LPC1768FBD100K - 100MHz Cortex-M3 512KB Flash MCU | NXP
Артикул: LPC1768FBD100K ✓ АктивенLPC1768FBD100K Обзор
What is an ARM Cortex-M3 microcontroller? A microcontroller is a single integrated circuit containing a processor core, memory and peripherals on one die. The Cortex-M3 is a 32-bit ARM processor architecture designed for embedded control: it uses the Thumb instruction set, has no separate cache or memory-management unit, and delivers deterministic interrupt-driven performance at low power. Within the hierarchy, the LPC1768 belongs to the LPC17xx family of NXP microcontrollers, which sit between simple 8-bit MCUs and higher-end Cortex-M4/M7 application processors.
Key features of the LPC1768 include 512 KB (512K x 8) flash program memory, 64 KB of data SRAM, an 8-channel 12-bit successive-approximation ADC, a single 10-bit DAC, four UARTs, two CAN 2.0B controllers, three SSP/SPI interfaces, three I2C interfaces, an I2S interface, motor-control PWM and an Ethernet MAC with MII/RMII. The 8-channel DMA controller allows peripheral transfers to run with minimal CPU intervention.
Technically, the device pairs the Cortex-M3 core with a nested vectored interrupt controller for fast, prioritized event handling, and provides a 100 MHz maximum CPU clock from an internal or external oscillator. The integrated Ethernet MAC supports 10/100 Mb/s traffic, and the USB controller can operate as Device, Host or OTG, making the part suitable for gateway, data-logger and connected-instrument designs without a discrete USB or Ethernet PHY.
Typical applications include industrial Ethernet gateways, USB-to-serial and protocol converters, motor and motion controllers using the PWM and CAN channels, data acquisition and test equipment using the 12-bit ADC, and networked sensor nodes using the Ethernet MAC with the 10/100 Mb/s PHY.
A key design consideration is that the LQFP-100 (14 x 14 mm) footprint demands careful escape routing: with a 0.5 mm pitch, high-speed USB and Ethernet differential pairs need continuous reference planes and short, symmetric traces, and decoupling should be placed directly at each VDD pin.
This page consolidates distributor pricing, verified drop-in alternatives from the NXP LPC17xx family, a parameter-by-parameter comparison table and practical PCB design notes that are not found together in the manufacturer datasheet.
Аналоги без доработки для LPC1768FBD100K — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с LPC1768FBD100K (тот же форм-фактор и посадочное место) — отличается по Package, Maximum CPU Frequency, DAC, Flash Memory.
LPC1766FBD100
✅ Прямая замена ⚠️ Характеристики не провереныУточнить цену
Открыть даташит →LPC1769FBD100
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LPC1778FBD100
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
LPC1788FBD100
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
LPC1768FBD100
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LPC1768FBD100K Максимальные параметры и электрические характеристики
| Core Processor | ARM Cortex-M3, 32-bit |
| Maximum CPU Frequency | 100 MHz |
| Program Memory Size (Flash) | 512 KB (512K x 8) |
| RAM Size (SRAM) | 64 KB (64K x 8) |
| EEPROM | None (0 bytes) |
| Supply Voltage Range (Vcc/Vdd) | 2.4 V to 3.6 V |
| ADC | 8-channel, 12-bit |
| DAC | 1-channel, 10-bit |
| Ethernet | 10/100 Mb/s Ethernet MAC with MII/RMII |
| USB | USB Device / Host / OTG controller |
| DMA | 8-channel DMA controller |
| Serial Interfaces | 4 x UART, 2 x CAN 2.0B, 3 x SSP/SPI, 3 x I2C, 1 x I2S |
| Motor Control PWM | Yes, motor control PWM channels |
| Oscillator Type | Internal (with external crystal/oscillator support) |
| Рабочая температура | -40 degC to +85 degC |
| Корпус | 100-LQFP (14 x 14 mm), SOT407-1 |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
| REACH Status | Compliant |
Руководство по цоколевке LPC1768FBD100K в корпусе 100-lqfp (14 x 14 mm), sot407-1
Цоколевка для LPC1768FBD100K (корпус 100-lqfp (14 x 14 mm), sot407-1). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для LPC1768FBD100K.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
LPC1768FBD100K подходит для 6 применениеs: Industrial Ethernet Gateway, USB-to-Serial and Protocol Converter, Motor Control and CAN Node, Data Acquisition and Test Equipment, Networked Sensor and IoT Gateway Node, Audio and Digital Signal Front End.
Industrial Ethernet Gateway
The LPC1768FBD100K suits protocol-conversion and Modbus/TCP gateway designs because it integrates a 10/100 Mb/s Ethernet MAC with MII/RMII, 512 KB of flash and 64 KB of SRAM for an lwIP stack, plus an 8-channel DMA controller that moves packet buffers without CPU intervention. It runs from a single 2.4 V to 3.6 V rail at 100 MHz, so the Ethernet PHY, magnetics and a single buck/LDO can share one 3.3 V supply. Use the four UARTs to bridge RS-485/Modbus RTU field buses to Ethernet, and the two CAN channels as an additional fieldbus option. Keep the RMII TX/RX traces short and length-matched over a continuous ground plane, and note that the MAC still requires an external PHY and magnetics.
Рекомендуется
USB-to-Serial and Protocol Converter
For USB-to-serial dongles, multi-port gateways and debug adapters, the LPC1768FBD100K provides a USB Device/Host/OTG controller alongside four UARTs, three SSP/SPI interfaces and three I2C buses, all driven by a 100 MHz Cortex-M3 core. The 512 KB of flash is ample for USB CDC or HID class stacks plus application firmware, and 64 KB of SRAM allows multiple CDC ports with flow control. A single 3.3 V supply (2.4 V to 3.6 V operating range) powers the MCU and USB PHY, while the LQFP-100 (14 x 14 mm, 0.5 mm pitch) package keeps the board compact. Route the USB D+/D- pair as a short, symmetric differential pair away from switching nodes, and add ESD protection at the connector.
Рекомендуется
Motor Control and CAN Node
The LPC1768FBD100K targets BLDC/PMSM drive electronics and machine-control nodes because it combines motor control PWM with a fast 8-channel 12-bit ADC for current and position feedback, two CAN 2.0B controllers for fieldbus connectivity and a 10-bit DAC for reference or excitation signals. At 100 MHz, PWM updates and the ADC sample-and-hold sequencing can be handled deterministically alongside the nested vectored interrupt controller. Its -40 degC to +85 degC industrial temperature range suits equipment cabinets and machine environments. Use a separate pre-driver and current-sense amplifier for the power stage, keep analog grounds and VREF quiet with their own RC filtering, and confirm timing with the LPC17xx User Manual before locking the PWM loop rate.
Рекомендуется
Data Acquisition and Test Equipment
The 8-channel, 12-bit ADC with hardware sequencing, plus four UARTs, three SSP/SPI ports and 64 KB of SRAM, makes the LPC1768FBD100K a good fit for multi-channel instrumentation, automated test fixtures and laboratory data loggers. The 10-bit DAC provides an analog output for stimulus or offset generation, and the Ethernet MAC can stream acquisition results directly to a host PC. Supply the analog domain from the same 2.4 V to 3.6 V core rail but filter it through an RC network to preserve conversion accuracy, and use a clean, low-noise reference on VREF. The -40 degC to +85 degC rating supports industrial bench and factory test use.
Рекомендуется
Networked Sensor and IoT Gateway Node
For connected sensor nodes that must aggregate readings locally and forward them over Ethernet or USB, the LPC1768FBD100K offers 512 KB of flash for local buffering and protocol stacks, 64 KB of SRAM, eight ADC channels for direct sensor conditioning and low-power sleep capability typical of the LPC17xx family. The Ethernet MAC with RMII keeps the node count high without adding a discrete network controller, while I2C and SPI ports address sensors and radio modules. Because the MCU runs from one 2.4 V to 3.6 V rail, a small buck converter from a 5 V or battery source is sufficient. Use the RTC and deep-sleep modes for duty-cycled reporting to reduce average current, and isolate the Ethernet magnetics from noisy sensor wiring.
Рекомендуется
Audio and Digital Signal Front End
The LPC1768FBD100K can serve as the digital front end in audio codecs, speaker or microphone arrays and interface-conversion equipment, using its I2S interface for sample streaming together with three SSP/SPI and three I2C ports for codecs and amplifiers. The 100 MHz Cortex-M3 core with 64 KB of SRAM handles real-time buffer handling, and the 10-bit DAC can drive a low-level analog output or bias reference where needed. Its -40 degC to +85 degC range supports industrial audio equipment. Keep the I2S clock and data lines away from Ethernet and USB routing, match their lengths, and provide independent filtering between the digital rails and the analog codec supply.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для LPC1768FBD100K — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Select the LPC1769FBD100 if the design needs Ethernet but not USB Host or OTG roles; it shares the same footprint, flash and SRAM and only drops the USB host capability. Choose the LPC1778FBD100 when you need more flash headroom in the same family and can forgo some USB functions, and the LPC1788FBD100 when the family feature set matches but the ordering code differs.
Avoid cross-brand substitutions in LQFP-100: STM32F2, STM32F4 and TI Stellaris equivalents use different pinouts and demand a full board and firmware redesign. Finally, check the 64 KB SRAM ceiling against your network stack before committing, and budget for an external Ethernet PHY and magnetics if you need a physical network port.
Сравнение с аналогами
| Параметр | Этот товар | LPC1766FBD100 | LPC1769FBD100 | LPC1778FBD100 | LPC1788FBD100 | LPC1768FBD100 |
|---|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Max Frequency | ARM Cortex-M3, 100 MHz | ARM Cortex-M3, 100 MHz | ARM Cortex-M3, 100 MHz | ARM Cortex-M3, 100 MHz | ARM Cortex-M3, 100 MHz | ARM Cortex-M3, 100 MHz |
| Supply Voltage Range | 2.4 V to 3.6 V | 2.4 V to 3.6 V | 2.4 V to 3.6 V | 2.4 V to 3.6 V | 2.4 V to 3.6 V | 2.4 V to 3.6 V |
| Ethernet / USB | 10/100 Mb/s Ethernet MAC + USB Device/Host/OTG | 10/100 Mb/s Ethernet MAC + USB Device/Host/OTG | 10/100 Mb/s Ethernet MAC, no USB Host/OTG | 10/100 Mb/s Ethernet MAC | 10/100 Mb/s Ethernet MAC + USB Device/Host/OTG | 10/100 Mb/s Ethernet MAC + USB Device/Host/OTG |
| ADC / DAC | 8 x 12-bit ADC / 1 x 10-bit DAC | 8 x 12-bit ADC / 1 x 10-bit DAC | 8 x 12-bit ADC / 1 x 10-bit DAC | 8 x 12-bit ADC | 8 x 12-bit ADC / 1 x 10-bit DAC | 8 x 12-bit ADC / 1 x 10-bit DAC |
| Operating Temperature | -40 degC to +85 degC | -40 degC to +85 degC | -40 degC to +85 degC | -40 degC to +85 degC | -40 degC to +85 degC | -40 degC to +85 degC |
Ключевые отличия
- Full USB Device/Host/OTG plus Ethernet MAC in a single Cortex-M3 (против LPC1769FBD100)
- Twice the flash of the 256 KB sibling while staying pin-compatible (против LPC1766FBD100)
- Complete, current supply channel versus an obsolete order code (против LPC1768FBD100,551)
- More peripheral integration than generic 100 MHz Cortex-M3 competitors (против STM32F207-class 100 MHz Cortex-M3 in LQFP-100)
Заметки по проектированию
The LPC1768FBD100K runs from a single 2.4 V to 3.6 V rail, so one 3.3 V buck or LDO can feed the core, I/O and the Ethernet PHY. Place a 100 nF ceramic decoupling capacitor at every VDD pin and terminate all VSS pins directly into the ground plane rather than daisy-chaining them; add a 4.7 uF to 10 uF bulk capacitor near the supply entry point. Estimated note: with typical Cortex-M3 activity, budget roughly 30 mA to 60 mA average current for the core plus peripherals at 100 MHz, so a 3.3 V regulator rated for at least 200 mA with headroom for PHY current avoids load-transient droop. Confirm the actual current budget against the LPC17xx User Manual power figures for your peripheral mix.
The 100-LQFP (14 x 14 mm, 0.5 mm pitch) land pattern is dense, so plan escape routing early. Keep the 12 MHz crystal and its load capacitors within 5 mm of XTAL1/XTAL2 with short, symmetric traces and a solid ground guard, and route the USB D+/D- and RMII TX/RX pairs as short, length-matched, continuously referenced traces over an unbroken ground plane. Place the Ethernet magnetics at the board edge with the PHY close to the MCU side, and keep switching-regulator inductors and their copper pours away from the ADC input pins and the VREF node.
Two mistakes account for most LPC1768 bring-up failures. First, the ADC and DAC share the digital 3.3 V rail, so switching-node noise directly corrupts conversions; isolate the analog path with an RC or ferrite filter and provide a clean, decoupled VREF. Second, the 8-channel 12-bit ADC uses hardware sequencing with a sample-and-hold window per channel, so a too-short acquisition time truncates the sample and produces repeatable channel-dependent errors; use the conversion-time figures in the LPC17xx User Manual when setting clock dividers and sample rates.
The 8-channel DMA controller can move peripheral data at bus speed with minimal CPU involvement, which is excellent for Ethernet and USB throughput but can create burst traffic on the same 3.3 V rail that the core uses. When a DMA-fed interface runs near its limit, constrain the DMA burst behavior in the register map, keep the DMA buffers in the faster internal SRAM region and avoid placing DMA-heavy peripherals adjacent to sensitive analog inputs. Verify with an oscilloscope that the 3.3 V rail does not sag more than a few tens of millivolts during burst transfers.
Информация о соответствии
RoHS and REACH compliance are stated in the published LPC1768FBD100 vs LPC1754FBD80K specification comparison for this part. The LPC1768 is an industrial-temperature (-40 degC to +85 degC) general-purpose MCU and is not AEC-Q100 automotive qualified; halogen-free and conflict-minerals declarations are not published in the retrieved sources and are therefore listed as unknown.
