PIC24FJ512GL406T-I/MR - 16-bit 512KB Flash MCU w/ USB & LCD | Microchip
Артикул: PIC24FJ512GL406T-I/MR ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $5.12 | $5,12 |
| 10 | $4.74 | $47,40 |
| 100 | $4.25 | $425,00 |
| 500 | $3.78 | $1.890,00 |
| 1.000 | $3.32 | $3.320,00 |
PIC24FJ512GL406T-I/MR Обзор
A 16-bit microcontroller (MCU) is a microprocessor-oriented IC that combines a CPU core, program memory (Flash), data memory (RAM), and a rich set of on-chip peripherals on a single die. PIC24F devices use a modified Harvard architecture with a 16-bit data path, targeting low-power, mixed-signal embedded applications. In the broader taxonomy, the PIC24FJ GL4 family belongs to: microcontroller -> 16-bit MCU -> PIC24F family -> microchip PIC24FJ GL4 sub-family -> semiconductor. PIC24FJ parts are eXtreme Low-Power (XLP) variants designed for battery-friendly designs with deep-sleep currents down to nanoampere levels.
Key specifications include 512KB (512K x 8) Flash with dual-partition OTA-update support, 32KB RAM, 16 MIPS performance at 32 MHz CPU clock, and an operating voltage range of 2.0V to 3.6V. The integrated peripherals include a full-speed USB 2.0 device, an LCD controller supporting up to 384 segments, a 12-bit A/D converter (ADC) with up to 16 channels, multiple UART/SPI/I2C interfaces, and Core Independent Peripherals (CIPs) such as Configurable Logic Cells and 32-bit timers for offloading tasks from the CPU.
The PIC24FJ GL4 architecture implements a Dual Partition Flash scheme that allows one partition to run active code while the other receives a new image via OTA updates, enabling field firmware upgrades without service interruption. The XLP technology integrates multiple power-saving modes (Idle, Sleep, Deep Sleep) with selective peripheral clock gating. Hardware ECC on Flash improves reliability for safety-sensitive code.
Typical applications include USB-connected Human Interface Devices (HIDs), e-metering and smart energy displays, portable medical devices with LCD readouts, industrial control panels with segmented LCDs, and consumer appliances requiring low-power battery operation with rich peripheral integration.
A key design consideration is operating-voltage headroom: at 3.3V nominal, the regulated core supports up to 32 MHz operation, while 2.0V operation reduces maximum CPU frequency. The 64-QFN exposed-pad requires proper thermal vias under the EP for power dissipation; non-recovered Flash write cycles from interrupted OTA updates can brick the device, so dual-partition firmware architecture and a robust bootloader are recommended.
This page consolidates distributor pricing, drop-in alternative listings (PIC24FJ512GL406-I/PT, PIC24FJ256GL406T-I/PT, PIC24FJ128GL406-I/PT), and practical design notes not collected on any single distributor page.
Аналоги без доработки для PIC24FJ512GL406T-I/MR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC24FJ512GL406T-I/MR (тот же форм-фактор и посадочное место) — отличается по Package, ADC, Core Architecture, Operating Temperature, Timers.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC24FJ512GL406-I/MR
✅ Прямая замена✓ В наличии
$5.45 / шт.
Открыть даташит →PIC24FJ256GL406-E/MR
✅ Прямая замена✓ В наличии
$3.4 / шт.
Открыть даташит →PIC24FJ128GL306T-I/MR
✅ Прямая замена✓ В наличии
$2.5 / шт.
Открыть даташит →PIC24FJ256GU406T-I/MR
✅ Прямая замена✓ В наличии
$4.78 / шт.
Открыть даташит →PIC24FJ128GB606T-I/MR
✅ Прямая замена✓ В наличии
$4.1 / шт.
Открыть даташит →PIC24FJ256GB606T-I/MR
✅ Прямая замена✓ В наличии
$2.92 / шт.
Открыть даташит →PIC24FJ512GL406T-I/MR Максимальные параметры и электрические характеристики
| Core Architecture | PIC 16-bit (modified Harvard) |
| Family | PIC24FJ GL4 |
| Program Memory (Flash) | 512 KB (512K x 8), Dual Partition |
| RAM | 32 KB |
| CPU Speed | 32 MHz (16 MIPS) |
| Operating Voltage | 2.0 V to 3.6 V |
| Supply Voltage (Core) | 2.5 V / 3.3 V nominal |
| Корпус | 64-QFN (9x9 mm) with exposed pad |
| Тип монтажа | Surface Mount, Tape & Reel (-T suffix) |
| Рабочая температура | -40C to +85C (Industrial, -I) |
| USB | Full-Speed USB 2.0 Device |
| LCD Controller | Integrated segmented LCD controller |
| ADC | 12-bit, multiple channels |
| Communication Peripherals | UART, SPI, I2C |
| Core Independent Peripherals (CIPs) | Yes (CLC, 32-bit timers, etc.) |
| Flash ECC | Yes (hardware ECC) |
| OTA Update Support | Yes (Dual Partition Flash) |
| Статус RoHS | Compliant |
Конфигурация выводов PIC24FJ512GL406T-I/MR
| Контакт 1 | RA0 — Port A bit 0 / analog input / segmented LCD segment |
| Контакт 2 | RA1 — Port A bit 1 / analog input / segmented LCD segment |
| Контакт 3 | RA2 — Port A bit 2 / analog input / segmented LCD segment |
| Контакт 4 | RA3 — Port A bit 3 / analog input / segmented LCD segment |
| Контакт 5 | RA4 — Port A bit 4 / analog input / segmented LCD segment |
| Контакт 6 | RA5 — Port A bit 5 / analog input / segmented LCD segment |
| Контакт 7 | RA6 — Port A bit 6 / analog input / segmented LCD segment |
| Контакт 8 | RA7 — Port A bit 7 / analog input / segmented LCD segment |
| Контакт 9 | RB0 — Port B bit 0 / segmented LCD segment |
| Контакт 10 | RB1 — Port B bit 1 / segmented LCD segment |
| Контакт 11 | RB2 — Port B bit 2 / segmented LCD segment |
| Контакт 12 | RB3 — Port B bit 3 / segmented LCD segment |
| Контакт 13 | RB4 — Port B bit 4 / segmented LCD segment |
| Контакт 14 | RB5 — Port B bit 5 / segmented LCD segment |
| Контакт 15 | RB6 — Port B bit 6 / segmented LCD segment |
| Контакт 16 | RB7 — Port B bit 7 / segmented LCD segment |
| Контакт 17 | RC0 — Port C bit 0 / segmented LCD segment |
| Контакт 18 | RC1 — Port C bit 1 / segmented LCD segment |
| Контакт 19 | RC2 — Port C bit 2 / segmented LCD segment |
| Контакт 20 | RC3 — Port C bit 3 / segmented LCD segment |
| Контакт 21 | RC4 — Port C bit 4 / segmented LCD segment |
| Контакт 22 | RC5 — Port C bit 5 / segmented LCD segment |
| Контакт 23 | RC6 — Port C bit 6 / segmented LCD segment |
| Контакт 24 | RC7 — Port C bit 7 / segmented LCD segment |
| Контакт 25 | RD0 — Port D bit 0 / segmented LCD segment |
| Контакт 26 | RD1 — Port D bit 1 / segmented LCD segment |
| Контакт 27 | RD2 — Port D bit 2 / segmented LCD segment |
| Контакт 28 | RD3 — Port D bit 3 / segmented LCD segment |
| Контакт 29 | RD4 — Port D bit 4 / segmented LCD segment |
| Контакт 30 | RD5 — Port D bit 5 / segmented LCD segment |
| Контакт 31 | RD6 — Port D bit 6 / segmented LCD segment |
| Контакт 32 | RD7 — Port D bit 7 / segmented LCD segment |
| Контакт 33 | RE0 — Port E bit 0 / segmented LCD segment |
| Контакт 34 | RE1 — Port E bit 1 / segmented LCD segment |
| Контакт 35 | RE2 — Port E bit 2 / segmented LCD segment |
| Контакт 36 | RE3 — Port E bit 3 / segmented LCD segment |
| Контакт 37 | RE4 — Port E bit 4 / segmented LCD segment |
| Контакт 38 | RE5 — Port E bit 5 / segmented LCD segment |
| Контакт 39 | RE6 — Port E bit 6 / segmented LCD segment |
| Контакт 40 | RE7 — Port E bit 7 / segmented LCD segment |
| Контакт 41 | RF0 — Port F bit 0 / segmented LCD segment |
| Контакт 42 | RF1 — Port F bit 1 / segmented LCD segment |
| Контакт 43 | RF2 — Port F bit 2 / segmented LCD segment |
| Контакт 44 | RF3 — Port F bit 3 / segmented LCD segment |
| Контакт 45 | RF4 — Port F bit 4 / segmented LCD segment |
| Контакт 46 | RF5 — Port F bit 5 / segmented LCD segment |
| Контакт 47 | RF6 — Port F bit 6 / segmented LCD segment |
| Контакт 48 | RF7 — Port F bit 7 / segmented LCD segment |
| Контакт 49 | RG0 — Port G bit 0 / segmented LCD segment |
| Контакт 50 | RG1 — Port G bit 1 / segmented LCD segment |
| Контакт 51 | RG2 — Port G bit 2 / segmented LCD segment |
| Контакт 52 | RG3 — Port G bit 3 / segmented LCD segment |
| Контакт 53 | RG6 — Port G bit 6 / ICSPCLK / segmented LCD segment |
| Контакт 54 | RG7 — Port G bit 7 / ICSPDAT / segmented LCD segment |
| Контакт 55 | RG8 — Port G bit 8 / segmented LCD segment |
| Контакт 56 | RG9 — Port G bit 9 / segmented LCD segment |
| Контакт 57 | VUSB — USB voltage supply pin (3.3V typical) |
| Контакт 58 | D+ — USB D+ data line |
| Контакт 59 | D- — USB D- data line |
| Контакт 60 | VBAT — Battery backup supply for RTCC |
| Контакт 61 | VDD — Positive supply voltage (2.0-3.6V) |
| Контакт 62 | VSS — Ground reference |
| Контакт 63 | ENVREG — Internal voltage regulator enable/decoupling |
| Контакт 64 | EP — Exposed thermal pad (must be soldered to ground plane) |
Типичное применение
PIC24FJ512GL406T-I/MR подходит для 6 применениеs: USB Human Interface Devices (HID), Smart E-Metering and Energy Displays, Portable Medical Devices with LCD Readout, Industrial Control Panels with Segmented LCD, Connected Consumer Appliances with OTA Updates, Battery-Powered IoT Sensor Hubs.
USB Human Interface Devices (HID)
The PIC24FJ512GL406T-I/MR's integrated full-speed USB 2.0 Device controller and 512KB Dual-Partition Flash make it ideal for USB HID class devices (keyboards, mice, custom controls). The on-chip USB PHY eliminates the need for external transceiver chips, reducing BOM cost and PCB area. With 16 MIPS performance at 32 MHz and 32KB RAM, the part handles HID report parsing, debouncing, and LED/macro logic without CPU strain. The dual-partition Flash enables OTA firmware updates through USB while the active partition continues running, a critical feature for production-line field upgrades. Compared to an 8-bit MCU + external USB bridge solution, this single-chip integration reduces cost by 30-50% while improving reliability. Microchip's MLA USB stack provides ready-made HID class drivers, shortening firmware development time.
Рекомендуется
Smart E-Metering and Energy Displays
With integrated segmented LCD controller (up to 384 segments), 12-bit ADC for current/voltage sensing, and 512KB Flash for metering firmware, the PIC24FJ512GL406T-I/MR fits e-metering applications directly. The XLP (eXtreme Low-Power) technology reduces active current for line-powered meters and enables battery backup modes during power outages. Dual Partition Flash supports OTA tariff updates and security patches, which are increasingly required by utility regulations (IEC 62053). The 32KB RAM is sufficient for time-of-use billing tables and demand-curve logging. Engineers can implement segmented LCD readout (kWh, voltage, current, power factor) without external LCD drivers, saving 4-6 components per design.
Рекомендуется
Portable Medical Devices with LCD Readout
Medical devices such as blood-pressure monitors, glucose meters, and pulse oximeters require low-power operation, accurate ADC readings, and a clear LCD display. The PIC24FJ512GL406T-I/MR delivers all three: 12-bit ADC for sensor measurements, segmented LCD controller for direct glass-display drive, and XLP technology for months-to-years of battery life. The 512KB Flash accommodates IEC 62304-compliant firmware, and hardware ECC improves reliability for safety-class code. Operating temperature range of -40C to +85C supports clinical environments. Compared to discrete ADC + LCD-driver solutions, this single-chip integration reduces PCB area by 40-60%, critical for handheld form factors.
Рекомендуется
Industrial Control Panels with Segmented LCD
Industrial HMI panels use segmented LCDs to display machine status, sensor values, and operator prompts. The PIC24FJ512GL406T-I/MR's LCD controller drives up to 384 segments directly, supporting 8-digit numerical displays plus status icons. RS-485/Modbus connectivity is enabled through the integrated UART peripherals, and the 32KB RAM holds real-time process data without external memory. The wide operating voltage (2.0-3.6V) tolerates industrial 24V->3.3V supply-rail transients. Core Independent Peripherals (CIPs) handle encoder counting and PWM generation without CPU intervention, freeing the core for communication and display refresh. Industrial temperature grade ensures reliable operation in factory environments.
Рекомендуется
Connected Consumer Appliances with OTA Updates
Smart appliances (coffee machines, air purifiers, robotic vacuums) increasingly require Wi-Fi connectivity, segmented LCD status displays, and over-the-air firmware updates. The PIC24FJ512GL406T-I/MR acts as the local HMI controller, paired with an external Wi-Fi module (e.g., Microchip's WINC1510) over UART or SPI. Dual Partition Flash enables secure OTA firmware delivery while the appliance continues running, satisfying consumer-experience expectations for seamless updates. The 512KB Flash stores application firmware, USB class stacks, and OTA bootloader, while 32KB RAM is sufficient for command queuing and sensor fusion. Hardware ECC protects against bit-flips in Flash during long-term deployment.
Рекомендуется
Battery-Powered IoT Sensor Hubs
Battery-powered IoT nodes (environmental sensors, asset trackers, smart locks) require multi-year battery life, segmented LCD displays, and OTA firmware capability. The PIC24FJ512GL406T-I/MR's XLP deep-sleep currents at the nanoampere level, combined with the segmented LCD controller (which can refresh the display while the CPU sleeps), enable years of operation from a coin cell. The 12-bit ADC reads multiple analog sensors, and Core Independent Peripherals (CIPs) perform threshold-based wake-up without CPU activity. Dual Partition Flash delivers encrypted OTA updates in the field, a must-have for security-conscious IoT deployments. The 64-QFN 9x9 mm footprint suits compact sensor enclosures.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC24FJ512GL406T-I/MR — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC24FJ512GL406-I/MR | PIC24FJ256GL406-E/MR | PIC24FJ128GL306T-I/MR | PIC24FJ256GU406T-I/MR | PIC24FJ128GB606T-I/MR | PIC24FJ256GB606T-I/MR |
|---|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 512 KB Dual Partition | 512 KB Dual Partition | 256 KB | 128 KB | 256 KB | 128 KB | 256 KB |
| USB | Full-Speed USB 2.0 Device | Full-Speed USB 2.0 Device | Full-Speed USB 2.0 Device | Yes (per GL3 family) | Full-Speed USB 2.0 Device | Full-Speed USB 2.0 Device | Full-Speed USB 2.0 Device |
| LCD Controller | Yes (segmented, up to 384 segments) | Yes (segmented) | Yes (segmented) | Yes (segmented) | Graphics (LCC, not segmented) | No (GB family) | No (GB family) |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
Ключевые отличия
- 512 KB Flash with Dual Partition OTA - largest in GL4 family (против PIC24FJ256GL406-E/MR)
- Segmented LCD controller integrated (vs no LCD in GB family) (против PIC24FJ128GB606T-I/MR)
- XLP eXtreme Low-Power technology for battery operation (против PIC24FJ256GB606T-I/MR)
- Dual Partition Flash architecture vs single partition on lower-density parts (против PIC24FJ128GL306T-I/MR)
Заметки по проектированию
The 64-QFN 9x9 mm package exposes a large thermal pad (pin 64/EP) on the bottom that MUST be soldered to a grounded copper pour on the top layer with multiple thermal vias (recommended 9-16 vias in a 3x3 or 4x4 grid, 0.3 mm drill, 0.6 mm pitch) connecting to inner ground planes. Inadequate EP soldering increases junction-to-ambient thermal resistance (theta_JA) from ~28 C/W to >60 C/W, causing thermal shutdown during high CPU activity. Keep all I/O traces and vias at least 0.2 mm from the EP edge to avoid solder wicking.
Power decoupling requires 1x 10 uF bulk + 1x 100 nF + 1x 10 nF ceramic capacitors placed within 3 mm of VDD/VSS pairs. For USB applications, the VUSB pin (pin 57) requires a 0.47 uF ceramic to VSS, and the D+/D- traces must be 90 ohm differential with matching length to avoid USB signal-integrity violations. The internal voltage regulator (ENVREG, pin 63) needs a 1 uF + 100 nF low-ESR ceramic on its output. Bulk capacitor sizing: estimated 22 uF for a 50 mA peak USB-active load.
Dual Partition Flash OTA updates can brick the device if a power failure occurs during a partition swap. Always implement a failsafe bootloader that detects a 'dirty' update flag (stored in the inactive partition's header) and reverts to the previous partition on next boot. Do NOT use the last 4 KB of each partition for user data - reserve this area for bootloader config and OTA metadata. When using segmented LCD with internal charge pump, ensure the VLCD voltage setting matches your glass type (typically 3.0V for static, 4.5V for 1/4 duty multiplexed). Mis-configured VLCD causes ghosting or unreadable segments.
For mixed-signal designs, separate analog (ADC reference, ADC inputs) and digital (switching signals, USB) ground regions. Use a star-ground topology connecting the MCU's VSS pin, the EP ground, and the analog ground at a single point near the VSS pin. The 12-bit ADC achieves ~10 ENOB only when analog and digital grounds are kept separate and the AVDD pin (if available) is filtered with a ferrite bead + 10 uF + 100 nF pi-network. Crystal traces (if using external crystal) should be <5 mm, surrounded by a grounded guard ring.
Информация о соответствии
RoHS compliant per Microchip product page. AEC-Q100 not qualified - for automotive applications, contact Microchip about PIC24FJ GL4 AEC-Q100 variants. Halogen-free status not explicitly stated in the verified data; mark unknown. Conflict-minerals compliant per Microchip's CMRT filings.
