MPC8548PXAQGD - PowerQUICC III e500 SoC 1GHz, 783-FCBGA | NXP
Артикул: MPC8548PXAQGD ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $171 | $171.000,00 |
MPC8548PXAQGD Обзор
A communications SoC (System-on-Chip) is an integrated circuit that combines a processor core, memory controller, and multiple I/O subsystems on a single silicon die. The MPC8548 belongs to the PowerQUICC III family of communications processors, which itself is part of the broader Power Architecture embedded microprocessor hierarchy. PowerQUICC III devices target telecom, networking, and storage equipment, and they descend from NXP/Freescale's classic PowerQUICC architecture (originally derived from the Motorola 68K-based QUICC, then MPC8xx PowerQUICC, then PowerQUICC II, then PowerQUICC III). This category hierarchy - communications SoC -> embedded MPU -> microprocessor -> integrated circuit - clarifies the part's place in modern embedded design.
Key features include the e500 core with Book E instruction set, hardware MMU, and a high-bandwidth on-chip fabric; an integrated DDR2 SDRAM controller with 64-bit data path and ECC; dual 10/100/1000 Ethernet MACs with SGMII and TBI interfaces; three PCI/PCI-X controllers (one PCI-X 64-bit/133MHz plus two PCI 32-bit/66MHz); two PCI Express interfaces (x1/x2/x4 widths); one Serial RapidIO port; and a flexible Local Bus controller supporting NAND/NOR flash and SRAM. The integrated security engine and DMA controllers further enable high-throughput packet processing.
The architecture separates data-plane acceleration from the host processor through dedicated DMA channels and queue management, allowing the e500 core to focus on control-plane and exception handling. The DDR2 controller with ECC supports up to 2 GB of registered DIMMs, which is critical for high-availability networking designs requiring memory error correction.
Typical applications include router line cards, multi-service switching platforms, base-station controllers, storage area network (SAN) bridges, and industrial control planes requiring deterministic real-time response. The wide I/O mix - GbE + PCIe + SRIO + PCI-X - allows the same silicon to land on converged carrier-grade platforms, military/aerospace embedded switches, and medical imaging backplanes.
When designing with this device, pay close attention to power sequencing: the MPC8548 requires a specific core/serdes voltage ramp order and proper decoupling on all VDD rails. Reference the hardware specification document for the exact sequencing and the recommended 4-layer PCB stack-up. The 783-ball FCBGA requires a 1.0 mm pitch land pattern with microvia technology for the inner rows.
This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes that go beyond the manufacturer datasheet - including lifecycle context and pin-compatibility analysis across the PQ38 family.
Аналоги без доработки для MPC8548PXAQGD — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MPC8548PXAQGD (тот же форм-фактор и посадочное место) — отличается по Ethernet, Package, RoHS Status, Mounting Type, Core Architecture.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MPC8548PXAULB
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
MPC8548PXAUJB
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$121.75 / шт.
Открыть даташит →MPC8548PXAQUD
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
MPC8548PXAQGD Максимальные параметры и электрические характеристики
| Product Type | PowerQUICC III Communications SoC / Microprocessor |
| Series / Family | PowerQUICC III (PQ38) |
| Core Architecture | Power Architecture e500 (Book E) |
| Core Count | 1 |
| Разрядность шины данных | 32-bit |
| Maximum Core Frequency | 1000 MHz (1.0 GHz) |
| Silicon Revision | R3.0 |
| L1 Cache | 32 KB instruction / 32 KB data |
| L2 Cache | 256 KB integrated |
| Memory Controller | DDR2 SDRAM with ECC, up to 2 GB |
| Ethernet | Dual 10/100/1000 Mbps MACs (SGMII / TBI) |
| PCI / PCI-X | 1x PCI-X 64-bit/133 MHz + 2x PCI 32-bit/66 MHz |
| PCI Express | 2x PCIe interfaces (x1/x2/x4) |
| Serial RapidIO | 1x SRIO port |
| Корпус | 783-ball FCBGA, 1.0 mm pitch (Pb-free) |
| Рабочая температура | 0C to +105C (industrial extended) |
| Тип монтажа | Surface Mount (BGA) |
| Статус RoHS | Compliant (Pb-free package suffix GD) |
Руководство по цоколевке MPC8548PXAQGD в корпусе 783-ball fcbga, 1.0 mm pitch (pb-free)
Цоколевка для MPC8548PXAQGD (корпус 783-ball fcbga, 1.0 mm pitch (pb-free)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для MPC8548PXAQGD.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MPC8548PXAQGD подходит для 6 применениеs: Router Line-Card / Control-Plane Processor, Multi-Service Switching Platforms, Base Station Controller / Radio Network Processor, Storage Area Network (SAN) Bridge / iSCSI Gateway, Industrial Control / Substation Automation, Military / Aerospace Embedded Switch.
Router Line-Card / Control-Plane Processor
The MPC8548PXAQGD is purpose-built for routing line cards that require deterministic control-plane performance. Its 1000 MHz e500 core handles routing-table updates, OSPF/BGP calculations, and exception packets, while the integrated dual GbE MACs terminate line-side traffic and the PCIe/SRIO ports uplink to a central fabric ASIC. The DDR2 controller with ECC supports up to 2 GB of route-table memory with single-bit error correction, which is mandatory for carrier-grade MTBF targets. Compared to a host-CPU + co-processor design, the MPC8548's peripheral integration reduces board area by roughly 40% and BOM cost by an estimated 25%, while keeping latency under 50 microseconds for forwarding-table lookups in typical edge-router workloads.
Рекомендуется
Multi-Service Switching Platforms
Carrier-grade multi-service switches require simultaneous Ethernet, TDM, and packet processing. The MPC8548PXAQGD's mix of dual GbE, three PCI/PCI-X controllers, and SRIO makes it ideal as a service-aware control processor that classifies traffic, applies QoS policies, and bridges between legacy TDM buses (via PCI-X-attapsed framer ASICs) and modern packet fabrics. Its 783-FCBGA package supports the industrial 0C to +105C range required for NEBS-compliant telecom chassis. Estimated throughput at 1 GHz is sufficient for OC-12 line rates with full deep-packet-inspection overhead, while the hardware ECC on the DDR2 controller prevents silent memory corruption that would otherwise cause extended outages in tier-1 carrier deployments.
Рекомендуется
Base Station Controller / Radio Network Processor
In 3G/4G base-station controller cards, the MPC8548PXAQGD handles Layer-2/Layer-3 processing, encryption, and timing-critical MAC scheduling for multiple sectors. Its hardware AES engine offloads encryption from the e500 core, freeing cycles for radio-resource management, while the Serial RapidIO port connects to baseband DSPs (such as NXP's MSC81xx family) at deterministic low latency. The wide I/O fabric - GbE for backhaul, PCIe for CPRI to RRH links, and PCI-X for legacy baseband modules - allows a single MPC8548 to act as the supervisor for an entire sector group, reducing the controller-card count in the BTS chassis.
Рекомендуется
Storage Area Network (SAN) Bridge / iSCSI Gateway
The MPC8548PXAQGD's combination of dual Gigabit Ethernet, PCI-X for legacy Fibre Channel cards, and PCI Express for modern SAS/SATA controllers makes it a strong fit for iSCSI-to-Fibre-Channel bridge cards and SAN gateway appliances. Its 1 GHz core can sustain TOE (TCP Offload Engine) workloads at line rate on GbE ports, and the hardware ECC on DDR2 is essential for the write-back cache that must survive power glitches in RAID arrays. Estimated sustained iSCSI throughput exceeds 900 Mbps per port when running typical 8 KB I/O blocks, sufficient for mid-range enterprise SAN edge deployments.
Рекомендуется
Industrial Control / Substation Automation
Industrial automation backbones - IEC 61850 substation controllers, factory automation PLCs, and ruggedized Ethernet switches - benefit from the MPC8548PXAQGD's extended 0C to +105C temperature range and its deterministic GbE and PCI-X latency. The integrated memory ECC plus the wide peripheral mix allow one MPC8548 to handle both real-time deterministic traffic (via PCI-X-attapsed FPGA coprocessors) and best-effort traffic (via GbE). The 783-FCBGA package, while complex to lay out, provides the ruggedness and thermal headroom needed for industrial environments with high ambient temperature swings, vibration, and long product lifecycle requirements.
Рекомендуется
Military / Aerospace Embedded Switch
The MPC8548PXAQGD's wide I/O mix - dual GbE, two PCIe, SRIO, and three PCI/PCI-X - is well-suited for ruggedized embedded switching platforms used in military and aerospace vehicles. Its deterministic interrupt latency and hardware ECC meet the reliability requirements of DO-254 / MIL-STD-810 designs when used with appropriate ruggedization and conformal coating. The processor can serve as the supervisor for a chassis that aggregates sensor data via SRIO, manages video and audio routing via PCIe, and presents a Gigabit Ethernet uplink to the vehicle backbone. The 105C junction rating supports sealed avionics enclosures with limited airflow.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MPC8548PXAQGD — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MPC8548PXAULB | MPC8548PXAUJB | MPC8548PXAQUD |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Package | 783-FCBGA (1.0 mm pitch) | 783-FCBGA (1.0 mm pitch) - same | 783-FCBGA (1.0 mm pitch) - same | 783-FCBGA (1.0 mm pitch) - same |
| Core Architecture | Power Architecture e500 | Power Architecture e500 - same | Power Architecture e500 - same | Power Architecture e500 - same |
| Core Frequency | 1000 MHz | 833 MHz (-16.7%) | 667 MHz (-33.3%) | 1000 MHz (same) |
| Silicon Revision | R3.0 | R3.0 family - same | R3.0 family - same | R3.x newer marking |
| Memory Controller | DDR2 with ECC, up to 2 GB | DDR2 with ECC, up to 2 GB - same | DDR2 with ECC, up to 2 GB - same | DDR2 with ECC, up to 2 GB - same |
| Operating Temperature | 0C to +105C | 0C to +105C - same | 0C to +105C - same | 0C to +105C - same |
| Pin-to-Pin Compatible | (reference part) | Yes - drop-in | Yes - drop-in | Yes - drop-in |
Ключевые отличия
- Highest-frequency grade in the PQ38 family (против MPC8548PXAULB (833 MHz))
- Same silicon and footprint as lower-speed grades (против MPC8548PXAUJB (667 MHz))
- DDR2 with hardware ECC vs un-ECC alternatives (против Lower-cost PowerQUICC II (MPC82xx family))
Заметки по проектированию
Estimated: The MPC8548PXAQGD requires multiple supply rails (core VDD, IO VDD, DDR2 VDD, serdes VDDS, PLL VDD, and auxiliary rails) with a strict power-on/power-off sequencing requirement per the NXP hardware specification. Failure to sequence correctly can latch up the device or cause long-term reliability degradation. Use a multi-rail PMIC with programmable delay lines or a discrete RC-sequenced reset controller, and add bulk decoupling of at least 100 uF per rail plus 0.1 uF high-frequency bypass close to each BGA pin pair. Verify sequencing in prototype characterization, since this is a top cause of field returns in PowerQUICC III designs.
Estimated: At 1 GHz core, the MPC8548PXAQGD can dissipate roughly 5-7 W depending on workload and the activity factor of the GbE and PCIe PHYs. The 783-FCBGA has a typical theta_JB of 4 C/W with proper thermal vias in the land pattern, but no integrated heatsink. For NEBS-compliant telecom designs, a 30 x 30 mm aluminum heatsink with thermal interface material is recommended. Place the heatsink after PCB assembly using a clip or epoxy bond, and ensure airflow is at least 200 LFM across the heatsink in NEBS Level 3 conformance testing.
The 783-FCBGA at 1.0 mm pitch requires a 4-layer PCB with HDI (microvia) technology for the inner-row escape. Per NXP's reference design, use 0.5 oz copper on outer layers and 1.0 oz on inner layers, with a stack-up targeting 100 ohm differential impedance for SRIO and PCIe lanes. All 16 microvia-in-pad balls must be filled and plated over (via-in-pad with copper fill is mandatory for BGA reliability). Maintain a continuous ground reference plane under the BGA for return-path integrity, especially under the high-speed serial lanes. Plan for at least 2 x 50 ohm matched-length PCIe pairs and 4 x 50 ohm matched-length SRIO pairs in the BGA breakout region.
Top pitfalls include incorrect power sequencing (always sequence core before IO), missing serdes reference clock termination (use a 100 ohm differential termination as close as possible to the BGA pin pair), and improper DDR2 fly-by routing (the MPC8548 supports it but requires length matching per byte lane within 25 mils). Also avoid routing high-speed signals over the BGA's power-plane splits - return-path discontinuities cause SI issues that are difficult to debug post-layout. Always verify the JTAG chain configuration with the boundary-scan tool before bringing up DDR2, since misconfigured JTAG can mask DDR2 initialization issues.
Информация о соответствии
RoHS and REACH compliance confirmed by NXP product environmental reporting. 'GD' suffix in MPN indicates lead-free package per NXP part decoder. Halogen-free status requires verification in the specific procurement document. AEC-Q100 not applicable - this is a telecom/industrial MPU, not an automotive grade.
