
| Корпус | 484-UFBGA (U484), 19 mm × 19 mm, 1.0 mm ball pitch |
| Тип монтажа | Surface Mount (BGA) |
| Configuration Method | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |
| Статус RoHS | Compliant (Pb-Free) |
Руководство по цоколевке EP3C40U484C6N в корпусе 484-ufbga (u484), 19 mm × 19 mm, 1.0 mm ball pitch
Цоколевка для EP3C40U484C6N (корпус 484-ufbga (u484), 19 mm × 19 mm, 1.0 mm ball pitch). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP3C40U484C6N.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP3C40U484C6N подходит для 6 применениеs: Industrial Motor Control, Video Processing Pipeline, Telecom Baseband Preprocessing, ASIC Prototyping Platform, Military / Aerospace Ruggedized Subsystem, Test & Measurement Instrumentation.
Industrial Motor Control
The EP3C40U484C6N is well matched to multi-axis industrial motor control where its 126 embedded 18×18 multipliers accelerate field-oriented-control (FOC) and space-vector PWM math, while the 1.16 Mbit of distributed M9K memory buffers phase-current and resolver feedback samples. Placed between 3.3 V Hall-sensor / encoder front-ends and a 1.2 V core, the device's 331 user I/Os expose enough pins for up to 4 three-phase bridges plus auxiliary GPIO. Compared with a Cortex-M microcontroller approach, the FPGA closes the current loop at much lower latency (under 1 µs), improving torque ripple and dynamic response. Designers typically pair the FPGA with EPCOS/TDK power inductors and an IR/Infineon IGBT gate driver such as the IR2110S for the high-voltage side.
Рекомендуется
Video Processing Pipeline
In video broadcast and surveillance designs, the EP3C40U484C6N drives HDMI/DVI input ports, scales HD/SD streams, and bridges to DDR2/DDR3 frame buffers. The 39,600 logic elements comfortably hold a full 1080p60 deinterlacer and scaler, while the 126 hardware multipliers accelerate polyphase resampling without consuming fabric LUTs. The U484 BGA exposes enough LVDS pairs to receive 24-bit RGB plus HSYNC/VSYNC/DE from a Silergy/TI HDMI receiver such as the TFP401A. Power dissipation at 60 fps is typically 1-1.5 W, dominated by the LVDS I/O banks, and fits comfortably within the commercial 0-85 °C window without an explicit heatsink. For higher frame rates or 4K upconversion, migrate to Cyclone IV E or Cyclone V.
Рекомендуется
Telecom Baseband Preprocessing
Cyclic-prefix insertion, FFT pre-processing and crest-factor reduction (CFR) for small-cell LTE/5G base stations fit naturally in the EP3C40U484C6N. The fabric holds a 1024-point radix-2 FFT engine at full LTE 20 MHz bandwidth while the device consumes well under 2 W on the 1.2 V core rail. Four on-die PLLs derive the reference clocks for the radio ADC (such as an ADI AD9268) and a backplane SERDES, with the per-bank VCCIO supporting both 1.8 V CML and 2.5 V LVDS signalling. The U484 package's 331 user I/Os expose enough LVDS pairs to fan out to two radio channels plus CPRI/Ethernet fronthaul. Compared with a DSP processor, the FPGA approach cuts latency by a factor of 5-10 in the same power budget.
Рекомендуется
ASIC Prototyping Platform
Design teams use the EP3C40U484C6N to prototype mid-complexity ASICs up to ~2 million gates, leveraging Quartus Prime's incremental compilation to partition the design across multiple FPGA instances. The 39,600 LEs map approximately 2-3× the equivalent ASIC gate count, while the 1.16 Mbit of embedded RAM holds per-block memories and FIFOs that would otherwise require external SRAM. The U484 BGA's high pin count exposes enough GPIO for full-speed ASIC peripheral emulation, including DDR2 controller pins if the prototype board adds an external DRAM. For very large ASICs (>5M gates) teams cascade several EP3C120 or migrate to Cyclone IV GX/Stratix V prototyping boards.
Рекомендуется
Military / Aerospace Ruggedized Subsystem
Ruggedized vetronics, avionics databuses (MIL-STD-1553, ARINC 429) and UAV flight controllers adopt the EP3C40U484C6N's industrial / military temperature siblings (EP3C40F484I7N, EP3C40F484I8N) that share the same Cyclone III die. With -40 °C to +125 °C junction temperature range and SEU-mitigation features (CRC on configuration bitstream, optional soft ECC in M9K blocks), the device is a proven platform for DO-254 and MIL-STD-810 designs. The U484 ball map supports dual-redundant 1553 transceivers such as the Holt HI-3585 and four RS-422 ports for legacy avionics, while four PLLs clean the jitter on the 1553 BC/RT clocks. For radiation-hardened missions, consider the Microsemi/RT ProASIC3 or the Xilinx XQR series rather than Cyclone III.
Рекомендуется
Test & Measurement Instrumentation
Logic analyzers, protocol exercisers (I2C/SPI/CAN/UART) and arbitrary waveform generators use the EP3C40U484C6N to capture and re-synthesise high-speed bus traffic. The fabric holds 32 channels of 200 MHz state-mode capture with on-chip compression, while the 126 hardware multipliers compute FFT-based spectral analysis in real time without off-chip DSP. The U484 BGA exposes up to 331 user I/Os, enough for 32 LVDS channels plus PMOD expansion for protocol-specific pods. Total board power is typically 1.5-2.5 W and fits a small aluminium chassis without active cooling. Compared with a discrete-TTL capture approach, the FPGA cuts BOM cost and PCB area by 60-70 % for the same channel count.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP3C40U484C6N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP3C40U484C7N | EP3C40U484I6N | EP3C40U484A7N | EP3C40F484C6N |
|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 484-UFBGA (U484) | 484-UFBGA (U484) - same footprint | 484-UFBGA (U484) - same footprint | 484-UFBGA (U484) - same footprint | 484-FBGA (F484) - same ball count, 1.0 mm pitch vs 0.8 mm |
| Logic Elements | 39,600 LE | 39,600 LE - identical | 39,600 LE - identical | 39,600 LE - identical | 39,600 LE - identical |
| Total Memory Bits | 1,161,216 bits | 1,161,216 bits - identical | 1,161,216 bits - identical | 1,161,216 bits - identical | 1,161,216 bits - identical |
| Embedded Multipliers | 126 (18x18) | 126 - identical | 126 - identical | 126 - identical | 126 - identical |
| Speed Grade | -6 (mid-tier) | -7 (slower than -6) | -6 (same as target) | -7 (slower than -6) | -6 (same as target) |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) - same | -40 °C to +100 °C (Industrial) | -40 °C to +125 °C (Automotive) | 0 °C to +85 °C (Commercial) - same |
| Configuration Bitstream | Cyclone III (identical across family) | Cyclone III - bitstream-compatible | Cyclone III - bitstream-compatible | Cyclone III - bitstream-compatible | Cyclone III - bitstream-compatible |
Ключевые отличия
- Identical 39,600 LE, 1.16 Mbit memory and 126 multipliers as -7 and -I variants (против EP3C40U484C7N)
- Commercial temperature window at the lowest price point in the U484 family (против EP3C40U484I6N)
- Bitstream-compatible across the entire Cyclone III EP3C40 family (против EP3C40F484C6N)
Заметки по проектированию
The 484-ball UFBGA package uses a 0.8 mm ball pitch, which demands 4-layer (or finer) PCB stack-up with microvia-in-pad for reliable assembly. Route each of the 8 VCCIO bank supplies with at least one 0.1 µF X7R decoupling capacitor placed within 100 mils of the corresponding ball, plus a bulk 10 µF per bank. The 1.2 V VCCINT and PLL analog supply (VCC_PLL) each require their own decoupling network with 1 µF + 0.1 µF + 10 µF bulk to suppress switching-noise injection into the phase-locked loops.
Estimated: at 100 MHz fMAX with 60 % utilization and typical 12 mA per I/O, the U484 device dissipates approximately 1.2-1.8 W on a 4-layer PCB with adequate ground pour. The U484's θJA of about 15 °C/W means a junction rise of 18-27 °C above ambient, keeping the junction well below the 100 °C commercial limit. For sealed enclosures without airflow, add a small copper heatsink pad or thermal via array under the BGA thermal pad to drop the junction by an additional 5-10 °C.
Do not assume Cyclone III configuration bitstreams are portable to Cyclone IV E: pin assignments, PLL settings, and I/O standard names differ. Confirm the Quartus II device library is set to EP3C40U484C6 (not EP3C40U484) before synthesizing, otherwise the fitter may produce a non-functional bitstream. For multi-voltage I/O designs, every VCCIO bank must be powered even if unused, or the corresponding inputs float into an indeterminate state that can exceed absolute-maximum ratings during configuration.
For LVDS at >400 Mbps use the dedicated LVDS-capable pins in bank 1, 2, 3, or 4 only; older bank numbers do not support true LVDS. Match trace lengths within ±150 mil for LVDS pairs and ±50 mil for DDR2 interfaces to keep setup/hold margins intact. Place series 100 Ω differential termination resistors as close to the receiver pins as the layout allows.
Информация о соответствии
The trailing 'N' suffix confirms lead-free (Pb-free) terminal finish. RoHS and REACH compliant per Intel/Altera product declaration. The EP3C40U484C6N itself is not AEC-Q100 qualified; the EP3C40U484A7N variant in the same U484 package is the automotive-grade option. Halogen-free per JEDEC JS709.
