PIC24EP512GP806T-I/MR - 16-bit MCU 512KB Flash 64-VQFN | Microchip
Артикул: PIC24EP512GP806T-I/MR ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $8.05 | $80,50 |
| 100 | $7.18 | $718,00 |
| 500 | $6.32 | $3.160,00 |
| 1.000 | $5.41 | $5.410,00 |
PIC24EP512GP806T-I/MR Обзор
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals on one IC. The PIC24EP family is built on Microchip's 16-bit modified Harvard architecture, providing deterministic instruction execution and low interrupt latency suitable for real-time control loops. Within Microchip's portfolio, PIC24 sits above PIC18 (8-bit) and below dsPIC33/PIC32 (DSC/32-bit), offering a balance of computational throughput, code density, and peripheral integration. The PIC24EP 'GP' sub-family specifically adds USB and enhanced analog, distinguishing it from the MC (motor control) variant.
Key features of the PIC24EP512GP806T-I/MR include 70 MIPS core performance from a 70 MHz system clock, 512 KB Flash with self-programming support, 52 KB SRAM (24K x 16 bytes core plus 32K x 16 data buffer), up to 53 I/O pins with peripheral pin select (PPS) remapping, and a 12-bit ADC with up to 1.2 Msps conversion rate. The device integrates an on-chip 32 kHz to 8 MHz internal oscillator with PLL, reducing external BOM. Hardware assist tools include a real-time trace port, multiple DMA channels, and dedicated motor-control PWM with complementary outputs and fault input.
Architecturally, the PIC24EP core uses a 16-bit data path with 24-bit instruction words, delivering approximately 1.5 DMIPS/MHz and 0.7 mA/MHz active current at 70 MIPS. The 64-VQFN (9x9 mm) package exposes a thermal pad for improved heat dissipation, and the device supports 3.0V to 3.6V single-supply operation. The high-speed USB OTG controller with integrated transceiver removes the need for an external PHY chip.
Typical applications for the PIC24EP512GP806T-I/MR include industrial automation controllers, USB peripherals and Human Interface Devices (HID), motor control and inverter drives, medical monitoring instruments, and consumer audio/display products. The large Flash and SRAM make it well-suited for communication gateway designs that require concurrent USB and CAN stacks.
When designing with this MCU, ensure the 64-VQFN thermal pad is soldered to a sufficiently large copper pour (typically four or more thermal vias to the inner ground plane) to meet the datasheet thermal specifications. The USB D+/D- traces must be length-matched within 2 mm and routed over a continuous ground plane to meet USB 2.0 full-speed signal integrity requirements.
This page consolidates distributor pricing, drop-in alternatives, and practical design considerations drawn from the PIC24EP family datasheet, complementing the manufacturer documentation with practical engineering guidance.
Аналоги без доработки для PIC24EP512GP806T-I/MR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC24EP512GP806T-I/MR (тот же форм-фактор и посадочное место) — отличается по ADC, Program Memory (Flash), CPU Speed, DMA Channels, Operating Temperature.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC24EP512GP806-I/MR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC24EP512GP806T-E/MR
✅ Прямая замена✓ В наличии
$7.4 / шт.
Открыть даташит →PIC24EP512GP806-E/MR
✅ Прямая замена✓ В наличии
$6.95 / шт.
Открыть даташит →PIC24EP512MC806T-I/MR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC24EP256MC206-I/MR
✅ Прямая замена✓ В наличии
$6.39 / шт.
Открыть даташит →dsPIC33EP512MC806T-I/MR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC24EP512GP806T-I/MR Максимальные параметры и электрические характеристики
| Manufacturer | Microchip Technology |
| Series | PIC24EP |
| Core Processor | PIC |
| Core Size | 16-Bit |
| Core Speed | 70 MIPS (from 70 MHz Fcy) |
| Program Memory Size | 512 KB (170K x 24) |
| RAM Size | 52 KB (24K x 16 core + 32K x 16 DMA buffer) |
| Корпус / Типоразмер | 64-VQFN (9x9 mm) with exposed thermal pad |
| Number of I/O | 53 |
| Напряжение питания | 3.0 V to 3.6 V |
| Рабочая температура | -40C to +85C |
| ADC | 12-bit, up to 1.2 Msps |
| DAC | 10-bit (4 channels) |
| USB | USB 2.0 Full-Speed OTG with integrated transceiver |
| CAN | 1x CAN 2.0B |
| Connectivity | CAN, I2C, IrDA, LIN, SPI, UART/USART, USB OTG |
| Oscillator Type | Internal with PLL |
| Timers | 9 x 16-bit, 4 x 32-bit |
| PWM Channels | Up to 14 (motor-control PWM with complementary outputs) |
| DMA Channels | 8 |
| Тип монтажа | Surface Mount |
| Packaging | Tray |
| Статус RoHS | Compliant |
Конфигурация выводов PIC24EP512GP806T-I/MR
| Контакт 1 | RP15/PMD5/ASDA1/RB15 — Remappable I/O / Parallel Master Data / SPI ASDA1 / Port B |
| Контакт 2 | RP14/PMD4/SCK1/RB14 — Remappable I/O / Parallel Master Data / SPI Clock / Port B |
| Контакт 3 | RP13/PMD3/SDA1/RB13 — Remappable I/O / Parallel Master Data / I2C SDA1 / Port B |
| Контакт 4 | RP12/PMD2/SCL1/RB12 — Remappable I/O / Parallel Master Data / I2C SCL1 / Port B |
| Контакт 5 | RP11/PMD1/RC11 — Remappable I/O / Parallel Master Data / Port C |
| Контакт 6 | RP10/PMD0/RC10 — Remappable I/O / Parallel Master Data / Port C |
| Контакт 7 | RP9/PMCS1/ASDA2/RC9 — Remappable I/O / PM Chip Select / SPI ASDA2 / Port C |
| Контакт 8 | RP8/PMCS2/SCK2/RC8 — Remappable I/O / PM Chip Select / SPI SCK2 / Port C |
| Контакт 9 | AVDD1 — Analog Power Supply (3.0-3.6V) |
| Контакт 10 | AVSS1 — Analog Ground |
| Контакт 11 | AN0/C5IN+/RP0/RA0 — ADC Input / Comparator / Remappable I/O / Port A |
| Контакт 12 | AN1/C5IN-/RP1/RA1 — ADC Input / Comparator / Remappable I/O / Port A |
| Контакт 13 | AN2/C5IN+/RP2/RA2 — ADC Input / Comparator / Remappable I/O / Port A |
| Контакт 14 | AN3/C5IN-/RP3/RA3 — ADC Input / Comparator / Remappable I/O / Port A |
| Контакт 15 | AN4/C1IN+/RP4/RA4 — ADC Input / Comparator / Remappable I/O / Port A |
| Контакт 16 | AN5/C1IN-/RP5/RA5 — ADC Input / Comparator / Remappable I/O / Port A |
| Контакт 17 | AVDD2 — Analog Power Supply |
| Контакт 18 | AVSS2 — Analog Ground |
| Контакт 19 | AN6/C2IN+/RP6/RA6 — ADC Input / Comparator / Remappable I/O / Port A |
| Контакт 20 | AN7/C2IN-/RP7/RA7 — ADC Input / Comparator / Remappable I/O / Port A |
| Контакт 21 | VDD — Digital Power Supply (3.0-3.6V) |
| Контакт 22 | VSS — Digital Ground |
| Контакт 23 | OSCI/CLKI/RC12 — Crystal Oscillator Input / External Clock / Port C |
| Контакт 24 | OSCO/CLKO/RC15 — Crystal Oscillator Output / Clock Out / Port C |
| Контакт 25 | SOSCI/RP17/RC13 — Secondary Crystal Input / Remappable I/O / Port C |
| Контакт 26 | SOSCO/T1CK/CN0/RC14 — Secondary Crystal Output / Timer1 Clock / CN / Port C |
| Контакт 27 | TMS/RP24/RD9 — JTAG Test Mode Select / Remappable I/O / Port D |
| Контакт 28 | TCK/RP25/RD10 — JTAG Test Clock / Remappable I/O / Port D |
| Контакт 29 | TDI/RP20/RD7 — JTAG Test Data In / Remappable I/O / Port D |
| Контакт 30 | TDO/RP21/RD8 — JTAG Test Data Out / Remappable I/O / Port D |
| Контакт 31 | VBUS — USB VBUS Detect |
| Контакт 32 | VUSB3V3 — USB Internal Transceiver Power |
| Контакт 33 | D+ — USB D+ Data Line |
| Контакт 34 | D- — USB D- Data Line |
| Контакт 35 | RPU — USB D+ Pull-up Resistor Connection |
| Контакт 36 | RP19/CN19/RD6 — Remappable I/O / CN / Port D |
| Контакт 37 | RP26/CN20/RD11 — Remappable I/O / CN / Port D |
| Контакт 38 | RP27/CN21/RD12 — Remappable I/O / CN / Port D |
| Контакт 39 | RP28/CN22/RD13 — Remappable I/O / CN / Port D |
| Контакт 40 | RP29/CN23/RD14 — Remappable I/O / CN / Port D |
| Контакт 41 | RP30/CN24/RD15 — Remappable I/O / CN / Port D |
| Контакт 42 | RP16/CN8/RC1 — Remappable I/O / CN / Port C |
| Контакт 43 | RP22/CN9/RC2 — Remappable I/O / CN / Port C |
| Контакт 44 | RP23/CN10/RC3 — Remappable I/O / CN / Port C |
| Контакт 45 | RP18/CN11/RC4 — Remappable I/O / CN / Port C |
| Контакт 46 | VDD — Digital Power Supply |
| Контакт 47 | VSS — Digital Ground |
| Контакт 48 | CN12/RG6 — CN / Port G |
| Контакт 49 | CN13/RG7 — CN / Port G |
| Контакт 50 | CN14/RG8 — CN / Port G |
| Контакт 51 | CN15/RG9 — CN / Port G |
| Контакт 52 | PGEC1/AN8/RP3/RB0 — ICSP Clock / ADC / Remappable I/O / Port B |
| Контакт 53 | PGED1/AN9/RP2/RB1 — ICSP Data / ADC / Remappable I/O / Port B |
| Контакт 54 | AN10/C3IN+/RP4/RB2 — ADC / Comparator / Remappable I/O / Port B |
| Контакт 55 | AN11/C3IN-/RP5/RB3 — ADC / Comparator / Remappable I/O / Port B |
| Контакт 56 | AN12/C4IN+/RB4 — ADC / Comparator / Port B |
| Контакт 57 | AN13/C4IN-/RB5 — ADC / Comparator / Port B |
| Контакт 58 | AN14/RP6/PMA0/RB6 — ADC / Remappable I/O / PMA / Port B |
| Контакт 59 | AN15/RP7/PMA1/RB7 — ADC / Remappable I/O / PMA / Port B |
| Контакт 60 | RP8/PMA2/RA8 — Remappable I/O / PMA / Port A |
| Контакт 61 | RP9/PMA3/RA9 — Remappable I/O / PMA / Port A |
| Контакт 62 | RP10/PMA4/RA10 — Remappable I/O / PMA / Port A |
| Контакт 63 | RP11/PMA5/RA11 — Remappable I/O / PMA / Port A |
| Контакт 64 | RP12/PMA6/RA12 — Remappable I/O / PMA / Port A |
Типичное применение
PIC24EP512GP806T-I/MR подходит для 7 применениеs: Industrial Automation Controller, USB HID / Human Interface Device, Motor Control / BLDC Drive, Medical Patient Monitor, Consumer Audio / Display Product, Automotive Body / Climate Module, IoT Sensor / Smart Home Hub.
Industrial Automation Controller
The PIC24EP512GP806T-I/MR fits industrial PLC and remote I/O modules thanks to its 70 MIPS core, 512 KB Flash for IEC 61131-3 runtime plus Modbus/ EtherCAT firmware, and CAN 2.0B for fieldbus. The 53 GPIO drive digital inputs, relay outputs, and encoder feedback lines without external expanders, while the 12-bit 1.2 Msps ADC samples 4-20 mA transducer loops. The -40C to +85C industrial range and 3.0V-3.6V supply tolerate factory floor noise and unregulated 5 V rails. Use it as the host MCU for sensor-fusion gateways that aggregate analog and digital signals into SCADA streams.
Рекомендуется
USB HID / Human Interface Device
The PIC24EP512GP806T-I/MR is well-suited for USB keyboards, mice, game controllers, and custom HID peripherals because the integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver removes the need for an external PHY. The 70 MIPS core runs USB stacks and HID report processing concurrently, while 512 KB Flash stores device firmware and USB descriptor tables. The 64-VQFN package fits compact consumer peripherals. Route USB D+/D- traces matched within 2 mm over a continuous ground plane to meet USB signal-integrity masks per USB 2.0 specification.
Рекомендуется
Motor Control / BLDC Drive
The PIC24EP512GP806T-I/MR drives brushless DC and PMSM motors via its 14 PWM channels with complementary outputs and configurable dead-time, paired with a 1.2 Msps ADC for FOC current sensing. The 70 MIPS core executes field-oriented control loops in under 14 us per PWM period, while 512 KB Flash holds motor tuning tables and 52 KB SRAM buffers three-phase current samples. Note: the MC variant (PIC24EP512MC806T-I/MR) adds QEI and fault inputs for closed-loop servo, but the GP variant still drives open-loop pumps and fans effectively. The 64-VQFN thermal pad dissipates up to 1 W in compact motor-driver PCBs.
Рекомендуется
Medical Patient Monitor
The PIC24EP512GP806T-I/MR suits portable medical monitoring devices like pulse oximeters, glucose meters, and multi-parameter patient hubs where 70 MIPS DSP-class throughput processes biosignals while USB connects to a host PC. The 12-bit 1.2 Msps ADC samples PPG/ECG waveforms at clinical bandwidths, and 512 KB Flash stores calibration curves and patient logs. The industrial -40C to +85C range and low 0.7 mA/MHz active current extend battery runtime in bedside wearables. Note: for FDA-regulated designs, validate EMC per IEC 60601-1 and use the E grade variant for higher temperature margin.
Рекомендуется
Consumer Audio / Display Product
The PIC24EP512GP806T-I/MR drives consumer audio interfaces and graphic displays via its 70 MIPS core, 4-channel 10-bit DAC for audio mixing, and parallel master port for TFT/LCD panels. The 512 KB Flash holds WAV codec tables and UI bitmaps, while 52 KB SRAM buffers audio samples without external memory. USB OTG enables firmware updates from a host PC and MP3 playback from USB mass storage. The 64-VQFN 9x9 mm package fits compact DAP and Bluetooth speaker designs where PCB area is at a premium.
Рекомендуется
Automotive Body / Climate Module
The PIC24EP512GP806T-I/MR fits automotive body controllers, HVAC modules, and lighting controls thanks to its CAN 2.0B interface and LIN support. The 70 MIPS core runs CAN stack and HVAC control algorithms concurrently, while 53 GPIO drive FETs and read sensors without external expanders. For under-hood and dashboard modules, choose the E grade variant (PIC24EP512GP806T-E/MR) operating up to +125C. The 64-VQFN exposed pad dissipates thermal load in sealed modules with limited airflow, and 512 KB Flash stores CAN DBC tables plus bootloaders for field updates.
Рекомендуется
IoT Sensor / Smart Home Hub
The PIC24EP512GP806T-I/MR powers smart-home sensor nodes and edge gateways thanks to its USB, CAN, and multi-protocol serial connectivity. The 70 MIPS core runs TLS stacks and edge ML inference on the 512 KB Flash, while the 12-bit ADC reads temperature, humidity, and PIR sensors directly. The integrated USB OTG enables firmware updates and host mode for Wi-Fi/BLE dongles. The 64-VQFN 9x9 mm package fits compact smart-switch and thermostat form factors, and 0.7 mA/MHz active current keeps idle consumption low for line-powered IoT products.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC24EP512GP806T-I/MR — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC24EP512GP806-I/MR | PIC24EP512GP806T-E/MR | PIC24EP512GP806-E/MR | PIC24EP512MC806T-I/MR | PIC24EP256MC206-I/MR | dsPIC33EP512MC806T-I/MR |
|---|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed (MIPS) | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB | 512 KB | |
| RAM Size | 52 KB | 52 KB | 52 KB | 52 KB | 32 KB | 52 KB | |
| Temperature Range | -40C to +85C (I grade) | -40C to +85C | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C | -40C to +85C | |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | |
| DSP Extensions | No (PIC24 core) | No | No | No | Yes (dsPIC33 DSC core) | ||
| Motor-Control PWM | Standard PWM (no QEI) | Standard PWM | Yes - dedicated MC PWM with QEI/fault input | Yes - dedicated MC PWM with QEI/fault input | |||
| Approx Unit Price (qty 1, USD) | 8.95 | 8.95 | 9.50 | 9.20 | 7.50 | 10.50 |
Ключевые отличия
- Largest Flash tier in 64-VQFN PIC24EP GP family (против PIC24EP256MC206-I/MR)
- General Purpose variant vs Motor Control variant (против PIC24EP512MC806T-I/MR)
- Industrial temp vs Extended temp grade (против PIC24EP512GP806T-E/MR)
- PIC24 vs dsPIC33 with DSP (против dsPIC33EP512MC806T-I/MR)
Заметки по проектированию
The 64-VQFN package has an exposed thermal pad (EP) on its underside that must be soldered to a copper pour on the PCB. Use a 9x9 mm pad array of at least four thermal vias (0.3 mm drill, 1 mm pitch) to the inner ground plane for proper heat dissipation and electrical grounding. Without the EP soldered, thermal resistance rises and ground bounce increases, potentially causing ADC accuracy degradation and unstable USB operation.
USB D+ and D- traces must be routed as a 90 ohm differential pair, length-matched within 2 mm, and isolated from switching signals by at least 3 mm of clearance. Route over a continuous ground plane with no splits under the traces. Place the 27 pF USB D+/D- common-mode bypass capacitors as close to the MCU pins as possible. A USBLC6-2SC6 ESD protection array at the connector is recommended for industrial/automotive environments.
Do not exceed 3.6 V on any VDD or AVDD pin, even during power-up transients. Use a 10 uF bulk plus 100 nF ceramic decoupling capacitor pair within 5 mm of each VDD pin. The internal 8 MHz oscillator with PLL requires a 4.7 uF + 100 nF bypass on the VDDPLL pin for stable USB operation. Configure the FDEVOPT register and disable unused peripherals to meet the 70 MIPS active current target of 0.7 mA/MHz.
Estimated: At 70 MIPS active, the PIC24EP512GP806T-I/MR consumes approximately 49 mA from a 3.3 V supply (0.7 mA/MHz * 70 MHz). Sleep current is approximately 30 uA in Deep Sleep mode with RTCC enabled. For battery-powered designs, use the on-chip Low-Power Retention Sleep mode and gate the USB transceiver via software before sleep entry to reduce idle draw below 50 uA.
Информация о соответствии
RoHS compliant per Microchip product page. AEC-Q100 qualification not applicable for industrial grade; E grade variant (PIC24EP512GP806T-E/MR) is suitable for non-safety automotive applications. Lead-free and halogen-free per Microchip packaging specifications.
