EP4CGX150DF27C7 - Cyclone IV GX FPGA 149K LE | Altera | 672-FBGA
Артикул: EP4CGX150DF27C7 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $520.79 | $520,79 |
| 10 | $495.5 | $4.955,00 |
| 100 | $460.2 | $46.020,00 |
| 500 | $425 | $212.500,00 |
| 1.000 | $390 | $390.000,00 |
EP4CGX150DF27C7 Обзор
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (CLBs), programmable interconnect, embedded memory, DSP blocks, and (in the GX variants) multi-gigabit transceivers on a single die. FPGAs sit in the semiconductor hierarchy between fixed-function ASICs and software-defined processors: they deliver ASIC-class deterministic latency and parallelism while remaining fully reprogrammable in the field, which makes them ideal for high-volume, cost-sensitive designs that still require hardware-level customization.
The Cyclone IV GX family is engineered for the lowest cost and lowest power in its class, with this -7 commercial speed grade, 1.2 V core operation, and integrated 3.125 Gbps transceivers that enable protocols such as PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, and CPRI. The device integrates 720 Kbits of embedded RAM distributed across M9K blocks, 360 18×18 hardware multipliers for DSP, and 8 PLLs for clock management - sufficient to implement moderate-complexity signal processing pipelines and protocol bridging.
Architecturally, the EP4CGX150DF27C7 uses an SRAM-based configuration cell, requiring a serial or parallel configuration device (typically an EPCS or EPCQ flash) on the board to load the bitstream at power-up. The 60 nm process is mature, well-characterized, and supported by the Quartus II / Quartus Prime design toolchain, which provides synthesis, place-and-route, timing analysis, and the Qsys system-integration tool for rapid IP assembly.
Typical applications include industrial video processing and machine vision, automotive infotainment and driver-assistance backbones, wireless baseband preprocessing, low-cost protocol bridging (PCIe to Ethernet, CPRI fronthaul), and any cost-sensitive embedded design that needs FPGA-class parallelism without the cost of high-end Stratix devices. Designers typically choose this device when logic density above 100K LE is needed, transceivers are required, and PCB real estate for a 27×27 mm BGA is acceptable.
When designing with this device, attention to power integrity is essential: a 1.2 V core rail with tight tolerance (±3%) and adequate decoupling (typically 100 µF bulk + multiple 0.1 µF + 10 nF ceramics per rail) must be provided. Thermal management relies on the exposed-die top-side heat-spreader rather than a PCB heatsink; a heatsink, heat pipe, or forced-air cooling is recommended above ~3 W dissipation. Configuration mode, JTAG, and transceiver reference-clock routing should be planned early because PCB rework on a 672-ball FBGA is impractical.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations not found in the manufacturer datasheet alone, with a focus on engineering trade-offs that matter during component selection and board bring-up.
Аналоги без доработки для EP4CGX150DF27C7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP4CGX150DF27C7 (тот же форм-фактор и посадочное место) — отличается по Package, Speed Grade, Transceivers, Operating Temperature, Embedded Memory Bits.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP4CGX150DF27C6N
✅ Прямая замена✓ В наличии
$205 / шт.
Открыть даташит →EP4CGX150DF27C7N
✅ Прямая замена✓ В наличии
$171 / шт.
Открыть даташит →EP4CGX110DF27C7N
✅ Прямая замена✓ В наличии
$204.2 / шт.
Открыть даташит →EP4CGX110DF27C7
✅ Прямая замена✓ В наличии
$272.5 / шт.
Открыть даташит →EP4CGX110DF27I7N
✅ Прямая замена✓ В наличии
$198 / шт.
Открыть даташит →EP4CGX110DF31C7N
✅ Прямая замена✓ В наличии
$112.4 / шт.
Открыть даташит →EP4CGX150DF27C7 Максимальные параметры и электрические характеристики
| Family | Cyclone IV GX |
| Logic Elements | 149,760 |
| Total Memory Bits | 6,635,520 |
| Maximum User I/O | 393 |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.2 V |
| Корпус | 672-ball FBGA (F27), 27 × 27 mm |
| Speed Grade | -7 (commercial) |
| Temperature Grade | Commercial (0 °C to 85 °C) |
| Embedded Memory | 720 Kbits (M9K blocks) |
| Hardware Multipliers | 360 (18 × 18) |
| PLLs | 8 |
| Transceivers | Up to 8 channels, 3.125 Gbps |
| Transceiver Protocols | PCIe Gen1, Gigabit Ethernet, Serial RapidIO, CPRI |
| Configuration | SRAM-based (EPCS/EPCQ flash required) |
| Статус RoHS | Compliant |
Руководство по цоколевке EP4CGX150DF27C7 в корпусе 672-ball fbga (f27), 27 × 27 mm
Цоколевка для EP4CGX150DF27C7 (корпус 672-ball fbga (f27), 27 × 27 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP4CGX150DF27C7.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP4CGX150DF27C7 подходит для 6 применениеs: Industrial Machine Vision, Wireless Baseband Preprocessing, Automotive Infotainment Backbone, PCIe Gen1 Protocol Bridge, Industrial Protocol Conversion, Test and Measurement Front-End.
Industrial Machine Vision
The EP4CGX150DF27C7 is well-suited to industrial machine-vision systems because its 149,760 logic elements and 360 18×18 hardware multipliers can host real-time image-processing pipelines (Sobel, Canny, color-space conversion, Bayer demosaic) at typical 720p60 or 1080p30 camera rates. The 720 Kbits of embedded M9K memory serves as line buffers and small frame buffers, while the 3.125 Gbps transceivers drive Camera Link, CoaXPress, or GigE Vision output to a host PC. The commercial 0–85 °C temperature grade is acceptable for factory-floor enclosures with filtered air; for harsher environments, the industrial-grade EP4CGX150DF31I7N variant is preferred. Power dissipation at full utilization is around 3–4 W, manageable with a small heatsink on the FBGA top heat-spreader.
Рекомендуется
Wireless Baseband Preprocessing
In wireless baseband and small-cell designs, the EP4CGX150DF27C7 functions as a cost-effective preprocessing engine for CPRI fronthaul, LTE PHY-layer channelization, and digital predistortion (DPD) feedback paths. The integrated 3.125 Gbps transceivers handle CPRI option 3 and 4 links directly, eliminating external PHY ICs. The 360 hardware multipliers accelerate FIR filtering, FFT butterflies, and crest-factor reduction (CFR) math; 720 Kbits of block RAM holds intermediate samples. Combined with 8 PLLs for multi-clock domain generation and PCIe Gen1 endpoint support for host connectivity, the device replaces more expensive DSPs in cost-sensitive small cells and remote-radio-head (RRH) designs.
Рекомендуется
Automotive Infotainment Backbone
For automotive infotainment and driver-assistance systems, the EP4CGX150DF27C7 aggregates multiple camera inputs (front, rear, surround-view), performs real-time video stitching and overlay, and outputs a unified LVDS or HDMI stream to the head-unit display. Its 393 user I/O pins accommodate parallel RGB, BT.656, and OpenLDI inputs, while 3.125 Gbps transceivers carry serialized video to remote display panels. Designers targeting -40 °C to 100 °C must use the industrial-grade EP4CGX150DF31I7N variant instead; the commercial EP4CGX150DF27C7 is only rated 0–85 °C and is therefore limited to cabin-cabin use cases. The 60 nm process provides mature AEC-Q100 documentation heritage for similar Cyclone families.
Рекомендуется
PCIe Gen1 Protocol Bridge
The EP4CGX150DF27C7 is a popular PCIe Gen1 endpoint / root-port bridge, exploiting its hard PCIe IP block to implement low-cost ×1 or ×4 PCIe endpoints with up to 250 MB/s throughput per lane. Typical bridges include PCIe-to-Gigabit Ethernet (for low-cost NIC designs), PCIe-to-Serial RapidIO (for DSP aggregation), and PCIe-to-Local-Bus / PCIe-to-parallel SRAM adapters used in legacy industrial replacement. The integrated transceivers provide the PCIe PHY, removing the need for external clock-data-recovery (CDR) chips. 149,760 logic elements leave ample room for application-layer state machines, DMA engines, and interrupt controllers alongside the PCIe hard IP.
Рекомендуется
Industrial Protocol Conversion
In factory-automation gateways, the EP4CGX150DF27C7 converts between industrial protocols such as EtherCAT, PROFINET, Modbus TCP, EtherNet/IP, and legacy serial fieldbuses (RS-485, CAN). Its 3.125 Gbps transceivers host EtherCAT or PROFINET IRT master/slave stacks directly, while the 393 I/O pins drive parallel industrial I/O banks (24 V tolerant with external level shifters). The 360 hardware multipliers accelerate any onboard signal-conditioning math. Operating temperature must be observed: the commercial 0–85 °C grade covers most factory cabinets with filtered air; for unconditioned environments, the EP4CGX150DF31I7N industrial variant is required. The device's low unit cost at $390/1000 (as of 2026-09-10) supports the cost targets of industrial Ethernet gateways.
Рекомендуется
Test and Measurement Front-End
In bench-top and ATE-style test equipment, the EP4CGX150DF27C7 serves as a flexible pattern-generator and acquisition front-end, with logic elements implementing custom stimulus sequencers, M9K blocks buffering capture samples, and 3.125 Gbps transceivers streaming raw ADC/DAC data to a host processor over PCIe. The 8 PLLs derive all required sampling clocks from a single reference, simplifying clock-tree design. The commercial temperature grade suits laboratory environments; for production-floor testers the industrial EP4CGX150DF31I7N is recommended. Combined with an external high-speed ADC (e.g., 16-bit 250 MSPS) and a small DSP, the device builds a complete low-cost mixed-signal test platform.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP4CGX150DF27C7 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP4CGX150DF27C6N | EP4CGX150DF27C7N | EP4CGX110DF27C7N | EP4CGX110DF27C7 | EP4CGX110DF27I7N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 672-ball FBGA (F27), 27×27 mm | 672-ball FBGA (F27), 27×27 mm | 672-ball FBGA (F27), 27×27 mm | 672-ball FBGA (F27), 27×27 mm | 672-ball FBGA (F27), 27×27 mm | 672-ball FBGA (F27), 27×27 mm |
| Family | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 149,760 | 149,760 | 149,760 | 109,424 | 109,424 | 109,424 |
| Memory Bits | 6,635,520 | 6,635,520 | 6,635,520 | 4,534,272 | 4,534,272 | 4,534,272 |
| Maximum User I/O | 393 | 393 | 393 | 393 | 393 | 393 |
| Speed Grade | -7 (commercial) | -6 (slower) | -7 (commercial) | -7 (commercial) | -7 (commercial) | -7 (industrial) |
| Temperature Grade | Commercial 0 °C to 85 °C | Commercial 0 °C to 85 °C | Commercial 0 °C to 85 °C | Commercial 0 °C to 85 °C | Commercial 0 °C to 85 °C | Industrial -40 °C to 100 °C |
| Lead-Free Finish | No (standard SnPb) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | No | Yes (Pb-free) |
Ключевые отличия
- Highest logic density in the Cyclone IV GX family at 149,760 LE (против EP4CGX110DF27C7N)
- Faster -7 speed grade than the -6 variant (против EP4CGX150DF27C6N)
- Commercial temperature range for cost-sensitive applications (против EP4CGX110DF27I7N)
- Larger 672-ball F27 package vs smaller 256-ball F23 (против EP4CGX150CF23C7N)
Заметки по проектированию
The EP4CGX150DF27C7 requires multiple power rails per the Cyclone IV Device Handbook: VCCINT = 1.2 V ±5% core, VCCA = 2.5 V PLL analog, VCCD_PLL = 1.2 V PLL digital, VCCIO per I/O bank (1.2 / 1.5 / 1.8 / 2.5 / 3.0 / 3.3 V), and separate VCCCHIP_L / VCCCHIP_R for the 8 transceiver channels. Power-up sequencing requires VCCINT to ramp before VCCIO to prevent I/O latch-up; use a power-supply supervisor with PG (power-good) output to gate the VCCIO enable. Bulk capacitance of 100 µF + 10 µF + 0.1 µF per rail is recommended, with additional 10 nF high-frequency bypass near each ball-pair.
Power dissipation for a fully-utilized Cyclone IV GX EP4CGX150 typically ranges from 2.5 W (low-utilization) to 4.5 W (full transceivers + DSP), per Cyclone IV GX power-play estimation. The 672-ball FBGA package relies on a top-side exposed die for heat transfer; attach a small heatsink (e.g., 20×20×10 mm aluminum with thermal pad) using a 0.15 mm thermal interface material. Without active cooling, junction temperature in a still-air enclosure may exceed 100 °C under sustained transceiver traffic; use the Quartus PowerPlay tool to estimate θJA and TJ for your specific design before committing to a thermal solution.
PCB layout for the 672-ball F27 FBGA at 1.0 mm ball pitch requires a minimum of 6 PCB layers (signal / GND / VCC / signal / signal / GND) and microvia / via-in-pad technology for the BGA break-out. Escape routing must use 50 Ω controlled impedance for all high-speed signal pairs (transceivers, external memory interfaces). Place the EPCS/EPCQ configuration flash within 25 mm of the FPGA to keep the AS (Active Serial) data and DCLK traces short and impedance-matched. Provide a 4-pin JTAG header (TCK, TMS, TDI, TDO with proper pull-ups) for factory programming and in-field updates. A 100-ohm differential reference-clock source is mandatory for each transceiver quad.
Common pitfalls when designing with the EP4CGX150DF27C7 include: (1) confusing the 'DF27' (672-ball F27 package, 27×27 mm) with the 'CF23' (256-ball F23 package, 23×23 mm) - they are NOT pin-compatible despite similar family naming; (2) forgetting that the 'C7' suffix denotes commercial temperature grade - for industrial designs the 'I7' variant is required; (3) attempting to JTAG-chain the FPGA with non-Altera devices using 3.3 V TCK levels - Cyclone IV expects 2.5 V or 1.8 V TCK; (4) underestimating configuration time - large bitstreams (>20 Mbit) take >100 ms to load from EPCS, requiring careful reset and ready-signal timing for downstream logic; (5) mixing VCCIO voltages across I/O banks that share the same VREF - each bank is independent, so verify with the pin planner before PCB finalization.
Информация о соответствии
Standard EP4CGX150DF27C7 ordering code uses SnPb terminal finish; for lead-free RoHS-compliant variant, order EP4CGX150DF27C7N (with 'N' suffix). Not AEC-Q100 qualified - for AEC-Q100 designs use the industrial-grade EP4CGX150CF23I7N variant in the smaller F23 package. RoHS and REACH compliance are confirmed by Altera/Intel product page documentation as of 2026-09-10.
