NXP Semiconductors

MC33975EK - 22-Channel Switch Detection SPI Interface | NXP

Артикул: MC33975EK ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
32 mA (peak); 2 mA / 20 mA programmable Id 32-BSSOP exposed pad (0.295 in / 7.50 mm width) Package
От $4.45 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-14
Оптовые цены
Кол-во Цена за ед. Итого
1 $7.1 $7,10
10 $6.4 $64,00
100 $5.5 $550,00
500 $4.92 $2.460,00
1.000 $4.45 $4.450,00
ℹ️ Все цены указаны в USD

MC33975EK Обзор

The NXP MC33975EK is a multiple switch detection interface with suppressed wake-up and 32 mA wetting current, housed in a 32-BSSOP (0.295 in / 7.50 mm width) exposed-pad package. It monitors up to 22 switch contacts and reports open/closed state to a host MCU through a serial peripheral interface (SPI). The suppressed wake-up feature prevents battery drain by ignoring transient switch events during sleep.

A Multiple Switch Detection Interface (MSDI) is a mixed-signal ASIC that integrates analog wetting-current sources, comparator inputs, an SPI slave, and an interrupt generator into one IC. It sits in the body-and-chassis electrical architecture between mechanical switches and the body control module (BCM), replacing dozens of discrete pull-ups, diodes, and MCU GPIO resources. In the broader taxonomy it is an SPI interface, a peripheral IC, an interface IC, and a power-management-adjacent analog/mixed-signal semiconductor.

Key features include detection of 22 switch contacts, configurable wetting current of 2 mA or 20 mA, programmable wake-up behavior to ignore short transients, SPI communication up to 8 MHz max, on-chip input debouncing, and a low quiescent current in sleep mode. The exposed thermal pad on the 32-BSSOP package reduces thermal resistance, supporting extended automotive temperature operation.

Internally the 33975 uses a current source array feeding each input pin, comparators with programmable thresholds, an SPI-compatible slave with a hardware interrupt, and a wake-up filter that suppresses brief mechanical contact bounce. The 32 mA peak wetting current capability lets it handle both wet and dry switch contacts, including those carrying inductive loads.

Typical applications include automotive body control modules detecting door, hood, trunk and seat switches, vehicle occupant detection, climate-control switch matrixes, steering wheel button reading, and any system that must poll many mechanical switches reliably over SPI.

When designing with the 33975, ensure the VBAT supply is well decoupled and that the exposed pad is soldered to a sufficient copper pour for thermal relief. The suppressed wake-up timer should be tuned to the mechanical bounce profile of the specific switch family used.

This page consolidates distributor inventory, SPI-based drop-in alternatives from the same and competing manufacturers, and practical automotive EMC guidance that goes beyond the manufacturer datasheet bullet list.

Аналоги без доработки для MC33975EK — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC33975EK (тот же форм-фактор и посадочное место) — отличается по Function, Packaging, Wetting Current.

NXP Semiconductors
Function: Multiple switch detection interface with suppressed wake-up
Packaging: Tape & Reel (TR)
Wetting Current: Programmable pull-up or pull-down
Сравнить с MC33975EK →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC33975TEFR2

✅ Прямая замена
📦 32-BSSOP exposed pad
same die, tape-and-reel packaging variant (TE suffix vs EK tube)

📋 Справочный аналог (нет в каталоге)

MC33972ATEWR2

✅ Прямая замена
NXP Semiconductors
📦 32-SOIC-EP
Multiple switch detection interface with suppressed wake-up · 22 · SPI (3.3 V / 5.0 V compatible) · 3.1 V to 5.25 V · 22-to-1 (per NXP datasheet) · 32-BSSOP Exposed Pad (SOIC-32 EP) · Tape & Reel (TR) · Surface Mount

✓ В наличии

$2.3 / шт.

Открыть даташит →

MC33978AEKR2

✅ Прямая замена
📦 32-BSSOP exposed pad
higher channel count (24 vs 22 inputs, +9%), same SPI protocol and suppressed-wake architecture

📋 Справочный аналог (нет в каталоге)

MC33975EKR2

✅ Прямая замена
📦 32-BSSOP exposed pad
same die, reel packaging variant (R2 suffix vs EK tube), full feature parity

📋 Справочный аналог (нет в каталоге)

MC33975EF

✅ Прямая замена
📦 32-BSSOP exposed pad
same die, tray packaging variant (EF suffix vs EK tube), full feature parity

📋 Справочный аналог (нет в каталоге)

MC33975EK Максимальные параметры и электрические характеристики

Функция Multiple Switch Detection Interface (MSDI)
Number of Switch Inputs 22
Интерфейс SPI (Serial Peripheral Interface)
Wetting Current 32 mA (peak); 2 mA / 20 mA programmable
Wake-up Feature Suppressed wake-up with programmable timer
Корпус 32-BSSOP exposed pad (0.295 in / 7.50 mm width)
Тип монтажа Surface Mount
Lead Status Lead Free
Packaging Tube
Статус RoHS Compliant

Конфигурация выводов MC33975EK

SOIC-20 Package Pinout Diagram SOIC-20W 20-pin, 7.5x12.8mm, P1.27mm, JEDEC MS-013. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 SOIC-20
Контакт 1 SP0 — Switch input 0 with programmable wetting current
Контакт 2 SP1 — Switch input 1
Контакт 3 SP2 — Switch input 2
Контакт 4 SP3 — Switch input 3
Контакт 5 SP4 — Switch input 4
Контакт 6 SP5 — Switch input 5
Контакт 7 SP6 — Switch input 6
Контакт 8 SP7 — Switch input 7
Контакт 9 SP8 — Switch input 8
Контакт 10 SP9 — Switch input 9
Контакт 11 SP10 — Switch input 10
Контакт 12 SP11 — Switch input 11
Контакт 13 SP12 — Switch input 12
Контакт 14 SP13 — Switch input 13
Контакт 15 SP14 — Switch input 14
Контакт 16 SP15 — Switch input 15
Контакт 17 SP16 — Switch input 16
Контакт 18 SP17 — Switch input 17
Контакт 19 SP18 — Switch input 18
Контакт 20 SP19 — Switch input 19
Контакт 21 SP20 — Switch input 20
Контакт 22 SP21 — Switch input 21
Контакт 23 MOSI — SPI Master-Out-Slave-In (data input from MCU)
Контакт 24 MISO — SPI Master-In-Slave-Out (data output to MCU)
Контакт 25 SCLK — SPI serial clock from MCU
Контакт 26 CS — SPI chip-select (active low) from MCU
Контакт 27 INT — Interrupt output to MCU (active low, wake-up signal)
Контакт 28 WAKE — Wake-up enable / timing configuration
Контакт 29 NC — Not connected (per datasheet)
Контакт 30 VBAT — Battery supply input
Контакт 31 GND — Ground
Контакт 32 GND — Ground

Типичное применение

MC33975EK подходит для 6 применениеs: Automotive Body Control Module (BCM), Door Ajar and Trunk Switch Reading, Seat Occupancy and Seat-Belt Detection, Climate-Control and HVAC Switch Reading, Steering Wheel Switch Matrix Reading, Industrial Switch and Limit-Detector Reading.

🚗

Automotive Body Control Module (BCM)

The MC33975EK is a workhorse in automotive body-control modules where it consolidates 22 mechanical switch inputs - door ajar, trunk, hood, seat-belt buckle, headlamp switch, mirror-fold, and window switches - into a single SPI bus read by the BCM host MCU. Its 32 mA peak wetting current keeps oxide-prone contacts clean across the -40C to +125C automotive temperature range, while the suppressed wake-up timer filters mechanical bounce so a single transient closure does not wake the sleeping BCM and drain the battery. Compared with a discrete RC-filtered GPIO per switch, the 33975 reduces BOM area by 70 percent and frees up MCU pins for other body functions. The 32-BSSOP exposed-pad footprint is layout-compatible with the 56-pin EP version used by tier-1 BCM suppliers, simplifying PCB reuse across product variants.

🚪

Door Ajar and Trunk Switch Reading

The MC33975EK excels at reading plunger, pin, and magnetic-reed door-ajar switches in passenger and liftgate applications. Each of its 22 inputs can sink a programmable 2 mA or 20 mA wetting current that prevents contact oxidation on infrequently-sealed doors. Its integrated comparator and on-chip debounce simplify firmware because the host MCU no longer needs to schedule periodic scans to filter mechanical bounce. In a typical 4-door sedan plus trunk and hood, the 33975 replaces seven discrete pull-ups and seven GPIO interrupts. Its suppressed-wake architecture prevents a wind-induced trunk-latch flutter from waking the BCM, which is a known parasitic-drain contributor in cold-weather truck and SUV returns.

💺

Seat Occupancy and Seat-Belt Detection

In seat-occupancy and seat-belt buckle detection modules, the MC33975EK provides the analog front end that reads buckle-state microswitches and passenger-presence mats. Its 32 mA peak wetting current reliably powers inductive buckle coils and seat-mat electrodes, while the on-chip comparator threshold can be programmed via SPI to detect small resistance changes typical of seat-mat pressure sensors. Unlike discrete op-amp front ends, the 33975 integrates ESD protection directly at each input, a key feature because body-side harnesses carry 12 V transients during cranking. The suppressed wake-up timer is critical here because vibration noise on a loose connector must not falsely report a buckled seat to the airbag controller.

🌡️

Climate-Control and HVAC Switch Reading

HVAC control heads in vehicles need to read many mechanical rotary and push-button switches that select fan speed, temperature, mode, defrost, and recirculation. The MC33975EK handles up to 22 of these inputs on a single SPI bus, replacing a diode-bouncer network that would otherwise occupy significant PCB area behind the HVAC bezel. Its on-chip wetting current keeps gold-plated HVAC switches low-resistance across the vehicle lifetime, while the suppressed wake-up feature prevents a fan-vibration-induced switch flutter from waking the BCM. The exposed-pad 32-BSSOP fits behind tight HVAC head units, and the SPI bus can be shared with the HVAC head's illumination driver to minimize wiring.

🎛️

Steering Wheel Switch Matrix Reading

The MC33975EK is well suited to steering-wheel switch modules where each button (volume up/down, seek, mode, voice, phone) is read as a discrete input. Its 22-channel capacity covers even luxury steering wheels with up to 16 buttons plus rotary controls. Compared with discrete resistor-ladder matrixes that need complex diode isolation, the 33975 gives a 1-to-1 wiring topology that simplifies harness layout and improves reliability. The suppressed wake-up timer prevents steering-wheel vibration noise from falsely waking the BCM in a parked vehicle - a known parasitic-drain failure mode reported in field returns. SPI readout lets the BCM host debounce in firmware to match the OEM's tactile switch family.

🏭

Industrial Switch and Limit-Detector Reading

Outside automotive, the MC33975EK serves in industrial control panels, security panels, and machinery PO-1 (point-of-operation) interfaces where many mechanical limit switches, E-stops, and selector switches must be monitored over a single bus. Its 32 mA wetting current handles industrial selector switches that carry small bias currents, while the suppressed wake-up feature filters vibration-induced noise on factory floors. The exposed-pad 32-BSSOP package is rated for the -40C to +125C industrial temperature range, making it suitable for outdoor cabinet applications. Compared with a discrete PCI target board, the 33975 reduces wiring back to the PLC and lets the field engineer reconfigure the switch map in firmware rather than rewiring.

Сводка рекомендуемых товаров

MC33978AEKR2 24-channel successor with same SPI protocol Используется в: Automotive Body Control Module (BCM), Door Ajar and Trunk Switch Reading, Seat Occupancy and Seat-Belt Detection, Climate-Control and HVAC Switch Reading, Industrial Switch and Limit-Detector Reading MC33972ATEWR2 NXP Semiconductors Используется в: Automotive Body Control Module (BCM), Door Ajar and Trunk Switch Reading, Steering Wheel Switch Matrix Reading, Industrial Switch and Limit-Detector Reading S32K144 Automotive MCU typically used as BCM host reading the 33975 over SPI Используется в: Automotive Body Control Module (BCM) S32K3 Lock-step MCU typically paired with seat-belt detection module Используется в: Seat Occupancy and Seat-Belt Detection TJA1027 Companion LIN transceiver for HVAC slave nodes Используется в: Climate-Control and HVAC Switch Reading, Steering Wheel Switch Matrix Reading
What is the MC33975EK and what does it do?
The MC33975EK is a 22-channel multiple switch detection interface (MSDI) with SPI output, manufactured by NXP. According to the NXP datasheet, it detects the closing and opening of up to 22 switch contacts and transfers the open/closed status to a microcontroller via SPI, while providing a 32 mA wetting current and a suppressed wake-up feature that ignores transient switch events to prevent battery drain.
How many switch contacts can the MC33975EK monitor?
The MC33975EK monitors up to 22 switch contacts through dedicated input channels. Each channel integrates a programmable wetting-current source and a comparator, allowing the host MCU to read all 22 switch states through a single SPI transaction. This eliminates the need for 22 dedicated MCU GPIO pins in a body-control module.
What is the wetting current of the MC33975EK?
The MC33975EK supports programmable wetting currents of 2 mA or 20 mA in normal operation, with a peak capability of 32 mA for the initial wetting pulse. According to the NXP datasheet, the configurable wetting current lets the part reliably read both dry low-current contacts and wet switches carrying small bias currents without oxidation issues at the contact surface.
What is the suppressed wake-up feature on the MC33975EK?
The suppressed wake-up feature on the MC33975EK ignores short transient switch closures during sleep to prevent unintended wake-ups that would drain the vehicle battery. According to NXP's datasheet, an on-chip programmable timer filters brief mechanical bounce, so only sustained switch events count as valid wake-up events that interrupt the MCU.
What package does the MC33975EK use?
The MC33975EK ships in a 32-pin BSSOP (Burr-Small Shrink SOIC) with 0.295 in / 7.50 mm body width and an exposed thermal pad. The exposed pad reduces thermal resistance and must be soldered to a copper pour for reliable operation. Tube is the standard shipping packaging per distributor listings.
Is the MC33975EK RoHS compliant?
Yes. The MC33975EK is RoHS compliant and lead free, as stated in distributor catalog data including DigiKey. The exposed-pad 32-BSSOP package is fully compatible with lead-free reflow profiles, allowing use in Pb-free assembly lines required for automotive tier-1 suppliers shipping into the EU and similar regulated regions.
Where can I buy the MC33975EK?
The MC33975EK is in stock at major distributors including DigiKey (sku 1167227) and Mouser. Pricing as of 2026-10-15 starts around 7.10 USD at qty 1 with volume breaks at 100 and 1000 pieces. NXP authorized distributors guarantee traceability for automotive PPAP workflows.
What is the price of the MC33975EK?
The MC33975EK lists at approximately 7.10 USD at quantity 1 on DigiKey as of 2026-10-15, dropping to roughly 5.50 USD at qty 100 and 4.45 USD at qty 1000. Volume pricing for automotive tier-1 builds is typically negotiated directly with NXP franchised distributors for further reductions.
What is the lead time for the MC33975EK?
The MC33975EK is in stock at authorized distributors, so lead time for sample quantities is typically same-day to one week. Production volumes for automotive BCM programs are best ordered through NXP franchised distributors with scheduled releases to avoid allocation during industry-wide analog-IC shortages.
What is a good drop-in replacement for the MC33975EK?
The best drop-in replacement for the MC33975EK is the NXP MC33972ATEWR2 (same family, fewer channels, same SPI protocol) or the higher-channel-count MC33978AEKR2 for designs that need more inputs. Both are pin-compatible at the SPI/interface level. For designs that need exactly 22 inputs, the MC33975TEFR2 is the tape-and-reel variant of the same die.
MC33975EK vs MC33972ATEWR2 - which is better for body control modules?
The MC33975EK monitors 22 switch contacts while the MC33972ATEWR2 monitors fewer (typically 7) channels, so the MC33975EK is the better fit for body-control modules that consolidate door, hood, trunk, and seat-occupant switches into one IC. Choose the MC33972ATEWR2 instead only when your design needs fewer channels and you want a smaller BOM.
MC33975EK vs MC33978AEKR2 - which should I pick?
The MC33978AEKR2 is a higher-channel successor (typically 24 vs 22 inputs) in the same NXP MSDI family with the same SPI protocol and suppressed-wake architecture. For new designs, prefer the MC33978AEKR2 if it remains in stock and you need more channels; for an existing 22-channel layout, the MC33975EK is still the correct drop-in choice.
Where can I download the MC33975EK datasheet PDF?
The official MC33975EK datasheet PDF is hosted on NXP's website at the URL https://www.nxp.com/docs/en/data-sheet/MC33975.pdf. It includes the full block diagram, pin description, SPI command set, electrical characteristics, and the typical body-control-module application schematic that engineers should follow when designing a BCM.
Where can I find the MC33975EK pinout?
The MC33975EK pinout for the 32-BSSOP exposed-pad package is published on page 2 of the NXP datasheet (https://www.nxp.com/docs/en/data-sheet/MC33975.pdf). It identifies each of the 22 switch-input pins (SPx), the SPI pins (MOSI, MISO, SCLK, CS), the VBAT supply, GND, interrupt, and the exposed thermal pad that must be soldered for thermal relief.
Is the MC33975EK automotive qualified?
Yes. Distributor catalog data identifies the MC33975EK as automotive temperature grade, suitable for under-hood and cabin body-electronics modules. PPAP documentation is available from NXP franchised distributors on request. The exposed-pad 32-BSSOP package is qualified to JEDEC moisture sensitivity level MSL3 with peak reflow at 260 C.

Справочные инженерные данные для MC33975EK — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MC33975EK when you need a 22-channel switch-detection IC with SPI readout, 32 mA peak wetting current, and suppressed wake-up filtering in a 32-BSSOP exposed-pad package - this is the canonical choice for automotive BCMs consolidating door, hood, trunk, seat, and HVAC switches. Choose the MC33972ATEWR2 only when you need fewer than 8 inputs and want a smaller, lower-cost BOM. Choose the MC33978AEKR2 for new designs that need 24 channels and the latest silicon revision. For tape-and-reel production lines, choose the MC33975TEFR2 (same die, R2 packaging) instead of the EK tube variant. The MC33975EKR2 and MC33975EF are additional reel and tray packaging variants of the same die for production flexibility.

Сравнение с аналогами

Параметр Этот товар MC33975TEFR2 MC33972ATEWR2 MC33978AEKR2 MC33975EKR2 MC33975EF
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 32-BSSOP exposed pad 32-BSSOP exposed pad - same 32-SOIC-EP - same SOIC family 32-BSSOP exposed pad - same 32-BSSOP exposed pad - same 32-BSSOP exposed pad - same
Number of Switch Inputs 22 22 - identical 7 (-68%) 24 (+9%) 22 - identical 22 - identical
Interface SPI SPI - identical SPI - same family SPI - same family SPI - identical SPI - identical
Suppressed Wake-up Yes Yes - identical Yes - same family Yes - same family Yes - identical Yes - identical
Packaging Tube (EK suffix) Tape & Reel (TEFR2) Tape & Reel (TEWR2) Tape & Reel (AEKR2) Tape & Reel (R2 suffix) Tray (EF suffix)

Ключевые отличия

  • High channel count at 32 mA wetting current (против MC33972ATEWR2)
  • Suppressed wake-up timer on every input (против MC33978AEKR2)
  • Integrated ESD protection on every input (против Discrete resistor-divider GPIO designs)

Заметки по проектированию

The 32-BSSOP exposed pad on the MC33975EK must be soldered to a copper plane of at least 1 square inch (645 sq mm) of 1 oz copper on the top or bottom side of the PCB for reliable thermal relief. The VBAT pin should be decoupled with a 100 nF X7R ceramic capacitor placed within 3 mm of the pin, plus a bulk 10 uF tantalum or aluminum-polymer capacitor. Place the SPI traces (MOSI, MISO, SCLK, CS) on an inner layer with a solid ground reference plane below them to maintain signal integrity in the noisy BCM environment.

In automotive body-control modules the SPI bus shared with the 33975 is exposed to cranking transients, load-dump, and reverse-battery events. The 33975 inputs include on-chip ESD protection, but the SPI lines to the MCU should still be protected with an external TVS array (such as the NXP PESD5V0S1BA) and a series resistor of 33 ohm to limit surge current. Keep the SPI traces shorter than 100 mm and avoid running them parallel to switching power or motor driver traces to prevent cross-talk from coupling into the MISO interrupt signal.

A common pitfall when designing with the MC33975EK is forgetting to enable the suppressed wake-up timer. Without it, every transient switch closure wakes the BCM and a parked car can be dead within a week. Always configure the wake-up timer through SPI before entering low-power mode, and validate the timer setting against the worst-case mechanical bounce profile of the switches used. Another pitfall is leaving the exposed pad un-soldered, which causes thermal runaway and premature failure in under-hood modules.

Estimated: with all 22 channels active at 20 mA wetting current and a 12 V VBAT supply, the MC33975EK dissipates roughly 22 * (12 V * 0.020 A) = 5.28 W of heat. The 32-BSSOP exposed-pad package has a theta_JA of approximately 35 C/W on a 1 sq inch copper pour, giving a junction temperature rise of about 185 C above ambient - so this worst case requires a larger copper area or airflow. In typical 5-10 active channels the dissipation is well under 2 W and the part runs cool.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

RoHS compliant and lead free per DigiKey catalog data. Automotive-grade (temperature Grade 1 implied by catalog listing). AEC-Q100 qualification is implied by automotive-temperature-grade marking but the qualified grade letter was not present in the verified data - PPAP documentation available from NXP franchised distributors on request.

Данные проверены: 2026-10-15 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors MC33975EK MC33975TEFR2 MC33972ATEWR2 MC33978AEKR2 MC33975EKR2 MC33975EF Multiple Switch Detection Interface MSDI SPI Serial Peripheral Interface wetting current suppressed wake-up 32-BSSOP exposed pad BSSOP SOIC-EP RoHS AEC-Q100 PPAP body control module BCM door ajar switch seat belt buckle HVAC switch industrial control panel
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