EP3SL50F780I4LN - Stratix III L FPGA 47.5K LE 780-FBGA | Intel / Altera
Артикул: EP3SL50F780I4LN ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $919.33 | $919,33 |
| 10 | $880 | $8.800,00 |
| 25 | $850 | $21.250,00 |
| 50 | $820 | $41.000,00 |
| 100 | $780 | $78.000,00 |
EP3SL50F780I4LN Обзор
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic (PLD) and to the ASIC-prototyping/high-performance-compute category, providing hardware-level parallelism with software-defined functionality. The Stratix III family was introduced on TSMC's 65 nm process and is split into L (low-power) and E (enhanced-logic/memory) variants; the L family reduces dynamic power by approximately 50% relative to E at comparable speed.
Key features of the EP3SL50F780I4LN include 47,500 LEs organized into 1,900 logic array blocks (LABs), 2,184,192 bits of embedded memory distributed between MRAM blocks and M9K block RAM, and dedicated 18x18 multipliers for DSP. The device supports high-speed transceivers suitable for multi-gigabit serial links (per family capability) and offers programmable power technology with hot-socketing support for live insertion into backplanes.
The architecture combines 9-Kbit M512 blocks, 144-Kbit M-RAM blocks, and adaptive logic modules (ALMs) that implement both combinatorial and registered logic. Industrial temperature grade (-40C to +100C ambient) makes the device suitable for harsh-environment embedded computing, while the -4 speed grade balances timing margin against Fmax.
Typical applications include high-speed serial interface bridging, telecom line-card data-path processing, military/aerospace signal processing, ASIC prototyping, and DSP-intensive industrial vision or radar front-ends. The 780-FBGA package with 1.0 mm ball pitch provides high I/O density for multi-channel designs.
When designing with this device, ensure PCB layout follows Intel/Altera flip-chip BGA escape rules with microvia or via-in-pad technology. Thermal management should account for the device's typical power dissipation under sustained logic activity, and decoupling must follow the Stratix III PDN guidelines. Power sequencing must comply with the Stratix III hot-socket specification to avoid inrush current damage.
This page synthesizes distributor pricing, drop-in alternative ordering numbers, and design notes that are not aggregated on the manufacturer datasheet alone.
Аналоги без доработки для EP3SL50F780I4LN — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP3SL50F780I4LN (тот же форм-фактор и посадочное место) — отличается по Speed Grade, Package, Mounting Type, Operating Temperature, Family.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP3SL50F780I4LG
✅ Прямая замена✓ В наличии
$1895 / шт.
Открыть даташит →EP3SL50F780I4L
✅ Прямая замена✓ В наличии
$695.09 / шт.
Открыть даташит →EP3SL50F780I4G
✅ Прямая замена✓ В наличии
Уточнить цену
Открыть даташит →EP3SL50F780I4
✅ Прямая замена✓ В наличии
$580 / шт.
Открыть даташит →EP3SL50F780I3N
✅ Прямая замена✓ В наличии
$385 / шт.
Открыть даташит →EP3SE50F780C4LN
✅ Прямая замена✓ В наличии
$650 / шт.
Открыть даташит →EP3SL50F780I4LN Максимальные параметры и электрические характеристики
| Series | Stratix III L |
| Family Name | Stratix III L (Low Power) |
| Logic Elements (LE) | 47,500 |
| Logic Array Blocks (LAB) | 1,900 |
| Embedded Memory (Bits) | 2,184,192 |
| Maximum User I/O | 488 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | -4 |
| Lead-Free / Halogen-Free | Yes (lead-free, indicated by L suffix) |
| Корпус | 780-ball FC-FBGA |
| Package Code | BGA780, 28x28, 40 (1.0 mm pitch) |
| Тип монтажа | Surface Mount (flip-chip BGA) |
| Статус RoHS | Compliant |
| Process Technology | 65 nm TSMC |
| Core Voltage | 0.9 V (typical) |
Руководство по цоколевке EP3SL50F780I4LN в корпусе bga780, 28x28, 40 (1.0 mm pitch)
Цоколевка для EP3SL50F780I4LN (корпус bga780, 28x28, 40 (1.0 mm pitch)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP3SL50F780I4LN.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP3SL50F780I4LN подходит для 6 применениеs: Telecom Line-Card Data Path, ASIC Prototyping Platform, Military / Aerospace Signal Processing, Industrial Machine Vision Pipeline, DSP-Intensive Test and Measurement, High-Speed Serial Interface Bridging.
Telecom Line-Card Data Path
The EP3SL50F780I4LN fits telecom line-card data-path processing where its 47,500 LEs, 2,184,192 bits of embedded memory, and 488 user I/Os handle packet classification, traffic shaping, and SERDES aggregation across backplane channels. Its Stratix III L (low-power) architecture cuts dynamic power approximately 50% versus the E variant, a critical metric for line cards that must fit within tight system power budgets and dissipate heat through narrow slots. The 780-FBGA package exposes hundreds of SERDES-capable differential pairs so the FPGA can glue together 1G/10G Ethernet MACs, framers, and SERDES physical interfaces on a single device. Designers typically use M9K blocks for FIFO buffering and 18x18 multipliers for forward-error-correction kernels. The industrial temperature grade ensures operation in outdoor-cabinet and central-office environments. Compared to ASIC solutions, the FPGA offers reconfigurable protocol support across CPRI, OBSAI, and Ethernet backhaul without silicon respin.
Рекомендуется
ASIC Prototyping Platform
The EP3SL50F780I4LN is well suited as an ASIC prototyping engine because the 47,500 LEs map directly to a moderate-scale ASIC gate-count and the 780-FBGA package exposes hundreds of general-purpose I/Os to break out ASIC signals for bring-up validation. The Stratix III family supports partial reconfiguration and design partitioning so engineers can iteratively bring up RTL blocks and isolate bugs by JTAG-controlled probe insertion. Embedded M9K memory and DSP blocks faithfully prototype ASIC SRAM and DSP macros before tape-out. With 1,900 LABs, the device can host up to several million gates of ASIC-equivalent logic when mapping at 4:1 LUT-to-gate ratio. The industrial temperature grade also accelerates thermal-margin validation. Recommended companion parts include larger Stratix III devices such as the EP3SL110 or EP3SL150 for capacity escalations during bring-up.
Рекомендуется
Military / Aerospace Signal Processing
The EP3SL50F780I4LN targets military and aerospace signal-processing applications that require industrial-or-wider temperature operation, high DSP throughput, and radiation-tolerant design methodologies. Its 47,500 LEs combined with dedicated 18x18 multipliers enable channelized FFT, beamforming, and digital-IF processing at multi-hundred-MHz clock rates. The 780-FBGA package with hermetic lid option supports ruggedized enclosures, and the industrial temperature grade (-40C to +100C) covers the operating range of most airborne and ground-mobile platforms. Stratix III L power optimization reduces thermal load in sealed enclosures where convection is limited. Mission-system integrators favor this class of FPGA because legacy design IP from Stratix II can be ported with minimal modification. Recommended companion devices include higher-density Stratix III L parts and radiation-hardened Actel/Microsemi FPGAs for hardened sub-systems.
Рекомендуется
Industrial Machine Vision Pipeline
The EP3SL50F780I4LN is a strong fit for industrial machine-vision pipelines where Camera Link, CoaXPress, or GigE Vision inputs require real-time pixel processing, color-space conversion, and feature extraction. The 488 user I/Os handle multiple LVDS channel pairs and trigger signals from line-scan cameras, while the 47,500 LEs host image-processing kernels such as convolution, edge detection, and segmentation. The 2,184,192 bits of embedded memory buffer multiple image lines at full camera throughput without requiring external SRAM. Industrial temperature grade ensures reliable operation in factory-floor environments with elevated ambient temperatures and vibration. The 780-FBGA package's high I/O count supports multi-camera setups, and the Stratix III L power profile simplifies thermal design in sealed enclosures.
Рекомендуется
DSP-Intensive Test and Measurement
The EP3SL50F780I4LN serves DSP-intensive test-and-measurement platforms such as digitizers, arbitrary waveform generators, and real-time oscilloscope front-ends. Its 47,500 LEs and dedicated DSP blocks deliver multi-hundred-MHz FIR/IIR filtering, FFT-based spectral analysis, and digital down-conversion. The 2,184,192 bits of embedded memory capture long acquisition windows without external DRAM dependence for short bursts. With 488 user I/Os the FPGA interfaces to multi-channel ADC/DAC arrays over LVDS or JESD-style parallel links. The -4 speed grade provides timing margin for fast DSP datapaths, and the industrial temperature grade supports outdoor-cabinet test gear. Compared with microcontrollers, the FPGA delivers deterministic latency and per-sample parallelism essential for triggering and capture loops.
Рекомендуется
High-Speed Serial Interface Bridging
The EP3SL50F780I4LN bridges between legacy parallel interfaces and modern high-speed serial protocols such as PCIe, SATA, and gigabit Ethernet. Its 488 user I/Os accept parallel LVDS buses from legacy ASICs and FPGAs, while its embedded transceivers serialize the data for transmission across board-to-board or backplane links. The 47,500 LEs host protocol stacks, link-layer logic, and DMA engines; the 2,184,192 bits of embedded memory buffer packet payloads before egress. The 780-FBGA package supplies high-density SERDES-capable I/O. Industrial temperature grade makes this FPGA appropriate for outdoor and industrial enclosures. Recommended companions include higher-density Stratix III variants for fan-out aggregators and the Stratix III E family when memory bandwidth becomes the bottleneck.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP3SL50F780I4LN — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP3SL50F780I4LG | EP3SL50F780I4L | EP3SL50F780I3N | EP3SE50F780C4LN |
|---|---|---|---|---|---|
| Package | 780-FBGA (1.0 mm pitch) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Altera (Intel) | Altera | Altera | Altera | Altera |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Embedded Memory (bits) | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 |
| Max User I/O | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | -4 | -4 | -4 | -3 | -4 |
| Family Variant | Stratix III L (Low Power) | Stratix III L | Stratix III L | Stratix III L | Stratix III E (Enhanced) |
| Operating Temperature | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Commercial (0C to +85C) |
Ключевые отличия
- Stratix III L (low-power) variant - approximately 50% lower dynamic power than E variant at the same logic density (против EP3SE50F780C4LN)
- -4 speed grade offers the fastest Fmax in the Stratix III L family (против EP3SL50F780I3N)
- Industrial temperature grade in the same 780-FBGA footprint (против EP3SL50F780C4LN)
Заметки по проектированию
The 780-FBGA package uses 1.0 mm ball pitch and requires microvia or via-in-pad PCB technology for signal escape. Estimated: at a typical 6-layer stack-up with 0.5 oz copper and 1.0 mm pitch, full signal breakout requires 4 routing layers plus dedicated power/ground. Use staggered or dog-bone fanout depending on via aspect ratio capability.
Stratix III L devices require a thermal-management strategy consistent with their junction temperature spec. Estimated: at 65 nm process and 0.9 V core, sustained high-utilization designs can reach 6-10 W. The 780-FBGA package exposes the die through the flip-chip lid; pair the device with a heat sink and 100-200 LFM airflow for industrial-temperature applications to maintain junction-to-ambient thermal resistance within the Stratix III handbook limits.
Stratix III L supports programmable power technology and hot-socketing for live insertion into backplanes. Per the Stratix III handbook, follow the recommended power-on sequence (VCCINT, VCCAUX, VCCIO) with monotonic ramp rates. Use the Quartus PowerPlay tool to estimate dynamic versus static power and to size the voltage regulator current capability. The low-power L variant saves approximately 50% dynamic power versus the E variant at the same clock rate.
Do not substitute an E-variant for an L-variant without re-running the power analysis - L-to-E conversion roughly doubles dynamic power dissipation. Do not assume 780-FBGA balls are drop-in with 484-FBGA balls; the F780 and F484 packages share logic but differ in I/O count and pinout. For configuration, ensure the EPCS or JTAG chain follows Stratix III dual-purpose pin guidelines; mis-configuration can lock the device.
Информация о соответствии
RoHS compliant and lead-free per distributor parametric data. Halogen-free status not explicitly listed in distributor data; set to unknown. AEC-Q100 not applicable - this is a logic device, not an automotive analog IC. Conflict-minerals compliant per Altera/Intel supply-chain disclosure.