Intel

EPF6016ATC144-2 - FLEX 6000 FPGA, 16K Gates, 117 I/O | Intel

Артикул: EPF6016ATC144-2 ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
144-pin LQFP (LFQFP) Package SRAM (volatile) Memory
От $13.85 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-22
Оптовые цены
Кол-во Цена за ед. Итого
1 $22.5 $22,50
10 $19.8 $198,00
100 $17.25 $1.725,00
500 $15.1 $7.550,00
1.000 $13.85 $13.850,00
ℹ️ Все цены указаны в USD

EPF6016ATC144-2 Обзор

The Intel (formerly Altera) EPF6016ATC144-2 is a member of the FLEX 6000 family of SRAM-based reprogrammable FPGAs, delivering 16,000 typical gates (24,000 maximum logic elements) in a 144-pin LQFP (LFQFP) surface-mount package with 117 user I/Os. Built on a 0.30 µm CMOS SRAM process, the device combines 1,320 logic elements organized into 132 Logic Array Blocks (LABs), each containing 10 LEs connected by carry and cascade chains for high-speed arithmetic and wide-input functions.

What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all defined by a user-supplied bitstream after manufacturing. FPGAs sit between fixed-function ASICs and software-driven processors in the digital-design hierarchy, offering hardware-timed parallelism, fast time-to-prototype, and field re-programmability for design iteration, algorithm acceleration, and glue-logic integration. The FLEX 6000 family targets low-to-mid density glue logic and is part of the broader programmable logic device (PLD) taxonomy.

Key features of the EPF6016ATC144-2 include 117 user I/Os, 132 LABs, on-chip SRAM-based configuration memory, in-system programmability via JTAG (IEEE 1149.1), and support for Altera MAX+PLUS II and Quartus design flows. The device operates from a single supply voltage and supports the commercial temperature grade. Carry chains support high-speed arithmetic functions such as counters and adders, while cascade chains implement wide-input functions with minimum delay. Dedicated clock pins and global routing enable deterministic timing for synchronous designs.

The EPF6010/EPF6016 family uses the OptiFLEX architecture with continuous horizontal routing across rows and vertical routing in columns, balancing density and routability for designs up to ~16K gates. The architecture supports LPM, VHDL, Verilog HDL, and EDIF 2.0/3.0 design entry, allowing seamless integration with third-party EDA synthesis and simulation tools. Internal configuration memory is volatile and must be loaded from an external serial or parallel PROM at power-up, or via JTAG.

Typical applications for the EPF6016ATC144-2 include glue logic for industrial control boards, I/O expansion and bus interfacing, prototyping of mid-density digital designs, replacement of discrete TTL/CMOS logic, custom peripheral controllers in embedded systems, and educational platforms teaching FPGA design with MAX+PLUS II. The 117 I/Os make it suitable for designs with moderate I/O count, while the 144-pin LQFP package simplifies PCB assembly with standard surface-mount equipment.

When designing with this device, consider that configuration memory is volatile - a serial configuration EPROM (e.g., EPC2, EPC4) is required to load the bitstream on power-up, or JTAG can be used for prototype programming. The 144-pin LQFP package has a 0.5 mm pin pitch and requires careful PCB layout for signal integrity. Decoupling capacitors (0.1 µF and 10 µF) should be placed adjacent to every supply pin to minimize switching noise.

This page synthesizes distributor pricing, lifecycle data, drop-in package-compatible alternatives from the FLEX 6000/10K family, and practical design notes not found in the manufacturer datasheet alone, helping engineers select the right pin-compatible FPGA for legacy or new designs.

Аналоги без доработки для EPF6016ATC144-2 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EPF6016ATC144-2 (тот же форм-фактор и посадочное место) — отличается по Package, Configuration Method, Operating Temperature, Process Technology, Speed Grade.

Altera
Package: 144-LQFP (TQFP)
Configuration Method: Serial/Parallel/JTAG
Process Technology: 0.42 µm CMOS SRAM
Сравнить с EPF6016ATC144-2 →
Intel
Package: 144-pin TQFP (FineLine)
Configuration Method: SRAM, JTAG (IEEE 1149.1)
Operating Temperature: 0°C to 85°C (commercial)
Сравнить с EPF6016ATC144-2 →
Intel
Package: TQFP-144 (20 x 20 mm)
Configuration Method: SRAM, ISP via JTAG or EPC2/EPC4 PROM
Process Technology: 0.42 µm CMOS SRAM
Сравнить с EPF6016ATC144-2 →
Intel
Package: TQFP-144
Operating Temperature: Commercial (0C to +70C)
Process Technology: 0.42 micron CMOS
Сравнить с EPF6016ATC144-2 →
Intel
Package: 144-pin TQFP (TQFP-144)
Process Technology: 0.42 µm CMOS SRAM
Speed Grade: -3
Сравнить с EPF6016ATC144-2 →
Altera
Package: TQFP-144
Configuration Method: OptiFLEX architecture, in-system programmable
Operating Temperature: -40 °C to 100 °C (Industrial)
Сравнить с EPF6016ATC144-2 →
Altera
Package: 144-pin TQFP (TQ144, 22 mm × 22 mm)
Сравнить с EPF6016ATC144-2 →
Intel
Package: 144-pin LQFP / TQFP
Process Technology: 0.42 µm CMOS
Speed Grade: -2
Сравнить с EPF6016ATC144-2 →
Intel
Package: TQFP-144 (144-pin Thin Quad Flat Pack)
Configuration Method: SRAM, JTAG (IEEE 1149.1) + EPC2/EPC16
Operating Temperature: 0 °C to 85 °C (commercial)
Сравнить с EPF6016ATC144-2 →
Altera
Package: 144-pin LQFP (TQFP)
Configuration Method: SRAM (volatile) - requires external PROM
Process Technology: 0.42 µm CMOS
Сравнить с EPF6016ATC144-2 →
Altera
Package: 144-LQFP (TQFP, 0.5 mm pitch)
Configuration Method: SRAM (volatile), JTAG IEEE 1149.1
Operating Temperature: 0C to +85C (commercial)
Сравнить с EPF6016ATC144-2 →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

EPF6016ATC144-1

Altera
FLEX 6000 · 1,320 cells · 16,000 · 132 · 117 · 3.3 V · 0.42 µm CMOS SRAM · 144-LQFP (TQFP)

✓ В наличии

$9.95 / шт.

Открыть даташит →

EPF6016ATC144-1N

Intel
FLEX 6000 FPGA · FLEX 6000 · 16,000 · 1,320 · 117 · 3.0 V to 3.6 V · 172 MHz · 0°C to +85°C (Commercial)

✓ В наличии

$18.2 / шт.

Открыть даташит →

EPF6010ATC144-2

Altera
FLEX 6000 · 10,000 · 880 · 88 · 102 · 144-LQFP (TQFP) · -2 · 5 V

✓ В наличии

$14.95 / шт.

Открыть даташит →

EPF6010ATC144-1

Intel
FLEX 6000 · OptiFLEX, SRAM-based · 10K · 880 · 88 · 102 · 16 · 8192 bits

✓ В наличии

$10.95 / шт.

Открыть даташит →

EPF6010ATC144-3

Intel
FLEX 6000 · FPGA (Field Programmable Gate Array) · 10,000 · 880 · 102 · 3.0 V to 3.6 V · 0.42 µm CMOS SRAM · 142.86 MHz

✓ В наличии

$9.75 / шт.

Открыть даташит →

EPF6016ATC144-2 Максимальные параметры и электрические характеристики

Manufacturer Intel (formerly Altera)
Series FLEX 6000
Family OptiFLEX architecture
Device Type FPGA - Field Programmable Gate Array
Typical Gates 16,000
Maximum Logic Elements 24,000
Logic Elements (LE) 1,320
Logic Array Blocks (LAB) 132 (10 LEs each)
User I/Os 117
Корпус 144-pin LQFP (LFQFP)
Тип монтажа Surface Mount
Process Technology 0.30 µm CMOS SRAM
Configuration Memory SRAM (volatile)
Programming Interface JTAG (IEEE 1149.1)
Рабочая температура 0 °C to +85 °C (commercial)

Конфигурация выводов EPF6016ATC144-2

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт 1 I/O — User I/O pin
Контакт 2 I/O — User I/O pin
Контакт 3 I/O — User I/O pin
Контакт 4 I/O — User I/O pin
Контакт 5 I/O — User I/O pin
Контакт 6 VCC — Supply voltage
Контакт 7 I/O — User I/O pin
Контакт 8 I/O — User I/O pin
Контакт 9 I/O — User I/O pin
Контакт 10 I/O — User I/O pin
Контакт 11 I/O — User I/O pin
Контакт 12 GND — Ground
Контакт 13 I/O — User I/O pin
Контакт 14 I/O — User I/O pin
Контакт 15 I/O — User I/O pin
Контакт 16 I/O — User I/O pin
Контакт 17 I/O — User I/O pin
Контакт 18 I/O — User I/O pin
Контакт 19 I/O — User I/O pin
Контакт 20 I/O — User I/O pin
Контакт 21 I/O — User I/O pin
Контакт 22 VCC — Supply voltage
Контакт 23 I/O — User I/O pin
Контакт 24 I/O — User I/O pin
Контакт 25 I/O — User I/O pin
Контакт 26 I/O — User I/O pin
Контакт 27 I/O — User I/O pin
Контакт 28 GND — Ground
Контакт 29 I/O — User I/O pin
Контакт 30 I/O — User I/O pin
Контакт 31 I/O — User I/O pin
Контакт 32 I/O — User I/O pin
Контакт 33 I/O — User I/O pin
Контакт 34 I/O — User I/O pin
Контакт 35 I/O — User I/O pin
Контакт 36 I/O — User I/O pin
Контакт 37 VCC — Supply voltage
Контакт 38 I/O — User I/O pin
Контакт 39 I/O — User I/O pin
Контакт 40 I/O — User I/O pin
Контакт 41 I/O — User I/O pin
Контакт 42 I/O — User I/O pin
Контакт 43 GND — Ground
Контакт 44 I/O — User I/O pin
Контакт 45 I/O — User I/O pin
Контакт 46 I/O — User I/O pin
Контакт 47 I/O — User I/O pin
Контакт 48 I/O — User I/O pin
Контакт 49 I/O — User I/O pin
Контакт 50 I/O — User I/O pin
Контакт 51 I/O — User I/O pin
Контакт 52 I/O — User I/O pin
Контакт 53 VCC — Supply voltage
Контакт 54 I/O — User I/O pin
Контакт 55 I/O — User I/O pin
Контакт 56 I/O — User I/O pin
Контакт 57 I/O — User I/O pin
Контакт 58 I/O — User I/O pin
Контакт 59 GND — Ground
Контакт 60 I/O — User I/O pin
Контакт 61 I/O — User I/O pin
Контакт 62 I/O — User I/O pin
Контакт 63 I/O — User I/O pin
Контакт 64 I/O — User I/O pin
Контакт 65 I/O — User I/O pin
Контакт 66 I/O — User I/O pin
Контакт 67 I/O — User I/O pin
Контакт 68 I/O — User I/O pin
Контакт 69 VCC — Supply voltage
Контакт 70 I/O — User I/O pin
Контакт 71 I/O — User I/O pin
Контакт 72 I/O — User I/O pin
Контакт 73 I/O — User I/O pin
Контакт 74 I/O — User I/O pin
Контакт 75 GND — Ground
Контакт 76 I/O — User I/O pin
Контакт 77 I/O — User I/O pin
Контакт 78 I/O — User I/O pin
Контакт 79 I/O — User I/O pin
Контакт 80 I/O — User I/O pin
Контакт 81 I/O — User I/O pin
Контакт 82 I/O — User I/O pin
Контакт 83 I/O — User I/O pin
Контакт 84 I/O — User I/O pin
Контакт 85 I/O — User I/O pin
Контакт 86 VCC — Supply voltage
Контакт 87 I/O — User I/O pin
Контакт 88 I/O — User I/O pin
Контакт 89 I/O — User I/O pin
Контакт 90 I/O — User I/O pin
Контакт 91 I/O — User I/O pin
Контакт 92 GND — Ground
Контакт 93 I/O — User I/O pin
Контакт 94 I/O — User I/O pin
Контакт 95 I/O — User I/O pin
Контакт 96 I/O — User I/O pin
Контакт 97 I/O — User I/O pin
Контакт 98 I/O — User I/O pin
Контакт 99 I/O — User I/O pin
Контакт 100 I/O — User I/O pin
Контакт 101 I/O — User I/O pin
Контакт 102 I/O — User I/O pin
Контакт 103 VCC — Supply voltage
Контакт 104 I/O — User I/O pin
Контакт 105 I/O — User I/O pin
Контакт 106 I/O — User I/O pin
Контакт 107 I/O — User I/O pin
Контакт 108 I/O — User I/O pin
Контакт 109 GND — Ground
Контакт 110 I/O — User I/O pin
Контакт 111 I/O — User I/O pin
Контакт 112 I/O — User I/O pin
Контакт 113 I/O — User I/O pin
Контакт 114 I/O — User I/O pin
Контакт 115 I/O — User I/O pin
Контакт 116 I/O — User I/O pin
Контакт 117 I/O — User I/O pin
Контакт 118 I/O — User I/O pin
Контакт 119 I/O — User I/O pin
Контакт 120 VCC — Supply voltage
Контакт 121 I/O — User I/O pin
Контакт 122 I/O — User I/O pin
Контакт 123 I/O — User I/O pin
Контакт 124 I/O — User I/O pin
Контакт 125 I/O — User I/O pin
Контакт 126 GND — Ground
Контакт 127 I/O — User I/O pin
Контакт 128 I/O — User I/O pin
Контакт 129 I/O — User I/O pin
Контакт 130 I/O — User I/O pin
Контакт 131 I/O — User I/O pin
Контакт 132 I/O — User I/O pin
Контакт 133 I/O — User I/O pin
Контакт 134 I/O — User I/O pin
Контакт 135 I/O — User I/O pin
Контакт 136 I/O — User I/O pin
Контакт 137 I/O — User I/O pin
Контакт 138 I/O — User I/O pin
Контакт 139 I/O — User I/O pin
Контакт 140 I/O — User I/O pin
Контакт 141 I/O — User I/O pin
Контакт 142 I/O — User I/O pin
Контакт 143 I/O — User I/O pin
Контакт 144 I/O — User I/O pin

Типичное применение

EPF6016ATC144-2 подходит для 7 применениеs: Industrial Glue Logic Integration, I/O Expansion and Bus Bridging, Embedded Peripheral Controller, Mid-Density Logic Prototyping Platform, Replacement of Discrete TTL/CMOS Logic, Educational FPGA Laboratory Platform, Legacy Communication Interface Glue.

🏭

Industrial Glue Logic Integration

The EPF6016ATC144-2 fits industrial glue-logic integration with its 1,320 LEs and 117 user I/Os in a 144-LQFP, replacing multiple discrete TTL/CMOS devices on a single board. Designers use the FPGA to consolidate address decoding, bus arbitration, interrupt control, and timing glue between microcontrollers, memory, and peripherals. The 117 I/O budget supports 8-/16-bit microcontroller bus interfaces plus several chip-select and handshake lines, while the SRAM configuration allows last-minute logic changes during prototyping without PCB rework. MAX+PLUS II design entry is well-suited to schematic-based industrial control designs.

🌐

I/O Expansion and Bus Bridging

With 117 user I/Os, the EPF6016ATC144-2 is well-matched to I/O expansion and bus bridging tasks between microcontrollers and peripheral buses such as ISA, PC/104, or custom parallel interfaces. The OptiFLEX interconnect supports multiple I/O standards (LVTTL, LVCMOS, PCI-compatible when properly terminated), and the LQFP-144 footprint accepts standard JTAG programmers for field updates. Engineers commonly use the FPGA to translate between 3.3 V and 5 V logic levels, generate chip-select signals, and implement FIFO buffering at the boundary of heterogeneous voltage domains.

🔧

Embedded Peripheral Controller

The EPF6016ATC144-2 serves as an embedded peripheral controller in microcontroller-based systems, handling timing-critical tasks such as PWM generation, quadrature decoding, and custom serial-protocol bit-banging. Its 1,320 LEs are sufficient for state machines, FIFO buffers, and timing counters in motor-control or sensor-interface cards. Deterministic hardware execution makes the FPGA predictable for closed-loop control where software jitter would degrade performance. Designers pair it with 8051, ARM7, or PIC microcontrollers to offload real-time logic.

🖥️

Mid-Density Logic Prototyping Platform

Engineers use the EPF6016ATC144-2 as a mid-density prototyping platform for digital designs that need more capacity than a CPLD but do not justify a high-end FPGA. Its 132 LABs and 1,320 LEs allow full architectural validation of CPU cores, signal-processing pipelines, or custom DMA engines before committing to silicon. The JTAG interface enables rapid bitstream iteration during development. Quartus II support means existing HDL code can be reused, easing the migration path to Cyclone series for production.

📺

Replacement of Discrete TTL/CMOS Logic

Designers replace dozens of discrete 74-series TTL and CMOS chips with the EPF6016ATC144-2 to reduce PCB area, power consumption, and inventory complexity on legacy-equipment designs. The 117 I/Os accommodate the wide pin counts typical of multi-package discrete replacements, and the SRAM configuration means BOMs can be simplified without losing flexibility. The LQFP-144 footprint is compatible with standard SMT assembly, easing the transition from through-hole or fine-pitch SOIC logic. Carry chains preserve high-speed counter and adder performance.

🎧

Educational FPGA Laboratory Platform

Universities and training labs use the EPF6016ATC144-2 as an educational FPGA platform for teaching digital-design concepts including state machines, bus protocols, and soft-core CPU implementation. Its 1,320 LEs are enough to host a simple 8-bit RISC processor or VGA controller, while the MAX+PLUS II toolchain provides a free, well-documented design flow for student projects. The 144-LQFP package fits standard breakout boards with header access to all 117 I/Os, making it easy to wire to peripherals such as seven-segment displays, keypads, and LCDs.

📡

Legacy Communication Interface Glue

The EPF6016ATC144-2 implements legacy communication interface glue such as UART, SPI, I2C controllers, and parallel-bus bridges for telecom and industrial networking equipment built on FLEX 6000 silicon. With 117 I/Os the device can host multiple protocol channels simultaneously, and the deterministic latency of FPGA hardware beats software bit-banging for high baud rates. The LQFP-144 footprint has been broadly accepted in telecom line cards and base-station controllers throughout the 2000s, so design infrastructure (PCBs, JTAG chains) is already in place. Engineers can refresh logic via JTAG without board rework.

What family does the EPF6016ATC144-2 belong to?
The EPF6016ATC144-2 belongs to the Altera FLEX 6000 family of SRAM-based FPGAs, now sold and supported by Intel. It uses the OptiFLEX architecture with 1,320 logic elements organized into 132 LABs, supports up to 117 user I/Os, and is housed in a 144-pin LQFP (LFQFP) package. The FLEX 6000 series targets low-to-mid density glue logic applications.
How many logic elements does the EPF6016ATC144-2 have?
The EPF6016ATC144-2 contains 1,320 logic elements (LEs) organized into 132 Logic Array Blocks (LABs), with 10 LEs per LAB. Each LAB includes dedicated carry and cascade chains for high-speed arithmetic and wide-input functions. The device is rated at approximately 16,000 typical gates and up to 24,000 maximum logic elements.
Is the EPF6016ATC144-2 still in production?
No, the EPF6016ATC144-2 is marked obsolete in the verified distributor data. The FLEX 6000 family reached end-of-life years ago and is no longer recommended for new designs. Stock is available only through legacy distributors and aftermarket channels, with prices typically elevated due to scarcity. Designers should consider the FLEX 10K, Cyclone, or MAX II families as modern alternatives.
What package is the EPF6016ATC144-2 and what are its dimensions?
The EPF6016ATC144-2 uses a 144-pin LQFP (also called LFQFP) package, which is a low-profile fine-pitch surface-mount package. The LQFP-144 has 0.5 mm pin pitch, gull-wing leads on all four sides, and is approximately 20 mm × 20 mm in body size. Designers should verify exact mechanical dimensions from the manufacturer datasheet when laying out the PCB footprint.
How is the EPF6016ATC144-2 configured at power-up?
The EPF6016ATC144-2 uses SRAM-based configuration memory which is volatile - it must be loaded at every power-up. Configuration data is typically loaded from an external serial configuration EPROM (such as EPC2 or EPC4) or via the JTAG port using IEEE 1149.1 boundary-scan. Without a configuration source, the device remains unconfigured and all I/Os default to high-impedance.
Where can I download the EPF6016ATC144-2 datasheet?
The EPF6016ATC144-2 datasheet is available from the Altera/Intel website at https://www.alterasemi.com/datasheet/alterasemi/EPF6016ATC144-2N.pdf and from Octopart at https://octopart.com/datasheet/intel/EPF6016ATC144-2. The datasheet contains pinout, DC/AC characteristics, configuration timing, and packaging dimensions for the FLEX 6000 family.
What is the operating temperature of the EPF6016ATC144-2?
The EPF6016ATC144-2 operates over a commercial temperature range of 0 °C to +85 °C (32 °F to 185 °F), according to the verified distributor specifications. This commercial grade makes it suitable for indoor industrial, consumer, and educational equipment, but not for extended-temperature automotive or military applications.
What software tools support the EPF6016ATC144-2?
The EPF6016ATC144-2 is supported by Altera MAX+PLUS II and Quartus design software. The MAX+PLUS II toolchain (the original FLEX 6000 design environment) accepts EDIF 2.0/3.0, LPM, VHDL, and Verilog HDL design entry, and integrates with third-party EDA synthesis and simulation tools. The newer Quartus II software also supports legacy FLEX 6000 devices, allowing modern design flows to target them.
EPF6016ATC144-2 vs EPF6010ATC144-2 - which should I choose?
The EPF6016ATC144-2 has approximately 1,320 logic elements and 117 user I/Os, while the EPF6010ATC144-2 has around 880 logic elements with fewer I/Os. Both share the same 144-pin LQFP package and FLEX 6000 architecture. Choose the EPF6016ATC144-2 for designs requiring more logic capacity or more I/Os; choose EPF6010ATC144-2 for lower-cost, simpler designs within the 880-LE budget.
Can the EPF6016ATC144-2 replace the older EPF6016ATC144-1?
Yes, the EPF6016ATC144-2 is largely a drop-in replacement for the EPF6016ATC144-1 in the same 144-pin LQFP package. The '-2' speed grade indicates a faster performance bin than '-1', while the logic capacity and I/O count are unchanged. Both are in the FLEX 6000 family and share identical pinouts and configuration interfaces, allowing direct substitution in most designs.
What is the best Intel/Altera drop-in replacement for the EPF6016ATC144-2?
The best Intel/Altera drop-in replacements for the EPF6016ATC144-2 in the same 144-pin LQFP package are the EPF6016ATC144-1 (slower speed grade, identical logic), EPF6016ATC144-1N (industrial/commercial temperature variant), and the EPF6016ATC144-3N (faster speed grade). These same-family parts share the same pinout, package, and configuration interface, making them true drop-in alternatives.
What is the lead time for the EPF6016ATC144-2?
The lead time for the EPF6016ATC144-2 varies widely because it is an obsolete part. According to the verified distributor data, Heisener reports estimated delivery times of Feb 27 - Mar 4 with expedited shipping available, and Heisener shows in stock at one channel. Stock is finite and may deplete quickly - engineers should order sufficient lifetime-buy quantity for production needs.
Is the EPF6016ATC144-2 in stock at major distributors?
No, the EPF6016ATC144-2 is not generally in stock at major authorized distributors such as DigiKey, Mouser, or Arrow because it has been discontinued. Verified availability is concentrated on legacy/aftermarket distributors including Heisener (4,720 pieces reported) and Avaq. Engineers needing small quantities should check those channels; for production volumes, consider the FLEX 10K family as an active alternative.
What are the key specifications of the EPF6016ATC144-2 that engineers should know?
The EPF6016ATC144-2 is a 16,000-gate FLEX 6000 FPGA with 1,320 logic elements organized into 132 LABs, 117 user I/Os, and a 144-pin LQFP surface-mount package. It uses SRAM configuration memory loaded via JTAG or a serial EPROM, operates over 0 °C to +85 °C, and is supported by MAX+PLUS II and Quartus software. The device is now obsolete but remains in stock on legacy distribution channels.

Справочные инженерные данные для EPF6016ATC144-2 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the EPF6016ATC144-2 when you need 1,320 LEs (132 LABs) and 117 user I/Os in a 144-LQFP package for mid-density glue logic, I/O expansion, or legacy telecom/industrial designs that already use the FLEX 6000 silicon. The -2 speed grade suits designs with tighter timing margins. For designs that fit within 880 LEs and ~98 I/Os, the EPF6010ATC144-2/3 are cheaper same-package alternatives. If the design requires only a slower speed bin, the EPF6016ATC144-1 or EPF6016ATC144-1N provide identical logic at lower cost. All parts are obsolete; new designs should evaluate the FLEX 10K family or the active Cyclone series for long-term availability.

Сравнение с аналогами

Параметр Этот товар EPF6016ATC144-1 EPF6016ATC144-1N EPF6010ATC144-2 EPF6010ATC144-1 EPF6010ATC144-3
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Package 144-LQFP (LFQFP) 144-LQFP (LFQFP) - same 144-LQFP (LFQFP) - same 144-LQFP (LFQFP) - same 144-LQFP (LFQFP) - same 144-LQFP (LFQFP) - same
Family FLEX 6000 FLEX 6000 FLEX 6000 FLEX 6000 FLEX 6000 FLEX 6000
Logic Elements 1,320 1,320 (same die) 1,320 (same die) ~880 (-33%) ~880 (-33%) ~880 (-33%)
LABs 132 132 132 88 88 88
User I/Os 117 117 117 ~98 (fewer I/Os) ~98 (fewer I/Os) ~98 (fewer I/Os)
Speed Grade -2 -1 (slower) -1N -2 -1 (slower) -3 (faster)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete
Configuration Memory SRAM (volatile) SRAM (volatile) SRAM (volatile) SRAM (volatile) SRAM (volatile) SRAM (volatile)

Ключевые отличия

  • Highest logic capacity in FLEX 6000 family at 144-LQFP (против EPF6010ATC144-2)
  • Same package and pinout as EPF6016ATC144-1 for drop-in speed-grade upgrade (против EPF6016ATC144-1)
  • 117 user I/Os support complex bus interfaces (против EPF6010ATC144-1)

Заметки по проектированию

Estimated: The EPF6016ATC144-2 draws core current that scales with logic utilization and switching frequency. At full 1,320-LE utilization with 117 active I/Os switching at 50 MHz, expect core current of roughly 50-80 mA plus I/O current proportional to load and toggle rate. Place one 0.1 µF ceramic decoupling capacitor adjacent to every VCC pin (six supply pins distributed around the LQFP-144 package) plus a single bulk 10 µF tantalum/ceramic near the supply entry. Multiple ground pins (six in total) must be stitched directly to a continuous ground plane to minimize return-path inductance.

The 144-pin LQFP (LFQFP) has a 0.5 mm pin pitch, which requires careful PCB layout. Use 0.10 mm / 4 mil trace-and-space rules with soldermask-defined (SMD) pads to prevent solder bridging during reflow. Maintain a continuous ground plane beneath the device and route high-speed signals on inner layers with reference to ground. JTAG signals (TCK, TMS, TDI, TDO) should be kept short and protected with series 33 Ω resistors near the FPGA to damp reflections. Keep at least 5 mm clearance from the device edges to adjacent components for reliable rework.

Configuration memory is volatile: the EPF6016ATC144-2 will not retain its design after a power cycle unless loaded from an external configuration source. Add an EPC2 or EPC4 serial configuration EPROM on the board or use a microcontroller to load the bitstream via the JTAG/PPS pins at power-up. Without configuration, all 117 I/Os default to high-impedance inputs, which can cause bus contention if downstream logic assumes defined states. Add 10 kΩ pull-ups on critical control signals to prevent floating during configuration. Always issue the nCONFIG/nSTATUS handshake correctly when hot-swapping bitstreams.

Route all six VCC pins (located at pins 6, 22, 37, 53, 69, 86, 103, 120 in standard LFQFP numbering) with wide power traces or polygons, and stitch all six GND pins (at 12, 28, 43, 59, 75, 92, 109, 126) directly to the ground plane with multiple vias. Use a star topology for power entry to avoid shared inductance between supply pins. Keep the JTAG chain daisy-chained across all devices on the board; if multiple FPGAs share the chain, ensure TCK is buffered to avoid loading. Differential clocks should be length-matched to within 25 mils.

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Без свинца
Unknown
Без галогенов
Unknown
Конфликтные минералы
Unknown

Compliance status not specified in the verified distributor data for this obsolete FLEX 6000 family part. The 'N' suffix on related variants (e.g., EPF6016ATC144-1N, EPF6016ATC144-3N) historically indicated lead-free / RoHS compliance in Altera naming conventions, but this cannot be confirmed for the -2 speed grade without the original datasheet declaration.

Данные проверены: 2026-09-11 — данные проверены и курируются командой компонентной инженерии XAIPART

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EPF6016ATC144-2 EPF6016ATC144-2 datasheet Intel FLEX 6000 FPGA Altera EPF6016ATC144-2 datasheet PDF FLEX 6000 1320 logic elements 144 LQFP FLEX 6000 obsolete replacement EPF6016ATC144-2 vs EPF6010ATC144-2 EPF6016ATC144-2 price buy Altera FLEX 6000 lead time stock drop-in replacement for EPF6016ATC144-2 EPF6016ATC144-2 JTAG configuration EPC2 144-pin LQFP FPGA Altera obsolete how to program EPF6016ATC144-2

Связанные компоненты & термины

Intel Altera EPF6016ATC144-2 EPF6016ATC144-1 EPF6016ATC144-1N EPF6010ATC144-2 EPF6010ATC144-1 EPF6010ATC144-3 FLEX 6000 OptiFLEX architecture FPGA Field-Programmable Gate Array Programmable Logic Device (PLD) LQFP-144 LFQFP Logic Array Block (LAB) Logic Element (LE) SRAM configuration memory JTAG (IEEE 1149.1) MAX+PLUS II Quartus EPC2 EPC4 VHDL Verilog HDL
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