EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel
Артикул: EP3SE110F1152C3N ⚠ Последняя закупка| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1780 | $17.800,00 |
| 100 | $1695 | $169.500,00 |
| 500 | $1620 | $810.000,00 |
| 1.000 | $1560 | $1.560.000,00 |
EP3SE110F1152C3N Обзор
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows engineers to implement arbitrary digital logic by configuring an array of configurable logic blocks (CLBs), interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) and are widely used as a flexible alternative to ASICs in applications that demand parallelism, hardware acceleration, and fast time-to-market.
Key features of the EP3SE110F1152C3N include 4,300 logic array blocks (LABs), up to 8,936,448 RAM bits organized in M9K and M144K memory blocks, embedded DSP blocks for high-throughput fixed- and floating-point arithmetic, support for external memory interfaces including DDR3 with read/write leveling, and high-speed LVDS I/O with SERDES capability. The Stratix III E family integrates programmable power technology, allowing unused blocks to enter a low-power state for energy efficiency.
The architecture combines a multi-tier routing fabric with a programmable power network, enabling trade-offs between performance and dynamic power. The 65 nm process and 12-layer flip-chip package provide the signal integrity required for multi-gigabit serial interfaces and 400 MHz external memory interfaces typical of telecom and DSP applications.
Typical applications include high-performance digital signal processing, wireline and wireless baseband processing, military/aerospace signal processing, ASIC prototyping, high-speed data acquisition, and video broadcast equipment. The 744 user I/Os and large logic capacity also make the EP3SE110F1152C3N well-suited for protocol bridging and custom interface aggregation.
Designers should plan PCB layout for the 35 mm × 35 mm FC-FBGA-1152 package with at least 6 routing layers, use controlled impedance for high-speed differential pairs, and follow Intel's power distribution decoupling guidelines for Stratix III to achieve the published 500 MHz core performance and full I/O bandwidth.
This page synthesizes distributor stock data, drop-in same-package alternatives from the Stratix III family, and Stratix III power/PCB design notes not found in a single distributor listing, helping engineers compare alternatives and qualify supply faster.
Аналоги без доработки для EP3SE110F1152C3N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP3SE110F1152C3N (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Family, Speed Grade, Process Technology.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP3SE110F1152C4N
✅ Прямая замена✓ В наличии
$1395 / шт.
Открыть даташит →EP3SE110F1152C2N
✅ Прямая замена✓ В наличии
$1925 / шт.
Открыть даташит →EP3SE110F1152C2NES
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$1320 / шт.
Открыть даташит →EP3SE110F1152C2
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$4100 / шт.
Открыть даташит →EP3SE110F1152C3
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$3200 / шт.
Открыть даташит →EP3SE110F1152C3N Максимальные параметры и электрические характеристики
| Family | Stratix III E |
| Series | Stratix III |
| Logic Elements (LE) | 107,500 |
| Logic Array Blocks (LABs) | 4,300 |
| Total RAM Bits | 8,936,448 |
| User I/Os | 744 |
| Operating Frequency (max) | 500 MHz |
| Core Supply Voltage | 1.1 V nominal |
| Process Technology | 65 nm TSMC |
| Package Type | FC-FBGA-1152 (flip-chip BGA) |
| Рабочая температура | 0 °C to 85 °C (commercial) |
| Speed Grade | C3 |
| Тип монтажа | Surface Mount |
| Способ монтажа | SMD/SMT (Tray) |
| DSP Blocks | Yes (embedded multipliers) |
| Тип памяти | M9K and M144K block RAM |
| External Memory Support | DDR/DDR2/DDR3 with read/write leveling |
| Boundary Scan | IEEE 1149.1 (JTAG) |
| Lead-Free | Yes (per Altera/Intel datasheet family convention) |
Руководство по цоколевке EP3SE110F1152C3N в корпусе fc-fbga-1152 (flip-chip bga)
Цоколевка для EP3SE110F1152C3N (корпус fc-fbga-1152 (flip-chip bga)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP3SE110F1152C3N.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP3SE110F1152C3N подходит для 6 применениеs: High-Performance Digital Signal Processing, Wireline Telecom and Baseband Processing, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, High-Speed Data Acquisition Systems, Video Broadcast and Imaging Equipment.
High-Performance Digital Signal Processing
The EP3SE110F1152C3N is well suited to high-performance DSP workloads thanks to its 107,500 logic elements, embedded DSP blocks, and 8,936,448 bits of block RAM. The Stratix III E family pairs variable-precision multipliers with dedicated accumulator chains, enabling efficient FFT, FIR, and matrix arithmetic at clock rates up to 500 MHz. Compared with a DSP-only processor, the FPGA parallelises hundreds of MAC operations per cycle, making it a natural fit for radar, software-defined radio, and baseband signal chains where throughput-per-watt dominates the design budget.
Рекомендуется
Wireline Telecom and Baseband Processing
Wireline and wireless baseband designs benefit from the EP3SE110F1152C3N's 744 user I/Os, high-speed LVDS support, and DDR3 external memory interface with read/write leveling. The Stratix III E fabric implements channel cards, framer/mapper functions, and forward-error-correction (FEC) blocks that would otherwise require an ASIC. Designers can allocate on-chip M9K/M144K blocks to packet buffers and lookup tables while reserving DSP blocks for Viterbi or turbo decoding, achieving line-rate processing on a single FPGA.
Рекомендуется
ASIC Prototyping and Emulation
The 107,500 LE capacity of the EP3SE110F1152C3N gives ASIC prototyping teams enough logic density to map medium-scale ASICs one-to-one, avoiding time-multiplexing overhead and preserving cycle-accurate behaviour. The 1152-ball FC-FBGA delivers the I/O count required to bring out large ASIC pin sets for real-world stimulus, and the IEEE 1149.1 JTAG chain integrates with commercial emulation debuggers. The 65 nm Stratix III silicon closely tracks the timing of production ASIC nodes, improving pre-silicon verification confidence.
Рекомендуется
Military and Aerospace Signal Processing
Defense and aerospace platforms leverage the EP3SE110F1152C3N for radar DSP, electronic warfare, and secure communications, where commercial-grade silicon (0 to 85 °C) is acceptable for ground-based systems and laboratory equipment. The high logic count supports beamforming, pulse compression, and direction-finding algorithms in a single device. Note that for flight-grade or extreme-temperature deployments, designers should migrate to radiation-hardened equivalents such as Microsemi/Microchip RTAX or Xilinx Virtex-5QV rather than rely on the commercial Stratix III.
Рекомендуется
High-Speed Data Acquisition Systems
Data acquisition cards built around the EP3SE110F1152C3N benefit from its 744 I/Os and DDR3 memory controller, which buffer multi-gigasample-per-second ADC streams before forwarding to a host over PCIe or 10 Gigabit Ethernet. The Stratix III fabric implements real-time FIR filtering, decimation, and trigger logic directly in hardware, offloading the host CPU. Programmable power technology lets unused LABs enter a low-power state, helping thermal budgets on densely populated ADC boards.
Рекомендуется
Video Broadcast and Imaging Equipment
Broadcast video routers, format converters, and image processing pipelines map efficiently onto the EP3SE110F1152C3N. The large block-RAM pool stores multiple frames of video for colour-space conversion and scaling, while the high-speed LVDS I/O links to HDMI, SDI, or DisplayPort serializer/deserializer chips. The C3 speed grade typically delivers sufficient timing margin for SD/HD video line rates; designers targeting 4K or higher should consider the C4 variant or migrate to Stratix V with integrated transceivers.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP3SE110F1152C3N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP3SE110F1152C4N | EP3SE110F1152C2N | EP3SE110F1152C2 | EP3SE110F1152C3 |
|---|---|---|---|---|---|
| Package | FC-FBGA-1152 | FC-FBGA-1152 (same) | FC-FBGA-1152 (same) | FC-FBGA-1152 (same) | FC-FBGA-1152 (same) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E |
| Speed Grade | C3 | C4 (faster) | C2 (slower, lower power) | C2 (slower, lower power) | C3 (same) |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Total RAM Bits | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 |
| User I/Os | 744 | 744 | 744 | 744 | 744 |
| Operating Temperature | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Ключевые отличия
- Same FC-FBGA-1152 footprint with finer speed-bin flexibility (против EP3SE110F1152C2N)
- Higher signal-integrity margin for 500 MHz designs (против EP3SE110F1152C4N)
- Direct second-source on the same Stratix III E silicon (против EP3SE110F1152C3 (without N suffix))
Заметки по проектированию
The FC-FBGA-1152 package uses a 1.0 mm ball pitch on a 35 mm × 35 mm substrate and demands a minimum of six PCB layers with microvia stacks. According to Altera Stratix III board design guidelines, allocate dedicated ground and power planes directly under the device, use 100 Ω differential impedance for LVDS pairs, and escape signals through staggered microvias to avoid via stubs above 0.3 mm. Skimping on layer count or stack-up symmetry will compromise DDR3 read/write-leveling margins.
At full logic utilization (90% LE, 80% DSP), the EP3SE110F1152C3N can dissipate 8–12 W depending on toggle rate and clocking profile. Stratix III programmable power technology shuts down unused LABs, so enabling the Quartus II PowerPlay power analyzer and forcing unused blocks to low-power mode is essential. A heatsink with 4–6 W/K thermal resistance, mounted with a thermal interface material rated for 1.0 W/mK or better, is typical for convection-cooled chassis.
The Stratix III core requires a 1.1 V supply with ±30 mV tolerance under 5 A dynamic load. Use a multi-phase PWM controller such as the Intel Enpirion EM11x0 family or equivalent, followed by a low-ESR polymer bulk capacitor bank (4× 220 µF) plus 22 µF ceramics at each supply pin. Independent 2.5 V and 1.8 V supplies are required for the I/O banks and PLL analog rails - isolate these with ferrite beads to prevent switching noise injection.
Do not assume the C3 speed grade meets the same fMAX as a C4 part when migrating between boards - re-run Quartus II TimeQuest timing analysis after a substitution. Also, configuration modes (Passive Serial, Fast Passive Parallel, JTAG) require correct MSEL pin strapping; floating MSEL pins are a common cause of configuration failure on first prototypes. Reference the Stratix III configuration handbook for the supported mode pins per package.
Информация о соответствии
Compliance status not explicitly stated in the provided web data. Per Altera/Intel datasheet family convention, modern Altera FPGAs are lead-free. AEC-Q100 is not applicable to FPGAs of this complexity.
