NXP Semiconductors

MC9S12B128MFUE - 16-bit HCS12 MCU, 128KB Flash, 25MHz | NXP

Артикул: MC9S12B128MFUE ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
80-QFP (14x14 mm) Package 25 MHz Speed 128 KB (128K x 8) Flash Memory
От $10.4 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-17
Оптовые цены
Кол-во Цена за ед. Итого
1 $18.5 $18,50
10 $16.2 $162,00
100 $13.85 $1.385,00
500 $11.9 $5.950,00
1.000 $10.4 $10.400,00
ℹ️ Все цены указаны в USD

MC9S12B128MFUE Обзор

The NXP MC9S12B128MFUE is a 16-bit HCS12 microcontroller with 128KB Flash, 25MHz CPU, and 80-pin QFP package, AEC-Q100 qualified for automotive multiplexing.

An HCS12 microcontroller is a 16-bit automotive-grade MCU built on the Freescale/NXP HCS12 CPU core. The HCS12 sits within the broader taxonomy: microcontroller (MCU) -> embedded microcontroller -> automotive MCU -> 16-bit MCU -> HCS12 family. It is designed for body and chassis electronics that demand deterministic real-time behaviour, on-chip peripherals for CAN/LIN networking, and operation across the -40C to +125C automotive temperature range.

Key features include 128KB of on-chip Flash for application code and data, 2KB of EEPROM for non-volatile parameters, 4KB of RAM, an HCS12 CPU core running at 25MHz bus speed, and an integrated CAN 2.0 module plus multiple SCI/SPI peripherals. The device is offered in an 80-pin QFP package (14x14 mm) that is fully pin-compatible with the rest of the MC9S12B-Family, allowing designers to migrate between memory sizes and peripheral mixes without PCB rework.

The MC9S12B128MFUE is built on NXP's 0.25 micron automotive CMOS process and includes a phased-locked loop (PLL) for flexible clock generation, a 16-channel 10-bit ADC for sensor reading, and a PWM module with up to 8 channels for motor or lighting control. Background Debug Mode (BDM) is supported for non-intrusive in-circuit debugging, and the on-chip voltage regulator simplifies single-supply 5V operation.

Typical applications include automotive body controllers, door modules, seat controllers, instrument cluster slaves, HVAC control modules, and CAN/LIN gateway nodes. Members of the MC9S12B family are widely deployed in body-electronics multiplexing where dozens of ECUs share a CAN backbone.

When designing with this MCU, designers should budget Flash endurance (typically 100K cycles) and use the integrated EEPROM for parameter storage rather than the Flash array. The 80-pin QFP footprint leaves most GPIO and peripheral pins available; consult the pinout diagram before committing a PCB layout because not every signal is bonded out on every package variant.

This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a one-stop reference for sourcing the MC9S12B128MFUE.

Аналоги без доработки для MC9S12B128MFUE — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC9S12B128MFUE (тот же форм-фактор и посадочное место) — отличается по Package, Program Memory Size, Core, RoHS Status, RAM Size.

NXP Semiconductors
Package: 80-LQFP (14x14 mm)
Program Memory Size: 128 KB Flash
Core: HCS12 (S12B)
Сравнить с MC9S12B128MFUE →
NXP Semiconductors
Package: 80-QFP, 14 x 14 mm, 1.0 mm pitch
Core: HCS12 (16-bit CISC)
RoHS Status: Compliant
Сравнить с MC9S12B128MFUE →
NXP Semiconductors
Package: 80-QFP (14 x 14 mm)
Core: HCS12 (CISC)
RoHS Status: RoHS non-compliant (Pb-free process, SnPb or matte tin finish per datasheet packaging code)
Сравнить с MC9S12B128MFUE →
NXP Semiconductors
Package: 80-QFP (14x14 mm), LQFP-80
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Сравнить с MC9S12B128MFUE →
NXP Semiconductors
Program Memory Size: 128 KB (128K x 8)
RoHS Status: Compliant
RAM Size: 8 KB
Сравнить с MC9S12B128MFUE →
NXP Semiconductors
Package: 80-LQFP (14x14 mm)
Program Memory Size: 128 KB (128K x 8)
RoHS Status: Compliant per NXP product page
Сравнить с MC9S12B128MFUE →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC9S12B64MFUE

✅ Прямая замена
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 · HCS12 (CISC) · 16-bit · 25 MHz · 64 KB (64K x 8) · 2 KB · 5 V · 80-QFP (14 x 14 mm)

✓ В наличии

$9.1 / шт.

Открыть даташит →

MC9S12B256MFUE

✅ Прямая замена
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 (16-bit CISC) · S12B (MC9S12B series) · 25 MHz · 256 KB (256K x 8) · 12 KB · 4 KB · 2.35 V to 5.5 V · 10-bit, 8-channel

✓ В наличии

$21.6 / шт.

Открыть даташит →

MC9S12B128CFUE

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 (S12B) · 16 bit · 25 MHz · 128 KB Flash · 8 KB · 4 KB · 5 V typical (4.5 V to 5.5 V) · -40C to +85C

✓ В наличии

$14.85 / шт.

Открыть даташит →

MC9S12A128CFUE

✅ Прямая замена
📦 80-QFP (14x14)
MC9S12A-Family variant with 128KB Flash and same 80-QFP footprint; differs in peripheral mix (A vs B family CAN module)

📋 Справочный аналог (нет в каталоге)

MC9S12DG128VFUE

✅ Прямая замена
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 (16-bit CISC) · 16-bit · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8 · CANbus, I2C, SCI, SPI

✓ В наличии

Уточнить цену

Открыть даташит →

MC9S12B128MFUE Максимальные параметры и электрические характеристики

Manufacturer NXP USA Inc. (formerly Freescale Semiconductor)
Product Category Microcontrollers (MCU)
Core HCS12
Processor Series MC9S12B-Family
Разрядность шины данных 16-bit
Максимальная тактовая частота 25 MHz
Program Memory Size 128 KB (128K x 8) Flash
Диапазон рабочих температур -40C to +125C (automotive)
Корпус 80-QFP (14x14 mm)
Тип монтажа Surface Mount
AEC-Q100 Qualified (automotive grade)
Integrated CAN Module Yes (CAN 2.0)

Конфигурация выводов MC9S12B128MFUE

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт 1 VDDR — Voltage regulator supply
Контакт 2 VDD — Digital supply voltage
Контакт 3 VSS — Ground
Контакт 4 RESET — External reset input (active low)
Контакт 5 MODC — Mode control
Контакт 6 BKGD — Background debug mode
Контакт 7 XTAL — Crystal oscillator input
Контакт 8 EXTAL — External clock input
Контакт 9 VSS — Ground
Контакт 10 TXCAN — CAN transmit output
Контакт 11 RXCAN — CAN receive input
Контакт 12 PAD0 — Port AD bit 0
Контакт 13 PAD1 — Port AD bit 1
Контакт 14 PAD2 — Port AD bit 2
Контакт 15 PAD3 — Port AD bit 3
Контакт 16 PAD4 — Port AD bit 4
Контакт 17 PAD5 — Port AD bit 5
Контакт 18 PAD6 — Port AD bit 6
Контакт 19 PAD7 — Port AD bit 7
Контакт 20 PAD8 — Port AD bit 8
Контакт 21 PAD9 — Port AD bit 9
Контакт 22 PAD10 — Port AD bit 10
Контакт 23 PAD11 — Port AD bit 11
Контакт 24 PAD12 — Port AD bit 12
Контакт 25 PAD13 — Port AD bit 13
Контакт 26 PAD14 — Port AD bit 14
Контакт 27 PAD15 — Port AD bit 15
Контакт 28 VDD — Digital supply voltage
Контакт 29 VSS — Ground
Контакт 30 PP0 — Port P bit 0 / PWM0
Контакт 31 PP1 — Port P bit 1 / PWM1
Контакт 32 PP2 — Port P bit 2 / PWM2
Контакт 33 PP3 — Port P bit 3 / PWM3
Контакт 34 PP4 — Port P bit 4 / PWM4
Контакт 35 PP5 — Port P bit 5 / PWM5
Контакт 36 PP6 — Port P bit 6 / PWM6
Контакт 37 PP7 — Port P bit 7 / PWM7
Контакт 38 PS0 — Port S bit 0 / SCI0 TX
Контакт 39 PS1 — Port S bit 1 / SCI0 RX
Контакт 40 PS2 — Port S bit 2 / SPI0 SCK
Контакт 41 PS3 — Port S bit 3 / SPI0 MOSI
Контакт 42 PS4 — Port S bit 4 / SPI0 MISO
Контакт 43 PS5 — Port S bit 5 / SPI0 SS
Контакт 44 PS6 — Port S bit 6 / SCI1 TX
Контакт 45 PS7 — Port S bit 7 / SCI1 RX
Контакт 46 PT0 — Port T bit 0 / IOC0
Контакт 47 PT1 — Port T bit 1 / IOC1
Контакт 48 PT2 — Port T bit 2 / IOC2
Контакт 49 PT3 — Port T bit 3 / IOC3
Контакт 50 PT4 — Port T bit 4 / IOC4
Контакт 51 PT5 — Port T bit 5 / IOC5
Контакт 52 PT6 — Port T bit 6 / IOC6
Контакт 53 PT7 — Port T bit 7 / IOC7
Контакт 54 VDD — Digital supply voltage
Контакт 55 VSS — Ground
Контакт 56 PJ0 — Port J bit 0
Контакт 57 PJ1 — Port J bit 1
Контакт 58 PJ2 — Port J bit 2
Контакт 59 PJ3 — Port J bit 3
Контакт 60 PJ4 — Port J bit 4
Контакт 61 PJ5 — Port J bit 5
Контакт 62 PJ6 — Port J bit 6
Контакт 63 PJ7 — Port J bit 7
Контакт 64 PK0 — Port K bit 0
Контакт 65 PK1 — Port K bit 1
Контакт 66 PK2 — Port K bit 2
Контакт 67 PK3 — Port K bit 3
Контакт 68 PK4 — Port K bit 4
Контакт 69 PK5 — Port K bit 5
Контакт 70 PK6 — Port K bit 6
Контакт 71 PK7 — Port K bit 7
Контакт 72 PM0 — Port M bit 0
Контакт 73 PM1 — Port M bit 1
Контакт 74 VDD — Digital supply voltage
Контакт 75 VSS — Ground
Контакт 76 PE0 — Port E bit 0 / IRQ
Контакт 77 PE1 — Port E bit 1 / XIRQ
Контакт 78 PE2 — Port E bit 2
Контакт 79 PE3 — Port E bit 3
Контакт 80 PE4 — Port E bit 4

Типичное применение

MC9S12B128MFUE подходит для 6 применениеs: Automotive Body Control Module, Door Module and Seat Controller, HVAC Control Module, Instrument Cluster Peripheral, CAN/LIN Gateway Node, Industrial CAN-Based Controller.

🚗

Automotive Body Control Module

The MC9S12B128MFUE is purpose-built for automotive body control modules (BCMs) that orchestrate lighting, door locks, wipers, and accessory relays. Its 128KB Flash provides ample headroom for BCM application logic plus bootloader, while the on-chip CAN 2.0 controller interfaces directly with the vehicle CAN bus at 125 kbps to 1 Mbps. The 25MHz HCS12 core delivers deterministic interrupt latency under 100ns, critical for real-time body-network responses. AEC-Q100 qualification and -40C to +125C operation allow under-dash and under-hood deployment. Use the MC9S12B128MFUE when a proven, automotive-grade MCU with CAN connectivity is required.

🚗

Door Module and Seat Controller

Door modules and seat controllers use the MC9S12B128MFUE to drive window lift motors, mirror adjusters, seat position motors, and indicator LEDs. The on-chip PWM module generates up to 8 channels of motor-control signals with configurable frequency and duty cycle, while the 10-bit ADC reads position feedback from seat-travel sensors. The 128KB Flash stores motor calibration tables and seat-memory presets. The 80-QFP package is large enough for the I/O count required for multi-motor control and small enough to fit behind door trim panels. AEC-Q100 qualification ensures reliable operation in extreme cabin temperatures.

🏭

HVAC Control Module

HVAC control modules use the MC9S12B128MFUE to manage blower speed, blend door position, temperature sensors, and rear-defrost timing. The on-chip ADC scans multiple NTC thermistors to monitor cabin and duct temperatures, while PWM channels drive the blower motor at variable speed. The 128KB Flash supports complex comfort-control algorithms with adaptive learning. The CAN interface links the HVAC module to the rest of the vehicle network for climate setpoint sharing. Operating reliably from -40C to +125C ensures survival in dashboard-mounted enclosures exposed to solar heat load.

🎥

Instrument Cluster Peripheral

Instrument cluster peripheral ECUs (gateway nodes, secondary displays) use the MC9S12B128MFUE to relay CAN messages between body and powertrain networks. The integrated CAN 2.0 module handles message filtering and acceptance filtering, offloading the CPU for higher-level gateway logic. The 128KB Flash accommodates J1939 or CANopen protocol stacks. The 80-QFP package suits backplane-mounted cluster designs where space behind the cluster is plentiful. Pair the MCU with an external CAN transceiver such as TJA1050 or TJA1042 for physical-layer isolation.

🌐

CAN/LIN Gateway Node

CAN/LIN gateway nodes use the MC9S12B128MFUE to bridge between CAN bus segments or between CAN and LIN subnets. The 25MHz HCS12 core executes gateway filtering and message-routing logic with predictable latency, while the multiple SCI/UART channels support LIN master or slave operation. The 128KB Flash stores routing tables, diagnostic handlers, and transport-layer protocols. The AEC-Q100 qualification and -40C to +125C operation suit in-cabin gateway placement. Use the MC9S12B128MFUE when designing cost-sensitive gateway modules for body-network domains.

🏭

Industrial CAN-Based Controller

Outside automotive, the MC9S12B128MFUE is used in industrial CAN-based controllers such as programmable logic controllers (PLCs), remote I/O modules, and motor-control peripherals. The CAN interface provides robust communication in electrically harsh industrial environments, while the HCS12 core delivers deterministic timing for real-time control loops. The 128KB Flash accommodates IEC 61131-3 runtime or proprietary control firmware. The 80-QFP package is well-suited to industrial backplane mounting. Use the MC9S12B128MFUE for industrial applications where automotive-grade parts are deliberately chosen for their ruggedness.

What is the operating temperature range of MC9S12B128MFUE?
The MC9S12B128MFUE is rated for -40C to +125C operation. This is the standard automotive Grade 1 temperature range, making it suitable for under-hood and body-electronics applications that must survive harsh cabin and engine-bay environments. The part is qualified to AEC-Q100 standards per NXP product documentation.
How much Flash memory does MC9S12B128MFUE have?
The MC9S12B128MFUE integrates 128KB of on-chip Flash program memory, organized as 128K x 8 bytes. According to NXP's MC9S12B-Family datasheet, the Flash is split into multiple blocks to support in-application programming and erase-while-write on independent pages. Designers should budget Flash endurance of typically 100K cycles per block.
What package does MC9S12B128MFUE come in?
The MC9S12B128MFUE ships in an 80-pin QFP (Quad Flat Package) measuring 14x14 mm. The pinout is fully compatible with other MC9S12B-Family members, which means you can substitute a different memory-size variant on the same PCB layout without board rework. The 'MFUE' suffix in the part number specifically denotes this 80-QFP package and automotive temperature grade.
What is the difference between MC9S12B128MFUE and MC9S12A128CFUE?
The MC9S12B128MFUE belongs to the MC9S12B-Family optimized for automotive body multiplexing, while the MC9S12A128CFUE belongs to the MC9S12A-Family. Both share 128KB Flash, 25MHz HCS12 core, and 80-QFP package, but the B-family adds enhanced CAN capabilities and pin-compatible scalability. Choose the B-family for body modules, the A-family for broader industrial use.
Can MC9S12B128MFUE be used in automotive body control modules?
Yes, the MC9S12B128MFUE is purpose-built for automotive body and multiplexing applications. Its AEC-Q100 qualification, -40C to +125C operating range, on-chip CAN 2.0 controller, and pin compatibility across the MC9S12B-Family make it ideal for door modules, seat controllers, HVAC panels, and instrument cluster peripherals. The 'M' in the suffix marks the automotive temperature grade.
Where to buy MC9S12B128MFUE online?
The MC9S12B128MFUE is available from authorized NXP distributors including DigiKey, Mouser, and Micro-Semiconductor. As of 2026-10-18, Micro-Semiconductor.com listed approximately 6420 pieces in stock; DigiKey and Mouser typically carry this part with same-day shipment. Pricing tiers on this page are quoted as of 2026-10-18 from distributor data; check each distributor for current stock and lead time.
What is the price of MC9S12B128MFUE?
The MC9S12B128MFUE lists at approximately $18.50 per unit in single-piece quantity as of 2026-10-18. Volume pricing drops to roughly $10.40 per unit at 1000-piece reels. Pricing varies by distributor and reel quantity; the tiers on this page reflect standard distributor pricing and are subject to change without notice. Request a formal quote for OEM volumes.
What is the lead time for MC9S12B128MFUE?
Lead time for the MC9S12B128MFUE is typically 6 to 10 weeks from NXP, with distributor stock available for immediate shipment at most major franchised distributors. As of 2026-10-18, Micro-Semiconductor.com reported 6420 pieces in stock. For production volumes, place orders with NXP or authorized distributors 12 weeks ahead of need to ensure continuity of supply.
Is MC9S12B128MFUE in stock at major distributors?
Yes, the MC9S12B128MFUE is generally in stock at major franchised distributors. As of 2026-10-18, Micro-Semiconductor.com reported 6420 pieces available. DigiKey and Mouser also typically carry inventory or can source within a short lead time. Use distributor inventory checkers for real-time stock levels; XAIPART's availability reflects back-order status for quote-based fulfillment.
What is the best drop-in replacement for MC9S12B128MFUE?
The best drop-in replacement is the MC9S12B64MFUE, which shares the same 80-QFP package, 25MHz HCS12 core, and AEC-Q100 qualification but with 64KB Flash instead of 128KB. For the same 128KB Flash, the MC9S12B128MPBE (in a different package) is not pin-compatible. Within the MC9S12B-Family, the 80-QFP variants are pin-compatible, allowing flexible memory-size scaling without PCB changes.
Can MC9S12B64CFUE replace MC9S12B128MFUE?
The MC9S12B64CFUE is not a drop-in replacement for the MC9S12B128MFUE because it has only 64KB Flash versus 128KB Flash on the target. The 'CFUE' suffix also denotes a different temperature grade than the 'MFUE' automotive-grade target. While both share the HCS12 core and 80-QFP package, the memory difference means code designed for 128KB will not fit in 64KB without recompilation.
Where to download MC9S12B128MFUE datasheet PDF?
The MC9S12B128MFUE datasheet PDF is available from NXP's official product documentation portal and from secondary aggregators such as AllDatasheet and DigChip. The manufacturer datasheet covers HCS12 core architecture, memory map, peripheral registers, electrical characteristics, and package dimensions. Use the NXP document number for the latest revision; legacy Freescale/Motorola datasheets remain available for reference.
Where to find MC9S12B128MFUE pinout?
The MC9S12B128MFUE pinout is documented in the manufacturer datasheet and shows all 80 pins of the QFP package organized by function. Pin 1 is marked at the top-left of the package with a dot indicator; the package uses standard counter-clockwise numbering. The datasheet includes tables for each pin showing its primary function, alternate functions, and reset state. Refer to the pinout diagram on this page for the standard 80-QFP layout.
What are the key specifications of MC9S12B128MFUE that engineers should know?
The MC9S12B128MFUE integrates a 16-bit HCS12 CPU at 25MHz, 128KB Flash, on-chip CAN 2.0 controller, multiple SCI/SPI peripherals, 10-bit ADC, 8-channel PWM, and BDM debug interface, all in an 80-QFP package rated -40C to +125C. It is AEC-Q100 qualified and pin-compatible across the MC9S12B-Family for scalable memory options. These specifications make it a workhorse for automotive body and multiplexing applications.
What is the equivalent NXP part for MC9S12B128MFUE?
Within NXP's portfolio, the closest equivalent is the MC9S12B128MPBE, which shares the HCS12 core, 128KB Flash, and 25MHz speed but ships in a different package (LQFP-112). For true drop-in compatibility in the 80-QFP package, the MC9S12B64MFUE is pin-compatible but offers only 64KB Flash. Cross-brand equivalents from other manufacturers do not exist at the HCS12 register level, as this core is NXP/Freescale proprietary.

Справочные инженерные данные для MC9S12B128MFUE — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MC9S12B128MFUE when designing automotive body-control, door-module, or HVAC modules that require 128KB of Flash, an integrated CAN 2.0 controller, AEC-Q100 qualification, and -40C to +125C operation in an 80-QFP package. Choose the MC9S12B64MFUE if your firmware fits in 64KB and you want to reduce unit cost. Choose the MC9S12B256MFUE if you need to add bootloader, diagnostics, or larger protocol stacks. Choose the MC9S12B128CFUE only for non-automotive commercial-temperature applications; the CFUE suffix is not AEC-Q100 qualified. For industrial CAN controllers where automotive ruggedness is desirable, the MFUE grade provides extra reliability margin.

Сравнение с аналогами

Параметр Этот товар MC9S12B64MFUE MC9S12B256MFUE MC9S12B128CFUE MC9S12A128CFUE MC9S12DG128VFUE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 80-QFP (14x14) 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same
Core HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit
Clock Frequency 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
Flash Memory 128 KB 64 KB (-50%) 256 KB (+100%) 128 KB 128 KB 128 KB
Operating Temperature -40C to +125C (automotive) -40C to +125C (automotive) -40C to +125C (automotive) 0C to +70C (commercial) 0C to +70C (commercial) -40C to +125C (automotive)
CAN Module Yes (CAN 2.0) Yes (CAN 2.0) Yes (CAN 2.0) Yes (CAN 2.0) Yes (CAN 2.0) Yes (CAN 2.0)
Family MC9S12B-Family MC9S12B-Family MC9S12B-Family MC9S12B-Family MC9S12A-Family MC9S12D-Family
AEC-Q100 Qualified Yes Yes Yes No (commercial grade) No (commercial grade) Yes

Ключевые отличия

  • Pin-compatible scalability across MC9S12B-Family memory sizes (против MC9S12B64MFUE)
  • Automotive temperature grade (-40C to +125C) with AEC-Q100 qualification (против MC9S12B128CFUE)
  • On-chip CAN 2.0 controller for automotive networking (против MC9S12A128CFUE)

Заметки по проектированию

The MC9S12B128MFUE includes an on-chip voltage regulator that converts the 5V supply to internal logic levels. Bypass VDD and VDDR pins with 100nF ceramic capacitors placed within 2mm of each supply pin; add a 4.7uF bulk capacitor on VDDR to handle regulator transient loads during Flash programming. Decouple VSS pins individually to a low-impedance ground plane; star-grounding is not recommended at 25MHz bus speeds.

Route the XTAL and EXTAL traces as short and symmetric as possible, with a ground guard trace on each side. Place the crystal within 5mm of the MCU and avoid routing signal traces under the crystal. The 80-QFP package has a center thermal pad; connect it to a copper pour with thermal vias for improved heat dissipation at sustained 25MHz operation. Keep CAN bus traces (TXCAN, RXCAN) short and impedance-controlled to 120 ohms differential.

Do not exceed the Flash endurance of typically 100K erase/program cycles per block; use the on-chip EEPROM for frequently updated parameters (calibration, runtime counters). Always configure the PLL before increasing the bus frequency - jumping directly to 25MHz from the default oscillator mode can cause code execution failures. Use BDM (Background Debug Mode) for non-intrusive in-circuit debugging; the BKGD pin must be pulled high via 10kohm during reset for normal operation.

The HCS12 bus can operate at 25MHz with edge rates under 5ns; series-terminate address and data bus lines if the bus length exceeds 50mm. Avoid running clock traces parallel to I/O traces for more than 25mm to minimize crosstalk. The CAN bus requires a 120 ohm termination resistor at each end of the bus segment; place the resistor close to the transceiver IC, not the MCU. Use twisted-pair wiring for CAN_H and CAN_L.

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
Без свинца
Unknown
Без галогенов
Unknown
Конфликтные минералы
Unknown

AEC-Q100 qualified per NXP MC9S12B-Family product line. RoHS, REACH, lead-free, and halogen-free status not explicitly stated in the verified distributor data; consult the NXP material declaration for definitive compliance information.

Данные проверены: 2026-10-18 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors Freescale Semiconductor MC9S12B128MFUE MC9S12B-Family MC9S12B64MFUE MC9S12B256MFUE MC9S12B128CFUE MC9S12A128CFUE MC9S12DG128VFUE HCS12 16-bit microcontroller automotive MCU AEC-Q100 CAN 2.0 80-QFP Flash memory EEPROM PWM 10-bit ADC Background Debug Mode body control module automotive multiplexing RoHS REACH
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5
Отправлено
6
Доставлено
Просмотреть детали RFQ