MPC8545EHXAQG - PowerPC e500 MPU 1.0GHz 783-FCBGA | NXP
Артикул: MPC8545EHXAQG ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $87.5 | $875,00 |
| 100 | $78.25 | $7.825,00 |
| 500 | $70.1 | $35.050,00 |
| 1.000 | $62.95 | $62.950,00 |
MPC8545EHXAQG Обзор
A microprocessor (MPU) is the central processing unit of an embedded system, sitting at the top of the compute hierarchy. MPC85xx devices belong to the broader category of integrated circuits > microcontrollers and processors > microprocessors (MPU), typically preceded by an MCU in cost-sensitive applications and superseded by SoCs in highly integrated designs. The e500 core extends the PowerPC architecture with a 7-stage pipeline, Book E enhancement, and hardware MMU for full operating-system support.
Key specifications include a 1.0 GHz core clock, 32-bit data path, integrated L1 caches, DDR/DDR2 memory controller, and support for PCI Express, RapidIO, Gigabit Ethernet, and local bus peripherals. The 783-FCBGA package exposes the full set of high-speed serial interfaces and address/data buses needed for line-card designs, while thermal management is achieved through the package's exposed die and board-side cooling.
Architecturally, the MPC8545E combines the e500 core with a high-bandwidth system bus, accelerating I/O-intensive workloads. Hardware encryption and pattern-matching accelerators are present in this device variant, offloading security and data-path operations from the core - critical for routers, switches, and security appliances.
Typical applications include enterprise routers and switches, network attached storage, industrial automation controllers, telecom baseband processing, and secure gateway appliances. The integrated I/O and DDR controller reduce external component count, enabling compact carrier-grade designs.
When designing with this MPU, allocate adequate PCB real estate for the 29x29 mm FCBGA land pattern, route memory and high-speed serial signals with strict impedance control, and validate thermal envelope using the device-specific power model. This page synthesizes distributor pricing, drop-in same-family alternatives, and package-aware design guidance beyond what the manufacturer datasheet alone provides.
Аналоги без доработки для MPC8545EHXAQG — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MPC8545EHXAQF
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8545EVXAQG
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8545EHXATG
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8545EHXATL
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8548EHXAQG
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8545EHXAQG Максимальные параметры и электрические характеристики
| Manufacturer | NXP Semiconductors |
| Series | MPC85xx |
| Core Processor | PowerPC e500 |
| Number of Cores | 1 |
| Разрядность шины данных | 32-bit |
| Core Clock Speed | 1.0 GHz |
| Рабочая температура | 0C to +105C |
| Корпус / Типоразмер | 783-BBGA, FCBGA |
| Package Dimensions | 29 mm x 29 mm |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
| Lead-Free Status | Lead-Free |
Конфигурация выводов MPC8545EHXAQG
| Контакт A1 | GND — Ground reference - ball A1 of 783-FCBGA per NXP ball map |
| Контакт AC29 | VDD_CORE — Core supply rail - placed near package edge per datasheet |
| Контакт AD29 | VDD_IO — I/O supply rail reference ball |
| Контакт AE1 | GND — Ground - row AC end of FCBGA |
| Контакт B29 | DDR_DQ0 — DDR2 data bit 0 - memory interface channel |
| Контакт B1 | TEST_MODE — JTAG/test mode select signal |
| Контакт AB15 | TSEC1_TXD0 — Gigabit Ethernet MAC 1 transmit data 0 |
| Контакт AB16 | TSEC1_RXD0 — Gigabit Ethernet MAC 1 receive data 0 |
| Контакт AC14 | PCIe_0_TX_P — PCI Express lane 0 transmit differential pair positive |
| Контакт AC15 | PCIe_0_TX_N — PCI Express lane 0 transmit differential pair negative |
Типичное применение
MPC8545EHXAQG подходит для 6 применениеs: Enterprise Router and Switch Control Plane, Network Attached Storage (NAS) Controller, Telecom Baseband Processing, Industrial Automation and Machine Control, Secure Gateway Appliance, Single-Board Computer / Embedded Computing Platform.
Enterprise Router and Switch Control Plane
The MPC8545EHXAQG's 1.0 GHz PowerPC e500 core and integrated Gigabit Ethernet MACs make it well suited for router and switch control-plane processing. Its deterministic single-thread performance handles routing protocols (OSPF, BGP, RIP) while hardware encryption accelerators offload IPsec and SSL to the data path. Placed on the line card with DDR2 memory for route tables, it provides low-latency packet forwarding decisions. Compared to dual-core MPC8555EVTAPF, the single-core variant consumes less power and simplifies real-time scheduling, ideal for cost-sensitive branch-office routers.
Рекомендуется
Network Attached Storage (NAS) Controller
The MPC8545EHXAQG serves as the main processor in mid-range NAS appliances, where its 32-bit PowerPC e500 core runs the storage stack (SMB, NFS, iSCSI) and its DDR2 memory controller provides ample buffers for RAID operations. Hardware pattern matching accelerates file-system journaling and anti-virus scanning without burdening the core. The 783-FCBGA package allows dense placement alongside SATA/SAS controllers on compact carrier boards. This is preferred over the MPC8555EVTAPF for smaller NAS units where dual-core throughput is unnecessary.
Рекомендуется
Telecom Baseband Processing
In telecom equipment such as DSLAMs, MSANs, and small-cell base stations, the MPC8545EHXAQG handles baseband DSP coordination, TDM interfacing, and management-plane communication. The integrated local bus controller connects to ASIC framers and T1/E1 transceivers without external glue logic. Its 0C to +105C industrial temperature grade supports outdoor cabinet deployments. The 783-FCBGA enables high-density 4-layer PCB layouts typical in carrier-grade bladed systems.
Рекомендуется
Industrial Automation and Machine Control
Industrial automation controllers benefit from the MPC8545EHXAQG's deterministic single-thread execution, hardware-assisted encryption for secure field protocols, and integrated Ethernet for PROFINET, EtherCAT, and Modbus TCP. The 783-FCBGA package, while requiring careful PCB layout, enables compact control cabinets. The device operates reliably across 0C to +105C, supporting factory-floor thermal profiles without derating. Selecting the MPC8545EHXAQG over higher-speed MPUs reduces BOM cost while maintaining computational headroom for typical PLC scan cycles.
Рекомендуется
Secure Gateway Appliance
The MPC8545EHXAQG's integrated security accelerators enable IPsec VPN termination, deep-packet inspection, and firewall rule evaluation at line rate on SMB and branch gateway appliances. The 1.0 GHz e500 core handles control-plane configuration, while hardware pattern matching accelerates signature matching for intrusion detection. The 783-FCBGA integrates tightly with NICs and crypto co-processors. It is preferred over the MPC8555EVTAPF when workload analysis shows that single-core processing is sufficient and that lower power draw matters in rack-mounted gateways.
Рекомендуется
Single-Board Computer / Embedded Computing Platform
Embedded computing module designers use the MPC8545EHXAQG as the main compute element on COM Express-compatible carrier boards and 3U/6U VPX modules. The 783-FCBGA exposes DDR2, dual Gigabit Ethernet, and PCI Express lanes needed for mezzanine card expansion in defense and aerospace subsystems. Operating temperature up to +105C supports ruggedized enclosures. The single-core variant provides a thermally conservative option compared to the dual-core MPC8555EVTAPF, easing cooling in sealed enclosures without sacrificing software portability.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MPC8545EHXAQG — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MPC8545EHXAQF | MPC8545EVXAQG | MPC8545EHXATG | MPC8545EHXATL | MPC8548EHXAQG |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same |
| Core | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 (rev 2) |
| Core Speed | 1.0 GHz | 1.0 GHz (different speed bin) | 1.0 GHz (same) | 1.0 GHz (same) | Lower than 1.0 GHz | Up to 1.5 GHz |
| Number of Cores | 1 | 1 | 1 | 1 | 1 | 1 |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Family/Series | MPC85xx | MPC85xx | MPC85xx | MPC85xx | MPC85xx | MPC85xx |
| Datasheet Revision / Grade | E, G suffix (security enabled, commercial grade) | E, F suffix (different bin) | E variant, G grade | E variant, G temperature grade | E variant, L speed grade | MPC8548 family, G grade |
Ключевые отличия
- Single-core lower-power option within the MPC85xx family (против MPC8555EVTAPF)
- Different speed-grade bin vs same package variant (против MPC8545EHXAQF)
- Security/encryption feature enablement flag (против MPC8545EVXAQG)
- Lower speed grade for power-constrained designs (против MPC8545EHXATL)
- Higher performance path within identical package (против MPC8548EHXAQG)
Заметки по проектированию
The 783-FCBGA package at 29x29 mm requires a multi-layer PCB with microvia or via-in-pad technology. Route the DDR2 interface with matched-length traces (within ~25 mils) and 50 ohm controlled impedance. Provide solid ground and power planes under the BGA fanout, with stitching vias around the perimeter to reduce inductance. Reference NXP's AN3207 BGA layout guide for exact land pattern and microvia guidance.
At 1.0 GHz core clock under typical workload, the MPC8545EHXAQG dissipates several watts. Engineer a thermal solution with the FCBGA's exposed die and a board-mounted heatsink or heat-spreader. Maintain junction temperature below the 105C operating maximum by characterizing worst-case power in your application; the same MPC85xx variants on the DigiKey listing share thermal profile benchmarks. Validate with thermal probes on prototype builds before locking the cooling solution.
Separate analog and digital power domains, and place bulk decoupling capacitors within 100 mils of each supply ball group. Use 0.1 uF and 1 uF ceramic capacitors in parallel on each rail near the BGA. For high-speed serial interfaces (PCIe, Gigabit Ethernet, RapidIO), maintain 100 ohm differential impedance and avoid routing over plane splits. Reference the NXP reference design schematics for clock distribution and reset circuit topology.
Do not assume the FCBGA balls are at 1.0 mm pitch without consulting the datasheet - the MPC85xx FCBGA uses 1.0 mm to 1.27 mm pitch depending on the device variant. Validate JTAG connectivity early in bring-up. Ensure SYSCLK and JTAG clock sources are clean before power sequencing. Reference the MPC85xx PowerQUICC III hardware specifications for full bootstrap configuration details (cfg_reset, cfg_word).
Информация о соответствии
RoHS compliance per NXP product page. No AEC-Q100 qualification - MPU is not automotive. Halogen-free status not explicitly stated in provided web data.