MPC8343CVRAGDB - PowerQUICC II Pro 400MHz SoC | NXP
Артикул: MPC8343CVRAGDB ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $125.96 | $125,96 |
| 10 | $118.5 | $1.185,00 |
| 100 | $102.75 | $10.275,00 |
| 500 | $88.2 | $44.100,00 |
| 1.000 | $79.4 | $79.400,00 |
MPC8343CVRAGDB Обзор
What is a PowerQUICC II Pro integrated communications processor? It is a system-on-chip (SoC) that integrates a Power Architecture CPU core with peripheral and communication controllers traditionally found on separate chips in networking and embedded designs. In the power-IC hierarchy, it sits at the level of a microprocessor with integrated memory and I/O controllers, one tier above discrete MPU + companion-chip designs, simplifying BOM and reducing board area in routers, switches, and industrial gateways.
Key features of the MPC8343CVRAGDB include the e300 core running at 400 MHz, a DDR1/DDR2 memory controller, dual 10/100/1000 Ethernet (GigE) MACs, a Hi-Speed USB 2.0 controller, dual PCI interfaces, and an integrated security engine. It is sold with the industrial-grade temperature range of -40 °C to +105 °C, comes from silicon revision 2.1, and ships in lead-free 620-HBGA packaging, suitable for long-lifecycle industrial and networking equipment.
The architecture combines an enhanced e300 processor core (built on Power Architecture technology) with a flexible system interface unit that arbitrates among DDR memory, PCI, local bus, and the communication peripherals. The integrated security block accelerates DES, 3DES, AES, IPSec, and SSL/TLS operations, offloading packet processing from the core and enabling line-rate VPN throughput in mid-range routers and security appliances.
Typical applications include wired and SOHO routers, industrial control gateways, networked storage, secure VPN/IPSec appliances, and PCI-based add-in cards for embedded computing. The dual-GigE plus dual-PCI combination maps directly to small form-factor line cards and customer-premises equipment (CPE) where board real estate is constrained.
When designing with the MPC8343CVRAGDB, allocate at least four PCB layers for the high-speed DDR2 memory interface and follow NXP AN3369 power-on and JTAG layout guidelines. Pay special attention to the e300 core's branch prediction and MMU configuration when porting legacy PowerQUICC I/II firmware; the II Pro core adds Book E enhancements that affect exception handling on existing software bases.
This page synthesizes authorized-distributor stock data, drop-in replacement options for end-of-life units, lifecycle status, and parameter-level comparison against siblings in the PowerQUICC II Pro family - information not consolidated in a single place on the NXP product page.
Аналоги без доработки для MPC8343CVRAGDB — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MPC8343CVRAGDB (тот же форм-фактор и посадочное место) — отличается по Ethernet, Memory Controller, USB, Operating Temperature, Package.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MPC8343CVRAGD
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8343VVAGDB
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8343EECVRAGDB
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8343CVRAGDB Максимальные параметры и электрические характеристики
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC II Pro |
| Part Family | MPC8343EA |
| Core Processor | PowerPC e300 |
| Core Architecture | Power Architecture (Book E enhancements) |
| Number of Cores | 1 |
| Разрядность шины данных | 32-bit |
| Максимальная тактовая частота | 400 MHz |
| Напряжение питания | 1.2 V core / 1.8 V / 2.5 V / 3.3 V I/O |
| Диапазон рабочих температур | -40 °C to +105 °C |
| Package Type | 620-HBGA (Hi-TCE, 29 mm × 29 mm, 1 mm pitch) |
| Тип монтажа | Surface Mount |
| Lead-Free / RoHS | Yes / Compliant |
| Memory Controller | DDR1 / DDR2 |
| Ethernet | Dual 10/100/1000 (GigE) |
| PCI | Dual PCI (PCI 2.3) |
| USB | Hi-Speed USB 2.0 |
| Security Accelerator | DES / 3DES / AES / IPSec / SSL/TLS |
| Silicon Revision | Rev 2.1 |
Руководство по цоколевке MPC8343CVRAGDB в корпусе 620-hbga (hi-tce, 29 mm × 29 mm, 1 mm pitch)
Цоколевка для MPC8343CVRAGDB (корпус 620-hbga (hi-tce, 29 mm × 29 mm, 1 mm pitch)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для MPC8343CVRAGDB.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MPC8343CVRAGDB подходит для 6 применениеs: Small / Medium Business Routers, Industrial Control Gateways, Network-Attached Storage (NAS) Controllers, Secure VPN / IPSec Appliances, PCI-Based Add-In Cards for Embedded Systems, Printers and Imaging Controllers.
Small / Medium Business Routers
The MPC8343CVRAGDB fits SOHO and branch-office routers because its dual 10/100/1000 Ethernet MACs terminate WAN and LAN ports directly, while the integrated DDR1/DDR2 controller removes the need for a companion Northbridge. At 400 MHz the e300 core sustains wire-speed NAT and ACL filtering on 1 Gbps uplinks, and the security engine accelerates IPSec VPN tunnels without offloading bulk routing. Power consumption remains manageable in fanless enclosures thanks to the 130 nm process node and the Hi-TCE HBGA thermal package, which accepts a clip-on heat sink. Compared with newer QorIQ parts the MPC8343CVRAGDB still wins in long-lifecycle SMB routers where a mature Linux BSP and stable silicon revision 2.1 matter more than raw throughput.
Рекомендуется
Industrial Control Gateways
Industrial gateways running Modbus/TCP, EtherNet/IP, or PROFINET over an M2M backhaul benefit from the MPC8343CVRAGDB's -40 °C to +105 °C industrial temperature window and its dual PCI interfaces for expansion cards. The 32-bit e300 core at 400 MHz runs a hardened Linux/RTOS that manages protocol translation without saturating CPU cycles, and the integrated USB 2.0 controller connects to Wi-Fi or cellular modems for redundant uplinks. The Hi-TCE HBGA package makes convection-cooled enclosure layouts feasible in factory cabinets where moving air is undesirable. The DDR2 controller supports up to 1 GB of ECC memory for buffer-intensive aggregators, matching the lifecycle expectations of 10-year industrial deployments.
Рекомендуется
Network-Attached Storage (NAS) Controllers
The MPC8343CVRAGDB sits at the heart of entry-level NAS controllers because its PCI bus attaches directly to SATA or RAID HBAs while the dual GigE links serve SMB and iSCSI traffic. The e300 core's MMU accelerates large-file streaming, and the 400 MHz cycle rate is enough to drive 100 MB/s+ sequential throughput on RAID-5 arrays without an offload engine. The 620-HBGA package and the DDR2 controller match the cost profile of SOHO/SMB NAS boards where bill-of-materials pressure is constant. Power-rail sequencing across the 1.2 V/1.8 V/2.5 V/3.3 V supplies is documented in the NXP hardware specifications, easing the transition from prototype to mass production.
Рекомендуется
Secure VPN / IPSec Appliances
For branch-office VPN concentrators, the MPC8343CVRAGDB's encryption engine accelerates AES, 3DES, and SHA-1 in hardware, sustaining line-rate IPSec on 200-300 Mbps aggregated tunnels when paired with the e300 core. The dual PCI slots host additional crypto accelerator cards when 1 Gbps aggregate is required, and the USB 2.0 host supports secure-token authentication. Despite EOL status the silicon revision 2.1 of this part remains validated against major VPN stacks such as OpenSSL and strongSwan, accelerating firmware porting. Industrial temperature bin and the long 10-year supply window through Rochester Electronics keep it viable in security infrastructure.
Рекомендуется
PCI-Based Add-In Cards for Embedded Systems
The MPC8343CVRAGDB's dual PCI 2.3 interfaces enable it to act as a co-processor card in legacy VME and CompactPCI systems, providing modern DDR2 memory and GigE connectivity on the PCI backplane. The 400 MHz e300 host runs RTEMS, VxWorks, or embedded Linux offloads, while the integrated security engine handles VPN termination for the host board. Industrial-temperature operation permits card cages in unconditioned outdoor cabinets such as railway or roadside cabinets. The chip-exposed HBGA top side exposes the silicon to a clip-on heat sink, allowing dense multi-card chassis to dissipate the 3 W typical power draw without airflow.
Рекомендуется
Printers and Imaging Controllers
Workgroup printers and multi-function imaging devices use the MPC8343CVRAGDB to manage the print engine, the scan pipeline, and the network interface in a single SoC. The dual PCI slots accept dedicated image-processing DSPs, while the dual GigE ports connect to office networks and the optional USB 2.0 serves as a device port for direct-attached scanning. The 400 MHz e300 plus 1 GB DDR2 memory is sufficient for 50 pages-per-minute duplex pipelines without external compression. Industrial-temperature grading makes the part suitable for the warm operating environments inside large-format plotters and copier enclosures.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MPC8343CVRAGDB — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MPC8343CVRAGD | MPC8343VVAGDB | MPC8343EECVRAGDB |
|---|---|---|---|---|
| Package | 620-HBGA (29x29, 1 mm pitch) | 620-HBGA (29x29, 1 mm pitch) - same | 620-HBGA (29x29, 1 mm pitch) - same | 620-HBGA (29x29, 1 mm pitch) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Maximum CPU Clock | 400 MHz | 400 MHz | 333 MHz | 400 MHz |
| Operating Temperature | -40 °C to +105 °C (industrial) | 0 °C to +70 °C (commercial) | -40 °C to +105 °C (industrial) | -40 °C to +105 °C (industrial) |
| Memory Controller | DDR1 / DDR2 | DDR1 / DDR2 | DDR1 / DDR2 | DDR1 / DDR2 |
| Gigabit Ethernet MACs | 2 | 2 | 2 | 2 |
| PCI Interfaces | Dual PCI 2.3 | Dual PCI 2.3 | Dual PCI 2.3 | Dual PCI 2.3 |
| Encryption Accelerator | Optional | Optional | Optional | Enabled (DES/3DES/AES/IPSec) |
| Hi-Speed USB 2.0 | Yes | Yes | Yes | Yes |
Ключевые отличия
- Encryption-accelerator enabled at same speed grade (против MPC8343EECVRAGDB)
- Full industrial temperature bin (против MPC8343CVRAGD)
- Highest 400 MHz core speed in the family (против MPC8343VVAGDB)
Заметки по проектированию
The 620-HBGA Hi-TCE package exposes the die top side for direct heat-sink attachment. At 400 MHz the e300 core dissipates approximately 3 W typical, and at elevated junction temperatures the silicon relies on a thermal interface material (TIM) plus clip-on heat sink. Populate a TIM-pad footprint even if the heat sink is omitted during bench characterization, because final assembly typically upgrades thermal coupling for production. Estimated: typical power 3 W, TDP ~5 W at +105 °C.
Allocate a minimum 4-layer (preferably 6-layer) stack-up for the MPC8343CVRAGDB. The DDR2 interface requires matched-length routing to within ±25 ps, and the 1 mm-pitch BGA escape needs microvia or sequential-lamination stack-up to fan out cleanly. Follow NXP application note AN3369 for power-rail sequencing and SerDes layout. Keep analog PLL bypass loops short and isolated from switcher noise.
A common integration pitfall is using commercial-grade firmware BSPs that assume the full -40 to +105 °C window without re-running timing closure at hot corners. Always re-validate DDR2 read/write margins over the industrial-temperature window because DRAM timing derates directly affect error-free operation. Also confirm that dual PCI mode is selected by POR (power-on reset) configuration rather than jumpered later; mixing PCI modes after boot causes bus contention.
Информация о соответствии
Lead-free Hi-TCE HBGA per Verified Electronics listing. AEC-Q100 does not apply - this is an industrial MPU, not an automotive-grade component. RoHS and conflict-minerals status confirmed by distributor listings as of 2026-10-17.
