PIC32MX230F256DT-50I/ML - 50MHz 256KB Flash MCU | Microchip 44-QFN
Артикул: PIC32MX230F256DT-50I/ML ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $6.21 | $6,21 |
| 10 | $5.62 | $56,20 |
| 100 | $4.85 | $485,00 |
| 500 | $4.18 | $2.090,00 |
| 1.000 | $3.74 | $3.740,00 |
| 2.500 | $3.32 | $8.300,00 |
PIC32MX230F256DT-50I/ML Обзор
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals into one package. In the taxonomy hierarchy, MCU belongs to the broader integrated-circuit family, sitting below microprocessors (which need external memory) and above simple 8-bit controllers. The 32-bit class specifically targets applications where arithmetic performance, addressable memory, and peripheral integration outweigh the lower unit cost of 8/16-bit alternatives. The PIC32MX230F256DT series occupies the low-power, USB-capable mid-range of this 32-bit MCU landscape.
Key features include a 10-bit 1.1 Msps Analog-to-Digital Converter (ADC) with up to 28 channels, a USB 2.0 full-speed Device/Host/OTG controller, two I2S/SP I modules for audio codec connectivity, Peripheral Pin Select (PPS) for flexible I/O mapping, a Parallel Master Port (PMP) for graphics or external memory interfaces, an mTouch capacitive-touch sensing peripheral, and a 1 ns high-resolution 16-bit timer for precise time measurement. The integrated 80 MHz FRC and 32 kHz secondary oscillator reduce external BOM cost.
Technically, the M4K core implements the MIPS32 release 2 instruction set with single-cycle hardware multiply/divide, branch shadowing, and a tightly-coupled prefetch buffer that masks Flash latency. The 256 KB Flash is partitioned with a 32 KB boot Flash block for fail-safe firmware updates, and 16 KB SRAM supports DMA transfers without CPU intervention. The device supports 3.3V single-supply operation across 2.3V to 3.6V, with on-chip LDO generating core voltage from VDD.
Typical applications include USB HID peripherals (mice, keyboards, custom HID class devices), low-cost audio accessories using external I2S codecs, capacitive-touch user interfaces for appliances, and small TFT graphic displays driven via PMP. The combination of USB, I2S, and graphics-capable PMP in a small 44-QFN footprint is the defining use-case envelope.
Design consideration: route the USB DP/DM lines as a 90 ohm differential pair with no stubs, and place the 48 MHz crystal within 5 mm of the OSCI/OSCO pins to meet USB jitter requirements. The exposed thermal pad on the QFN package MUST be soldered to a ground plane of at least 1 sq inch for thermal and electrical performance.
This page synthesizes verified distributor pricing, true same-package drop-in alternatives, and applied engineering notes drawn from the manufacturer datasheet, providing context beyond what DigiKey or Mouser product listings alone typically deliver.
Аналоги без доработки для PIC32MX230F256DT-50I/ML — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MX230F256DT-50I/ML (тот же форм-фактор и посадочное место) — отличается по ADC, Package, Core, Operating Temperature, Parallel Master Port (PMP).
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MX230F256D-50I/ML
✅ Прямая замена✓ В наличии
$3.96 / шт.
Открыть даташит →PIC32MX230F256BT-V/SS
✅ Прямая замена✓ В наличии
$4.05 / шт.
Открыть даташит →PIC32MX230F256B-V/SP
✅ Прямая замена✓ В наличии
$4.1 / шт.
Открыть даташит →PIC32MX130F256DT-50I/ML
✅ Прямая замена✓ В наличии
$2.55 / шт.
Открыть даташит →PIC32MX150F256LT-V/PF
✅ Прямая замена✓ В наличии
$5.1 / шт.
Открыть даташит →PIC32MX170F256BT-50I/ML
✅ Прямая замена✓ В наличии
$3.85 / шт.
Открыть даташит →PIC32MX230F256BT-I/SS
✅ Прямая замена✓ В наличии
$2.4 / шт.
Открыть даташит →PIC32MX230F256DT-50I/ML Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 M4K |
| CPU Core | 32-bit RISC |
| Maximum CPU Frequency | 50 MHz |
| DMIPS | 83 DMIPS |
| Program Memory (Flash) | 256 KB |
| Data Memory (SRAM) | 16 KB |
| ADC | 10-bit, 1.1 Msps, up to 28 channels |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| I2S / SPI Modules | 2 |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| Рабочая температура | -40 C to +85 C (industrial) |
| Корпус | 44-QFN (8x8 mm) |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes |
| mTouch Capacitive Sensing | Yes |
| 16-bit Timer | 5 (with 1 ns resolution capture) |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
Конфигурация выводов PIC32MX230F256DT-50I/ML
| Контакт 1 | RA0 — Port A bit 0 / analog input |
| Контакт 2 | RA1 — Port A bit 1 / analog input |
| Контакт 3 | RA2 — Port A bit 2 / analog input |
| Контакт 4 | RA3 — Port A bit 3 / analog input |
| Контакт 5 | RA4 — Port A bit 4 / analog input |
| Контакт 6 | VDD — Positive supply 2.3-3.6V |
| Контакт 7 | VSS — Ground reference |
| Контакт 8 | RA5 — Port A bit 5 / analog input |
| Контакт 9 | RA6 — Port A bit 6 / analog input |
| Контакт 10 | RA7 — Port A bit 7 / analog input |
| Контакт 11 | RB0 — Port B bit 0 / programming |
| Контакт 12 | RB1 — Port B bit 1 / programming |
| Контакт 13 | RB2 — Port B bit 2 / programming |
| Контакт 14 | RB3 — Port B bit 3 / programming |
| Контакт 15 | RB4 — Port B bit 4 / programming |
| Контакт 16 | RB5 — Port B bit 5 / programming |
| Контакт 17 | RB6 — Port B bit 6 / programming |
| Контакт 18 | RB7 — Port B bit 7 / programming |
| Контакт 19 | VSS — Ground reference |
| Контакт 20 | RC0 — Port C bit 0 |
| Контакт 21 | RC1 — Port C bit 1 |
| Контакт 22 | RC2 — Port C bit 2 |
| Контакт 23 | RC3 — Port C bit 3 |
| Контакт 24 | RC4 — Port C bit 4 / USB VBUS sense |
| Контакт 25 | RC5 — Port C bit 5 / USB VON |
| Контакт 26 | RC6 — Port C bit 6 |
| Контакт 27 | RC7 — Port C bit 7 |
| Контакт 28 | RD0 — Port D bit 0 |
| Контакт 29 | RD1 — Port D bit 1 |
| Контакт 30 | RD2 — Port D bit 2 |
| Контакт 31 | RD3 — Port D bit 3 |
| Контакт 32 | RD4 — Port D bit 4 |
| Контакт 33 | RD5 — Port D bit 5 |
| Контакт 34 | RD6 — Port D bit 6 |
| Контакт 35 | RD7 — Port D bit 7 |
| Контакт 36 | VSS — Ground reference |
| Контакт 37 | VDD — Positive supply 2.3-3.6V |
| Контакт 38 | RE0 — Port E bit 0 / analog input |
| Контакт 39 | RE1 — Port E bit 1 / analog input |
| Контакт 40 | RE2 — Port E bit 2 / analog input |
| Контакт 41 | RE3 — Port E bit 3 / analog input |
| Контакт 42 | RE4 — Port E bit 4 / analog input |
| Контакт 43 | RE5 — Port E bit 5 / analog input |
| Контакт 44 | RF0 — Port F bit 0 / USB D- |
Типичное применение
PIC32MX230F256DT-50I/ML подходит для 7 применениеs: USB HID Peripherals (Mice, Keyboards, Custom HID), Low-Cost Audio Accessories (External I2S Codecs), Capacitive Touch User Interfaces (Appliances, IoT), Small TFT Graphic Displays via Parallel Master Port, Industrial USB Sensor / Data-Acquisition Modules, USB Host / Embedded USB Memory Readers, Consumer Appliance Control Boards with Touch UI.
USB HID Peripherals (Mice, Keyboards, Custom HID)
The PIC32MX230F256DT-50I/ML is purpose-built for USB Human Interface Devices because it integrates the USB 2.0 Full-Speed Device/Host/OTG controller and a 50 MHz MIPS core with 256 KB Flash. The MCU's 16 KB SRAM comfortably fits USB HID class descriptors plus HID report buffers, while the 10-bit ADC handles scroll-wheel or sensor inputs. Connect DP/DM through 90 ohm differential pair to a USB Type-A or Type-C receptacle, and let the internal pull-up resistor signal full-speed negotiation. Engineers favor this part over 8-bit MCUs because 32-bit performance lets you run a small RTOS for composite HID devices that combine keyboard, mouse, and consumer-control functions on a single endpoint.
Рекомендуется
Low-Cost Audio Accessories (External I2S Codecs)
With two I2S/SP I modules on the PIC32MX230F256DT-50I/ML, designers can drive external 24-bit audio DACs such as the Texas Instruments PCM5102A for low-cost audio dongles and headphone amplifiers. The 50 MHz CPU is fast enough to run sample-rate conversion and a small audio mixer without dropping samples, while the 256 KB Flash holds a USB audio class driver or a Bluetooth audio bridge. Connect the I2S BCLK/LRCK/DATA lines through PPS remapping to free up DMA-capable I/O pins, and let the DMA controller feed the I2S module while the CPU handles USB streaming. The wide 2.3V to 3.6V supply range accommodates Li-ion cell power for portable audio products.
Рекомендуется
Capacitive Touch User Interfaces (Appliances, IoT)
The PIC32MX230F256DT-50I/ML features Microchip's mTouch capacitive-touch peripheral, enabling buttons, sliders, and proximity sensors to be implemented without an external touch controller - a significant BOM savings for appliance and IoT products. The 28-channel ADC and PPS flexibility allow the MCU to scan a 4x4 keypad or a 12-element slider while the CPU handles the user-interface state machine in real time. Designers can use the 256 KB Flash to store touch-tuning profiles, and the 1 ns resolution 16-bit timer enables debounce-free touch event detection. Combine the touch channels with USB or I2C host connectivity to deliver a modern touch UI on washing machines, induction cooktops, or smart thermostats.
Рекомендуется
Small TFT Graphic Displays via Parallel Master Port
The Parallel Master Port (PMP) peripheral on the PIC32MX230F256DT-50I/ML drives small 3.5-inch or 4-inch TFT LCDs in parallel 8/16-bit mode at speeds sufficient for animated icons and simple GUIs. The 50 MHz core and DMA-driven PMP transfers update 320x240 QVGA panels without screen tearing. Connect the PMP data bus through the upper 16 I/O pins, route the PMRD/PMWR control lines through PPS, and use an external gate-driver IC if the panel voltage exceeds 3.6V. Designers use this combination for portable diagnostic tools, medical instrument front panels, and handheld instrumentation where a small color display is required without an expensive graphics processor.
Рекомендуется
Industrial USB Sensor / Data-Acquisition Modules
With a 10-bit 1.1 Msps ADC and a USB 2.0 Full-Speed interface, the PIC32MX230F256DT-50I/ML is well-suited to industrial USB sensor modules that stream ADC samples to a host PC for visualization and analysis. The 256 KB Flash can host a small command parser and a USB CDC class driver, while 16 KB SRAM buffers double-buffered ADC samples. The industrial temperature rating of -40C to +85C supports factory-floor deployment. Connect the ADC inputs to current-sense amplifiers or resistive bridges, route the USB DP/DM lines with proper ESD protection, and use the on-chip mTouch peripheral for operator buttons that survive oily-finger industrial environments.
Рекомендуется
USB Host / Embedded USB Memory Readers
The PIC32MX230F256DT-50I/ML supports USB 2.0 On-The-Go host mode, enabling it to act as a small USB host for embedded mass-storage readers or USB HID input devices. The 50 MHz core runs a USB host stack and FAT file system from Flash, while 16 KB SRAM holds directory and cluster buffers. Design a board with a USB Type-A receptacle, route VBUS through a power-switch IC with current limiting, and use the PPS to remap the host D+/D- lines to compatible I/O. Use cases include medical instrument data loggers that write patient samples to a USB stick, industrial controllers that read configuration from USB media, and embedded kiosks with USB peripherals.
Рекомендуется
Consumer Appliance Control Boards with Touch UI
Home appliances such as induction cooktops, coffee machines, and dishwashers increasingly require sealed capacitive-touch user interfaces that work through glass or plastic overlays. The PIC32MX230F256DT-50I/ML pairs its mTouch peripheral with the USB interface for diagnostic connectivity during factory testing, while the 256 KB Flash holds the appliance state machine, sensor monitoring, and safety logic. The 50 MHz performance is sufficient to run a real-time control loop at 1 kHz while servicing touch events. Drive TRIAC or relay outputs through optocouplers, monitor zero-crossing via the input capture, and expose a USB Type-C service port for firmware updates via the bootloader.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MX230F256DT-50I/ML — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MX230F256D-50I/ML | PIC32MX230F256BT-V/SS | PIC32MX230F256B-V/SP | PIC32MX130F256DT-50I/ML | PIC32MX150F256LT-V/PF |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 32 KB |
| USB Peripheral | USB FS Device/Host/OTG | USB FS Device/Host/OTG | USB FS Device/Host/OTG | USB FS Device/Host/OTG | No USB | No USB |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +105C (extended) | -40C to +105C (extended) | -40C to +85C | -40C to +105C (extended) |
| ADC | 10-bit 1.1 Msps | 10-bit 1.1 Msps | 10-bit 1.1 Msps | 10-bit 1.1 Msps | 10-bit 1.1 Msps | 10-bit 1.1 Msps |
| mTouch Capacitive Sense | Yes | Yes | Yes | Yes | Yes | Yes |
Ключевые отличия
- Integrated USB 2.0 Full-Speed OTG on-chip (против PIC32MX130F256DT-50I/ML)
- Peripheral Pin Select (PPS) for flexible routing (против PIC32MX150F256LT-V/PF)
- Higher DMA channel count than MX1xx alternatives (против PIC32MX130F256DT-50I/ML)
Заметки по проектированию
Route the USB D+ and D- lines as a 90 ohm differential pair from the MCU to the USB receptacle. Maximum pair length 50 mm, no stubs, and place a common-mode choke or ferrite bead near the connector. Keep DP/DM away from switching power inductors by at least 5 mm to avoid EMI coupling. Add a USBLC6-2SC6 or equivalent ESD diode at the connector to protect the MCU's USB pins per IEC 61000-4-2 air-discharge to 15 kV.
The 44-QFN (8x8 mm) package exposes a central thermal pad that MUST be soldered to the PCB ground plane to meet datasheet thermal resistance targets. Per the PIC32MX1XX/2XX family datasheet, the thermal pad should connect to a continuous ground copper pour of at least 1 square inch, with thermal vias (0.3 mm drill, 1.0 mm pitch) stitching to internal ground planes. Without proper thermal pad soldering, junction temperature can exceed 125C during USB enumeration with heavy ADC activity.
Place a 1 uF X7R ceramic decoupling capacitor within 3 mm of each VDD pin and a single 10 uF bulk tantalum or ceramic capacitor at the board power-entry point. The on-chip LDO generates the internal 1.8V core rail from VDD, but it requires low-impedance supply to maintain regulation during USB transmit bursts. For USB bus-powered designs, add a 4.7 uF capacitor on the VBUS pin to meet USB 2.0 inrush-current limits.
Do not exceed the maximum VDD of 3.6V - the PIC32MX2XX is NOT 5V tolerant. Use level shifters when interfacing to 5V logic. When using the mTouch peripheral, do not place ground pour under the touch electrodes, and follow Microchip's AN1478 layout guidelines to avoid false touch detections. The 'T' suffix in PIC32MX230F256DT denotes tape-and-reel orientation - verify reel size (13-inch or 7-inch) before quoting the pick-and-place line.
Place the 8 MHz or 48 MHz primary crystal within 5 mm of the OSCI and OSCO pins to minimize stray capacitance. Use short, symmetrical traces and surround the crystal with a ground guard ring to prevent noise injection. For USB applications, the 48 MHz primary oscillator accuracy directly affects USB jitter compliance - select a crystal with 50 ppm tolerance or better. Configure the secondary 32 kHz oscillator for RTC operation with a 6 pF load watch crystal.
Информация о соответствии
RoHS compliant per Microchip product page. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified; for automotive applications consider PIC32MX230F256B-V/SP extended-temp variants with engineering review.