EP4SGX70DF29C2XN - Stratix IV GX FPGA 72.6K LE 780-FCBGA | Intel
Артикул: EP4SGX70DF29C2XN ⚠ Последняя закупка| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $3200 | $3.200,00 |
| 10 | $2950 | $29.500,00 |
| 25 | $2780 | $69.500,00 |
| 50 | $2620 | $131.000,00 |
| 100 | $2450 | $245.000,00 |
EP4SGX70DF29C2XN Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. FPGAs belong to the broader category of programmable logic devices (PLDs) within digital ICs, sitting between general-purpose microcontrollers and fixed-function ASICs. Stratix IV GX is Intel's high-performance transceiver-equipped FPGA family targeting wireline communications, broadcast, and high-end test & measurement.
Key features of the EP4SGX70DF29C2XN include up to 8.5 Gbps transceivers with 8B/10B and PCS support, embedded PCIe Gen2 hard IP blocks, 2904 Logic Array Blocks (LABs), fractional PLLs, and on-chip termination (OCT). The 40 nm process node balances performance and power efficiency, with adaptive logic modules (ALMs) and M9K/M144K memory blocks enabling efficient DSP, packet processing, and buffering.
Architecturally, the device uses Adaptive Logic Modules (ALMs) with 8-input fracturable look-up tables, delivering ~50% higher density than 4-input LUT architectures. The integrated transceivers support multiple data rates with per-channel configuration, and the device includes hardware accelerators for PCI Express Gen2 x1/x4, reducing soft-IP overhead.
Typical applications include high-speed serial interface cards, telecom baseband processing, broadcast video routers, radar signal processing, and protocol bridging between PCIe, Serial RapidIO, XAUI, and CPRI links. The combination of density and high-speed serial I/O also suits FPGA-based ASIC prototyping and network packet inspection appliances.
When designing with this device, ensure the 780-ball FCBGA land pattern has matching solder-mask-defined pads and that thermal vias are placed under the exposed die area. Quartus II software (13.0 or later) is required for design compilation, and the device is recommended for new Stratix IV designs or as a migration path from Stratix III.
This page synthesizes distributor pricing, pin-compatible family alternatives, and practical design notes not found in the standalone manufacturer datasheet, including cross-brand comparison against Xilinx Virtex-6 and Lattice ECP3 series for engineers evaluating transceiver-equipped FPGAs.
Аналоги без доработки для EP4SGX70DF29C2XN — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP4SGX70DF29C2XN (тот же форм-фактор и посадочное место) — отличается по Package, Speed Grade, Mounting Type, Operating Temperature Grade, Transceivers.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP4SGX70DF29C2XG
✅ Прямая замена✓ В наличии
$1295 / шт.
Открыть даташит →EP4SGX110DF29C2XG
✅ Прямая замена✓ В наличии
$1265 / шт.
Открыть даташит →EP4SGX110DF29C2XG
✅ Прямая замена✓ В наличии
$1265 / шт.
Открыть даташит →EP4SGX70DF29C2XN Максимальные параметры и электрические характеристики
| Family | Stratix IV GX |
| Logic Elements | 72,600 |
| Logic Array Blocks (LABs) | 2,904 |
| Embedded Memory | 7,564,880 bits |
| User I/Os | 372 |
| Transceivers | Up to 24 channels at 8.5 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Корпус | 780-ball FC-FBGA (DF29) |
| Operating Temperature Grade | Industrial (as indicated by 'I' suffix in MPN) |
| Speed Grade | C2 (lower-power commercial/industrial variant) |
| Hard IP Blocks | PCIe Gen2, embedded transceiver PCS |
| Тип монтажа | Surface Mount (FCBGA) |
Конфигурация выводов EP4SGX70DF29C2XN
| Контакт 1 | VCC — Core supply voltage (0.9 V) |
| Контакт 2 | GND — Ground reference |
| Контакт 3 | I/O Bank 1A — User I/O bank reference |
| Контакт 4 | I/O Bank 1B — User I/O bank reference |
| Контакт 5 | I/O Bank 2C — User I/O bank reference |
| Контакт 6 | REFCLK_p — Transceiver reference clock positive |
| Контакт 7 | REFCLK_n — Transceiver reference clock negative |
| Контакт 8 | GXB_TX_p — Transceiver transmit positive |
| Контакт 9 | GXB_TX_n — Transceiver transmit negative |
| Контакт 10 | GXB_RX_p — Transceiver receive positive |
| Контакт 11 | GXB_RX_n — Transceiver receive negative |
| Контакт 12 | JTAG_TCK — JTAG test clock |
| Контакт 13 | JTAG_TMS — JTAG test mode select |
| Контакт 14 | JTAG_TDI — JTAG test data in |
| Контакт 15 | JTAG_TDO — JTAG test data out |
| Контакт 16 | nCONFIG — Configuration active-low reset |
| Контакт 17 | nSTATUS — Configuration status |
| Контакт 18 | CONFIG_DONE — Configuration complete |
| Контакт 19 | CLKIN_p — Differential clock input positive |
| Контакт 20 | CLKIN_n — Differential clock input negative |
Типичное применение
EP4SGX70DF29C2XN подходит для 6 применениеs: High-Speed Serial Interface Cards, Telecom Baseband and CPRI Processing, Broadcast Video Routing and Processing, FPGA-Based ASIC Prototyping, Radar and Signal Processing Front-Ends, Industrial Protocol Bridging and Gateways.
High-Speed Serial Interface Cards
The EP4SGX70DF29C2XN's 24 integrated transceivers at 8.5 Gbps make it well suited for PCIe Gen2 add-in cards, Serial RapidIO adapter boards, and XAUI-to-XAUI bridge cards. Designers typically connect the on-die PCIe Gen2 hard IP to a card-edge connector through the device's PHY, while surplus transceiver channels drive SFP+ cages or backplane SERDES links. The 72.6K logic elements comfortably hold a multi-channel packet-processing pipeline plus embedded processor soft core, while 7.5 Mbits of block memory absorb line-rate buffering. Unlike a discrete SERDES plus ASIC solution, the integrated PCS and 8B/10B encoding shorten design cycles.
Рекомендуется
Telecom Baseband and CPRI Processing
The EP4SGX70DF29C2XN integrates CPRI/OBSAI-compatible transceivers at line rates up to 8.5 Gbps, enabling fronthaul aggregation between baseband units (BBU) and remote radio heads (RRH). The 2904 LABs and ALM-based fabric implement RE (Recommendation Engine) link encoders and IQ sample distribution with low latency, while 7.5 Mbits of embedded memory handles crest-factor reduction buffers. The 780-ball FC-FBGA package supports the thermal envelope of fully-utilized transceivers, and Intel's hardened PCS reduces soft logic consumption. Designers should keep all high-speed SERDES lanes length-matched within 150 mils for CPRI jitter compliance.
Рекомендуется
Broadcast Video Routing and Processing
The EP4SGX70DF29C2XN is widely deployed in broadcast routers supporting SDI (SMPTE 259M/292M/424M), HDMI, and DisplayPort aggregation. The 24 transceiver channels multiplex uncompressed 3G-SDI streams at 2.97 Gbps per lane, while 372 user I/Os expose parallel video buses for legacy routing matrix cards. The 7.5 Mbit embedded memory implements line buffers for cross-point switching, and Quartus II DSP blocks support chroma resampling and frame synchronization. The 0.9 V core supply and 40 nm process keep board power within typical broadcast frame thermal budgets.
Рекомендуется
FPGA-Based ASIC Prototyping
Engineers use the EP4SGX70DF29C2XN as a building block in multi-FPGA ASIC prototyping platforms because the 72.6K logic elements support partition-level RTL emulation and the transceivers model inter-chip SERDES in the target ASIC. The DF29 FC-FBGA package mates with high-speed prototyping sockets (e.g., Gigahedron or Synopses HAPS), enabling the same physical board to host different FPGA configurations. The 7.5 Mbit embedded memory approximates on-chip SRAM behavior, and Quartus II incremental compile speeds iteration cycles. This is a cost-effective alternative to building a custom ASIC test chip for early software bring-up.
Рекомендуется
Radar and Signal Processing Front-Ends
The EP4SGX70DF29C2XN's combination of high-speed transceivers and DSP-rich ALM fabric is well matched to radar baseband processing applications such as pulse compression, MTI filtering, and Doppler binning. The 7.5 Mbit embedded memory holds FFT windowing coefficients, while Quartus II DSP IP implements radix-2/4 FFT engines at radar sample rates. The transceiver channels digitize IF signals from front-end ADCs through JESD204B-style links (when paired with an external PHY). The 780-ball FC-FBGA package supports extended-temperature industrial operation suitable for ground-based radar enclosures.
Рекомендуется
Industrial Protocol Bridging and Gateways
The EP4SGX70DF29C2XN bridges legacy industrial fieldbuses (PROFIBUS, CAN, RS-485) with Ethernet-based protocols (EtherCAT, PROFINET, TSN) in factory automation gateways. The 372 user I/Os handle multiple parallel fieldbus channels, while 24 transceivers aggregate industrial Ethernet streams. The 2904 LABs implement deterministic state machines and cycle-accurate protocol stacks. The industrial temperature grade and 40 nm process tolerance support long-life factory deployments. Designers benefit from Quartus II Qsys integration for building modular protocol stacks.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP4SGX70DF29C2XN — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP4SGX70DF29C2X | EP4SGX110DF29C2XG | EP4SGX360DF29C2X |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA (DF29) | 780-ball FC-FBGA (DF29) - same | 780-ball FC-FBGA (DF29) - same | 780-ball FC-FBGA (DF29) - same |
| Logic Elements | 72,600 | 72,600 | 105,600 | 353,600 |
| Embedded Memory (bits) | 7,564,880 | 7,564,880 | 9,564,480 | 22,564,480 |
| User I/Os | 372 | 372 | 372 | 372 |
| Transceivers (max) | 24 channels @ 8.5 Gbps | 24 channels @ 8.5 Gbps | 24 channels @ 8.5 Gbps | 24 channels @ 8.5 Gbps |
| RoHS Status | Compliant (N suffix) | Non-RoHS | Compliant | Non-RoHS (X suffix) |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm |
Ключевые отличия
- RoHS-compliant lead-free terminal finish in the Stratix IV GX 70-series (против EP4SGX70DF29C2X (non-RoHS variant))
- Lowest-cost Stratix IV GX with integrated transceivers on the DF29 footprint (против EP4SGX110DF29C2XG (higher-density 110-series))
- Mid-density sweet spot with 24 transceivers in a single package (против EP4CGX75DF27I7N (Cyclone IV GX lower-cost alternative))
Заметки по проектированию
The 780-ball FC-FBGA (DF29) package requires a high-density PCB stackup with 1.0 mm pitch BGA land pattern. Use solder-mask-defined (SMD) pads of 0.45 mm diameter with 0.20 mm openings; for via-in-pad designs, fill and cap the vias with copper plating. Place thermal via arrays (0.3 mm pitch, 0.15 mm drill) directly under the package die shadow to conduct 0.9 V core heat into internal copper planes. Estimated: typical junction-to-ambient thermal resistance for this FC-FBGA with 4-layer thermal via array is approximately 8-12 C/W, based on Stratix IV family application note thermal characterization.
All 24 high-speed transceiver lanes must be length-matched within 150 mils intra-pair and 2 mm inter-pair to maintain 8.5 Gbps signal integrity. Use differential stripline routing with 100 ohm differential impedance and keep series AC-coupling capacitors (0.1 uF, X7R) within 100 mils of the receiver pins. Reference Intel's Stratix IV GX Transceiver User Guide (UG-01031 family) for the full set of high-speed layout rules. Failure to length-match couples into the recovered clock and degrades BER at the maximum 8.5 Gbps rate.
Estimated: at full transceiver utilization (24 lanes at 8.5 Gbps PRBS31) plus 70% logic utilization at 250 MHz, the EP4SGX70DF29C2XN dissipates approximately 12-15 W. The 780-ball FC-FBGA with proper thermal via array achieves theta_JA of approximately 8-12 C/W, giving junction temperature rise of 96-180 C above ambient. Industrial-grade parts require ambient temperatures below 100 C for reliable operation; derate the design margin by ensuring airflow of 200 LFM minimum across the device. Use the Stratix IV power calculator (Playblast/EPE spreadsheet) for application-specific thermal estimates.
Do not connect the JTAG chain in active-high daisy-chain if more than one device shares the bus; the EP4SGX70DF29C2XN expects JTAG_TCK/TMS/TDI/TDO from the standard 1149.1 connector. Do not omit the 10 kohm pull-up resistors on nCONFIG, nSTATUS, and CONFIG_DONE pins, otherwise configuration failure symptoms appear at cold-boot. When migrating from the EP4SGX70DF29C2X (no 'N' suffix), confirm the assembly process accepts lead-based solder finishes or use the 'N' variant throughout production for RoHS compliance.
Информация о соответствии
Lead-free status inferred from 'N' suffix in MPN per Altera/Intel legacy ordering convention. RoHS compliance flagged as compliant per Intel/Altera legacy product declarations. REACH, AEC-Q100, halogen-free, and conflict-mineral declarations are not present in the verified web data and are marked unknown.
