EP3CLS200F484C8ES - Cyclone III LS FPGA, 198K LE, 484-BGA | Altera
Артикул: EP3CLS200F484C8ES ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $295 | $295,00 |
| 10 | $278 | $2.780,00 |
| 100 | $248 | $24.800,00 |
| 500 | $221 | $110.500,00 |
| 1.000 | $198 | $198.000,00 |
EP3CLS200F484C8ES Обзор
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O cells are defined by a user-loaded bitstream rather than fixed masks. FPGAs sit between standard logic ICs (fixed function) and ASICs (high NRE, large volumes), occupying a sweet spot of flexibility, time-to-market, and unit cost for medium-volume designs. Cyclone III LS is positioned in Altera's low-power, high-volume portfolio, targeting applications that need tens to hundreds of thousands of logic elements without paying for high-end transceivers. Cyclone III LS also includes dedicated hardware for cryptographic acceleration (AES, SHA) and a security lock for bitstream protection.
Key features of the EP3CLS200F484C8ES include 198,464 logic elements, 4,488 Kbits of embedded RAM arranged as 9-Kbit M9K blocks, 4 PLLs with up to 402 MHz fabric performance, and 210 maximum user I/Os. The 65 nm process and 1.2 V core rail keep dynamic power well below the original Cyclone II family, and the device supports commercial temperature grades as well as industrial variants in the same package. The FineLine BGA-484 footprint is shared across the Cyclone III LS density range, enabling pin-compatible migration within the family.
Architecturally, the device uses a Logic Array Block (LAB) fabric with 16 logic elements per LAB, each LE containing a 4-input LUT, a register, and dedicated carry-chain logic. The M9K memory blocks support true dual-port, single-port, ROM, and FIFO modes, and DSP-style multiplication can be inferred from the LUT fabric. Clock distribution is handled by a global clock network backed by four PLLs with eight output taps, giving the device deterministic clocking for synchronous interfaces.
Typical applications include industrial control and machine automation, video surveillance and image processing pipelines, low-cost display controllers, automotive infotainment (industrial temp grade), and software-defined radio baseband pre-processing. The Cyclone III LS family is also widely used in medical instrumentation and portable test equipment where the AES/SHA blocks simplify HIPAA-style data-protection requirements.
When designing with the EP3CLS200F484C8ES, use Quartus II (13.0sp1 or later recommended) for synthesis, place-and-route, and power estimation. Plan thermal dissipation carefully because BGA-484 packages route most heat through the PCB ball grid; a 1.0 mm pitch, 6-layer stack-up with thermal vias under the die is recommended for industrial workloads. Decoupling must follow the recommended capacitor network in the Cyclone III LS Hardware Reference Manual, and unused pins should be configured as tri-state inputs with weak pull-ups to avoid floating I/O damage.
This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III LS family, and PCB/design notes that go beyond what the Altera datasheet and Quartus handbook provide individually.
Аналоги без доработки для EP3CLS200F484C8ES — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP3CLS200F484C8ES (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, Operating Temperature, Embedded Memory, Speed Grade.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP3CLS200F484C8
✅ Прямая замена✓ В наличии
$118 / шт.
Открыть даташит →EP3CLS200F484C8N
✅ Прямая замена✓ В наличии
$1245 / шт.
Открыть даташит →EP3CLS200F484C7N
✅ Прямая замена✓ В наличии
$1650 / шт.
Открыть даташит →EP3CLS200F484C7
✅ Прямая замена✓ В наличии
$1720 / шт.
Открыть даташит →EP3CLS150F484C8N
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$115.2 / шт.
Открыть даташит →EP3CLS150F484C8
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$119 / шт.
Открыть даташит →EP3CLS200F484C8ES Максимальные параметры и электрические характеристики
| Device Family | Cyclone III LS |
| Logic Elements (LE) | 198,464 |
| Logic Cells / Logic Blocks | 47 |
| Embedded Memory | 4,488 Kbit (M9K blocks) |
| Maximum User I/O | 210 |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| PLLs | 4 |
| Fabric Performance | 402 MHz (max) |
| Корпус | 484-ball FBGA (FineLine BGA) |
| Тип монтажа | Surface Mount |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 8 |
| On-Chip Termination (OCT) | Supported |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL (per datasheet) |
| Статус RoHS | Compliant |
Руководство по цоколевке EP3CLS200F484C8ES в корпусе 484-ball fbga (fineline bga)
Цоколевка для EP3CLS200F484C8ES (корпус 484-ball fbga (fineline bga)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP3CLS200F484C8ES.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP3CLS200F484C8ES подходит для 6 применениеs: Industrial Control & Machine Automation, Video Surveillance & Image Processing Pipelines, Software-Defined Radio Baseband Pre-Processing, Medical Instrumentation & Portable Test Equipment, Automotive Infotainment & Driver-Assist Pre-Processing, Low-Cost Display Controllers & Digital Signage.
Industrial Control & Machine Automation
The EP3CLS200F484C8ES fits industrial control because its 198,464 logic elements and 210 user I/Os let a designer integrate a multi-axis motor-control state machine, deterministic EtherCAT or PROFIBUS slave interface, and a touch-screen GUI controller in a single FPGA. The Cyclone III LS 1.2 V core at 65 nm keeps the dynamic power low enough that a fanless industrial enclosure can survive at +70C ambient, and the AES/SHA accelerators on LS silicon let the controller authenticate field-device certificates without an external crypto IC. Placed between a host PLC and the power-stage IGBT/MOSFET gate drivers, the device also generates the deterministic PWM and dead-time insertion with sub-100 ns latency. Compared with a discrete MCU plus CPLD, the integrated approach reduces PCB area by roughly 40 percent and lets firmware updates ship as a bitstream.
Рекомендуется
Video Surveillance & Image Processing Pipelines
The EP3CLS200F484C8ES is well suited to multi-channel video surveillance because the M9K memory blocks (4,488 Kbits total) can double as line buffers for HD-SDI or MIPI CSI-2 inputs while the 4-input LUT fabric computes Bayer demosaic, motion detection, and H.264 pre-processing in real time. The four PLLs deliver eight output taps, enough to clock the image sensor, DDR2 frame buffer, Ethernet MAC, and ARM soft-core simultaneously without jitter issues. LVDS I/O at 840 Mbps per pair supports direct connection to industrial cameras without external transceivers, and the 484-ball FBGA provides 210 user I/Os for stacking multiple sensor inputs. Engineers typically pair the FPGA with a Micron DDR2 memory and an Ethernet PHY to build a complete NVR pre-processor.
Рекомендуется
Software-Defined Radio Baseband Pre-Processing
The EP3CLS200F484C8ES handles baseband pre-processing in software-defined radio because its 198K logic elements and DSP blocks can implement 64-tap FIR filters, digital down-converters, and FFT engines for narrow-band receivers up to 25 MHz bandwidth. The four PLLs synthesize the precision clocks required by 16-bit ADCs such as the AD9268 or AD9644, while LVDS pairs carry digitized samples into the FPGA at up to 210 Mbps per pair. The AES block on the Cyclone III LS die accelerates secure payload encryption for tactical or licensed-band radios. Compared with a fixed ASIC, the FPGA lets a single platform cover multiple waveform standards by reloading the bitstream in the field, and the FBGA-484 footprint survives extended-temperature mobile deployments.
Рекомендуется
Medical Instrumentation & Portable Test Equipment
The EP3CLS200F484C8ES is a strong fit for portable medical instrumentation because the AES/SHA blocks on the LS die satisfy HIPAA-style data-at-rest encryption without a companion security IC, saving both board space and BOM cost. The 198K logic elements run ultrasound beamformers, ECG/EEG DSP pipelines, and a small Nios II soft-core for system control concurrently, while the 4,488 Kbits of M9K memory buffer raw ADC samples between the front-end and the host processor. The 65 nm process keeps battery drain low enough for handheld ultrasound carts to operate on a single battery charge, and the 210 user I/Os accommodate multi-channel probes. Engineers typically add a TI ADS1278 or Analog Devices ADAS1000 analog front-end for ECG/EEG designs.
Рекомендуется
Automotive Infotainment & Driver-Assist Pre-Processing
The EP3CLS200F484C8ES supports automotive infotainment and driver-assist pre-processing because its 210 LVDS-capable user I/Os can ingest multiple camera streams and bus interfaces (CAN, LIN, FlexRay) while the LUT fabric performs lane-detection, object-classification pre-filtering, and graphics compositing on the head-unit display. The 1.2 V core and 65 nm process deliver the low dynamic power required by always-on rear-view camera systems, and the JTAG-based configuration path supports automotive OEM secure-boot flows. The FBGA-484 footprint provides thermal headroom for fanless dashboard enclosures, and the four PLLs derive independent clock domains for camera, display, and audio buses. Designers building ADAS prototypes typically pair the FPGA with TI FPD-Link III serializers and a Renesas R-Car host processor.
Рекомендуется
Low-Cost Display Controllers & Digital Signage
The EP3CLS200F484C8ES drives multi-panel digital signage because the 210 user I/Os include dedicated LVDS pairs that can source 1080p60 panels directly, and the embedded M9K memory acts as a frame buffer between the network ingest interface and the panel output. The Nios II soft-core running on the FPGA fabric can host a TCP/IP stack, MQTT, and a content scheduler without an external host CPU, reducing total system cost. The four PLLs synthesize independent video clocks for different panel resolutions, while the AES accelerator secures content streaming. Compared with an ARM SoC plus separate LCD controller, the single-FPGA approach halves the PCB footprint and simplifies the supply chain.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP3CLS200F484C8ES — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP3CLS200F484C8 | EP3CLS200F484C8N | EP3CLS200F484C7N | EP3CLS200F484C7 | EP3CLS150F484C8N | EP3CLS150F484C8 |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Altera (now Intel) | Altera (now Intel) - same | Altera (now Intel) - same | Altera (now Intel) - same | Altera (now Intel) - same | Altera (now Intel) - same | Altera (now Intel) - same |
| Logic Elements | 198,464 | 198,464 | 198,464 | 198,464 | 198,464 | 150,848 (-24%) | 150,848 (-24%) |
| Speed Grade | 8 | 8 | 8 | 7 (slower, lower cost) | 7 (slower, lower cost) | 8 | 8 |
| Temperature Grade | Commercial (0 to +85C) | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
| Embedded Memory (Kbit) | 4,488 | 4,488 | 4,488 | 4,488 | 4,488 | 3,888 (-13%) | 3,888 (-13%) |
| Maximum User I/O | 210 | 210 | 210 | 210 | 210 | 210 | 210 |
| RoHS / Pb-Free | RoHS (engineering sample suffix -ES) | Production finish (vendor-dependent) | Pb-free RoHS-compliant (N suffix) | Pb-free RoHS-compliant (N suffix) | Production SnPb finish (vendor-dependent) | Pb-free RoHS-compliant | Production finish (vendor-dependent) |
Ключевые отличия
- Highest-density Cyclone III LS part with engineering-sample ordering code (против EP3CLS150F484C8N)
- Speed grade 8 gives the fastest commercial timing (против EP3CLS200F484C7N)
- Cryptographic accelerators integrated on die (против EP3C120F484I7N (Cyclone III, not LS))
Заметки по проектированию
Estimated: the 484-ball FineLine BGA uses a 1.0 mm ball pitch, which is borderline for cost-effective 4-layer PCB fabrication. For prototypes use at least 6 layers with a dedicated ground plane directly under the BGA. Place at least four thermal vias in a 3x3 array under the central die footprint to keep junction temperature below +85C in commercial-temperature designs and below +100C in industrial-grade builds. The Cyclone III LS Hardware Reference Manual pin table lists dedicated GND ball positions; these must be stitched directly to the inner ground plane with no thermal relief (direct-connect) for best signal integrity.
Estimated: a typical design with 50% logic utilization and 50 MHz toggle rate draws approximately 0.5-0.8 W from the 1.2 V VCCINT rail. Decouple VCCINT with 4x 10 uF bulk ceramics + 16x 0.1 uF chip capacitors placed within 5 mm of the BGA. Use a separate LDO or DC-DC for VCC_PLL because PLL jitter is sensitive to VCCINT noise (PSRR requirement typically 60 dB at 1 MHz per handbook). All unused I/O banks must still have their VCCIO rails powered to a defined voltage (1.2-3.3 V) to avoid leakage through floating ESD structures.
Do not assume the EP3CLS200F484C8ES (engineering sample suffix) is interchangeable with the production EP3CLS200F484C8N: some ES units are pre-production silicon with bitstream-level differences fixed only in production ROM. Always validate your design against the final production datasheet revision. Quartus II 13.0sp1 is the latest version that supports Cyclone III LS - newer Quartus Prime versions do not support this family and will refuse to open the project. For JTAG programming, use only the USB-Blaster or Ethernet Blaster download cables; ByteBlaster II parallel-port cables are not supported on Linux/Windows 10.
Estimated: at full 198K LE utilization with 100% toggle rate, core power can reach 1.5 W. With a junction-to-ambient thermal resistance of approximately 12 C/W (4-layer JEDEC test board), the junction temperature rise is roughly 18 C above ambient - acceptable for commercial but borderline for industrial-temperature enclosures without airflow. Designers targeting sealed industrial housings should either reduce utilization to 70%, drop the clock rate, or add a small aluminum heat spreader attached via thermal interface material to the PCB top-side copper pour.
Информация о соответствии
RoHS and REACH compliance per Altera (now Intel) product declaration. AEC-Q100 is not applicable to FPGAs (passive-programmable logic). Halogen-free status not stated in retrieved datasheets; marked 'unknown'.