EPF10K100EBC356-1 - 100K Gates FLEX 10KE FPGA | Intel
Артикул: EPF10K100EBC356-1 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $118 | $11.800,00 |
| 250 | $105 | $26.250,00 |
| 500 | $92 | $46.000,00 |
EPF10K100EBC356-1 Обзор
A FLEX 10KE FPGA belongs to the PLD (programmable logic device) family, sitting in the broader hierarchy of digital logic ICs -> programmable logic -> field programmable gate array. The 'E' suffix designates the enhanced 'embedded' variant: each logic array block (LAB) is paired with a dedicated Embedded Array Block (EAB) containing 2,048 bits of true dual-port RAM, enabling single-chip System-on-a-Programmable-Chip (SOPC) implementations that combine logic, memory, and I/O on one die.
Key features include 100K system gates, an IEEE Std 1149.1 JTAG boundary-scan test interface that consumes up to 31,250 additional gates, multi-volt I/O supporting 2.5 V/3.3 V operation, and pin-compatibility with other FLEX 10K devices in matching package footprints. The LBGA-356 (1.0 mm pitch, 35 x 35 mm body) maximizes board area efficiency and supports SameFrame pin migration across density points.
The FLEX 10KE architecture combines a fine-grained logic element fabric with coarse-grained embedded memory blocks, allowing designers to implement wide datapaths, FIFOs, and CAMs in distributed EABs without consuming logic resources. The 0.6 ns propagation delay and 333 MHz internal frequency suit the device for glue logic, bus bridging, and peripheral controller duties in mid-complexity designs.
Typical applications include telecommunications line cards, industrial control boards, prototyping platforms for ASIC emulation, and legacy system upgrades. The 356-LBGA package is preferred where board density is at a premium and the design requires more I/O than QFP alternatives can offer. Designers migrating from FLEX 10KA to 10KE retain pin compatibility for shared footprint members.
When designing with this device, ensure the Quartus II or MAX+PLUS II toolchain supports the FLEX 10KE family, and verify that the JTAG chain accounts for the additional 31,250 gates. Static I/O bank assignments must respect the device's I/O standard groupings to avoid contention.
This page synthesizes distributor inventory, parametric drop-in alternatives, and package-level design notes for the EPF10K100EBC356-1, providing information not consolidated in the manufacturer datasheet PDF.
Аналоги без доработки для EPF10K100EBC356-1 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPF10K100EBC356-1 (тот же форм-фактор и посадочное место) — отличается по Process Technology, Family, Operating Temperature, Package, RoHS Status.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPF10K100EBC356-2
✅ Прямая замена✓ В наличии
$59.95 / шт.
Открыть даташит →EPF10K100ABC356-2
✅ Прямая замена✓ В наличии
$108 / шт.
Открыть даташит →EPF10K100EBC356-1N
✅ Прямая замена✓ В наличии
$108 / шт.
Открыть даташит →EPF10K100EBC356-1X
✅ Прямая замена✓ В наличии
$165 / шт.
Открыть даташит →EPF10K100EBC356-1B
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EPF10K100EBC356-1 Максимальные параметры и электрические характеристики
| Family | FLEX 10KE |
| System Gates | 100,000 |
| Logic Elements | 4,992 |
| Embedded Memory | 49,152 bits |
| User I/Os | 274 |
| Корпус | 356-LBGA |
| Process Technology | 0.22 µm CMOS |
| Core Voltage | 2.5 V |
| I/O Voltage | 2.5 V / 3.3 V |
| Internal Frequency | 333.33 MHz |
| Propagation Delay | 0.6 ns |
| Рабочая температура | 0 °C to 70 °C |
| JTAG (IEEE 1149.1) | Yes |
| Тип монтажа | Surface Mount |
| Logic Family | CMOS |
| Статус RoHS | Unknown - pre-RoHS design |
Руководство по цоколевке EPF10K100EBC356-1 в корпусе 356-lbga
Цоколевка для EPF10K100EBC356-1 (корпус 356-lbga). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EPF10K100EBC356-1.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EPF10K100EBC356-1 подходит для 6 применениеs: Telecommunications Line Card Glue Logic, Industrial Control Board Logic Integration, ASIC Prototyping and Emulation Platform, Legacy System Upgrade and Bridge Logic, Peripheral Controller and Co-Processor, Test and Measurement Instrumentation Front-End.
Telecommunications Line Card Glue Logic
The EPF10K100EBC356-1's 100K gates, 4,992 logic elements, and 49,152 bits of embedded SRAM make it well-suited for telecommunications line cards requiring bus bridging, protocol conversion, and FIFO buffering in compact LBGA-356 footprint. The device's 333.33 MHz internal frequency and 0.6 ns propagation delay handle TDM bus multiplexing, HDLC framing, and ATM segmentation at line rates. Embedded Array Blocks provide true dual-port memory for cell buffering without consuming logic resources. The 274 user I/Os accommodate parallel Utopia interfaces, POS-PHY connections, and standard telecom backplane buses.
Рекомендуется
Industrial Control Board Logic Integration
In industrial control applications, the EPF10K100EBC356-1 integrates glue logic between microcontrollers, motor drivers, and I/O expansion chips. Its 274 I/Os interface directly to multi-axis encoder inputs, PWM outputs, and isolated digital I/O banks, while the embedded SRAM supports real-time data tables for PID loops. Commercial 0-70 °C temperature rating suits factory-floor enclosures. The JTAG (IEEE 1149.1) interface enables in-system programming during board bring-up and field firmware updates via standard ByteBlaster cables.
Рекомендуется
ASIC Prototyping and Emulation Platform
Designers use the EPF10K100EBC356-1 as an ASIC prototyping vehicle where 100K gates and 4,992 logic elements map directly onto mid-complexity ASIC netlists. The 0.6 ns propagation delay approximates ASIC timing for pre-silicon validation, while embedded memory blocks model ASIC SRAM macros. Multiple EPF10K100EBC356-1 devices can be chained via JTAG to emulate larger ASICs, making this part a workhorse for ASIC verification teams. MAX+PLUS II and Quartus II synthesis flows support industry-standard Verilog and VHDL inputs.
Рекомендуется
Legacy System Upgrade and Bridge Logic
The EPF10K100EBC356-1 serves as a bus bridge and protocol converter in legacy systems upgrading from discrete TTL/CMOS logic to integrated programmable logic. Its 356-LBGA footprint maximizes board density while providing 274 I/Os to interface with legacy ISA, VME, or proprietary backplanes. Embedded Array Blocks replace external FIFO chips, reducing BOM count and board area. This application is common in military, medical, and industrial systems with multi-decade deployment lifecycles.
Рекомендуется
Peripheral Controller and Co-Processor
Used as a peripheral co-processor alongside a main CPU, the EPF10K100EBC356-1 offloads I/O handling, DMA control, and accelerator functions. The 49,152-bit embedded memory provides local data storage for high-throughput DMA streams, while 274 I/Os connect to multiple peripheral buses simultaneously. The 333.33 MHz internal frequency is well-matched to PCI and similar 33 MHz peripheral buses where the FPGA can implement custom controller state machines.
Рекомендуется
Test and Measurement Instrumentation Front-End
In test equipment, the EPF10K100EBC356-1 implements custom timing generators, pattern sequencers, and signal routing matrices. The high I/O count handles parallel fixture interfaces, while embedded memory stores calibration tables and pattern data. The JTAG boundary-scan chain supports PCB-level interconnect testing per IEEE 1149.1, adding up to 31,250 additional gates of test logic. The commercial temperature grade suits laboratory and production-line environments.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPF10K100EBC356-1 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPF10K100EBC356-2 | EPF10K100ABC356-2 | EPF10K100EBC356-1N | EPF10K100EBC356-1X | EPF10K100EBC356-1B |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 356-LBGA | 356-LBGA (same) | 356-LBGA (same) | 356-LBGA (same) | 356-LBGA (same) | 356-LBGA (same) |
| Speed Grade | -1 (fastest) | -2 (slower) | -2 (slower) | -1 (same) | -1 (same) | -1 (same) |
| Logic Elements | 4,992 | 4,992 (same) | 4,992 (same) | 4,992 (same) | 4,992 (same) | 4,992 (same) |
| System Gates | 100,000 | 100,000 (same) | 100,000 (same) | 100,000 (same) | 100,000 (same) | 100,000 (same) |
| Embedded SRAM | 49,152 bits | 49,152 bits (same) | 49,152 bits (same) | 49,152 bits (same) | 49,152 bits (same) | 49,152 bits (same) |
| User I/Os | 274 | 274 (same) | 274 (same) | 274 (same) | 274 (same) | 274 (same) |
| Core Voltage | 2.5 V | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete (Rochestock) | Obsolete | Obsolete |
Ключевые отличия
- Fastest speed grade in the FLEX 10KE LBGA-356 family (против EPF10K100EBC356-2)
- Same 356-LBGA footprint as BGA-256 variants enables easy migration (против EPF10K100BFC256-3)
- Embedded Array Blocks for true dual-port RAM (против EPF10K100BFC256-3)
Заметки по проектированию
The EPF10K100EBC356-1 requires a stable 2.5 V core supply with a tolerance of ±5% and separate 2.5 V or 3.3 V I/O bank supplies per the manufacturer datasheet. Decoupling requires at minimum one 100 µF bulk capacitor per supply rail plus 0.1 µF and 0.01 µF ceramic capacitors close to each VCC/GND pair. Estimated: with all 274 I/Os toggling at 33 MHz, Icc core current can exceed 500 mA, so power plane design with low impedance is critical.
In LBGA-356 packages, heat dissipation is primarily through the internal power/ground balls and PCB thermal vias. Per the manufacturer datasheet, the thermal resistance θJA is approximately 18 °C/W with a standard 4-layer JEDEC test board; without thermal vias under the package die-up area, junction temperature can rise above 100 °C at full I/O utilization. Recommend placing a 6x6 thermal via array (0.3 mm drill, 0.5 mm pitch) on all internal GND balls.
The 356-LBGA package has 1.0 mm ball pitch on a 35 x 35 mm body. PCB design requires 0.4 mm laser-drilled vias, microvia-in-pad construction recommended for inner balls, and matched 50 Ω controlled-impedance traces for high-speed I/O. Per the manufacturer datasheet, all VCC and GND balls must be connected to internal planes, and signal traces should not pass beneath the package footprint.
Common pitfalls: (1) Do not assume EPF10K100B (FLEX 10KB) and EPF10K100E (FLEX 10KE) are interchangeable - the 'B' lacks Embedded Array Blocks; (2) JTAG chain consumes up to 31,250 gates per the manufacturer datasheet, which must be included in resource estimation; (3) MAX+PLUS II design files must be resynthesized under Quartus for newer flows; (4) Commercial temperature grade parts will fail outside 0-70 °C.
Информация о соответствии
RoHS compliance not documented in verified distributor data. FLEX 10KE family predates widespread RoHS adoption in FPGAs; -N suffix variants (EPF10K100EBC356-1N) are likely lead-free but should be verified with the manufacturer's material declaration before RoHS-only assembly.