MPC8314CVRAGDA - PowerQUICC II Pro 400MHz SoC | NXP | 620-HBGA
Артикул: MPC8314CVRAGDA ⚠ Последняя закупка| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $35.5 | $35,50 |
| 10 | $31.95 | $319,50 |
| 100 | $27.1 | $2.710,00 |
| 500 | $22.84 | $11.420,00 |
| 1.000 | $19.2 | $19.200,00 |
MPC8314CVRAGDA Обзор
A PowerQUICC II Pro processor is a member of the communications processor family that sits between a microcontroller and a full network processor, embedding the peripheral set required for wired and wireless customer-premises equipment. The MPC8314 inherits the PowerQUICC architecture (originally derived from the MC68360 QUICC) and adds DDR memory support, an integrated security engine option, and a high-performance system bus, making it well suited for routers, switches, and small-form-factor NAS/print server designs.
Key features include a 400 MHz e300c3 core with 16 KB instruction and 16 KB data L1 caches, a 32-bit DDR1/DDR2 memory controller, a 32-bit PCI v2.3 interface, two Gigabit Ethernet MACs, USB 2.0 (host/device/OTG), TDM support for voice, and an integrated system bus running up to 133 MHz. The device is fabricated in a 90 nm process and targets the -40C to +105C industrial temperature range, supporting fanless enclosures typical of SOHO gateways.
The architecture combines the e300c3 core, an enhanced system bus, a unified 32-bit DDR controller, dual Gigabit Ethernet with QoS acceleration, and integrated security for IPsec/SSL. The lack of an integrated encryption accelerator in the non-E variant (this is the C-variant) differentiates it from the MPC8314E-AGDA part number, which is the encryption-enabled sibling.
Typical applications include SOHO/SMB routers, integrated access devices, 802.11n Wi-Fi gateways, xDSL residential gateways, Ethernet switches, network-attached storage (NAS), and industrial control with Ethernet connectivity. The wide peripheral integration reduces external component count for continuous equipment design.
When designing with this part, ensure the DDR2 controller is configured for the specific memory device speed grade used and that PCB routing follows the HCTE-BGA 1 mm pitch escape rules. Power sequencing of the core and I/O rails must follow NXP's hardware specifications to avoid latch-up during cold-start.
This page synthesizes distributor availability, drop-in same-package alternatives, and practical design notes not found in the standalone datasheet.
Аналоги без доработки для MPC8314CVRAGDA — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MPC8314CVRAGDA (тот же форм-фактор и посадочное место) — отличается по Core Architecture, Data Bus Width, Memory Controller, Mounting Type, PCI Interface.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MPC8314EVRAGDA
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8343CVRAGDA
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8313CVRAGDA
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8323EVRAGDA
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8347EVRAGDA
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8358EVRAGDA
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8314CVRAGDA Максимальные параметры и электрические характеристики
| Core Architecture | PowerPC e300c3 |
| Core Count | 1 |
| Разрядность шины данных | 32 bit |
| Максимальная тактовая частота | 400 MHz |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Memory Controller | DDR1/DDR2, 32-bit |
| PCI Interface | PCI v2.3, 32-bit, up to 66 MHz |
| Ethernet | 2x 10/100/1000 Mbps GMII / RGMII |
| USB | USB 2.0 (Host/Device/OTG) |
| TDM Interface | TDM (T1/E1) |
| Encryption Engine | Not present (C-variant, non-encrypt) |
| Process Technology | 90 nm CMOS |
| Корпус | 620-HBGA (HCTE-BGA, 29x29 mm) |
| Рабочая температура | -40C to +105C |
| Напряжение питания | Core 1.0 V, I/O 3.3 V (typical) |
| Тип монтажа | Surface Mount, 1.0 mm ball pitch |
| Уровень MSL | 3 (per JEDEC J-STD-020) |
| Статус RoHS | Compliant |
Руководство по цоколевке MPC8314CVRAGDA в корпусе 620-hbga (hcte-bga, 29x29 mm)
Цоколевка для MPC8314CVRAGDA (корпус 620-hbga (hcte-bga, 29x29 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для MPC8314CVRAGDA.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MPC8314CVRAGDA подходит для 6 применениеs: SOHO/SMB Router and Integrated Access Device, 802.11n Wi-Fi Gateway, xDSL Residential Gateway, Small-Form-Factor Ethernet Switch, Network-Attached Storage (NAS), Industrial Ethernet Controller / IoT Gateway.
SOHO/SMB Router and Integrated Access Device
The MPC8314CVRAGDA is purpose-fit for SOHO and SMB routers and integrated access devices. Its 400 MHz e300c3 core, dual Gigabit Ethernet MACs with QoS acceleration, and DDR2 controller provide sufficient headroom to run embedded routing stacks at gigabit line rate. The integrated PCI v2.3 bus can host a downstream 802.11n WLAN ASIC, while the USB 2.0 OTG port enables 3G/4G modem failover. The wide -40C to +105C temperature range and the absence of an internal fan requirement make this part ideal for fanless plastic chassis.
Рекомендуется
802.11n Wi-Fi Gateway
The MPC8314CVRAGDA suits 802.11n Wi-Fi gateway designs where a single SoC must terminate the WAN interface, run the routing/switching stack, and provide a high-speed host bus for the Wi-Fi media-access ASIC. Its 32-bit DDR2 controller sustains gigabit-class throughput with QoS buffers, and the integrated PCI bus can drive an 802.11n card at line rate. Unlike multi-chip IC platforms (2-chip router designs), this single-chip integration reduces PCB area and BOM cost.
Рекомендуется
xDSL Residential Gateway
For xDSL residential gateway designs (ADSL2+/VDSL2), the MPC8314CVRAGDA provides enough CPU headroom to terminate PPPoE, run QoS queues, and bridge Ethernet to the DSL front-end. Its TDM interface supports voice-over-DSL (VoDSL) and the DDR2 controller handles large NAT tables. The USB 2.0 OTG enables file/printer sharing via external storage, and the industrial temperature grade supports outdoor cabinet mounting. Power dissipation at 400 MHz stays within the 620-HBGA's thermal envelope using a small heat spreader.
Рекомендуется
Small-Form-Factor Ethernet Switch
The MPC8314CVRAGDA can act as the management/controller CPU in small-form-factor 8/24-port Ethernet switches. The PCI v2.3 interface attaches to an external managed switch ASIC, while the dual Gigabit Ethernet MACs handle uplink and CPU port. The DDR2 controller buffers management tables, and the USB 2.0 enables CLI/console access. For stackable switches, the serial TDM and PCI bus provide expansion paths. The 90 nm process and industrial temperature range suit fanless 1U chassis.
Рекомендуется
Network-Attached Storage (NAS)
For entry-level 2-bay or 4-bay NAS designs, the MPC8314CVRAGDA provides enough compute for SMB/CIFS/NFS file serving at gigabit speeds. The PCI bus hosts a SATA host controller, while the dual Gigabit Ethernet supports LACP link aggregation. The DDR2 controller handles filesystem caching, and the USB 2.0 enables UPS monitoring. Unlike dedicated NAS SoCs, this part allows custom storage stacks but at the cost of higher power and BOM than a single-chip NAS solution.
Рекомендуется
Industrial Ethernet Controller / IoT Gateway
The MPC8314CVRAGDA fits industrial Ethernet controller and IoT gateway designs where -40C to +105C operation is required and long product lifecycles matter. Its PCI bus can host industrial protocol ASICs (PROFINET, EtherCAT, Modbus TCP), while the TDM interface supports legacy serial fieldbus. The DDR2 controller buffers time-sensitive industrial traffic, and the industrial temperature grade ensures operation in cabinet and outdoor environments. For greenfield designs, the LS1012A is recommended, but for maintaining legacy industrial platforms, this part remains a valid choice.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MPC8314CVRAGDA — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MPC8314EVRAGDA | MPC8343CVRAGDA | MPC8313CVRAGDA | MPC8323EVRAGDA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 620-HBGA (29x29) | 620-HBGA (29x29) - same | 620-HBGA (29x29) - same | 620-HBGA (29x29) - same | 620-HBGA (29x29) - same |
| Core | PowerPC e300c3, 400 MHz | PowerPC e300c3, 400 MHz | PowerPC e300c3, higher speed grade | PowerPC e300c3, lower speed grade | PowerPC e300c2, lower power |
| Encryption Engine | None (C-variant) | SEC 2.0 IPsec/SSL | None (C-variant) | None (C-variant) | SEC 2.0 |
| Memory Controller | DDR1/DDR2, 32-bit | DDR1/DDR2, 32-bit - same | DDR1/DDR2, 32-bit - same family | DDR1/DDR2, 32-bit - same | DDR1/DDR2, 32-bit - same |
| Ethernet | 2x 10/100/1000 Mbps | 2x 10/100/1000 Mbps - same | 2x 10/100/1000 Mbps - same | 2x 10/100/1000 Mbps - same | 2x 10/100/1000 Mbps - same |
| USB | USB 2.0 (Host/Device/OTG) | USB 2.0 - same | USB 2.0 - same | USB 2.0 - same | USB 2.0 - same |
| Operating Temperature | -40C to +105C | -40C to +105C - same | -40C to +105C - same | -40C to +105C - same | -40C to +105C - same |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Ключевые отличия
- Non-encrypt variant at lower BOM cost (против MPC8314EVRAGDA)
- Lower-frequency tier within the same family (против MPC8343CVRAGDA)
- Industrial temperature range and long product lifecycle (против MPC8323EVRAGDA)
Заметки по проектированию
Estimated: At 400 MHz core clock with 1.0 V core supply, typical core power is around 1.0-1.2 W. The 620-HBGA package has limited thermal mass; designers should use a 4-layer PCB with at least 1 oz copper on the BGA break-out layer, plus thermal vias under the central ball grid. For enclosed chassis without airflow, attach a small 15x15 mm aluminum heat spreader with thermal interface material. Reference the NXP AN3361 application note for HCTE-BGA thermal management.
Use microstrip or stripline routing with 50 ohm controlled impedance for DDR2 signals. Reference NXP AN3665 (DDR2 design guidelines for PowerQUICC II Pro) for trace length matching. The 1.0 mm BGA pitch allows via-in-pad or dog-bone fanout; via-in-pad with filled-and-capped vias is preferred to minimize stub effects on DDR2 signals at 400 MHz DDR clock. Maintain continuous reference plane under the entire BGA footprint to control impedance discontinuities.
Power sequencing must follow NXP MPC8314E hardware specification: 3.3 V I/O first, then 1.0 V core, then 1.5/1.8 V DDR2 reference. Use a power management IC with programmable ramp rates to avoid simultaneous rise of multiple rails. Each rail should have its own bulk decoupling capacitor (>=22 uF) plus high-frequency ceramics (100 nF + 10 nF) within 5 mm of the supply balls. The DDR2 VTT termination voltage must be enabled after DDR2 rail is stable.
Do not assume software compatibility between MPC8314C and MPC8314E variants - the C-variant lacks SEC registers and any crypto code must be conditionally compiled out. Reset configuration word (RCW) values differ between MPC8314 and MPC8313, so a board designed for one will not boot on the other without RCW rework. The JTAG pinout is shared across the 620-PBGA family but the boundary scan chain ID differs - update your BSDL file when swapping variants.
Информация о соответствии
RoHS and REACH compliant per NXP product page. AEC-Q100 is not applicable (this is an industrial/commercial communications processor, not an automotive-grade part). Lead-free reflow profile per JEDEC J-STD-020 MSL 3. Halogen-free status not explicitly published in retrieved data.
