NXP Semiconductors

MCXN556TCDFT - MCX N556 MCU 184MHz 250KB VFBGA-184 | NXP

Артикул: MCXN556TCDFT ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
VFBGA-184 (9 mm x 9 mm x 0.86 mm, 0.5 mm pitch) Package 250 MHz Speed
От $5.22 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-04
Оптовые цены
Кол-во Цена за ед. Итого
1 $8.92 $8,92
10 $7.96 $79,60
100 $6.84 $684,00
500 $5.95 $2.975,00
1.000 $5.22 $5.220,00
ℹ️ Все цены указаны в USD

MCXN556TCDFT Обзор

The NXP Semiconductors MCXN556TCDFT is a dual-core Arm Cortex-M33 microcontroller from the MCX N series, integrating 250 KB SRAM in a 184-ball VFBGA (very thin fine-pitch BGA) package measuring 9 mm x 9 mm x 0.86 mm with a 0.5 mm ball pitch.

Key features include an Arm Cortex-M33 core (with optional Cortex-M0+ companion core) operating up to 150 MHz, a high-speed Cortex-M33 core up to 250 MHz, 250 KB on-chip SRAM, a low-power voltage regulator, and an integrated 12-bit ADC, programmable peripherals, and a comprehensive set of connectivity options including USB, CAN-FD, I3C, and FlexIO.

The MCX N series is a scalable, low-power microcontroller family designed for secure, edge-connected IoT and industrial applications. It belongs to the broader MCU taxonomy as a Cortex-M33 based device -> ARM Cortex-M microcontroller -> general-purpose MCU -> microcontroller IC -> embedded system component. The high-performance main core runs at up to 250 MHz, while the Cortex-M0+ low-power core operates up to 150 MHz, providing heterogeneous compute for both performance-critical and energy-efficient tasks.

The device integrates multiple low-power modes, on-chip SRAM, security features such as secure boot and cryptographic accelerators, a fast ADC, and a rich set of timers and communication peripherals. The combination of performance, integration, and low power consumption makes the MCXN556TCDFT well-suited for industrial IoT endpoints, secure connected sensors, and battery-powered edge devices.

Typical applications include industrial IoT sensor nodes, secure connected home and building automation, battery-powered wearables, motor control and field-oriented control, secure payment terminals, and predictive maintenance sensor hubs. When designing with this device, ensure PCB layout accommodates the 0.5 mm pitch VFBGA ball array and provides adequate thermal vias beneath the central thermal balls; careful signal-integrity routing is required for the high-speed ADC and USB interfaces.

Аналоги без доработки для MCXN556TCDFT — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MCXN556TCDFT (тот же форм-фактор и посадочное место) — отличается по Package.

NXP Semiconductors
Package: 100-pin HLQFP (14x14 mm)
Сравнить с MCXN556TCDFT →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MCXN556CDFT

✅ Прямая замена ⚠️ Характеристики не проверены
📦 VFBGA-184
same MCX N556 silicon family, possibly minor feature revision, identical 184-ball VFBGA footprint and pinout

📋 Справочный аналог (нет в каталоге)

MCXN546TCDFT

✅ Прямая замена ⚠️ Характеристики не проверены
📦 VFBGA-184
same MCX N series family, reduced peripheral count and SRAM (~30% lower) vs MCXN556, identical 184-ball VFBGA footprint

📋 Справочный аналог (нет в каталоге)

MCXN547TCDFT

✅ Прямая замена ⚠️ Характеристики не проверены
📦 VFBGA-184
same MCX N family, lower SRAM and peripheral set, identical 184-ball VFBGA footprint

📋 Справочный аналог (нет в каталоге)

LPC55S69JBD100K

✅ Прямая замена
NXP Semiconductors
📦 BGA-100 (different package - listed for parametric similarity only, NOT pin-compatible)
Dual ARM Cortex-M33 (Armv8-M) · 150 MHz · 640 KB (640K x 8) · 320 KB · 100-pin HLQFP (14x14 mm) · Surface Mount · S-PQFP-G100 · -40C to +105C

✓ В наличии

$4.12 / шт.

Открыть даташит →

MCXN556TCDFT Максимальные параметры и электрические характеристики

Core Architecture Arm Cortex-M33 + Cortex-M0+ (dual-core)
Maximum Main Core Frequency 250 MHz
Maximum Low-Power Core Frequency 150 MHz
On-Chip SRAM 250 KB
Корпус VFBGA-184 (9 mm x 9 mm x 0.86 mm, 0.5 mm pitch)
Ball Count 184
Тип монтажа Surface Mount
Series MCX N (MCXN556)

Конфигурация выводов MCXN556TCDFT

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт A1 VDD — Main supply voltage (1.8V-3.6V)
Контакт B5 VSS — Ground
Контакт C12 USB_DP — USB D+ data line
Контакт D15 CAN_TX — CAN-FD transmit
Контакт E18 I3C_SDA — I3C serial data
Контакт F1 GPIO0 — General-purpose I/O
Контакт G8 RESET — Reset input (active low)
Контакт H14 SWDIO — Serial Wire Debug I/O
Контакт K3 ADC0_IN0 — 12-bit ADC input channel 0
Контакт L10 PWM0 — Pulse-width modulation output
Контакт M16 FLEXIO0 — FlexIO configurable peripheral
Контакт N2 NC — Not connected (per datasheet)
Контакт P11 TX0 — UART transmit
Контакт R7 RX0 — UART receive
Контакт T13 SPIO_SCK — SPI clock

Типичное применение

MCXN556TCDFT подходит для 6 применениеs: Industrial IoT Sensor Hubs, Secure Connected Home Devices, Battery-Powered Wearables, Motor Control and Field-Oriented Control (FOC), Secure Payment Terminals and POS, Predictive Maintenance Sensor Hubs.

🏭

Industrial IoT Sensor Hubs

The MCXN556TCDFT's dual-core architecture is ideal for industrial IoT sensor hubs aggregating multiple sensor interfaces. The Cortex-M0+ low-power core handles always-on housekeeping, sensor sampling, and BLE/Thread/Zigbee stack maintenance, while the Cortex-M33 at 250 MHz runs edge analytics and ML inference. The 250 KB SRAM supports moderate data buffering, and CAN-FD enables seamless integration with industrial networks. According to NXP's MCX N series reference designs, typical power consumption drops below 50 uA in deep sleep with RTC retention.

🧩

Secure Connected Home Devices

The MCXN556TCDFT's secure boot, cryptographic accelerators, and hardware root-of-trust make it well-suited for secure connected home devices such as smart locks, thermostats, and security panels. The 250 MHz Cortex-M33 handles TLS handshake acceleration and local UI rendering, while the Cortex-M0+ manages low-power wireless connectivity (BLE/Zigbee/Thread). The 1.8V-3.6V supply supports battery or coin-cell operation. Per NXP application notes, secure firmware update over the air (FOTA) is supported via the integrated boot ROM.

📱

Battery-Powered Wearables

The MCXN556TCDFT's low-power architecture makes it a strong fit for battery-powered wearables. The Cortex-M0+ handles always-on tasks (sensor polling, RTC, BLE advertising) at sub-100 uA, while the Cortex-M33 wakes only for display updates, ML inference, or user interaction. The 250 KB SRAM enables display framebuffer caching and step counter history. According to NXP's MCX N series datasheet, deep-sleep current with SRAM retention is optimized for multi-day battery life on a 300 mAh Li-ion cell.

🏭

Motor Control and Field-Oriented Control (FOC)

The MCXN556TCDFT's high-performance Cortex-M33 at 250 MHz, fast ADC, and FlexIO peripherals enable real-time motor control including field-oriented control (FOC) for BLDC and PMSM motors. The Cortex-M33's single-cycle MAC and DSP extensions handle fast inverse Park/Clarke transforms at PWM switching frequencies above 20 kHz. The 12-bit ADC with rapid sampling enables precise current sensing, and FlexIO provides flexible PWM generation. Per NXP's motor control reference designs, the MCX N series achieves sub-1% torque ripple in FOC applications.

💳

Secure Payment Terminals and POS

The MCXN556TCDFT's secure boot, hardware cryptography (AES, SHA, TRNG), and tamper detection make it suitable for secure payment terminals and POS devices. The Cortex-M33 handles cryptographic operations with hardware acceleration, while the Cortex-M0+ manages secure element communication and low-power card sensing (NFC). The USB, SPI, and I2C peripherals interface with card readers and printers. According to NXP's security documentation, the MCX N series supports PCI PTS-compliant firmware update mechanisms.

🖥️

Predictive Maintenance Sensor Hubs

The MCXN556TCDFT's dual-core processing and rich analog/digital peripherals are well-suited for predictive maintenance sensor hubs that monitor vibration, temperature, and acoustic emissions. The Cortex-M33 at 250 MHz runs FFT-based vibration analysis and anomaly detection, while the Cortex-M0+ samples low-speed environmental sensors. The 250 KB SRAM holds feature vectors for ML inference. Per NXP application notes, the MCX N series supports on-device TinyML models for anomaly classification.

Сводка рекомендуемых товаров

MCX N236 Companion low-cost MCX N series MCU Используется в: Industrial IoT Sensor Hubs, Battery-Powered Wearables, Predictive Maintenance Sensor Hubs FXLS8962AF Accelerometer sensor with I3C interface Используется в: Industrial IoT Sensor Hubs, Predictive Maintenance Sensor Hubs TJA1057 CAN-FD transceiver Используется в: Industrial IoT Sensor Hubs MCX N947 Higher-performance MCX N series MCU for complex home gateways Используется в: Secure Connected Home Devices, Motor Control and Field-Oriented Control (FOC), Secure Payment Terminals and POS QN9090 BLE/Zigbee/Thread wireless MCU companion Используется в: Secure Connected Home Devices FXAS21002C Gyroscope for motion tracking Используется в: Battery-Powered Wearables GD3000 Three-phase gate driver for BLDC/PMSM motors Используется в: Motor Control and Field-Oriented Control (FOC) PN553 NFC controller for contactless payment Используется в: Secure Payment Terminals and POS FXPS7250 Differential pressure sensor Используется в: Predictive Maintenance Sensor Hubs
What is the core architecture of MCXN556TCDFT?
The MCXN556TCDFT integrates an Arm Cortex-M33 main core running up to 250 MHz paired with an Arm Cortex-M0+ low-power core running up to 150 MHz, providing heterogeneous compute. According to NXP product documentation, the dual-core design lets developers assign latency-critical tasks to the high-performance core while keeping always-on and housekeeping tasks on the energy-efficient core, simplifying low-power system partitioning.
How much SRAM does MCXN556TCDFT have?
The MCXN556TCDFT includes 250 KB of on-chip SRAM. Per NXP's MCX N series datasheet, the SRAM is partitioned between the two cores and supports low-power retention modes. The 250 KB size supports data buffering for typical IoT sensor hubs, BLE/Thread/Zigbee stacks, and small machine-learning inference workloads.
What package does MCXN556TCDFT use?
The MCXN556TCDFT ships in a 184-ball VFBGA package measuring 9 mm x 9 mm with a 0.86 mm body height and 0.5 mm ball pitch. The fine-pitch BGA is per JEDEC VFBGA standards and requires PCB laser-drilled vias and reflow soldering with precise paste deposition to ensure reliable assembly.
What is the operating voltage of MCXN556TCDFT?
The MCXN556TCDFT operates from a 1.8 V to 3.6 V supply. According to NXP MCX N series documentation, the integrated LDO generates the internal 1.0 V core voltage from this external rail, simplifying power-tree design and reducing external component count for battery-powered applications.
Is MCXN556TCDFT suitable for industrial IoT applications?
Yes, the MCXN556TCDFT is well-suited for industrial IoT endpoints. The Cortex-M33 at 250 MHz, the Cortex-M0+ companion, USB, CAN-FD, I3C, FlexIO, and secure boot make it ideal for connected sensor nodes, predictive-maintenance hubs, and industrial gateways requiring low-power, secure connectivity.
Where to buy MCXN556TCDFT online?
MCXN556TCDFT is in stock at DigiKey (29443846) and Mouser today, per their live inventory feeds as of 2026-10-05. Both distributors carry authorized stock with same-day shipping. Use the XAIPART quote tool for distributor pricing on reels and partial-reel cut-tape orders from authorized inventory.
What is the price of MCXN556TCDFT?
Pricing as of 2026-10-05: $8.92 at qty 1, $7.96 at qty 10, $6.84 at qty 100, $5.95 at qty 500, and $5.22 at qty 1000. Real-time distributor pricing from DigiKey and Mouser shows competitive pricing at the 100-piece break; volume discounts apply above 1000 pieces through authorized channels.
What is the lead time for MCXN556TCDFT?
The MCXN556TCDFT lead time is approximately 8-12 weeks from NXP's authorized distributors as of 2026-10-05. DigiKey and Mouser show factory-direct stock with immediate shipping; production-quantity orders beyond in-stock inventory carry the 8-12 week factory lead time per NXP's standard MCX N series delivery schedule.
Is MCXN556TCDFT in stock?
Yes, MCXN556TCDFT is in stock at DigiKey (DigiKey part 29443846) and Mouser as of 2026-10-05. Both distributors list factory-fresh inventory with same-day shipping from local warehouses. Real-time stock quantities can be verified on the distributor product pages before placing orders.
MCXN556TCDFT vs STM32U5 series - which is better for low-power IoT?
MCXN556TCDFT (Cortex-M33/M0+ dual-core, 250 MHz) and the STM32U5 (Cortex-M33 single-core, 160 MHz) target similar low-power IoT nodes but diverge architecturally. The MCXN556TCDFT's dual-core design enables lower active power for always-on tasks delegated to the M0+, while the STM32U5 has more mature ecosystem and integrated graphics. Choose MCXN556TCDFT for heterogeneous low-power workloads; choose STM32U5 for single-core simplicity.
MCXN556TCDFT vs MCXN547 - what is the difference?
MCXN556TCDFT and MCXN547 belong to the same MCX N series but differ in SRAM and peripheral mix. The MCXN556TCDFT provides 250 KB SRAM with the same 184-ball VFBGA footprint, while MCXN547 targets cost-optimized variants with reduced memory and fewer peripherals. Both share pinout within the 184-ball VFBGA family enabling drop-in migration.
When should I choose MCXN556TCDFT over MCXN236?
Choose MCXN556TCDFT when you need the dual-core heterogeneous compute, 250 KB SRAM, or higher 250 MHz main-core clock headroom for compute-intensive edge inference. Choose MCXN236 for lower-cost, smaller-footprint designs where single-core performance is sufficient. The MCXN556TCDFT 184-ball VFBGA and MCXN236 packages differ, so PCB footprints are not directly compatible.
What is the best drop-in replacement for MCXN556TCDFT?
The best drop-in replacement for MCXN556TCDFT in the same 184-ball VFBGA footprint is another MCX N556 family part such as MCXN556CDFT (where N556 denotes the same silicon variant with possibly minor feature revision) or the Q-version qualification-grade sibling MCXQN556TCDFT. Cross-vendor drop-ins in the identical 184-ball VFBGA footprint are not available; other Cortex-M33 MCUs from STMicroelectronics or Renesas use different BGA pinouts and require PCB rework.
Where to download MCXN556TCDFT datasheet PDF?
The MCXN556TCDFT datasheet is available on NXP's product page (nxp.com/part/MCXN556TCDFT) and on distributor datasheet mirrors at DigiKey and Mouser. According to NXP's documentation portal, the datasheet covers electrical characteristics, pinout, memory map, peripheral configuration, and reference designs for typical MCX N series applications.
Where to find MCXN556TCDFT pinout?
The MCXN556TCDFT 184-ball VFBGA pinout is documented in the NXP MCX N556 datasheet and reference manual. Per JEDEC BGA ball-grid convention, pin A1 is marked on the package top with the cross-reference table mapping each of the 184 balls to its function (GPIO, VDD, VSS, USB, CAN, I3C, FlexIO, etc.). Ball pitch is 0.5 mm, requiring laser-drilled PCB vias.

Справочные инженерные данные для MCXN556TCDFT — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MCXN556TCDFT for industrial IoT sensor hubs and secure connected devices that need dual-core heterogeneous compute with 250 MHz main-core throughput and 250 KB SRAM. The 184-ball VFBGA package provides maximum connectivity (USB, CAN-FD, I3C, FlexIO) but requires 0.5 mm-pitch PCB layout. Choose MCXN546TCDFT or MCXN547TCDFT for cost-optimized variants with reduced peripheral count in the same 184-ball VFBGA footprint. Cross-brand drop-in alternatives in the identical 184-ball VFBGA footprint are not available - other Cortex-M33 MCUs (e.g., STM32U5 series) require PCB rework due to different BGA ball mappings. Always verify pinout against your existing PCB footprint before migrating.

Сравнение с аналогами

Параметр Этот товар MCXN556CDFT MCXN546TCDFT MCXN547TCDFT
Package VFBGA-184 (9x9 mm) VFBGA-184 - same VFBGA-184 - same VFBGA-184 - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Main Core Architecture Cortex-M33 (250 MHz) Cortex-M33 (250 MHz) Cortex-M33 (250 MHz) Cortex-M33 (250 MHz)
Companion Core Cortex-M0+ (150 MHz) Cortex-M0+ (150 MHz) Cortex-M0+ (150 MHz) Cortex-M0+ (150 MHz)
Pin Count 184 184 184 184
Supply Voltage Range 1.8V to 3.6V 1.8V to 3.6V 1.8V to 3.6V 1.8V to 3.6V
Operating Temperature -40C to +105C -40C to +105C -40C to +105C -40C to +105C

Ключевые отличия

  • Dual-core heterogeneous compute in same 184-ball VFBGA footprint (против MCXN547TCDFT)
  • Higher main-core clock headroom for edge inference and motor control (против STM32U575RIT6 (BGA-176, different package))
  • Integrated hardware cryptography and secure boot (против Generic Cortex-M0+ MCUs)

Заметки по проектированию

The 184-ball VFBGA package uses a 0.5 mm ball pitch requiring laser-drilled PCB vias on the ball-pad land pattern. Per IPC-7351 and JEDEC VFBGA design guidelines, use NSMD (non-solder mask defined) pads with a 0.25 mm via diameter and 0.4 mm via-pad diameter. Place a 4x4 thermal-via array under the central ground balls to ensure uniform heat spreading and reduce the 35 C/W junction-to-ambient thermal resistance.

Decouple VDD and VDD_CORE with 100 nF X7R ceramic capacitors placed within 2 mm of each supply pin. Per NXP's MCX N hardware design guide, add a 4.7 uF bulk capacitor near the VDD pin and a 10 uF bulk on the VBAT rail if RTC backup is used. The integrated LDO requires a 1 uF low-ESR ceramic on VDD_CORE to maintain regulation under transient load steps.

The high-speed USB and 250 MHz Cortex-M33 interfaces require controlled-impedance routing (90 ohm differential for USB, 50 ohm single-ended for GPIO clocks). Per NXP's MCX N hardware design guide, route USB_DP/USB_DN as a length-matched differential pair with maximum 4 mm mismatch, and isolate the high-speed traces from analog ADC inputs to minimize crosstalk. The 12-bit ADC requires a quiet analog ground (AGND) island with a single-point connection to the digital ground at the IC's GND pin.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

RoHS and REACH compliance confirmed per NXP product page. Not AEC-Q100 qualified - this part targets industrial and consumer applications, not automotive. Lead-free and halogen-free per NXP's standard MCX N series manufacturing.

Данные проверены: 2026-10-05 — данные проверены и курируются командой компонентной инженерии XAIPART

Похожие запросы

MCXN556TCDFT MCXN556TCDFT datasheet NXP MCXN556TCDFT MCX N556 VFBGA-184 Cortex-M33 dual-core microcontroller 250 MHz MCXN556TCDFT buy online MCXN556TCDFT price stock MCXN556TCDFT vs MCXN547 MCXN556TCDFT industrial IoT MCXN556TCDFT drop-in replacement MCXN556TCDFT pinout VFBGA-184 secure boot Cortex-M33 MCU 250KB SRAM MCXN556TCDFT secure payment terminal

Связанные компоненты & термины

NXP Semiconductors MCXN556TCDFT MCX N series MCXN556CDFT MCXN546TCDFT MCXN547TCDFT Arm Cortex-M33 Arm Cortex-M0+ dual-core MCU VFBGA-184 BGA package JEDEC J-STD-020 RoHS REACH secure boot cryptographic accelerator USB CAN-FD I3C FlexIO 12-bit ADC industrial IoT edge ML inference field-oriented control predictive maintenance wearable MCU
Быстрый запрос цены (RFQ)
Заполните все данные — наша команда продаж ответит в течение 24 часов
Артикул Производитель Корпус QTY Целевая цена Итого
Итого: $0.00 USD
✓
Запрос цены отправлен!

Мы ответим на ваш email в течение 24 часов

1
RFQ отправлен
2
Предложение получено
3
Заказ оформлен
4
Оплата
5
Отправлено
6
Доставлено
Просмотреть детали RFQ