EP4SGX360KF40C3 - Stratix IV GX FPGA 353K LE | Intel
Артикул: EP4SGX360KF40C3 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $11124.96 | $11.124,96 |
| 10 | $10568.71 | $105.687,10 |
| 100 | $9700 | $970.000,00 |
| 500 | $8900 | $4.450.000,00 |
| 1.000 | $8200 | $8.200.000,00 |
EP4SGX360KF40C3 Обзор
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from a matrix of configurable logic blocks (CLBs), embedded memory, DSP slices, and high-speed transceiver channels. Within the broader taxonomy, the FPGA sits between application-specific integrated circuits (ASICs) and general-purpose microcontrollers: more flexible than an ASIC, more parallel than a CPU. The Stratix IV family targets high-end communications, signal processing, and ASIC prototyping where logic density, transceiver bandwidth, and on-chip memory bandwidth matter most.
Key features of the EP4SGX360KF40C3 include 23,105,536 total RAM bits, embedded transceivers supporting multi-gigabit serial protocols, 744 user I/O pins distributed across 16 I/O banks, and a -3 speed grade targeting higher clock frequencies. The 40 nm process node balances leakage and performance, while the FC-BGA package provides the thermal and electrical density required to support the device's high logic count and I/O bandwidth.
Typical applications include high-speed serial interface bridging, ASIC prototyping, digital signal processing pipelines, software-defined radio baseband, and high-throughput data acquisition. The combination of 353K logic elements and embedded transceivers makes the EP4SGX360KF40C3 well suited for protocols such as PCIe Gen2, Serial RapidIO, XAUI, and CPRI/OBSAI in wireless infrastructure.
When designing with this device, plan power sequencing carefully: the 0.87 V to 0.93 V core rail requires tight regulation and clean startup. Use Intel Quartus II software for synthesis, place-in-the-loop fitting, and SignalTap logic analysis. Refer to the Stratix IV GX handbook for transceiver PCB layout guidelines (controlled-impedance differential routing, AC coupling capacitors, and guard traces).
Аналоги без доработки для EP4SGX360KF40C3 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP4SGX360KF40C3 (тот же форм-фактор и посадочное место) — отличается по Package, Speed Grade, Process Technology, Operating Temperature, Transceivers.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP4SGX360KF40C3N
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$1320 / шт.
Открыть даташит →EP4SGX360KF40C2N
✅ Прямая замена✓ В наличии
$1850 / шт.
Открыть даташит →EP4SGX360KF40C2
✅ Прямая замена✓ В наличии
$10400 / шт.
Открыть даташит →EP4SGX360KF40I3N
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$5120 / шт.
Открыть даташит →EP4SGX360KF40I4N
✅ Прямая замена✓ В наличии
$3100 / шт.
Открыть даташит →EP4SGX360KF40C3 Максимальные параметры и электрические характеристики
| Series | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 353,600 |
| Logic Cells | 141,440 |
| Logic Blocks / LABs | 14,144 |
| Total RAM Bits | 23,105,536 |
| Number of I/O | 744 |
| Напряжение питания | 0.87 V to 0.93 V (core) |
| Process Technology | 40 nm |
| Рабочая температура | 0C to +85C (commercial) |
| Корпус | 1517-BBGA, FC-BGA (40x40 mm) |
| Speed Grade | -3 (faster) |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
| Lead Free | Yes |
Руководство по цоколевке EP4SGX360KF40C3 в корпусе 1517-bbga, fc-bga (40x40 mm)
Цоколевка для EP4SGX360KF40C3 (корпус 1517-bbga, fc-bga (40x40 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP4SGX360KF40C3.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP4SGX360KF40C3 подходит для 6 применениеs: ASIC Prototyping and Emulation, High-Speed Serial Interface Bridging, Software Defined Radio Baseband, High-Throughput Data Acquisition, Telecom Baseband Processing, Video Broadcast and Image Processing.
ASIC Prototyping and Emulation
The EP4SGX360KF40C3 delivers 353,600 logic elements and 23,105,536 RAM bits in a single die, providing enough capacity to prototype multi-million-gate ASICs before tape-out. Quartus II synthesis maps RTL directly into the Stratix IV GX fabric, while per-pin I/O flexibility supports LVDS, LVCMOS, and HSTL for bridging to the target ASIC's pad ring. Compared to ASIC respins costing USD 500K+, a single FPGA prototype board typically returns its NRE within one design cycle.
Рекомендуется
High-Speed Serial Interface Bridging
The EP4SGX360KF40C3 integrates multi-gigabit transceivers supporting protocols such as PCIe Gen2, Serial RapidIO, XAUI, and CPRI/OBSAI for wireless backhaul. The 744 user I/O pins route sideband signals, status LEDs, and parallel data buses, while the embedded transceivers handle serialization at line rates up to 8.5 Gbps. This makes the part well suited for telecom line cards, base station baseband, and protocol-conversion mezzanines where one FPGA replaces multiple discrete bridge chips.
Рекомендуется
Software Defined Radio Baseband
With 14,144 LABs and abundant DSP blocks, the EP4SGX360KF40C3 implements wideband baseband processing for software-defined radio platforms, including FFT/iFFT engines, channelizers, and digital up/down converters. The 23 Mbit embedded memory buffers complex IQ samples between FFT stages without external SRAM, reducing BOM cost and PCB area. Combined with onboard transceivers, the device samples RF directly and outputs demodulated bits to a host processor.
Рекомендуется
High-Throughput Data Acquisition
The EP4SGX360KF40C3 ingests parallel ADC data at hundreds of MHz sample rates through its 744 LVDS-capable I/O, then performs real-time DSP, decimation, and packetization in the FPGA fabric. The 23 Mbit block RAM and MLAB memory form deep FIFOs that decouple ADC bursts from downstream Ethernet or PCIe transmission. Industrial test, medical imaging (CT/MRI), and radar digitizer applications all leverage this throughput.
Рекомендуется
Telecom Baseband Processing
In LTE and 5G NR baseband units, the EP4SGX360KF40C3 handles PHY-layer functions including turbo/LDPC decoding, MIMO matrix math, and CPRI/OBSAI fronthaul interfacing. The high logic count supports multi-sector processing in a single FPGA, reducing board count and system power. The 40 nm process balances leakage and performance, while the -3 speed grade delivers the timing margin required for 200 MHz+ PHY clock domains.
Рекомендуется
Video Broadcast and Image Processing
The EP4SGX360KF40C3 supports real-time video processing pipelines including 4K/UHD upscaling, motion estimation, and broadcast format conversion. Its 744 I/O accommodate multiple SDI/HDMI/DisplayPort interfaces at 3 Gbps each, while embedded memory buffers frame buffers for temporal noise reduction. The -3 speed grade supports the pixel-clock rates required for 4K@60 processing in a single device, eliminating multi-FGA synchronization complexity.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP4SGX360KF40C3 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP4SGX360KF40C3N | EP4SGX360KF40C2N | EP4SGX360KF40C2 | EP4SGX360KF40I3N | EP4SGX360KF40I4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FBGA, FC-BGA (40x40 mm) | 1517-FBGA, FC-BGA (40x40) - same | 1517-FBGA, FC-BGA (40x40) - same | 1517-FBGA, FC-BGA (40x40) - same | 1517-FBGA, FC-BGA (40x40) - same | 1517-FBGA, FC-BGA (40x40) - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Total RAM Bits | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/O Count | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed Grade | -3 | -3 | -2 | -2 | -3 | -4 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Core Voltage | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V |
Ключевые отличия
- Highest user I/O count in the Stratix IV GX F40 package family (против EP4SGX360HF35C3)
- -3 speed grade balances Fmax and cost (против EP4SGX360KF40I4N)
- Same die across KF40 package variants preserves IP portability (против EP4SGX290NF45I4N)
Заметки по проектированию
The EP4SGX360KF40C3 core requires a 0.87 V to 0.93 V supply capable of delivering up to several amps with tight transient response; use an Intel Enpirion EM21xx or EM22xx multi-phase controller with per-phase inductors and ceramic output caps. Aux supplies (VCCAUX, VCCPD, VCCIO banks) must ramp within the Stratix IV GX power-sequencing window defined in the device handbook to avoid latch-up. Decoupling: place 0402/0201 ceramics every 3-5 mm across the package footprint plus bulk polymer caps near the BGA.
Estimated: at 100% resource utilization, the 40 nm die in the 1517-FCBGA package can dissipate 15-25 W depending on toggle rate and transceiver activity. With theta_JA in the 8-12 C/W range for this BGA (per Stratix IV thermal characterization), junction temperature can approach 100C in still air at room ambient. Mandatory 4-layer PCB with unbroken inner ground plane and thermal vias beneath the central BGA balls, plus airflow of 200 LFM minimum for production reliability.
The 1517-ball FC-BGA at 1.0 mm pitch requires HDI PCB fabrication with laser-drilled microvias and stacked via structures. Route all transceiver channels as 100 ohm differential pairs with continuous reference ground, length-matching within 150 mil for TX/RX pairs, and AC coupling capacitors (0.1 uF) at the transmitter output per Stratix IV GX transceiver user guide. Pin-swapping is permitted within I/O banks but NEVER across banks due to VCCIO grouping.
Common pitfall #1: leaving JTAG pins floating - always pull TCK to GND through 1-10 kohm and TMS/TDI to VCCPD through 1-10 kohm for predictable Quartus II configuration. Pitfall #2: mismatched CONFIG_VOLTAGE settings between Quartus project and actual board - the EP4SGX360KF40C3 requires 1.8 V/2.5 V/3.0 V/3.3 V configuration voltage depending on the boot mode selected. Pitfall #3: ignoring MSL handling - the BGA must be baked at 125C for 24+ hours before reflow if the humidity indicator card shows >10% RH.
Информация о соответствии
RoHS compliant per Intel product page. Lead-free finish (NiPdAu). For automotive applications, Stratix IV GX devices are not AEC-Q100 qualified - use Cyclone IV or Cyclone V Auto grade parts instead. Halogen-free status not explicitly stated in provided data.
