LCMXO3D-4300HC-6BG256C - 4300 LUT MachXO3D FPGA, 206 I/O | Lattice
Артикул: LCMXO3D-4300HC-6BG256C ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.8 | $2.980,00 |
| 500 | $26.1 | $13.050,00 |
| 1.000 | $22.95 | $22.950,00 |
LCMXO3D-4300HC-6BG256C Обзор
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers can configure after manufacture to implement arbitrary digital logic. Within the broader taxonomy, FPGAs sit below ASICs and alongside CPLDs; the MachXO3D belongs to the "secure control" sub-category that combines logic fabric with on-die immutable security and hardware roots-of-trust. This positioning makes MachXO3D distinct from generic low-density FPGAs that lack integrated cryptographic engines.
Key features include 4300 LUTs, 538 kbits of distributed and block RAM (94208 bits per distributor data), embedded Flash for configuration, support for LVCMOS 1.2/1.5/1.8/2.5/3.3 V signaling across multiple I/O banks, and on-chip hardened security blocks. The 256-ball CABGA package provides high I/O density with a small footprint suitable for space-constrained control boards. Up to 206 user I/Os are exposed, giving designers generous margin for parallel buses, sensor aggregation, and control-plane glue logic.
The MachXO3D architecture pairs a non-volatile configuration cell (no external boot PROM required) with the Lattice sensAI / security IP ecosystem, enabling instant-on secure boot and secure firmware update. Designers typically pair the device with the Lattice Diamond / Radiant toolchain for synthesis, place-and-route, and bitstream generation, plus the Lattice Propel SDK for embedded RISC-V soft cores and peripheral libraries.
Typical applications include secure industrial control, IoT edge nodes, hardware Root-of-Trust for multi-rail systems, secure boot and firmware update controllers, glue logic replacement for microcontrollers, and protocol bridging (I2C/SPI/UART to Ethernet or PCIe). The combination of low static power, instant-on operation, and integrated security makes the part well suited to always-on control tasks that previously required a discrete MCU plus external supervisor.
When designing with this device, ensure the bank voltages are sequenced correctly (each I/O bank has independent VCCIO), and follow Lattice reference schematics for the JTAG / SPI programming interface. Use the Lattice Radiant toolchain (or Diamond for legacy designs) to verify pin assignments and timing closure before tape-out.
This page synthesizes distributor availability, drop-in same-package alternatives, application guidance, and design considerations not found on a single OEM datasheet - giving engineers a one-stop decision reference for selecting or replacing the LCMXO3D-4300HC-6BG256C in a 256-CABGA footprint.
Аналоги без доработки для LCMXO3D-4300HC-6BG256C — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с LCMXO3D-4300HC-6BG256C (тот же форм-фактор и посадочное место) — отличается по Configuration Memory, Logic Elements / LUTs, Mounting Type, Operating Temperature, RoHS Status.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
LCMXO3D-4300HC-5BG256C
✅ Прямая замена✓ В наличии
$8.55 / шт.
Открыть даташит →LCMXO3D-4300HC-6BG256I
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LCMXO3D-9400HC-6BG256C
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LCMXO3D-4300HE-6BG256C
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LCMXO3LF-4300E-6BG256C
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LCMXO3D-4300HC-6BG256C Максимальные параметры и электрические характеристики
| Family | MachXO3D |
| Logic Elements / LUTs | 4300 |
| User I/Os | 206 |
| Distributed / Block RAM | 94208 bit (538 kb equivalent per JLCPCB listing) |
| Supply Voltage (Core) | 2.5 V / 3.3 V |
| I/O Bank Voltages Supported | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (LVCMOS) |
| Рабочая температура | 0C to +85C (commercial grade, suffix C) |
| Speed Grade | -6 |
| Корпус | 256-ball CABGA (BG256) |
| Тип монтажа | Surface Mount |
| Configuration Memory | Internal non-volatile Flash |
| Security Engine | Hardened AES / SHA / HMAC / ECC / RSA (per MachXO3D family datasheet) |
| Уровень MSL | 3 (per JLCPCB BG256 listing) |
| Статус RoHS | Compliant |
| Programming Interface | JTAG / SPI (Lattice Radiant or Diamond toolchain) |
Руководство по цоколевке LCMXO3D-4300HC-6BG256C в корпусе 256-ball cabga (bg256)
Цоколевка для LCMXO3D-4300HC-6BG256C (корпус 256-ball cabga (bg256)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для LCMXO3D-4300HC-6BG256C.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
LCMXO3D-4300HC-6BG256C подходит для 6 применениеs: Hardware Root-of-Trust Controller, Secure Industrial IoT Edge Node, Glue Logic Replacement for MCUs, Secure Boot and Firmware Update Controller, Protocol Bridging (I2C/SPI/UART to MIPI/RGMII), Power Sequencing and Supervisor for Multi-Rail Systems.
Hardware Root-of-Trust Controller
The LCMXO3D-4300HC-6BG256C is purpose-built as a hardware Root-of-Trust (RoT) controller in multi-rail computing and industrial systems. Its on-die immutable AES, SHA, HMAC, ECC, and RSA engines let the device verify signed firmware, enforce secure boot of a host processor, and gate power to downstream rails only after cryptographic validation succeeds - replacing a discrete secure-element IC plus CPLD with a single 256-ball CABGA part. The 4300 LUTs and 206 user I/Os comfortably absorb the secure-state machine plus I2C/SPI/UART control planes used for measured-boot attestation. Designers typically instantiate the Lattice Propel SDK cryptographic IP and connect the RoT outputs to the host reset and power-good pins.
Рекомендуется
Secure Industrial IoT Edge Node
The LCMXO3D-4300HC-6BG256C serves as the secure control plane of an Industrial IoT edge node, aggregating sensor I2C/SPI buses, driving status LEDs, and handling secure firmware update over MQTT or OPC-UA. The on-chip hardened crypto block offloads TLS handshake and signed-firmware verification from a small host MCU, while the 4300 LUTs implement custom Modbus/Profibus protocol bridges. With 206 user I/Os the part can directly interface to 24 V-tolerant LVCMOS peripherals and industrial sensor arrays. The non-volatile instant-on configuration eliminates boot-time latency typical of MCU-only designs, allowing the node to be production-line programmed and shipped without external boot devices.
Рекомендуется
Glue Logic Replacement for MCUs
When a microcontroller lacks the I/O count or voltage mix required by a board, the LCMXO3D-4300HC-6BG256C can absorb all glue logic - voltage-level translation, bus arbitration, reset distribution, watchdog timing - while adding free hardware Root-of-Trust capability. The 256-ball CABGA exposes 206 LVCMOS-capable I/Os across multiple banks, supporting 1.2 V to 3.3 V mixed-voltage rails without external level shifters. The non-volatile instant-on configuration means the glue logic is alive in microseconds at power-up, well before the host MCU finishes its own boot. This is a common upgrade path for legacy designs that pair a small MCU with a discrete CPLD - the MachXO3D replaces both.
Рекомендуется
Secure Boot and Firmware Update Controller
The LCMXO3D-4300HC-6BG256C is frequently used as a dedicated secure-boot and firmware-update controller for headless embedded systems that lack their own cryptographic acceleration. The MachXO3D's hardware AES/SHA engines verify signed firmware images from an external SPI Flash before passing the verified image to the host processor, and re-encrypt the image on the fly for at-rest protection. The 4300 LUTs absorb the SPI master controller, the secure-state machine, and the host-facing handshake logic. With 206 I/Os available, multiple SPI/QSPI Flash chips and parallel boot paths can be supported simultaneously.
Рекомендуется
Protocol Bridging (I2C/SPI/UART to MIPI/RGMII)
The LCMXO3D-4300HC-6BG256C is well suited to protocol bridging tasks where an application processor must connect to legacy I2C/SPI/UART peripherals and a high-speed RGMII or MIPI-CSI link in the same design. The 4300 LUTs comfortably implement soft I2C/SPI/UART controllers, while dedicated PLL and DDR edge-clock resources handle the RGMII/MIPI timing. The 206 I/Os in the BG256 package give designers enough headroom to fan out to several peripherals plus the high-speed link. The Lattice Radiant toolchain provides reference IP for these protocols, accelerating time-to-prototype.
Рекомендуется
Power Sequencing and Supervisor for Multi-Rail Systems
The LCMXO3D-4300HC-6BG256C can replace a stack of discrete power-supervisor ICs and a sequencing CPLD in multi-rail computing, telecom, or networking systems. Designers program timing-critical power-up, power-down, and fault-response sequences into the MachXO3D fabric and connect its 206 I/Os to each rail's enable, power-good, and fault pins. The integrated hardware Root-of-Trust adds cryptographic attestation of the rail configuration at boot, which is increasingly required by data-center and telecom customers. The non-volatile configuration means the sequence is correct from the very first power-on, with no external boot device required.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для LCMXO3D-4300HC-6BG256C — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | LCMXO3D-4300HC-5BG256C | LCMXO3D-4300HC-6BG256I | LCMXO3D-9400HC-6BG256C | LCMXO3D-4300HE-6BG256C | LCMXO3LF-4300E-6BG256C |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 256-ball CABGA (BG256) | 256-ball CABGA (BG256) - same | 256-ball CABGA (BG256) - same | 256-ball CABGA (BG256) - same | 256-ball CABGA (BG256) - same | 256-ball CABGA (BG256) - same |
| Logic Elements / LUTs | 4300 | 4300 | 4300 | 9400 | 4300 | 4300 |
| User I/Os | 206 | 206 | 206 | 206 | 206 | 206 |
| Speed Grade | -6 | -5 (faster Fmax) | -6 | -6 | -6 | -6 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Integrated Security Engine | Yes (AES / SHA / HMAC / ECC / RSA) | Yes (AES / SHA / HMAC / ECC / RSA) | Yes (AES / SHA / HMAC / ECC / RSA) | Yes (AES / SHA / HMAC / ECC / RSA) | Yes (AES / SHA / HMAC / ECC / RSA) | No (MachXO3 family, no integrated crypto) |
| Configuration Memory | Internal non-volatile Flash | Internal non-volatile Flash | Internal non-volatile Flash | Internal non-volatile Flash | Internal non-volatile Flash | Internal non-volatile Flash |
| Toolchain | Lattice Radiant / Diamond | Lattice Radiant / Diamond | Lattice Radiant / Diamond | Lattice Radiant / Diamond | Lattice Radiant / Diamond | Lattice Radiant / Diamond |
Ключевые отличия
- On-die hardware Root-of-Trust crypto engines (против LCMXO3LF-4300E-6BG256C)
- Industrial temperature option in same BG256 footprint (против LCMXO3D-4300HC-6BG256I)
- Higher LUT density upgrade path within same footprint (против LCMXO3D-9400HC-6BG256C)
- Speed-grade flexibility (-6 vs -5) (против LCMXO3D-4300HC-5BG256C)
Заметки по проектированию
The LCMXO3D-4300HC-6BG256C supports separate VCC core (2.5 V or 3.3 V) and VCCIO bank supplies (1.2 V to 3.3 V LVCMOS). Per the Lattice MachXO3D family datasheet, decouple each VCC/VCCIO pin with a 0.1 uF X7R ceramic cap placed within 3 mm of the ball, plus a bulk 10 uF per supply rail. Power-on sequence is flexible, but VCCIO banks must not be driven before VCC core. Estimated: typical 4300-LUT MachXO3D device draws ~20 mA quiescent on VCC core at 25C - always consult the iCEpower estimator spreadsheet for design-specific current.
In the 256-ball CABGA (BG256) package, the bottom-side thermal pad must be soldered to a continuous ground plane on the PCB to achieve the rated thermal performance. Estimated: for the BG256 with 4-layer PCB and 1 oz copper, theta_JA is approximately 25 C/W - well within the 0C to +85C commercial rating for typical MachXO3D designs. Avoid placing the device near board hot-spots or directly over PCB cutouts that break the thermal ground plane.
The 256-ball CABGA has a 0.8 mm ball pitch - use a 4-layer PCB with 0.5 oz outer / 1 oz inner copper and a non-solder-mask-defined (NSMD) land pattern with 0.4 mm pads. Per Lattice reference designs, route signals on the top layer only under the BGA escape region using laser-drilled microvias or 4-mil trace/spacing escape routing. Confirm signal integrity for high-speed interfaces (DDR, RGMII, MIPI) by following the Lattice MachXO3D hardware checklist before committing to layout.
Common pitfalls include leaving JTAG pins floating (tie TMS high via 10 kohm, TCK low through 10 kohm if unused), failing to populate the PROGRAMN pull-up (4.7 kohm to VCC), or assuming the bitstream is secure without enabling MachXO3D security features in Radiant (you must explicitly enable AES bitstream encryption and unique device secret). Without these, the on-die crypto engines are not active and the device behaves like a standard MachXO3.
Информация о соответствии
RoHS / REACH / lead-free per Lattice product page and JLCPCB listing. Commercial temperature grade only - not AEC-Q100 qualified (no automotive-grade variant of the MachXO3D family exists at 4300 LUT).
