iCE40UP5K-UWG30 - 5280 LUT UltraLow Power FPGA | Lattice
Артикул: iCE40UP5K-UWG30 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $12.63 | $12,63 |
| 10 | $11.5 | $115,00 |
| 100 | $10.4 | $1.040,00 |
| 500 | $9.6 | $4.800,00 |
| 1.000 | $8.85 | $8.850,00 |
iCE40UP5K-UWG30 Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks, look-up tables (LUTs), flip-flops, and interconnect that designers configure to implement custom digital circuits. Within the product hierarchy, the iCE40UP5K is a low-density, low-power FPGA, a sibling of CPLDs and a complement to microcontrollers and ASSPs in the broader family of programmable logic and power management ICs.
Key differentiating features include the iCE40 UltraPlus fabric with 5280 LUTs and 640 kbit of distributed block RAM plus 1.1 Mb of SPRAM, two hardened I2C and two hardened SPI interfaces for offloading communication tasks, eight 16x16 DSP MAC blocks for sensor-fusion and tiny-ML workloads, and two PLLs. Its active power consumption is the lowest in its class, enabling battery-powered and always-on applications.
Architecturally, the UltraPlus family extends the iCE40 fabric with large on-chip SPRAM and DSP blocks, supporting the Lattice sensAI stack for neural-network inference at the edge. Configuration is via an internal configuration image or external SPI flash, and the device is supported by the free Lattice iCEcube2 and open-source iCE40 toolchains.
Typical applications include smartphone and wearable sensor-hub designs, always-on machine-learning inference, industrial IoT edge nodes, and display or camera interface bridging, where sub-milliwatt standby and a sub-3 mm footprint are decisive.
Design consideration: the 0.4 mm pitch WLCSP requires controlled-impedance PCB design; ball A1 marks pin 1 and power-ball grouping means simultaneous-switching I/O budgeting is essential for clean signal integrity.
This page synthesizes verified distributor data, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Аналоги без доработки для iCE40UP5K-UWG30 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
ICE40UP5K-UWG30ITR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
ICE40UP5K-UWG30ITR1K
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
iCE40UP5K-UWG30 Максимальные параметры и электрические характеристики
| Family | iCE40 UltraPlus |
| Logic Elements (LUTs) | 5280 |
| Flip-Flops | 6272 |
| Embedded Block RAM (EBR) | 80 kbit (10 x 80 kbit) |
| SPRAM | 1,171,456 bit (1.1 Mb) |
| DSP MAC Blocks (16x16) | 8 |
| PLLs | 2 |
| User I/O | 21 |
| Core Supply Voltage | 1.2 V |
| I/O Supply Voltage | 1.71 V to 3.6 V (banked) |
| Configuration | Internal (UP5K internal osc) or external SPI flash |
| Корпус | 30-UFBGA / WLCSP, 0.4 mm pitch |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
Руководство по цоколевке iCE40UP5K-UWG30 в корпусе 30-ufbga / wlcsp, 0.4 mm pitch
Цоколевка для iCE40UP5K-UWG30 (корпус 30-ufbga / wlcsp, 0.4 mm pitch). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для iCE40UP5K-UWG30.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
iCE40UP5K-UWG30 подходит для 6 применениеs: Smartphone Sensor Hub, Always-On Tiny ML / Edge AI, Wearable and Battery-Powered Devices, Industrial IoT Edge Nodes, Camera and Display Interface Bridging, Prototype, Education, and Open-Source FPGA.
Smartphone Sensor Hub
The iCE40UP5K-UWG30 fits smartphone and tablet sensor-hub duty because it combines 21 user I/O in a 2.1 mm-class WLCSP with an always-on fabric consuming microamp-scale standby power. Hardened I2C and SPI blocks keep communication off the main application processor, allowing it to sleep while the FPGA aggregates accelerometer, gyroscope, and proximity data with deterministic latency. Its 1.1 Mb SPRAM buffers sensor streams, and the eight 16x16 DSP MACs execute tap filters and wake-word or gesture classifiers locally, so only recognized events interrupt the host. Placed between sensors and the PMIC rails, it draws from a 1.2 V core with banked VCCIO from 1.71 V to 3.6 V, matching modern sensor interface levels without level shifters.
Рекомендуется
Always-On Tiny ML / Edge AI
Lattice positions the iCE40 UltraPlus family explicitly for always-on machine learning, and the UP5K is the flagship density. The eight hardened 16x16 MAC blocks and 1.1 Mb SPRAM host compact CNNs for keyword spotting, vibration anomaly detection, and visual wake words via the sensAI flow, executing inference at milliwatt-scale power - far below MCU+NPU alternatives. In a typical chain, a PDM microphone or camera feeds the fabric through SPI/I2C, the DSP blocks run the neural net, and an interrupt wakes the host only on a positive classification. The 30-ball UWG30 package enables this intelligence inside wearables, earbuds, and battery sensors where PCB area under 3 mm square is mandatory and no external DRAM is affordable in power or space.
Рекомендуется
Wearable and Battery-Powered Devices
In wearables, hearing aids, and battery sensors, the UWG30's combination of 0.4 mm WLCSP footprint and lowest-in-class dynamic power directly extends battery life and shrinks the PCB. The iCE40UP5K implements custom timing controllers, display scan logic, or gesture pipelines that would otherwise require an always-on MCU, while its fabric gates unused logic to cut leakage. Configuration from small SPI flash keeps BOM cost low, and the hardened SPI/I2C reduces firmware complexity. With a 1.2 V core and 1.71-3.6 V banked I/O, it interfaces directly with PMIC rails common in wearable designs. The 21-I/O budget covers a full sensor set plus display or LED driver lines, and reprogrammability allows feature updates after production through the SPI slave interface.
Рекомендуется
Industrial IoT Edge Nodes
Industrial edge nodes use the iCE40UP5K-UWG30 to preprocess sensor data before transmission, cutting radio airtime and energy. Deterministic fabric logic handles ADC sampling, FFT pre-processing, and protocol conversion between Modbus-like field I/O and Ethernet or LoRa backends, while the 1.1 Mb SPRAM buffers bursts. The industrial-temperature ICE40UP5K-UWG30ITR variant suits factory-floor temperature ranges, and the small WLCSP fits dense DIN-rail or capsule sensor form factors. The two PLLs generate precise sampling clocks from cheap crystals, and hardened SPI/I2C link to host MCUs such as PIC32MZ parts without software bit-banging. Reprogrammability in the field allows analytics-model updates over the network, keeping deployed nodes current across long industrial service lifetimes.
Рекомендуется
Camera and Display Interface Bridging
The iCE40UP5K bridges between CMOS image sensors and host processors or small displays, converting DVP/parallel camera streams to SPI, MIPI-adjacent protocols, or LCD timing. Its fabric implements shift registers, line buffers in block RAM, and frame buffers in SPRAM at deterministic timing that software cannot match, while consuming far less power than a streaming SoC. In earbuds and AR-viewfinder products, the 30-ball package occupies sensor-adjacent PCB space no QFN can. The two PLLs recover pixel clocks, and 21 I/O handle a 10-bit camera bus with control lines to spare. Designers typically add an SPI flash for the bitstream and level-match banks to sensor VCCIO, achieving sub-milliwatt active bridging with under-100-microamp standby between captures.
Рекомендуется
Prototype, Education, and Open-Source FPGA
The iCE40UP5K is the most accessible FPGA for learning and prototyping: it is fully supported by the open-source Yosys/nextpnr/icestorm toolchain, requiring no proprietary licenses, and low-cost boards such as Upduino use exactly this die. The UWG30 WLCSP variant serves compact custom boards once a design outgrows breakout modules, while the identical fabric makes migrating between packages a layout exercise, not a redesign. Makers implement soft CPUs, VGA controllers, and DSP pipelines within the 5280 LUTs, using 1.1 Mb SPRAM for frame or coefficient storage. Hackaday and community projects document deep reverse-engineering of the architecture, and the free Lattice iCEcube2 offers a commercial-grade alternative path for the same silicon.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для iCE40UP5K-UWG30 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | ICE40UP5K-UWG30ITR | ICE40UP5K-UWG30ITR1K |
|---|---|---|---|
| Package | 30-UFBGA WLCSP (UWG30) | 30-UFBGA WLCSP (UWG30) - same | 30-UFBGA WLCSP (UWG30) - same |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| LUTs | 5280 | 5280 | 5280 |
| SPRAM | 1.1 Mb | 1.1 Mb | 1.1 Mb |
| User I/O | 21 | 21 | 21 |
| DSP MACs | 8 (16x16) | 8 (16x16) | 8 (16x16) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V |
| Packing / Grade | Base device (orderable as ITR for T&R) | Tape & Reel, industrial | 1000-unit reel, industrial |
Ключевые отличия
- Sub-3 mm footprint with 5280 LUTs (против ICE40UP5K-SG48)
- Largest on-chip memory in class (1.1 Mb SPRAM) (против ICE5LP1K)
- True same-footprint production continuity (против ICE40UP5K-UWG30ITR)
Заметки по проектированию
The 0.4 mm pitch WLCSP demands fine-pitch PCB processes: 0.2 mm vias or dog-bone fanout, solder-mask-defined pads per the Lattice iCE40 packaging file, and exact A1 ball orientation. Generate the footprint from the official Lattice packaging file rather than third-party symbols. Budget one ground-return via per pair of high-speed I/O and keep the WLCSP escape region free of other components to allow rework access.
The device needs a 1.2 V core rail and banked VCCIO of 1.71 V to 3.6 V; power-up sequencing per the iCE40 UltraPlus datasheet must be observed or configuration may fail. Decouple each supply ball with at least 100 nF ceramic close to the ball, plus bulk capacitance at the rail. Estimated: with a small design drawing ~10 mA core current, IR drop across 0.5 ohm of trace resistance is only 5 mV, but shared power balls make simultaneous-switching I/O budgeting the dominant noise concern, not DC drop.
Configuration is the most common failure mode: the bitstream must match the exact die (UP5K), and SPI flash contents must be programmed before power-up for standalone operation. Note that the UWG30 exposes only 21 I/O - fewer than the SG48 QFN variant - so I/O-rich designs cannot migrate without package change. Order the ITR industrial SKU for extended-temperature production; the naming difference is a packing/grade distinction, not different silicon.
Информация о соответствии
RoHS compliant per DigiKey product listing for ICE40UP5K-UWG30ITR. REACH and halogen-free status not stated in provided data.
