EP3CLS150F780I7 - Cyclone III LS 150K LE FPGA 780-FBGA | Intel
Артикул: EP3CLS150F780I7 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $959.69 | $959,69 |
| 10 | $905.5 | $9.055,00 |
| 100 | $825 | $82.500,00 |
| 500 | $760 | $380.000,00 |
| 1.000 | $712.5 | $712.500,00 |
EP3CLS150F780I7 Обзор
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that lets designers implement arbitrary digital logic in silicon after PCB fabrication, trading per-unit cost against design flexibility, parallelism, and time-to-market. FPGAs sit hierarchically between Application-Specific Integrated Circuits (ASICs) and microcontrollers: more flexible than ASICs but more power-efficient than software-driven CPUs for parallel DSP, interface bridging, and glue-logic tasks. The Cyclone III LS sub-family (the "LS" suffix denoting Low-power with Security) extends Cyclone III with hardware cryptographic blocks while retaining the static power of approximately 0.5 W typical at 65 nm.
Key features include 150,848 logic elements (LEs), 6,137,856 embedded RAM bits, 413 user I/O pins, 4 PLLs, 1.2 V core supply, 65 nm process technology, and on-chip AES / 3DES / SHA / TRNG security accelerators. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through per-bank reference voltages, and offers configuration via JTAG, Active Serial, or Passive Parallel modes from external flash memory.
Architecturally, the Cyclone III LS family uses a logic-element-based fabric with embedded M9K memory blocks, hardware multiplier blocks for DSP, and dedicated global clock networks tied to the PLLs. The 65 nm process and architectural gating reduce static power versus the original Cyclone III, while the LS variant adds a dedicated security block for protocol offload (TLS, IPsec, secure boot) without consuming general-purpose logic resources.
Typical applications include industrial motor control, video surveillance and image processing, industrial protocol bridging (PROFINET, EtherCAT), low-cost digital signal processing front-ends, secure IoT gateways, and telecommunications line cards. The 780-FBGA package provides abundant I/O for parallel video or memory interfaces while keeping PCB footprint reasonable.
When designing, ensure the 1.2 V core rail uses at least 10 µF of bulk ceramic decoupling within 10 mm of the power pins and that each PLL analog supply (VCCA_PLL) is filtered through a ferrite bead. Industrial temperature grade (the "I7" speed-grade identifier) means 100 °C junction maximum; derate output drive strength in tightly enclosed enclosures.
This page combines distributor pricing, pin-compatible alternatives, and PCB layout guidance drawn from the manufacturer datasheet and authorized distributor listings - information not consolidated on a single OEM page.
Аналоги без доработки для EP3CLS150F780I7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP3CLS150F780I7 (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, Embedded Memory Bits, Configuration Modes, Operating Temperature Grade.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP3CLS150F780C8N
✅ Прямая замена✓ В наличии
$205 / шт.
Открыть даташит →EP3CLS100F780I7N
✅ Прямая замена✓ В наличии
$174 / шт.
Открыть даташит →EP3C120F780I7N
✅ Прямая замена✓ В наличии
$198.45 / шт.
Открыть даташит →EP3C80F780I7N
✅ Прямая замена✓ В наличии
$514.03 / шт.
Открыть даташит →EP3CLS150F780I7 Максимальные параметры и электрические характеристики
| Family | Cyclone III LS |
| Logic Elements | 150,848 |
| Embedded Memory Bits | 6,137,856 |
| User I/O Pins | 413 |
| Number of PLLs | 4 |
| Core Supply Voltage | 1.2 V |
| Process Technology | 65 nm |
| Корпус | 780-ball FBGA |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C TJ) |
| Configuration Modes | JTAG, Active Serial, Passive Serial, Passive Parallel |
| Security Accelerators | AES, 3DES, SHA-1/256, TRNG |
| Maximum User I/O | 413 |
| Тип памяти | Embedded SRAM (M9K blocks) |
| Статус RoHS | Compliant |
| Тип монтажа | Surface Mount (BGA) |
Руководство по цоколевке EP3CLS150F780I7 в корпусе 780-ball fbga
Цоколевка для EP3CLS150F780I7 (корпус 780-ball fbga). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP3CLS150F780I7.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP3CLS150F780I7 подходит для 6 применениеs: Industrial Motor Control, Video Surveillance and Image Processing, Industrial Protocol Bridging (PROFINET / EtherCAT), Low-Cost DSP Front-End, Secure IoT Gateway, Telecommunications Line Card.
Industrial Motor Control
The EP3CLS150F780I7 fits industrial motor control because 150,848 logic elements and 413 user I/O pins comfortably absorb multi-axis FOC / SVPWM control loops plus encoder and resolver interfaces. Its 4 on-chip PLLs drive the PWM timers and high-speed ADC sample clocks with sub-nanosecond jitter, while the 1.2 V core keeps static power around 0.5 W - useful in sealed IP65 enclosures. The 780-ball FBGA exposes enough LVDS pairs to capture resolver feedback simultaneously on three axes without external multiplexing, and the LS family's -40 °C to +100 °C industrial temperature rating handles under-hood or cabinet ambient conditions. Engineers typically pair the FPGA with external ADC and gate-driver ASICs, while the FPGA handles commutation, current loop, and fieldbus glue.
Рекомендуется
Video Surveillance and Image Processing
With 150K logic elements, 6.14 Mbit of embedded SRAM, and 413 user I/O pins, the EP3CLS150F780I7 can ingest parallel sensor data from a multi-megapixel image sensor and perform real-time pipeline processing such as color correction, gamma, edge enhancement, and H.264 motion estimation pre-processing. The hardware AES/SHA blocks offload encrypted video-stream authentication, allowing the FPGA to run video analytics in parallel with secure transmission. The 780-FBGA package exposes enough LVDS lanes for high-speed MIPI-CSI or sub-LVDS sensor interfaces, and the 4 PLLs generate the per-lane byte clocks with deterministic phase relationship required by CSI-2 receivers. Power stays low enough that fanless IP cameras are practical, and the industrial temperature grade survives outdoor housing conditions.
Рекомендуется
Industrial Protocol Bridging (PROFINET / EtherCAT)
The 150K-LE EP3CLS150F780I7 is a strong fit for PROFINET IRT, EtherCAT, EtherNet/IP, and Modbus TCP gateways because the high logic count and abundant I/O let designers implement master and slave stacks, deterministic MACs, and cut-through switching fabric in parallel. The 4 PLLs drive the 100 Mbit / 1 Gbit PHY reference clocks with low jitter, while the embedded M9K blocks serve as line-rate FIFOs between fieldbus and backplane. The LS family's hardware AES and SHA accelerators enable CIP Security or PROFINET Security Class 1 with minimal soft-logic overhead, and the 780-FBGA exposes enough LVDS pairs for parallel backplane interfaces in modular PLC racks. Industrial temperature rating ensures operation inside sealed control cabinets.
Рекомендуется
Low-Cost DSP Front-End
The EP3CLS150F780I7 supplies 150,848 logic elements plus dedicated 18×18 hardware multipliers, which is enough headroom for multi-channel FIR / FFT signal chains in radar, sonar, or test-instrument front-ends. The 6.14 Mbit of embedded SRAM holds FFT windows and overlap-save buffers without external memory, and the 4 PLLs generate independent sampling and IF clocks. The 65 nm silicon keeps the device under 1.5 W typical, suitable for portable test gear, while the 780-FBGA exposes enough LVDS pairs to interface with 16-bit ADCs at 250 MSPS. Engineers typically use Quartus DSP Builder or HDL templates to drop in FIR / DDC cores that consume 5-15K LEs per channel.
Рекомендуется
Secure IoT Gateway
The Cyclone III LS family was designed specifically for secure edge devices, and the EP3CLS150F780I7 includes dedicated AES-128/192/256, 3DES, SHA-1/256 engines plus a true random number generator, letting the device perform TLS/DTLS handshake and IPsec line-rate encryption without consuming soft-logic resources. The 150K logic elements can run a RISC-V soft core (such as PicoRV32) alongside an Ethernet MAC, packet processor, and firewall, while the 6.14 Mbit embedded memory buffers TLS sessions. The 780-FBGA exposes enough I/O for multiple Ethernet PHYs and USB 2.0 ULPI interfaces, and industrial temperature rating supports outdoor or factory deployments.
Рекомендуется
Telecommunications Line Card
The EP3CLS150F780I7 fits telecom line cards because 150K logic elements can implement CPRI / OBSAI fronthaul, JESD204B ADC aggregation, or low-rate TDM cross-connects in parallel. The 4 PLLs generate the per-link reference clocks with low jitter required by CPRI, while the embedded AES accelerator secures backhaul links. The 780-ball FBGA exposes enough LVDS pairs to interface directly with multi-gigabit SERDES framer ASICs, and industrial temperature rating supports central-office ambient. Static power of approximately 0.5 W per device keeps thermal design straightforward even when stacking 8-16 line cards in a shelf.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP3CLS150F780I7 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP3CLS150F780C8N | EP3CLS100F780I7N | EP3C120F780I7N | EP3C80F780I7N | EP3CLS150F484I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 484-ball FBGA - different footprint |
| Logic Elements | 150,848 | 150,848 | 100,848 | 119,088 | 81,264 | 150,848 |
| Embedded Memory (bits) | 6,137,856 | 6,137,856 | 4,451,328 | 3,981,312 | 2,810,880 | 6,137,856 |
| User I/O Pins | 413 | 413 | 413 | 531 | 295 | 313 |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Hardware Security Accelerators | AES, 3DES, SHA-1/256, TRNG | AES, 3DES, SHA-1/256, TRNG | AES, 3DES, SHA-1/256, TRNG | None (Cyclone III, not LS) | None (Cyclone III, not LS) | AES, 3DES, SHA-1/256, TRNG |
| Temperature Grade | Industrial (-40 C to +100 C TJ) | Commercial (0 C to +85 C TJ) | Industrial (-40 C to +100 C TJ) | Industrial (-40 C to +100 C TJ) | Industrial (-40 C to +100 C TJ) | Industrial (-40 C to +100 C TJ) |
Ключевые отличия
- Largest Cyclone III LS with on-chip hardware cryptography (против EP3C120F780I7N)
- 150K logic elements versus 100K in the LS100 variant (против EP3CLS100F780I7N)
- Lower-power 65 nm LS process versus older 90 nm Cyclone II (против EP2C50F484I7N)
Заметки по проектированию
The 1.2 V VCCINT rail must be supplied by a buck regulator capable of delivering at least 2 A peak with sub-3 % ripple; place at least 4 × 22 µF X7R ceramic decoupling capacitors within 10 mm of the FPGA power pins. VCCA_PLL (PLL analog supply, nominally 2.5 V) should be filtered through a ferrite bead and decoupled with 10 µF + 0.1 µF to suppress PLL jitter. VCCIO banks should each be tied to a regulated 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V supply per bank, and unused I/O banks must still receive power to avoid floating inputs.
Estimated: at 85 % resource utilisation and 100 MHz toggling rate the EP3CLS150F780I7 dissipates approximately 1.2-1.5 W on a JEDEC 2s2p test board (theta_JA roughly 18 °C/W), producing a junction temperature rise of 22-27 °C above ambient. With the industrial 100 °C junction limit, derate ambient to 73-78 °C maximum. For sealed enclosures, attach a small copper heat-spreader or micro heat-sink over the FBGA top with thermal pad; do not rely on the BGA balls alone for heat removal. Use the Quartus PowerPlay Early Power Estimator (EPE) worksheet to confirm your specific design before final layout.
Lay out the 780-ball FBGA with at least 6-layer stack-up using 1 oz copper on outer layers and 0.5 oz on inner layers. Microvia-in-pad is strongly recommended for the breakout to escape the 1.0 mm pitch BGA; route signal layers between GND/VCCINT planes to maintain impedance. Length-match LVDS pairs within 0.13 mm (5 mil) and use 100 Ω differential impedance. Reference each PLL clock pin to its own dedicated GND via within 5 mm to minimise jitter.
Do not leave configuration MSEL pins floating - they must be strapped high or low per the Cyclone III handbook to select Active Serial vs Passive Parallel mode. Failure to pull CONF_DONE high through a 10 kΩ resistor causes the device to remain in reset. The JTAG TCK pin must be pulled to VCCIO of the configuration bank through a 10 kΩ resistor when JTAG is unused, otherwise configuration can glitch at power-up.
Differential SSTL-2 / SSTL-18 / HSTL memory interfaces from the EP3CLS150F780I7 require external 50 Ω series damping resistors within 5 mm of the driver pins and termination resistors (50 Ω to VTT) at the receiver. Add a VTT regulator capable of sourcing peak transients of 1.5 A per byte lane group. Use IBIS models from the Intel website for SI simulation - the Cyclone III I/O buffers are not well approximated by default IBIS models from other vendors.
Информация о соответствии
RoHS and lead-free per Intel Cyclone III LS product page; not AEC-Q100 qualified - this is an industrial-grade commercial FPGA, not an automotive-qualified part.