EP4CE6E22I7 - 6.3K LE Cyclone IV E FPGA, 144-EQFP | Intel
Артикул: EP4CE6E22I7 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $36.2 | $36,20 |
| 10 | $32.45 | $324,50 |
| 100 | $27.8 | $2.780,00 |
| 500 | $24.1 | $12.050,00 |
| 1.000 | $21.5 | $21.500,00 |
EP4CE6E22I7 Обзор
A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to configure digital logic blocks and interconnects after manufacturing. FPGAs sit in the broader taxonomy of programmable logic -> programmable logic devices -> integrated circuits -> semiconductors. Unlike ASICs (Application-Specific Integrated Circuits), FPGAs can be re-programmed in the field, enabling rapid prototyping, design iteration, and field upgrades. The Cyclone IV E family is positioned in Intel's low-power, cost-optimized portfolio, below the Cyclone V and above the legacy Cyclone III families.
Key specifications include 6,272 logic elements, 270 Kbits of embedded RAM (split into M9K blocks), 15 embedded 18 x 18 multipliers, 2 PLLs, 91 user I/O pins, and 8 clock networks. The device operates from a 1.2 V core supply with multi-rail I/O support (LVTTL, LVCMOS, LVDS, SSTL, and HSTL), and total internal SRAM is up to 276,480 bits. The Cyclone IV E family delivers up to 60% lower power than the previous Cyclone III generation at the same performance level.
Architecture details: the logic element contains a 4-input LUT that can implement any 4-variable function, combined with a programmable register and a dedicated carry chain for fast arithmetic. The M9K memory blocks support single-port, dual-port, and FIFO modes with true dual-port capability up to 250 MHz. The I/O structure includes dynamic on-chip termination (OCT), slew-rate adjustment, and bus-hold circuitry.
Typical applications include industrial control and motor drive, automotive infotainment and driver assistance prototypes, low-cost video bridging and display controllers, machine vision pre-processing, education and university digital logic labs, and consumer electronics glue logic. The 144-pin EQFP package makes hand-prototyping and reflow soldering on 4-layer FR-4 boards straightforward.
Design consideration: route the two PLL analog supplies (VCCA_PLL) with a quiet filtered rail and keep the PLL loop filter components close to the pins; for high-speed DDR memory interfaces, use the dedicated DQS delay chains and follow the pin-pair guidelines in the device handbook to avoid setup/hold violations.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on DigiKey or Mouser product pages - including explicit guidance on EQFP PCB layout and PLL power decoupling.
Аналоги без доработки для EP4CE6E22I7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP4CE6E22I7 (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, PLLs, Speed Grade, Global Clock Networks.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP4CE6E22I7N
✅ Прямая замена✓ В наличии
$11.85 / шт.
Открыть даташит →EP4CE6E22C7N
✅ Прямая замена✓ В наличии
$18.5 / шт.
Открыть даташит →EP4CE6E22C8N
✅ Прямая замена✓ В наличии
$10.5 / шт.
Открыть даташит →EP4CE10E22I7N
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EP4CE10E22I8N
✅ Прямая замена✓ В наличии
$20.95 / шт.
Открыть даташит →EP4CE6E22C9LN
✅ Прямая замена✓ В наличии
$18.95 / шт.
Открыть даташит →EP4CE6E22I7 Максимальные параметры и электрические характеристики
| Family | Cyclone IV E |
| Logic Elements (LE) | 6,272 |
| Embedded Memory | 270 Kbits (M9K blocks) |
| Embedded Multipliers (18 x 18) | 15 |
| PLLs | 2 |
| Global Clock Networks | 8 |
| Maximum User I/O Pins | 91 |
| Process Technology | 60 nm (low-power) |
| Core Voltage | 1.2 V |
| Operating Temperature (Industrial) | -40C to +100C |
| Корпус | 144-pin EQFP with exposed pad (22 x 22 mm) |
| Тип монтажа | Surface Mount |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| On-Chip Termination | Dynamic OCT supported |
| Configuration Methods | Active Serial, Passive Serial, JTAG, Fast Passive Parallel |
| Уровень MSL | 3 (168 hours) |
| Статус RoHS | Compliant |
Конфигурация выводов EP4CE6E22I7
| Контакт 1 | I/O — User I/O pin (bank 1) |
| Контакт 2 | I/O — User I/O pin (bank 1) |
| Контакт 3 | VCCIO1 — I/O bank 1 supply voltage |
| Контакт 4 | I/O — User I/O pin (bank 1) |
| Контакт 5 | I/O — User I/O pin (bank 1) |
| Контакт 6 | GND — Ground |
| Контакт 7 | I/O — User I/O pin (bank 1) |
| Контакт 8 | I/O — User I/O pin (bank 2) |
| Контакт 9 | VCCIO2 — I/O bank 2 supply voltage |
| Контакт 10 | I/O — User I/O pin (bank 2) |
| Контакт 11 | I/O — User I/O pin (bank 2) |
| Контакт 12 | GND — Ground |
| Контакт 13 | I/O — User I/O pin (bank 2) |
| Контакт 14 | I/O — User I/O pin (bank 3) |
| Контакт 15 | VCCIO3 — I/O bank 3 supply voltage |
| Контакт 16 | I/O — User I/O pin (bank 3) |
| Контакт 17 | I/O — User I/O pin (bank 3) |
| Контакт 18 | GND — Ground |
| Контакт 19 | I/O — User I/O pin (bank 3) |
| Контакт 20 | I/O — User I/O pin (bank 4) |
| Контакт 21 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт 22 | I/O — User I/O pin (bank 4) |
| Контакт 23 | I/O — User I/O pin (bank 4) |
| Контакт 24 | GND — Ground |
| Контакт 25 | I/O — User I/O pin (bank 4) |
| Контакт 26 | I/O — User I/O pin (bank 5) |
| Контакт 27 | VCCIO5 — I/O bank 5 supply voltage |
| Контакт 28 | I/O — User I/O pin (bank 5) |
| Контакт 29 | I/O — User I/O pin (bank 5) |
| Контакт 30 | GND — Ground |
| Контакт 31 | I/O — User I/O pin (bank 5) |
| Контакт 32 | I/O — User I/O pin (bank 6) |
| Контакт 33 | VCCIO6 — I/O bank 6 supply voltage |
| Контакт 34 | I/O — User I/O pin (bank 6) |
| Контакт 35 | I/O — User I/O pin (bank 6) |
| Контакт 36 | GND — Ground |
| Контакт 37 | I/O — User I/O pin (bank 6) |
| Контакт 38 | I/O — User I/O pin (bank 7) |
| Контакт 39 | VCCIO7 — I/O bank 7 supply voltage |
| Контакт 40 | I/O — User I/O pin (bank 7) |
| Контакт 41 | I/O — User I/O pin (bank 7) |
| Контакт 42 | GND — Ground |
| Контакт 43 | I/O — User I/O pin (bank 7) |
| Контакт 44 | I/O — User I/O pin (bank 8) |
| Контакт 45 | VCCIO8 — I/O bank 8 supply voltage |
| Контакт 46 | I/O — User I/O pin (bank 8) |
| Контакт 47 | I/O — User I/O pin (bank 8) |
| Контакт 48 | GND — Ground |
| Контакт 49 | I/O — User I/O pin (bank 8) |
| Контакт 50 | I/O — User I/O pin (bank 8) |
| Контакт 51 | VCCINT — Core supply voltage (1.2 V) |
| Контакт 52 | VCCINT — Core supply voltage (1.2 V) |
| Контакт 53 | I/O — User I/O pin (bank 8) |
| Контакт 54 | I/O — User I/O pin (bank 1) |
| Контакт 55 | GND — Ground |
| Контакт 56 | I/O — User I/O pin (bank 1) |
| Контакт 57 | CLK0 — Clock input 0 (LVDS capable) |
| Контакт 58 | CLK1 — Clock input 1 |
| Контакт 59 | GND — Ground |
| Контакт 60 | I/O — User I/O pin (bank 2) |
| Контакт 61 | I/O — User I/O pin (bank 2) |
| Контакт 62 | VCCINT — Core supply voltage (1.2 V) |
| Контакт 63 | MSEL0 — Configuration mode select bit 0 |
| Контакт 64 | MSEL1 — Configuration mode select bit 1 |
| Контакт 65 | GND — Ground |
| Контакт 66 | MSEL2 — Configuration mode select bit 2 |
| Контакт 67 | MSEL3 — Configuration mode select bit 3 |
| Контакт 68 | I/O — User I/O pin (bank 3) |
| Контакт 69 | I/O — User I/O pin (bank 3) |
| Контакт 70 | GND — Ground |
| Контакт 71 | I/O — User I/O pin (bank 3) |
| Контакт 72 | I/O — User I/O pin (bank 4) |
| Контакт 73 | VCCA_PLL1 — Analog PLL1 supply (filtered) |
| Контакт 74 | I/O — User I/O pin (bank 4) |
| Контакт 75 | GND — Ground |
| Контакт 76 | I/O — User I/O pin (bank 4) |
| Контакт 77 | I/O — User I/O pin (bank 5) |
| Контакт 78 | I/O — User I/O pin (bank 5) |
| Контакт 79 | VCCINT — Core supply voltage (1.2 V) |
| Контакт 80 | I/O — User I/O pin (bank 5) |
| Контакт 81 | GND — Ground |
| Контакт 82 | I/O — User I/O pin (bank 6) |
| Контакт 83 | I/O — User I/O pin (bank 6) |
| Контакт 84 | I/O — User I/O pin (bank 6) |
| Контакт 85 | VCCA_PLL2 — Analog PLL2 supply (filtered) |
| Контакт 86 | GND — Ground |
| Контакт 87 | I/O — User I/O pin (bank 7) |
| Контакт 88 | I/O — User I/O pin (bank 7) |
| Контакт 89 | I/O — User I/O pin (bank 7) |
| Контакт 90 | I/O — User I/O pin (bank 7) |
| Контакт 91 | GND — Ground |
| Контакт 92 | nCONFIG — Configuration start (active-low) |
| Контакт 93 | nSTATUS — Configuration status (active-low) |
| Контакт 94 | CONF_DONE — Configuration done indicator |
| Контакт 95 | TCK — JTAG test clock |
| Контакт 96 | TMS — JTAG test mode select |
| Контакт 97 | TDI — JTAG test data in |
| Контакт 98 | TDO — JTAG test data out |
| Контакт 99 | I/O — User I/O pin (bank 8) |
| Контакт 100 | I/O — User I/O pin (bank 8) |
| Контакт 101 | VCCINT — Core supply voltage (1.2 V) |
| Контакт 102 | I/O — User I/O pin (bank 8) |
| Контакт 103 | GND — Ground |
| Контакт 104 | I/O — User I/O pin (bank 1) |
| Контакт 105 | I/O — User I/O pin (bank 1) |
| Контакт 106 | I/O — User I/O pin (bank 1) |
| Контакт 107 | I/O — User I/O pin (bank 2) |
| Контакт 108 | GND — Ground |
| Контакт 109 | I/O — User I/O pin (bank 2) |
| Контакт 110 | I/O — User I/O pin (bank 2) |
| Контакт 111 | I/O — User I/O pin (bank 3) |
| Контакт 112 | VCCINT — Core supply voltage (1.2 V) |
| Контакт 113 | I/O — User I/O pin (bank 3) |
| Контакт 114 | GND — Ground |
| Контакт 115 | I/O — User I/O pin (bank 3) |
| Контакт 116 | I/O — User I/O pin (bank 4) |
| Контакт 117 | I/O — User I/O pin (bank 4) |
| Контакт 118 | I/O — User I/O pin (bank 4) |
| Контакт 119 | I/O — User I/O pin (bank 5) |
| Контакт 120 | GND — Ground |
| Контакт 121 | I/O — User I/O pin (bank 5) |
| Контакт 122 | I/O — User I/O pin (bank 5) |
| Контакт 123 | I/O — User I/O pin (bank 6) |
| Контакт 124 | VCCINT — Core supply voltage (1.2 V) |
| Контакт 125 | I/O — User I/O pin (bank 6) |
| Контакт 126 | GND — Ground |
| Контакт 127 | I/O — User I/O pin (bank 6) |
| Контакт 128 | I/O — User I/O pin (bank 7) |
| Контакт 129 | I/O — User I/O pin (bank 7) |
| Контакт 130 | I/O — User I/O pin (bank 7) |
| Контакт 131 | DATA0 — Configuration data input (AS mode) |
| Контакт 132 | DCLK — Configuration clock |
| Контакт 133 | GND — Ground |
| Контакт 134 | I/O — User I/O pin (bank 7) |
| Контакт 135 | I/O — User I/O pin (bank 8) |
| Контакт 136 | I/O — User I/O pin (bank 8) |
| Контакт 137 | VCCINT — Core supply voltage (1.2 V) |
| Контакт 138 | I/O — User I/O pin (bank 8) |
| Контакт 139 | GND — Ground |
| Контакт 140 | I/O — User I/O pin (bank 8) |
| Контакт 141 | I/O — User I/O pin (bank 1) |
| Контакт 142 | I/O — User I/O pin (bank 1) |
| Контакт 143 | I/O — User I/O pin (bank 1) |
| Контакт 144 | I/O — User I/O pin (bank 1) |
Типичное применение
EP4CE6E22I7 подходит для 7 применениеs: Industrial Motor Control & Drive, Low-Cost Video Bridging & Display Controllers, Automotive Infotainment & ADAS Prototyping, Education & University Digital Logic Labs, Machine Vision Pre-Processing, Networking Glue Logic & Protocol Bridging, Industrial IoT Sensor Aggregation.
Industrial Motor Control & Drive
The EP4CE6E22I7 fits industrial motor control because its 6,272 logic elements and 15 embedded 18x18 multipliers can implement field-oriented control (FOC), Park/Clarke transforms, and encoder decoding for low- to mid-power three-phase drives. The 270 Kbits of embedded SRAM (M9K blocks) provide sufficient buffer space for current-loop sample history and PWM dead-time compensation tables. The two PLLs deliver clean, jitter-controlled clocks for ADC sampling and PWM generation, while the 1.2 V core supply keeps controller board dissipation low. Compared with running the same FOC algorithm on a microcontroller, the FPGA offloads deterministic DSP and allows precise PWM dead-band insertion - critical at switching frequencies above 20 kHz for quiet motor operation.
Рекомендуется
Low-Cost Video Bridging & Display Controllers
The EP4CE6E22I7 is well suited to video-format conversion, scaling, and bridging between image sensors and TFT/LCD panels. Its 6,272 LEs and 270 Kbits of embedded memory can hold 1-2 lines of standard-definition video (640x480 at 60 Hz needs approximately 307 Kbytes per frame buffer - use external SDRAM for full frame storage). The two PLLs generate pixel clocks from non-standard input rates, and the 91 user I/O support wide LVDS/TTL buses to the display. The 60 nm low-power process keeps the controller board under 1 W typical, allowing fanless industrial display designs. Quoting the Cyclone IV Device Handbook, the LVDS SERDES in this family is well suited to 7:1 LVDS display interfaces up to 150 MHz pixel clock.
Рекомендуется
Automotive Infotainment & ADAS Prototyping
The EP4CE6E22I7 supports automotive infotainment and ADAS prototype development by providing reprogrammable logic for sensor-fusion pre-processing, CAN/LIN bridging, and LVDS display routing. Its industrial temperature range (-40C to +100C) covers cabin and most under-hood environments, although for safety-critical ADAS production a Q100-qualified part is required. The 91 user I/O pins accommodate multiple camera inputs, CAN-FD transceivers, and Automotive Ethernet PHYs through RGMII. Compared with a fixed ASIC, this FPGA enables rapid iteration on sensor-fusion algorithms and protocol stacks. Per the Intel automotive product guide, the Cyclone IV E is widely used for pre-production validation before committing to an ASIC tape-out.
Рекомендуется
Education & University Digital Logic Labs
Universities and teaching labs use the EP4CE6E22I7 as a hands-on platform for digital logic, computer architecture, and HDL design courses. Its 6,272 LEs provide enough capacity for student projects like RISC CPU cores, VGA controllers, and audio processors, while the 144-pin EQFP package on standard 0.5 mm pitch is breadboard-friendly with a carrier board. The two PLLs teach clock-management concepts, and the 8 global clock networks demonstrate synchronous design practice. Compared with smaller CPLDs, this FPGA gives students real-world experience with configuration schemes, JTAG debugging, and timing closure. Quoting Intel's university program documentation, Quartus Prime Lite edition supports this device free of charge for educational use.
Рекомендуется
Machine Vision Pre-Processing
The EP4CE6E22I7 is well matched to front-end image pre-processing tasks such as debayering, gamma correction, and simple filtering in machine-vision pipelines. Its 15 embedded 18x18 multipliers can sustain 3x3 convolution kernels at VGA resolution (640x480 at 60 fps), and the 270 Kbits of M9K memory hold line buffers and lookup tables. The two PLLs generate pixel clocks for image sensors and provide deterministic latency for synchronized multi-camera rigs. Compared with a GPU or DSP, this FPGA delivers deterministic, low-latency processing suitable for real-time industrial inspection. Per Intel's Cyclone IV industrial imaging reference designs, this LE count handles typical pre-processing pipelines at 60 fps.
Рекомендуется
Networking Glue Logic & Protocol Bridging
The EP4CE6E22I7 handles networking glue-logic tasks like GMII-to-RGMII bridging, custom packet-header parsing, and PTP (precision time protocol) timestamping at line-rate. Its 6,272 LEs implement small custom NICs or protocol converters, while the 270 Kbits of embedded RAM buffer packet headers and timestamps. The 2 PLLs de-skew multiple Ethernet clock domains (typically 125 MHz, 156.25 MHz, and 161.13 MHz) with sub-100 ps jitter. Compared with a hard ASIC, this FPGA lets network equipment vendors ship custom feature differentiators without silicon NRE. Quoting Intel's Cyclone IV networking reference designs, the family supports GMII/RGMII/SGMII interfaces through LVDS I/O plus external PHYs.
Рекомендуется
Industrial IoT Sensor Aggregation
The EP4CE6E22I7 is appropriate for industrial IoT sensor-hub nodes that aggregate multiple sensor interfaces (I2C, SPI, UART, GPIO) and perform on-edge pre-processing before forwarding data upstream. Its 91 user I/O pins accommodate many concurrent sensor buses, and the 15 embedded multipliers handle small FFTs or sensor-fusion DSP. The 1.2 V core plus industrial temperature grade (-40C to +100C) suit factory-floor deployment in sealed enclosures. Compared with a microcontroller, this FPGA handles deterministic, parallel sampling across many sensors without RTOS overhead. Per Intel's IoT reference designs, the Cyclone IV E family is widely deployed in industrial sensor hubs.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP4CE6E22I7 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP4CE6E22I7N | EP4CE6E22C7N | EP4CE6E22C8N | EP4CE10E22I7N | EP4CE10E22I8N | EP4CE6E22C9LN |
|---|---|---|---|---|---|---|---|
| Package | EQFP-144 (22x22 mm) | EQFP-144 (22x22 mm) - same | EQFP-144 (22x22 mm) - same | EQFP-144 (22x22 mm) - same | EQFP-144 (22x22 mm) - same | EQFP-144 (22x22 mm) - same | EQFP-144 (22x22 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 6,272 | 6,272 | 6,272 | 6,272 | 10,320 | 10,320 | 6,272 |
| Embedded Memory | 270 Kbits | 270 Kbits | 270 Kbits | 270 Kbits | 414 Kbits | 414 Kbits | 270 Kbits |
| Embedded Multipliers (18x18) | 15 | 15 | 15 | 15 | 23 | 23 | 15 |
| PLLs | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Maximum User I/O | 91 | 91 | 91 | 91 | 91 | 91 | 91 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 60 nm low-power | 60 nm low-power | 60 nm low-power | 60 nm low-power | 60 nm low-power | 60 nm low-power | 60 nm low-power |
Ключевые отличия
- Lowest-cost Cyclone IV E density point (против EP4CE10E22I7N)
- Industrial temperature grade (против EP4CE6E22C7N)
- Higher LE density with pin-compatible footprint (против EP4CE10E22I7N)
- More embedded multipliers for DSP workloads (против EP4CE6E22C8N)
Заметки по проектированию
The EP4CE6E22I7 requires a clean 1.2 V core supply (VCCINT) capable of delivering up to approximately 500 mA typical and 800 mA peak during configuration. Each VCCIO bank is independent and must be powered according to the I/O standard used (typically 1.5 V, 1.8 V, 2.5 V, or 3.3 V). Decoupling: place 0.1 uF ceramic capacitors within 100 mil of every VCCINT and VCCIO pin, plus 10 uF bulk tantalum or ceramic on each supply rail. Per Intel's Cyclone IV power design guide, do not share ferrite beads between VCCINT and VCCIO rails.
The 144-pin EQFP package has an exposed thermal pad that MUST be soldered to a copper pad on the PCB for proper heat dissipation. Connect the thermal pad to the inner ground plane with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch). At typical utilization (50% LE, 25% RAM, 100 MHz), the EP4CE6E22I7 dissipates approximately 0.3 W to 0.5 W - well within the EQFP-144's 1.5 W thermal envelope without active cooling. For enclosed industrial enclosures, verify junction temperature using the theta_JA from the package thermal characteristics document.
Route the two PLL analog supplies (VCCA_PLL1, VCCA_PLL2) with a dedicated filtered rail - typically a ferrite bead plus 10 uF and 0.1 uF decoupling - and keep PLL loop-filter components within 100 mil of the analog supply pins. For DDR/DDR2 memory interfaces, use the dedicated DQS delay chains and follow the DQ-to-DQS pin-pair guidelines in the device handbook. The exposed thermal pad must have continuous solder coverage (avoid silk-screen over the pad); reflow profile should follow J-STD-020 with peak temperature not exceeding 245 C for lead-free assembly.
Common pitfalls with the EP4CE6E22I7: (1) Forgetting to drive MSEL[3:0] pins to a valid configuration mode - leaving them floating causes configuration failure. (2) Using LVDS inputs without the 100-ohm differential termination - signals will ring and fail timing. (3) Driving the same bank with mixed I/O standards (e.g. 1.8 V LVCMOS and 3.3 V LVCMOS) - each VCCIO bank supports only one voltage. (4) Skipping JTAG chain verification before attempting AS configuration - fix the JTAG chain first using the Quartus Prime programmer. (5) Driving TDI/TMS/TCK signals without series resistors close to the FPGA - causes reflections on the JTAG chain.
PCB layout best practices: place configuration EPCS flash memory within 50 mm of the FPGA's DATA0/DCLK/nCS pins to keep the AS configuration bus short. Use 50-ohm controlled impedance for high-speed LVDS pairs (typically 100-ohm differential). Keep clock inputs (CLK0-CLK3) short and away from switching signals to minimize jitter. The eight global clock networks should be assigned in Quartus Prime pin planner before routing to avoid re-routing later. Per Intel Cyclone IV hardware guidelines, place the FPGA in a corner of the board with ground vias around the perimeter to simplify the reference plane return paths.
Информация о соответствии
RoHS compliant per Intel/Altera product page. The EP4CE6E22I7 is the industrial-temperature variant; the lead-free (Pb-free) finish is offered on the EP4CE6E22I7N variant. Not AEC-Q100 qualified - this device is intended for industrial/commercial applications, not automotive safety-critical systems.
