PI7C7300DNAE - 3-Port PCI-to-PCI Bridge | Diodes
Артикул: PI7C7300DNAE ✓ АктивенPI7C7300DNAE Обзор
A PCI-to-PCI bridge is an interface IC that extends a PCI host bus through a transparent bridge while preserving transaction handling across the bus boundary. Within the broader semiconductor hierarchy, it is a specialized bus-interface controller and therefore part of the interface IC category. Its three-port architecture allows multiple PCI resources to be organized behind a shared upstream interface, reducing the need for separate host bridges when system expansion, monitoring, or industrial add-in cards must share a PCI connection.
The PI7C7300DNAE operates with a 3.3 V to 3.6 V core supply and is rated for 660 mA. Its three-port configuration is the principal functional feature for systems that must consolidate more than one downstream PCI connection. The 272-PBGA, 27 mm by 27 mm package provides a high pin count for the address, data, control, arbitration, clock, and power interfaces associated with a multiport bridge. Surface-mount construction supports automated assembly but requires careful escape routing and multilayer PCB planning.
Technically, the device belongs to the conventional PCI interface generation rather than a compactPCI, PCIe, or USB bridge. Conventional PCI systems separate address and data signaling and use dedicated control, arbitration, interrupt, and clock resources. The three-port topology therefore requires validation at the system level to confirm arbitration behavior, interrupt routing, bus ownership, and the electrical loading introduced by every connected card or module.
Typical implementation areas include industrial PCI expansion systems, embedded test equipment, data-acquisition controllers, legacy communication adapters, and PCI carrier systems that need multiple downstream resources. A three-port bridge is especially useful when three downstream bus segments require coordinated operation, but the complete system must remain within the electrical, protocol, and timing limits defined by the manufacturer datasheet.
A critical design consideration is the 272-ball BGA layout. The PCB should use the manufacturer land pattern, controlled escape routing, and uninterrupted reference planes for the many high-speed bus signals. Power and ground distribution should be evaluated for the specified 660 mA operating point, with attention given to simultaneous switching activity, connector loading, thermal performance, and the clock and signal-integrity requirements of the target PCI topology.
This page organizes the PI7C7300DNAE electrical limits, package information, sourcing questions, functional alternatives, and design considerations into one engineering reference. It also distinguishes true pin-compatible replacements from broader PCI-bridge alternatives, helping designers assess whether a candidate can occupy the same 272-ball footprint or merely provides a similar bus-bridging function.
Аналоги без доработки для PI7C7300DNAE — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Для этого товара нет аналогов без доработки.
Запросить аналогиPI7C7300DNAE Максимальные параметры и электрические характеристики
| Product Type | PCI-to-PCI bridge interface IC |
| Number of Ports | 3 ports |
| Рабочее напряжение питания | 3.3 V to 3.6 V |
| Operating Current | 660 mA |
| PCI Interface | Conventional PCI-to-PCI bridge |
| Package Type | 272-ball PBGA |
| Package Designation | PBGA-272 |
| Package Dimensions | 27 mm x 27 mm |
| Тип монтажа | Surface mount |
| Number of Balls | 272 balls |
| Manufacturer | Diodes Incorporated |
| Product Classification | Interface IC |
Руководство по цоколевке PI7C7300DNAE в корпусе 27 mm x 27 mm
Цоколевка для PI7C7300DNAE (корпус 27 mm x 27 mm). Этот силовой прибор имеет выводы затвора, стока и истока. Для неполяризованных корпусов обратитесь к техническому описанию производителя для точной ориентации вывода 1 и деталей посадочного места. Типичные применения включают проектирование источников питания, управление двигателями и коммутацию нагрузки.
Нет подробных данных о распиновке для PI7C7300DNAE.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
PI7C7300DNAE подходит для 6 применениеs: Industrial PCI Expansion, Embedded Test and Measurement, Data-Acquisition Controller, Legacy Communication Adapter, PCI Carrier System, Embedded Interface Backplane.
Industrial PCI Expansion
The PI7C7300DNAE fits industrial PCI expansion systems requiring three coordinated downstream bus resources behind a conventional PCI interface. Its three-port bridge topology reduces the need to distribute several independent host-bridge functions across one system. The device operates from 3.3 V to 3.6 V and is specified at 660 mA, allowing power planning to begin with a defined electrical envelope. Its 272-ball PBGA requires a multilayer board, but provides the pin density needed for address, data, control, clock, interrupt, and arbitration resources. Before layout, validate the manufacturer land pattern, complete timing limits, PCI loading rules, initialization sequence, and thermal performance of the assembled system.
Рекомендуется
Embedded Test and Measurement
The PI7C7300DNAE is suitable for embedded test and measurement equipment that must coordinate multiple conventional PCI resources behind a shared host connection. Three downstream ports can support a controlled arrangement of acquisition, communication, or stimulus modules, subject to the system timing and electrical limits. Its 3.3 V to 3.6 V supply range and 660 mA rating provide clear starting points for rail design. The 272-ball package supports the many signals associated with a multiport PCI bridge but demands precise escape routing, controlled-impedance construction, and effective ground-plane continuity. Confirm the complete pin assignments, clock requirements, reset behavior, and bus ownership rules from the manufacturer datasheet before releasing the PCB.
Рекомендуется
Data-Acquisition Controller
The PI7C7300DNAE can support a data-acquisition controller in which several conventional PCI modules share a host-bus connection. The three-port structure provides a basis for separating instrumentation or communication resources while retaining one upstream PCI interface. Its specified 660 mA operating point and 3.3 V to 3.6 V supply range must be reconciled with downstream card loading, connector requirements, and the controller's complete power budget. Because the device uses a 272-ball PBGA, the layout should include short escape routes, continuous reference planes, and carefully decoupled supply connections. System validation should cover arbitration, interrupt delivery, reset behavior, and timing margins under the intended module population.
Рекомендуется
Legacy Communication Adapter
The PI7C7300DNAE can be incorporated into a legacy communication adapter that bridges conventional PCI traffic to one or more downstream resources. Its three-port structure is useful when communication, storage, or control functions need coordinated access through a shared host interface. The 3.3 V to 3.6 V supply range aligns with the device's stated operating envelope, while the 660 mA rating provides a defined core current target. The large PBGA package is appropriate for the numerous bus and control assignments but requires a multilayer PCB with disciplined signal routing. Check the manufacturer timing specifications and initialization requirements, and verify connector, clock, interrupt, and arbitration behavior with the complete target system.
Рекомендуется
PCI Carrier System
The PI7C7300DNAE fits a PCI carrier system that consolidates multiple downstream cards behind one conventional PCI host connection. Its three-port architecture allows card resources to be grouped without assigning every function a separate bridge. The device's 272-ball PBGA provides the connection density required for a multiport bridge, but the carrier must include a full escape-routing layer and adequate power-plane capacity. Use the 3.3 V to 3.6 V operating range and 660 mA specification as initial design constraints, then account for each attached card and the carrier's own logic. Confirm hot-plug assumptions, reset sequencing, arbitration behavior, and timing margins before production because these are system-level constraints rather than package substitutions.
Рекомендуется
Embedded Interface Backplane
The PI7C7300DNAE can support an embedded interface backplane where three conventional PCI segments require coordinated bridging. The multiport topology is useful for separating functional subsystems while maintaining a common upstream path. Its 3.3 V to 3.6 V operating range and 660 mA specification should be checked against backplane loading, termination requirements, and powered-card combinations. The 272-ball PBGA footprint requires careful connector placement so that address, data, control, and clock routes can escape without avoidable discontinuities. Plan power and ground distribution independently from high-speed routing, maintain reference-plane continuity, and validate the complete topology using the manufacturer's electrical and timing documentation before manufacturing backplane variants.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PI7C7300DNAE — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар |
|---|---|
| Brand | Diodes Incorporated |
| Package | 272-ball PBGA (27 mm x 27 mm) |
| Product Type | PCI-to-PCI bridge interface IC |
| Number of Ports | 3 ports |
| Operating Supply Voltage | 3.3 V to 3.6 V |
| Operating Current | 660 mA |
| PCI Interface Generation | Conventional PCI |
| Mounting Type | Surface mount |
| Ball Count | 272 balls |
| Pin-to-Pin Replacement | No confirmed drop-in alternative |
Ключевые отличия
- Three-port conventional PCI bridging (против 89HPES32C4)
- Defined 660 mA operating specification (против PCI2PCI16)
- High-density 27 mm by 27 mm PBGA implementation (против 89HPES32C4)
Заметки по проектированию
Use the exact PBGA-272 manufacturer land pattern and pin-definition table. A 272-ball footprint requires deliberate escape routing for address, data, control, clock, interrupt, and arbitration nets. Maintain a continuous ground reference beneath routed layers, use the required via pattern, and preserve the manufacturer's pad and solder-mask geometry. Do not substitute a generic 272-ball symbol because BGA ball assignments and power connections are not standardized across devices.
Estimated power planning should use the documented 3.3 V to 3.6 V operating range and 660 mA operating-current specification as initial inputs. At the upper voltage, the device's core power demand alone is approximately 2.38 W before board or external load effects are included. Confirm whether the 660 mA figure applies to the device core or a broader test condition, then select plane area, copper connections, and decoupling using the manufacturer electrical requirements and the actual voltage-current operating point.
Treat conventional PCI clock, address, and data routes as high-speed nets even though the PI7C7300DNAE targets a conventional PCI topology. Follow the manufacturer trace-length, impedance, branch, loading, and termination guidance. Keep the clock path away from switching-power nodes, minimize stubs, provide uninterrupted return paths, and validate the populated board with a suitable PCI system. The 272-ball package can create routing congestion if power and ground connections are not planned before signal escape.
Do not treat the IDT 89HPES32C4 or TI PCI2PCI16 as drop-in replacements for the PI7C7300DNAE. The cross-reference information identifies similar PCI-bridging functions but does not establish a shared 272-ball footprint, identical pinout, or equivalent timing. A replacement program should begin with a documented land-pattern comparison and full electrical, protocol, initialization, and system-validation review rather than an assumption based only on the PCI-to-PCI function.
Информация о соответствии
Compliance status was not established for the PI7C7300DNAE. Verify RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals declarations with Diodes Incorporated before procurement.
