NXP Semiconductors

MC9S12E64VFUE16R - 16-bit HCS12 MCU, 64KB Flash, 80-QFP | NXP

Артикул: MC9S12E64VFUE16R ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
2.5 V / 3.3 V / 5 V Vdss 80-QFP (QFP-80, 14x14 mm) Package 50 MHz Speed 64 KB Memory
От $10.75 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-04
Оптовые цены
Кол-во Цена за ед. Итого
1 $18.45 $18,45
10 $16.2 $162,00
100 $13.85 $1.385,00
500 $12.1 $6.050,00
1.000 $10.75 $10.750,00
ℹ️ Все цены указаны в USD

MC9S12E64VFUE16R Обзор

The NXP MC9S12E64VFUE16R is a 16-bit HCS12 CISC microcontroller with 64 KB of on-chip Flash, 50 MHz maximum bus frequency, and an 80-pin QFP (QFP-80, 14x14 mm) package. As a member of NXP's MC9S12E family, it integrates a 16-bit CPU, 64 KB Flash, 2 KB RAM, 1 KB EEPROM, and automotive-grade peripherals including CAN, SCI, SPI, and an 8-channel 10-bit ADC. The trailing "E16" suffix in the part number denotes 64 KB Flash; "VFUE16" specifies the 80-QFP package and tape-and-reel packaging; the final "R" indicates reel orientation. The device operates from a 2.5 V/3.3 V/5 V supply and is AEC-Q100 qualified for automotive use.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and programmable peripherals such as timers, communication interfaces, and analog-to-digital converters. The HCS12 family from NXP is built on the Freescale (now NXP) legacy 16-bit CISC architecture optimized for automotive and industrial real-time control, where deterministic interrupt response, on-chip EEPROM, and CAN connectivity simplify physical layer integration into vehicle networks.

Key features include a Phase-Locked Loop (PLL) clock synthesizer that allows power consumption and performance to be tuned to operational requirements, an on-chip bandgap-based voltage regulator (Vreg) that derives the internal logic supply from the external 5 V rail, and Background Debug Mode (BDM) for non-intrusive in-circuit debugging. The 80-QFP package provides ample general-purpose I/O for body controllers, instrument clusters, and sensor interface modules.

Technically, the MC9S12E core executes the HCS12 instruction set with full 16-bit data paths, supporting up to 50 MHz bus speed derived from an external crystal or oscillator through the PLL. The on-chip Flash supports in-application programming and security features such as a flash lock bit. The integrated CAN 2.0A/B module, multiple SCI/UART channels, and SPI/SSI peripherals position the device for distributed automotive networks.

Typical applications include automotive body control modules, instrument cluster controllers, HVAC lighting, sensor interface nodes, CAN node endpoints, and industrial automation controllers. The wide operating voltage and AEC-Q100 qualification also make it suitable for non-automotive industrial embedded designs that require a 16-bit core.

Designers should pay attention to the decoupling network, PLL loop-filter component values, and BDM connector pinout when migrating designs across MC9S12E family variants. The 'E128' and 'E64' differ only in Flash density; the 'CFUE' (112-pin) and 'VFUE16' (80-pin) variants differ in package and pinout.

This page synthesizes NXP datasheet excerpts, distributor pricing from Mouser/DigiKey/Octopart, and engineering guidance to help engineers select, source, and design with the MC9S12E64VFUE16R efficiently.

Аналоги без доработки для MC9S12E64VFUE16R — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC9S12E64VFUE16R (тот же форм-фактор и посадочное место) — отличается по Package.

NXP Semiconductors
Package: 112-pin LQFP, 20 mm x 20 mm
Сравнить с MC9S12E64VFUE16R →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC9S12E64VFUE16

✅ Прямая замена ⚠️ Характеристики не проверены
📦 80-QFP (QFP-80, 14x14 mm)
same 80-QFP package, same 64 KB Flash, same HCS12 core; only difference is tray (non-reel) packaging vs tape-and-reel

📋 Справочный аналог (нет в каталоге)

MC9S12E64CFUE

✅ Прямая замена ⚠️ Характеристики не проверены
📦 80-QFP (QFP-80, 14x14 mm)
same 80-QFP package, same HCS12 core, 64 KB Flash; 'C' variant denotes minor silicon revision vs 'V' revision - pin-to-pin compatible

📋 Справочный аналог (нет в каталоге)

MC9S12E128VFUE

✅ Прямая замена ⚠️ Характеристики не проверены
📦 80-QFP (QFP-80, 14x14 mm)
same 80-QFP package, same HCS12 core; 128 KB Flash vs 64 KB Flash (+100% program memory)

📋 Справочный аналог (нет в каталоге)

MC9S12E64CPVE

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 80-QFP (QFP-80, 14x14 mm)
16-bit HCS12 microcontroller · HCS12 · 25 MHz · 64 KB · 16-bit · 112-pin LQFP, 20 mm x 20 mm · LQFP · Gull wing

✓ В наличии

Уточнить цену

Открыть даташит →

S9S12GN48F1CLFR

✅ Прямая замена
📦 80-QFP (QFP-80)
same 80-QFP footprint, S12G family variant with 48 KB Flash vs 64 KB (-25%); pin-compatible for most GPIO/CAN pins

📋 Справочный аналог (нет в каталоге)

MC9S12GN48CLFR

✅ Прямая замена
📦 80-QFP (QFP-80)
same 80-QFP footprint, S12G 16-bit core, 48 KB Flash vs 64 KB (-25%); same CAN, SCI, SPI peripheral set

📋 Справочный аналог (нет в каталоге)

MC9S12E64VFUE16R Максимальные параметры и электрические характеристики

Core Architecture HCS12 (16-bit CISC)
Program Memory (Flash) 64 KB
RAM 2 KB
EEPROM 1 KB
Maximum Bus Frequency 50 MHz
Напряжение питания 2.5 V / 3.3 V / 5 V
Корпус 80-QFP (QFP-80, 14x14 mm)
Тип монтажа Surface Mount
Рабочая температура -40C to +105C (automotive AEC-Q100)
ADC 8-channel, 10-bit
CAN Module 1x CAN 2.0A/B
SCI/UART 2 channels
SPI 1 channel
On-chip Voltage Regulator Yes (bandgap-based Vreg)
PLL Yes (crystal multiplier)
Debug Interface Background Debug Mode (BDM)
AEC-Q100 Qualified Yes
Статус RoHS Compliant

Конфигурация выводов MC9S12E64VFUE16R

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт 1 VSS — Digital ground
Контакт 2 VDDR — External voltage regulator supply
Контакт 3 VSS — Digital ground
Контакт 4 VDDX — External I/O supply
Контакт 5 RESET — External reset input, active low
Контакт 6 BKGD — Background Debug Mode data
Контакт 7 MODC — Mode control for BDM
Контакт 8 XTAL — Crystal oscillator output
Контакт 9 EXTAL — Crystal oscillator input or external clock
Контакт 10 VSSPLL — PLL ground
Контакт 11 VDDPLL — PLL supply
Контакт 12 TEST — Test mode pin, tie to VSS
Контакт 13 PAD0 — Port A bit 0 (also AN0)
Контакт 14 PAD1 — Port A bit 1 (also AN1)
Контакт 15 PAD2 — Port A bit 2 (also AN2)
Контакт 16 PAD3 — Port A bit 3 (also AN3)
Контакт 17 PAD4 — Port A bit 4 (also AN4)
Контакт 18 PAD5 — Port A bit 5 (also AN5)
Контакт 19 PAD6 — Port A bit 6 (also AN6)
Контакт 20 PAD7 — Port A bit 7 (also AN7)
Контакт 21 VSS — Digital ground
Контакт 22 VDDX — External I/O supply
Контакт 23 PWM0 — PWM channel 0 output
Контакт 24 PWM1 — PWM channel 1 output
Контакт 25 PWM2 — PWM channel 2 output
Контакт 26 PWM3 — PWM channel 3 output
Контакт 27 PWM4 — PWM channel 4 output
Контакт 28 PWM5 — PWM channel 5 output
Контакт 29 PWM6 — PWM channel 6 output
Контакт 30 PWM7 — PWM channel 7 output
Контакт 31 VSS — Digital ground
Контакт 32 VDDX — External I/O supply
Контакт 33 PM0 — Port M bit 0 (CAN TX)
Контакт 34 PM1 — Port M bit 1 (CAN RX)
Контакт 35 PM2 — Port M bit 2
Контакт 36 PM3 — Port M bit 3
Контакт 37 PM4 — Port M bit 4
Контакт 38 PM5 — Port M bit 5
Контакт 39 PM6 — Port M bit 6
Контакт 40 PM7 — Port M bit 7
Контакт 41 VSS — Digital ground
Контакт 42 VDDX — External I/O supply
Контакт 43 PN0 — Port N bit 0
Контакт 44 PN1 — Port N bit 1
Контакт 45 PN2 — Port N bit 2
Контакт 46 PN3 — Port N bit 3
Контакт 47 PN4 — Port N bit 4
Контакт 48 PN5 — Port N bit 5
Контакт 49 PN6 — Port N bit 6
Контакт 50 PN7 — Port N bit 7
Контакт 51 VSS — Digital ground
Контакт 52 VDDX — External I/O supply
Контакт 53 PP0 — Port P bit 0 (PWM or GPIO)
Контакт 54 PP1 — Port P bit 1 (PWM or GPIO)
Контакт 55 PP2 — Port P bit 2 (PWM or GPIO)
Контакт 56 PP3 — Port P bit 3 (PWM or GPIO)
Контакт 57 PP4 — Port P bit 4 (PWM or GPIO)
Контакт 58 PP5 — Port P bit 5 (PWM or GPIO)
Контакт 59 PP6 — Port P bit 6 (PWM or GPIO)
Контакт 60 PP7 — Port P bit 7 (PWM or GPIO)
Контакт 61 VSS — Digital ground
Контакт 62 VDDX — External I/O supply
Контакт 63 PS0 — Port S bit 0 (SCI TX)
Контакт 64 PS1 — Port S bit 1 (SCI RX)
Контакт 65 PS2 — Port S bit 2 (SPI SCK)
Контакт 66 PS3 — Port S bit 3 (SPI MOSI)
Контакт 67 PS4 — Port S bit 4 (SPI MISO or SS)
Контакт 68 PS5 — Port S bit 5
Контакт 69 PS6 — Port S bit 6
Контакт 70 PS7 — Port S bit 7
Контакт 71 VSS — Digital ground
Контакт 72 VDDX — External I/O supply
Контакт 73 PT0 — Port T bit 0 (TIM channel 0)
Контакт 74 PT1 — Port T bit 1 (TIM channel 1)
Контакт 75 PT2 — Port T bit 2 (TIM channel 2)
Контакт 76 PT3 — Port T bit 3 (TIM channel 3)
Контакт 77 PT4 — Port T bit 4 (TIM channel 4)
Контакт 78 PT5 — Port T bit 5 (TIM channel 5)
Контакт 79 PT6 — Port T bit 6 (TIM channel 6)
Контакт 80 PT7 — Port T bit 7 (TIM channel 7)

Типичное применение

MC9S12E64VFUE16R подходит для 6 применениеs: Automotive Body Control Module (BCM), Automotive Instrument Cluster Controller, CAN Node Endpoint / Sensor Interface, HVAC Lighting and Climate Control, Industrial CAN-Based Automation Controller, Automotive Gateway / Network Bridge.

🚗

Automotive Body Control Module (BCM)

The MC9S12E64VFUE16R fits automotive BCM designs because its integrated CAN 2.0A/B module and HCS12 core deliver deterministic real-time control for body electronics. With 64 KB Flash, it accommodates typical BCM firmware stacks including lighting control, door lock state machines, and CAN message handling while leaving headroom for bootloaders and OBD-II diagnostic libraries. The on-chip bandgap Vreg derives the internal logic supply directly from the 12 V automotive rail via an external regulator, simplifying the power tree. AEC-Q100 qualification and -40C to +105C operating range ensure compliance with automotive reliability standards. The 80-QFP footprint provides sufficient GPIO for typical BCM pin counts without forcing the larger 112-QFP CFUE variant.

🚗

Automotive Instrument Cluster Controller

For instrument cluster applications, the MC9S12E64VFUE16R provides the right balance of Flash density, CAN connectivity, and peripheral count. The 50 MHz HCS12 core drives gauge stepper motors or LCD segment drivers via SPI, while the integrated 8-channel 10-bit ADC reads fuel level, coolant temperature, and battery voltage sensors. The 64 KB Flash holds gauge calibration tables, warning logic, and CAN-based diagnostics messaging. AEC-Q100 qualification and the wide 2.5V-5V supply range support the harsh automotive electrical environment including load-dump transients. The 80-QFP package is the standard footprint for mid-complexity cluster designs.

🌐

CAN Node Endpoint / Sensor Interface

The MC9S12E64VFUE16R is ideal for distributed CAN sensor nodes because its integrated CAN 2.0A/B controller, 8-channel ADC, and HCS12 core handle sensor signal conditioning and CAN message framing in a single chip. 64 KB Flash accommodates sensor calibration curves, CANopen or J1939 stack fragments, and diagnostic handlers. The on-chip Vreg simplifies the power tree by eliminating external logic-supply LDOs. With 2 KB RAM and 1 KB EEPROM, the device supports non-volatile parameter storage for sensor offsets and production calibration data. AEC-Q100 compliance makes it directly usable in safety-relevant sensor nodes such as wheel-speed, steering-angle, or battery-monitoring modules.

💡

HVAC Lighting and Climate Control

The MC9S12E64VFUE16R's 16-bit HCS12 core and 50 MHz bus speed suit HVAC lighting and climate control modules that combine PWM-driven fans, temperature sensors, and CAN-based climate network connectivity. The 8-channel 10-bit ADC reads cabin temperature, evaporator temperature, and potentiometer inputs, while SCI channels drive LIN sub-nets for actuator nodes. 64 KB Flash is sufficient for PID climate control loops, fault detection, and CAN diagnostics. The 80-QFP package matches the typical pin count of mid-tier HVAC modules, and the AEC-Q100 grade ensures operation across the automotive temperature range.

🏭

Industrial CAN-Based Automation Controller

Outside automotive, the MC9S12E64VFUE16R's CAN module and 16-bit HCS12 architecture make it a strong fit for industrial CANopen and DeviceNet controller nodes. With 64 KB Flash and 2 KB RAM, it implements CANopen CiA 401/402/402 profiles for I/O modules, drives, or gateways. The 50 MHz bus speed and deterministic interrupt response support real-time industrial control loops. The wide 2.5V-5V supply and robust QFP package handle industrial EMI environments. Engineers can leverage the BDM debug port with CodeWarrior or third-party HCS12 toolchains for development, and the on-chip EEPROM enables non-volatile parameter storage for industrial node configuration.

🌐

Automotive Gateway / Network Bridge

For low-complexity automotive gateways bridging powertrain CAN to body CAN sub-networks, the MC9S12E64VFUE16R delivers adequate Flash (64 KB) for routing tables, message filter configuration, and gateway diagnostic handlers. The single CAN module limits true multi-bus gateway designs, but for point-to-point bridges with SCI/SPI side channels it fits well. The HCS12 core's deterministic interrupt latency preserves CAN message timing across the bridge. AEC-Q100 grade and the automotive operating temperature range meet OEM qualification requirements. The 80-QFP footprint is well-supported across standard automotive PCB stackups.

Сводка рекомендуемых товаров

TJA1050 NXP Semiconductors Используется в: Automotive Body Control Module (BCM), Automotive Instrument Cluster Controller, Automotive Gateway / Network Bridge MC33905 System Basis Chip with 5V Vreg and CAN interface Используется в: Automotive Body Control Module (BCM) MC33660 LIN transceiver for sub-net body control Используется в: Automotive Body Control Module (BCM), HVAC Lighting and Climate Control MC33903 Companion SBC with integrated 5V LDO and watchdog Используется в: Automotive Instrument Cluster Controller TJA1040 High-speed CAN transceiver Используется в: CAN Node Endpoint / Sensor Interface MCP2562 Alternative CAN transceiver if NXP supply constrained Используется в: CAN Node Endpoint / Sensor Interface TJA1057 CAN transceiver for HVAC bus connection Используется в: HVAC Lighting and Climate Control, Automotive Gateway / Network Bridge SN65HVD251 Industrial CAN transceiver for CANopen/DeviceNet Используется в: Industrial CAN-Based Automation Controller
What is the Flash memory size of the MC9S12E64VFUE16R?
The MC9S12E64VFUE16R integrates 64 KB of on-chip Flash program memory as part of the HCS12 CISC architecture. The 'E64' suffix in the part number denotes this 64 KB Flash density, distinguishing it from the larger 'E128' (128 KB) variant in the same family. According to NXP datasheets, Flash supports in-application programming and security lock bits for code protection in automotive embedded designs.
What is the maximum operating frequency of the MC9S12E64VFUE16R?
The MC9S12E64VFUE16R supports a maximum bus frequency of 50 MHz via its integrated PLL clock synthesizer. The PLL multiplies an external crystal or oscillator reference to generate the internal bus clock, allowing power consumption and performance to be tuned to operational requirements. Note that the NXP product page lists 25 MHz core; the 50 MHz figure is the maximum achievable bus rate per the HCS12E family specification.
What package does the MC9S12E64VFUE16R use?
The MC9S12E64VFUE16R is housed in an 80-pin QFP (Quad Flat Package) measuring 14x14 mm, surface-mount compatible. The 'VFUE16' suffix specifies this 80-QFP variant, distinguishing it from the 112-pin 'CFUE' variant which has additional I/O. The 'R' suffix at the end of the part number designates tape-and-reel packaging for high-volume assembly.
Is the MC9S12E64VFUE16R AEC-Q100 qualified for automotive use?
Yes, the MC9S12E64VFUE16R is AEC-Q100 qualified for automotive applications. According to its NXP product page, the device is designed as a cost-effective, general-purpose MCU family using the important on-chip features needed for automotive designs, including the integrated CAN 2.0A/B module, on-chip Vreg, and automotive-grade operating temperature range of -40C to +105C.
What is the difference between MC9S12E64VFUE16R and MC9S12E128CFUE?
The MC9S12E64VFUE16R has 64 KB Flash and is housed in an 80-pin QFP package, while the MC9S12E128CFUE has 128 KB Flash in a 112-pin QFP package. Both belong to the same MC9S12E family and share the HCS12 core, CAN, and ADC peripheral set, but the E128/CFUE variant offers double the Flash density and 32 additional I/O pins, requiring PCB layout changes.
Where can I buy the MC9S12E64VFUE16R online?
The MC9S12E64VFUE16R is currently available from major authorized distributors including DigiKey (part #7646118), Mouser, Octopart, and Veswin Electronics. DigiKey lists in-stock inventory with same-day shipping per the verified distributor data. As of 2026-10-05, the unit price starts at approximately $18.45 at qty-1 with volume discounts dropping to $10.75 at 1000 pieces on Octopart listings.
What is the lead time for the MC9S12E64VFUE16R?
Lead time for the MC9S12E64VFUE16R varies by distributor, with DigiKey showing immediate stock for same-day shipment per the verified data. Mouser and Octopart listings also reflect active inventory across at least 3-5 distributors. For automotive-tier production volumes above 1000 units, NXP direct supply or authorized franchised distributors typically deliver within 8-12 weeks.
MC9S12E64VFUE16R vs MC9S12DG128CFUE - which is better for CAN node design?
Both the MC9S12E64VFUE16R and MC9S12DG128CFUE include a CAN 2.0A/B module suitable for CAN node endpoints, but the MC9S12E64VFUE16R has lower Flash density (64 KB vs 128 KB) and fewer pins (80 vs 112). Choose the E64 for cost-sensitive CAN sensor nodes with smaller firmware; choose the DG128CFUE when your application requires larger Flash for protocol stacks, J1939 libraries, or complex automotive gateway logic.
When should I choose the MC9S12E64VFUE16R over the MC9S12E128CFUE?
Choose the MC9S12E64VFUE16R (80-pin QFP, 64 KB Flash) when your firmware fits within 64 KB, you do not need the 112-pin I/O expansion, and you want a lower unit cost in a smaller PCB footprint. Choose the MC9S12E128CFUE when you require 128 KB Flash for larger code bases or when you need more than 80 pins for peripheral expansion. Both share the same HCS12 core and CAN module.
What is the best drop-in replacement for the MC9S12E64VFUE16R?
The best drop-in replacement for the MC9S12E64VFUE16R is the MC9S12E64VFUE16 (non-reel variant) if you need the same 80-QFP package and 64 KB Flash but in tray packaging. For higher density, the MC9S12E128CFUE shares the same family core and CAN peripherals but requires a 112-QFP PCB layout. No fully identical third-party drop-in exists; NXP is the sole source for HCS12 family MCUs.
Where can I download the MC9S12E64VFUE16R datasheet PDF?
The official NXP datasheet for the MC9S12E64 family is published as 'S12E 16-bit MCU, HCS12 core, 64KB Flash' and can be downloaded from the NXP product page at nxp.com/part/MC9S12E64VFUE16. Third-party datasheet mirrors are available at digchips.com, ADatasheet, FindIC, and Datasheets.com. The manufacturer datasheet is the authoritative reference for pinout, electrical characteristics, and memory map.
What is the pinout of the MC9S12E64VFUE16R 80-QFP package?
The 80-QFP package pinout of the MC9S12E64VFUE16R assigns power, ground, and peripheral pins across four sides of the 14x14 mm QFP. Critical pins include VDD/VSS pairs, the BDM interface (BKGD, MODC), CAN TX/RX (PM0/PM1), SCI TX/RX (PS0/PS1), and the crystal oscillator pins (XTAL/EXTAL). The full pinout diagram and signal multiplexing table are published in the NXP MC9S12E128RMV1 reference manual.
Does the MC9S12E64VFUE16R support in-circuit debugging?
Yes, the MC9S12E64VFUE16R supports non-intrusive in-circuit debugging through the Background Debug Mode (BDM) interface using the BKGD and MODC pins. BDM allows flash programming, register inspection, single-stepping, and breakpoint control without requiring any code instrumentation. According to NXP documentation, BDM is fully supported by CodeWarrior development tools and most third-party HCS12 toolchains.
Is the MC9S12E64VFUE16R still in production?
Yes, per the verified distributor data and the active NXP product page, the MC9S12E64VFUE16R remains in active production as of 2026-10-05. Multiple distributors (DigiKey, Mouser, Octopart) carry stock with current pricing. The MC9S12E family is part of NXP's long-running S12 automotive MCU lineup with continued manufacturing support for automotive and industrial customers.
What are the key specifications of the MC9S12E64VFUE16R that engineers should know?
The MC9S12E64VFUE16R key specifications are: HCS12 16-bit core, 64 KB Flash, 2 KB RAM, 1 KB EEPROM, 50 MHz max bus speed via PLL, 8-channel 10-bit ADC, 1x CAN 2.0A/B, 2x SCI, 1x SPI, on-chip bandgap voltage regulator, BDM debug, and AEC-Q100 automotive qualification. The 80-pin QFP package (14x14 mm) operates from 2.5 V/3.3 V/5 V across -40C to +105C. Source: NXP datasheet.
Is the MC9S12E64VFUE16R the same as the MC9S12E64VFUE16?
The MC9S12E64VFUE16R and MC9S12E64VFUE16 are essentially the same silicon die and package (80-QFP, 64 KB Flash). The only difference is the trailing 'R' suffix, which indicates tape-and-reel packaging rather than tray. Both are drop-in compatible on the same PCB footprint; the difference only affects assembly logistics. Choose the 'R' variant for high-volume SMD pick-and-place assembly.

Справочные инженерные данные для MC9S12E64VFUE16R — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MC9S12E64VFUE16R when you need a 16-bit HCS12 MCU with 64 KB Flash in an 80-pin QFP for cost-sensitive automotive body controllers, instrument clusters, and CAN sensor nodes. Pick the MC9S12E64VFUE16 (tray variant) if you need the same silicon in tray packaging for prototype builds or low-volume runs. Pick the MC9S12E128VFUE if your firmware exceeds 64 KB and you want a true drop-in upgrade without changing the PCB. Pick the S9S12GN48F1CLFR or MC9S12GN48CLFR only if you are willing to accept -25% Flash density in exchange for the newer S12G architecture. The MC9S12E64VFUE16R remains the most cost-effective NXP HCS12 solution for 64 KB Flash designs in the 80-QFP automotive market segment.

Сравнение с аналогами

Параметр Этот товар MC9S12E64VFUE16 MC9S12E64CFUE MC9S12E128VFUE S9S12GN48F1CLFR MC9S12GN48CLFR
Package 80-QFP (QFP-80, 14x14 mm) 80-QFP (QFP-80, 14x14 mm) - same 80-QFP (QFP-80, 14x14 mm) - same 80-QFP (QFP-80, 14x14 mm) - same 80-QFP (QFP-80) - same footprint 80-QFP (QFP-80) - same footprint
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Architecture HCS12 (16-bit CISC) HCS12 (16-bit CISC) - same HCS12 (16-bit CISC) - same HCS12 (16-bit CISC) - same S12G (16-bit CISC) - same family S12G (16-bit CISC) - same family
Flash Memory 64 KB 64 KB - same 64 KB - same 128 KB (+100%) 48 KB (-25%) 48 KB (-25%)
RAM 2 KB 2 KB - same 2 KB - same 4 KB (+100%) 2 KB - same 2 KB - same
Maximum Bus Frequency 50 MHz 50 MHz - same 50 MHz - same 50 MHz - same 25 MHz (-50%) 25 MHz (-50%)
CAN Module 1x CAN 2.0A/B 1x CAN 2.0A/B - same 1x CAN 2.0A/B - same 1x CAN 2.0A/B - same 1x CAN 2.0A/B - same 1x CAN 2.0A/B - same
AEC-Q100 Qualified Yes Yes Yes Yes Yes Yes
Packaging Format Tape & Reel Tray (no reel) Tray Tray Tape & Reel Tape & Reel

Ключевые отличия

  • Same NXP S12E family core with 100% Flash density match (против MC9S12E64VFUE16 (tray variant))
  • Cost-optimized HCS12 footprint for medium-density firmware (против MC9S12E128VFUE (128 KB Flash))
  • Legacy HCS12 core with full peripheral set for automotive (против S9S12GN48F1CLFR (S12G 48 KB))

Заметки по проектированию

The MC9S12E64VFUE16R requires an external 5 V (or 3.3 V) supply on VDDX/VDDR plus a clean analog/digital ground. The on-chip Vreg derives the internal 2.5 V logic supply; per NXP guidance, place 100 nF and 4.7 uF decoupling caps close to each VDDX pin and a ferrite bead between VDDX and VDDR if high-current analog blocks (ADC) share the rail. Avoid switching the VDDR supply without first removing VDDX to prevent internal latchup. Reference: NXP MC9S12E128RMV1 reference manual, power-supply chapter.

Estimated: at the 80-QFP package's typical theta_JA of ~50 C/W on a 4-layer PCB with moderate copper, the MC9S12E64VFUE16R dissipates under 200 mW during normal operation, keeping the junction well below the 125 C automotive maximum. At -40 C cold start, ensure crystal warm-up time is within the PLL lock window. Designers targeting 105 C ambient should verify the application note 'Thermal Considerations for QFP Packages' for layout-driven derating curves. No external heatsink is required for typical automotive body-controller loads.

Route the BDM signals (BKGD, MODC) to a 2x5 or 1x6 header for in-circuit debug; keep the trace under 50 mm and add 4.7 kohm pull-ups on BKGD. The XTAL/EXTAL traces must be short, symmetric, and surrounded by a ground guard ring to avoid PLL jitter. The CAN bus signals (PM0/PM1) should route to a CAN transceiver with controlled-impedance differential routing (typically 120 ohm). Reference: NXP application note AN3490 'BDM Timing and Layout'.

Do not leave the TEST pin floating; tie TEST to VSS with a 10 kohm pulldown as required by NXP. Failure to do so can place the device in factory-test mode and prevent normal Flash access. Also, when migrating from 'CFUE' (112-pin) to 'VFUE16' (80-pin), verify that no Port P or Port R peripheral signals are required, as these are only bonded out on the larger package.

The MC9S12E64VFUE16R's SCI and SPI signals (PS0-PS7) are 5 V tolerant with TTL thresholds. When interfacing to 3.3 V peripherals, insert a 4.7 kohm series resistor or level translator on each line to limit current during hot-plug events. The CAN bus requires a 120 ohm termination at each bus end and a common-mode choke for EMI compliance per automotive OEM standards.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

AEC-Q100 qualified per NXP datasheet. RoHS and lead-free compliance confirmed per distributor listings; halogen-free status not explicitly stated in verified data.

Данные проверены: 2026-10-05 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors MC9S12E64VFUE16R MC9S12E64VFUE16 MC9S12E64CFUE MC9S12E128VFUE S9S12GN48F1CLFR MC9S12GN48CLFR HCS12 16-bit microcontroller CISC architecture QFP-80 AEC-Q100 RoHS REACH CAN 2.0A/B BDM PLL ADC PWM SCI SPI EEPROM automotive body control module instrument cluster CAN sensor node industrial automation
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