MCF51MM256CML - 50MHz ColdFire V1 MCU, 256KB Flash, 104-MAPBGA | NXP
Артикул: MCF51MM256CML ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.05 | $130,50 |
| 100 | $11.6 | $1.160,00 |
| 500 | $10.45 | $5.225,00 |
| 1.000 | $9.28 | $9.280,00 |
MCF51MM256CML Обзор
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (FLASH/ROM), data memory (RAM), and a rich set of peripherals (ADC, timers, communication controllers, GPIOs) into one package. The ColdFire V1 core is a 32-bit variable-length RISC architecture derived from the original ColdFire family, designed for low-cost, low-power, high-performance embedded applications. Within the broader semiconductor taxonomy, this MCU belongs to: microcontroller -> embedded processor -> 32-bit processor -> microprocessor -> semiconductor device.
Key features include an integrated analog front-end with 16-bit ADC, dual 16-bit DACs (designed for metrology applications), up to 50 MHz core clock, 256 KB program FLASH, on-chip RAM, low-power Run/Wait/Stop modes, and multiple serial interfaces including I2C, SPI, and UART. The device operates from a 2.5 V/3.3 V supply and supports an extended industrial operating temperature range suitable for harsh embedded environments.
Typical applications include single-phase and polyphase smart electricity meters, gas and water flow metering, portable medical monitoring devices, industrial sensor conditioning, and low-power wireless sensor nodes. The integrated 16-bit ADC with PGA and the dual 16-bit DACs make it purpose-built for accurate analog signal acquisition and waveform generation in metering products.
When designing with the MCF51MM256CML, observe the PCB layout recommendations in the manufacturer reference manual for the 104-MAPBGA: matched-impedance traces for high-speed peripherals, decoupling on every supply pin, and thermal vias under the package. The 104-ball MAPBGA requires X-ray inspection or AOI during assembly, so production test strategy should plan for BGA-specific processes.
This page synthesizes distributor pricing, drop-in alternative MPNs within the MCF51MM family, and practical engineering design notes not consolidated in the manufacturer datasheet, giving engineers a faster path to component selection and BOM risk mitigation.
Аналоги без доработки для MCF51MM256CML — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MCF51MM256CML (тот же форм-фактор и посадочное место) — отличается по Package, Mounting Type, Core Architecture, Supply Voltage, Lifecycle Status.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MCF51MM128CML
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MCF51MM256VML
✅ Прямая замена✓ В наличии
$9.2 / шт.
Открыть даташит →MCF51MM128VML
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MCF51MM256CMB
✅ Прямая замена✓ В наличии
$7.4 / шт.
Открыть даташит →MCF51MM256CLK
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
Уточнить цену
Открыть даташит →MCF51MM256CML Максимальные параметры и электрические характеристики
| Core Architecture | ColdFire V1 (32-bit RISC) |
| Processor Series | MCF51MM |
| Максимальная тактовая частота | 50 MHz |
| Разрядность шины данных | 32 bit |
| Program Memory Size | 256 KB (256K x 8) FLASH |
| Корпус | 104-MAPBGA (10x10 mm) |
| Напряжение питания | 2.5 V / 3.3 V |
| Тип монтажа | Surface Mount (BGA) |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Category | Microcontrollers (MCU) |
| Статус RoHS | Compliant (per DigiKey product page) |
Руководство по цоколевке MCF51MM256CML в корпусе 104-mapbga (10x10 mm)
Цоколевка для MCF51MM256CML (корпус 104-mapbga (10x10 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для MCF51MM256CML.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MCF51MM256CML подходит для 6 применениеs: Single-Phase Smart Electricity Meter, Polyphase Energy Meter, Gas and Water Flow Meter, Portable Medical Monitoring Device, Industrial Sensor Conditioning Module, Low-Power Wireless Sensor Node.
Single-Phase Smart Electricity Meter
The MCF51MM256CML is purpose-built for single-phase smart electricity metering. Its integrated 16-bit ADC with PGA samples voltage and current shunt signals at high resolution, while the dual 16-bit DACs generate calibration waveforms and test tones for accuracy verification at production. The ColdFire V1 core at 50 MHz executes metrology DSP algorithms (RMS, power, harmonic analysis) plus the communication protocol (DLMS/COSEM, IEC 62056) within tight real-time budgets. The 256 KB FLASH holds the metrology library, communication stack, and application code; the 2.5 V/3.3 V supply simplifies the analog/digital domain design. Drop-in alternatives like MCF51MM128CML can be used when the application fits in 128 KB.
Рекомендуется
Polyphase Energy Meter
In three-phase electricity meters, the MCF51MM256CML's ColdFire V1 core processes multiple ADC channels simultaneously to deliver accurate active, reactive, and apparent power measurements. The 32-bit data path and 50 MHz clock allow parallel sampling of phase voltages and currents, while on-chip timers synchronize ADC triggers to zero-crossing events. The 256 KB FLASH accommodates multi-tariff schedules, tamper detection logic, and DLMS/COSEM or Modbus protocol stacks. Same-package drop-in variants such as MCF51MM128VML allow cost-down redesigns once firmware is finalized, while preserving the PCB layout.
Рекомендуется
Gas and Water Flow Meter
The MCF51MM256CML serves gas and water flow meters by digitizing low-frequency pulse signals from flow sensors and running temperature/pressure compensation algorithms. Its low-power Run/Wait/Stop modes extend battery life in unattended meter deployments, and the on-chip RTC keeps accurate time-of-use logs. The 256 KB FLASH stores compensation curves, calibration tables, and wireless protocol stacks (Wireless M-Bus, LoRaWAN, NB-IoT) for AMR/AMI systems. The 104-MAPBGA package supports compact meter designs while exposing all required peripheral interfaces.
Рекомендуется
Portable Medical Monitoring Device
For portable medical monitors such as pulse oximeters, blood pressure cuffs, and patient wearables, the MCF51MM256CML provides 32-bit processing for biosignal DSP while keeping power consumption low. The integrated 16-bit ADC accurately digitizes PPG, ECG, or impedance signals, and the low-power modes extend battery runtime. The 256 KB FLASH stores signal-processing firmware and BLE/USB device stacks. ColdFire V1 instruction set compatibility allows reuse of legacy medical algorithms across the MCF51MM family.
Рекомендуется
Industrial Sensor Conditioning Module
In industrial 4-20 mA loop-powered sensor transmitters, the MCF51MM256CML acts as a digital front-end that digitizes bridge, RTD, or thermocouple signals and applies linearization, filtering, and HART protocol stacks. The ColdFire V1 core executes polynomial compensation in real time, while the dual DACs can output analog representations for legacy analog loops. The 256 KB FLASH holds calibration data, sensor profiles, and HART command libraries. Drop-in alternatives allow cost reduction once firmware stabilizes.
Рекомендуется
Low-Power Wireless Sensor Node
The MCF51MM256CML anchors battery-powered wireless sensor nodes by handling sensor acquisition, on-node DSP, and protocol MAC/PHY glue. Its low-power modes allow sleep currents in the microamp range while an external radio (Sub-GHz, BLE, or LoRa) handles wireless transmission. The 256 KB FLASH stores mesh firmware (e.g., 6LoWPAN, Thread, ZigBee) and sensor processing libraries. The 104-MAPBGA package integrates dense GPIO and serial interfaces into a compact 10x10 mm footprint for miniaturized nodes.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MCF51MM256CML — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MCF51MM128CML | MCF51MM256VML | MCF51MM128VML | MCF51MM256CMB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Package | 104-MAPBGA (10x10 mm) | 104-MAPBGA (10x10 mm) - same | 104-MAPBGA (10x10 mm) - same | 104-MAPBGA (10x10 mm) - same | 104-MAPBGA (10x10 mm) - same |
| Core Architecture | ColdFire V1 32-bit | ColdFire V1 32-bit - same | ColdFire V1 32-bit - same | ColdFire V1 32-bit - same | ColdFire V1 32-bit - same |
| Maximum Clock Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| FLASH Size | 256 KB | 128 KB (-50%) | 256 KB (same) | 128 KB (-50%) | 256 KB (same) |
| Temperature Grade | Commercial/Industrial (CML) | Commercial/Industrial (CML) | Extended (VML) | Extended (VML) | Commercial/Industrial (CML) |
| Supply Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant |
Ключевые отличия
- Integrated 16-bit ADC plus dual 16-bit DACs for single-chip metering (против MCF51MM128CML)
- Extended-temperature drop-in option exists for harsh environments (против MCF51MM256VML)
- Same-family migration path scales between 128 KB and 256 KB FLASH (против MCF51MM128VML)
Заметки по проектированию
The 104-MAPBGA package at 10x10 mm requires a 4- or 6-layer PCB with matched-length power/ground planes. Place decoupling capacitors (100 nF + 1 uF + 10 uF) within 1-2 mm of each power pin to suppress switching transients. Stitch the ground plane with vias around the BGA perimeter to control return paths and reduce EMI from the 50 MHz core clock.
While the ColdFire V1 core is low power, the 104-MAPBGA package dissipates heat through the PCB. Add a thermal via array under the package center pad and connect it to the internal ground plane to keep junction temperature within spec, especially in sealed meter enclosures with limited convection.
Avoid routing high-speed signals under the BGA package, where via stubs can cause impedance discontinuities. The MCF51MM256CML integrates 16-bit ADC and dual DACs - place analog traces on a separate inner layer with a clean ground split, and keep digital return currents from contaminating the analog ground reference. Production test must include BGA X-ray or AOI for solder joint verification.
Информация о соответствии
RoHS compliance confirmed by DigiKey product page listing for MCF51MM256CML (NXP USA Inc.). Reach and conflict-minerals status assumed compliant per NXP corporate policy; halogen-free status not explicitly stated in verified data.
