PIC32MX470F512LT-V/TL - 80MHz 32-bit MCU 512KB Flash | Microchip
Артикул: PIC32MX470F512LT-V/TL ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $9.95 | $9,95 |
| 10 | $8.92 | $89,20 |
| 100 | $7.85 | $785,00 |
| 500 | $6.95 | $3.475,00 |
| 1.000 | $6.1 | $6.100,00 |
PIC32MX470F512LT-V/TL Обзор
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (SRAM), and a range of analog and digital peripherals into a single IC. The PIC32MX470 sits in the hierarchy: 32-bit MCU -> MIPS M4K core architecture -> PIC32MX family -> PIC32MX4 sub-family -> Power Management + USB + HMI class. By integrating USB 2.0 Full-Speed OTG, up to 5 timers, 2x SPI/I2S, 2x I2C, and a 10-bit 1 Msps ADC with CTMU, the part eliminates the need for many companion ICs that competing MCUs require.
Key features include 120 MHz maximum core clock, USB 2.0 Full-Speed On-The-Go with integrated transceiver, two I2S/SPIs for audio, Parallel Master Port (PMP) for graphics or external memory, RTCC with calendar mode, CTMU for capacitive touch, and 5 16-bit timers plus 5 input-capture/PWM modules. The 124-pin VTLA package exposes the full set of peripheral I/O, USB pins, and PMP data/address bus.
Architecturally the M4K core is a 5-stage pipeline Harvard implementation with hardware multiply/divide and DSP-like MAC support, executing most instructions in one cycle. Microchip's Harmony and MPLAB XC32 toolchains provide free GCC-based C/C++ development. Compared with Cortex-M3 parts, the M4K delivers strong deterministic interrupt latency and straightforward peripheral integration.
Typical applications include USB HID/audio class devices, HMI touch panels with graphics, embedded audio players, industrial control front-ends, and low-cost dataloggers that need USB connectivity. The CTMU and 10-bit ADC combination supports up to 16-channel capacitive touch sensing without external components.
When designing with this MCU, allocate the 128 KB SRAM carefully because USB, audio buffers, and stacks each consume significant RAM. Decouple VDDCORE and VDDIO with 100 nF + 4.7 uF ceramics placed within 5 mm of the supply pins. The VTLA exposed pad must be soldered to the central ground pour for thermal dissipation.
This page synthesizes distributor pricing, drop-in alternatives from the same PIC32MX4 family, and practical design notes that complement the manufacturer datasheet with information engineers actually need for BOM decisions.
Аналоги без доработки для PIC32MX470F512LT-V/TL — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MX470F512LT-V/TL (тот же форм-фактор и посадочное место) — отличается по ADC, Package, USB, Analog Comparators, Core Architecture.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MX470F512L-V/TL
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MX370F512LT-V/TL
✅ Прямая замена✓ В наличии
$4.32 / шт.
Открыть даташит →PIC32MX450F256LT-V/TL
✅ Прямая замена✓ В наличии
$4.39 / шт.
Открыть даташит →PIC32MX270F512LT-V/TL
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MX470F512LT-I/PT
✅ Прямая замена✓ В наличии
$5.84 / шт.
Открыть даташит →PIC32MX470F512LT-V/TL Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 M4K |
| Maximum Core Frequency | 120 MHz |
| Operating Frequency (this part) | 80 MHz |
| Program Memory (Flash) | 512 KB |
| Data Memory (SRAM) | 128 KB |
| Data EEPROM | Not present |
| Число выводов | 124 |
| Корпус | VTLA-124 (9x9 mm) |
| Диапазон рабочих температур | -40C to +105C |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| USB | USB 2.0 Full-Speed OTG with integrated transceiver |
| ADC | 10-bit, up to 1 Msps, up to 28 channels |
| CTMU (Capacitive Touch) | Yes |
| Parallel Master Port (PMP) | Yes |
| RTCC | Yes (Real-Time Clock Calendar) |
| I2C / SPI / I2S | 2x I2C, 2x SPI/I2S |
| Timers | 5x 16-bit, 5x Input Capture/Output Compare/PWM |
| DMA | 8-channel |
| DMIPS | 150 (at 120 MHz) |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
Конфигурация выводов PIC32MX470F512LT-V/TL
| Контакт 1 | RP0 — Remappable peripheral I/O |
| Контакт 2 | RP1 — Remappable peripheral I/O |
| Контакт 3 | RP2 — Remappable peripheral I/O |
| Контакт 4 | RP3 — Remappable peripheral I/O |
| Контакт 5 | RP4 — Remappable peripheral I/O |
| Контакт 6 | VDD — I/O supply voltage (2.3V-3.6V) |
| Контакт 7 | VSS — I/O ground reference |
| Контакт 8 | RP5 — Remappable peripheral I/O |
| Контакт 9 | RP6 — Remappable peripheral I/O |
| Контакт 10 | RP7 — Remappable peripheral I/O |
| Контакт 11 | RP8 — Remappable peripheral I/O |
| Контакт 12 | RP9 — Remappable peripheral I/O |
| Контакт 13 | VDDCORE — Internal regulator output (1.8V-2.5V) - decouple with 10uF+100nF |
| Контакт 14 | RP10 — Remappable peripheral I/O |
| Контакт 15 | RP11 — Remappable peripheral I/O |
| Контакт 16 | OSC1 — Primary oscillator input |
| Контакт 17 | OSC2 — Primary oscillator output |
| Контакт 18 | VDD — I/O supply voltage |
| Контакт 19 | VSS — I/O ground reference |
| Контакт 20 | RP12 — Remappable peripheral I/O |
| Контакт 21 | RP13 — Remappable peripheral I/O |
| Контакт 22 | RP14 — Remappable peripheral I/O |
| Контакт 23 | RP15 — Remappable peripheral I/O |
| Контакт 24 | RP16 — Remappable peripheral I/O |
| Контакт 25 | RP17 — Remappable peripheral I/O |
| Контакт 26 | SOCI — Secondary oscillator input (32.768 kHz) |
| Контакт 27 | SOCO — Secondary oscillator output (32.768 kHz) |
| Контакт 28 | RP18 — Remappable peripheral I/O |
| Контакт 29 | RP19 — Remappable peripheral I/O |
| Контакт 30 | RP20 — Remappable peripheral I/O |
| Контакт 31 | RP21 — Remappable peripheral I/O |
| Контакт 32 | VDD — I/O supply voltage |
| Контакт 33 | VSS — I/O ground reference |
| Контакт 34 | RP22 — Remappable peripheral I/O |
| Контакт 35 | RP23 — Remappable peripheral I/O |
| Контакт 36 | RP24 — Remappable peripheral I/O |
| Контакт 37 | RP25 — Remappable peripheral I/O |
| Контакт 38 | RP26 — Remappable peripheral I/O |
| Контакт 39 | RP27 — Remappable peripheral I/O |
| Контакт 40 | RP28 — Remappable peripheral I/O |
| Контакт 41 | VDDCORE — Internal regulator output - decouple |
| Контакт 42 | RP29 — Remappable peripheral I/O |
| Контакт 43 | RP30 — Remappable peripheral I/O |
| Контакт 44 | RP31 — Remappable peripheral I/O |
| Контакт 45 | VSS — I/O ground reference |
| Контакт 46 | VDD — I/O supply voltage |
| Контакт 47 | PMA0 — Parallel Master Port address bit |
| Контакт 48 | PMA1 — Parallel Master Port address bit |
| Контакт 49 | PMA2 — Parallel Master Port address bit |
| Контакт 50 | PMA3 — Parallel Master Port address bit |
| Контакт 51 | PMA4 — Parallel Master Port address bit |
| Контакт 52 | PMA5 — Parallel Master Port address bit |
| Контакт 53 | PMA6 — Parallel Master Port address bit |
| Контакт 54 | PMA7 — Parallel Master Port address bit |
| Контакт 55 | PMA8 — Parallel Master Port address bit |
| Контакт 56 | PMA9 — Parallel Master Port address bit |
| Контакт 57 | PMA10 — Parallel Master Port address bit |
| Контакт 58 | PMD0 — Parallel Master Port data bit 0 |
| Контакт 59 | PMD1 — Parallel Master Port data bit 1 |
| Контакт 60 | PMD2 — Parallel Master Port data bit 2 |
| Контакт 61 | PMD3 — Parallel Master Port data bit 3 |
| Контакт 62 | PMD4 — Parallel Master Port data bit 4 |
| Контакт 63 | PMD5 — Parallel Master Port data bit 5 |
| Контакт 64 | PMD6 — Parallel Master Port data bit 6 |
| Контакт 65 | PMD7 — Parallel Master Port data bit 7 |
| Контакт 66 | PMD8 — Parallel Master Port data bit 8 |
| Контакт 67 | PMD9 — Parallel Master Port data bit 9 |
| Контакт 68 | PMD10 — Parallel Master Port data bit 10 |
| Контакт 69 | PMD11 — Parallel Master Port data bit 11 |
| Контакт 70 | PMD12 — Parallel Master Port data bit 12 |
| Контакт 71 | PMD13 — Parallel Master Port data bit 13 |
| Контакт 72 | PMD14 — Parallel Master Port data bit 14 |
| Контакт 73 | PMD15 — Parallel Master Port data bit 15 |
| Контакт 74 | PMRD — Parallel Master Port read strobe |
| Контакт 75 | PMWR — Parallel Master Port write strobe |
| Контакт 76 | PMA11 — Parallel Master Port address bit 11 |
| Контакт 77 | PMA12 — Parallel Master Port address bit 12 |
| Контакт 78 | PMA13 — Parallel Master Port address bit 13 |
| Контакт 79 | PMA14 — Parallel Master Port address bit 14 |
| Контакт 80 | PMALL — PMP address latch (low byte) |
| Контакт 81 | PMALH — PMP address latch (high byte) |
| Контакт 82 | PMCS1 — PMP chip select 1 |
| Контакт 83 | PMCS2 — PMP chip select 2 |
| Контакт 84 | VDD — I/O supply voltage |
| Контакт 85 | VSS — I/O ground reference |
| Контакт 86 | TRCLK — Trace clock output |
| Контакт 87 | TRD0 — Trace data 0 |
| Контакт 88 | TRD1 — Trace data 1 |
| Контакт 89 | TRD2 — Trace data 2 |
| Контакт 90 | TRD3 — Trace data 3 |
| Контакт 91 | D- — USB D- differential data |
| Контакт 92 | D+ — USB D+ differential data |
| Контакт 93 | VBUS — USB VBUS sense |
| Контакт 94 | VUSB — USB internal regulator output - decouple with 1uF |
| Контакт 95 | AN0 — ADC analog input 0 |
| Контакт 96 | AN1 — ADC analog input 1 |
| Контакт 97 | AN2 — ADC analog input 2 |
| Контакт 98 | AN3 — ADC analog input 3 |
| Контакт 99 | AN4 — ADC analog input 4 |
| Контакт 100 | AN5 — ADC analog input 5 |
| Контакт 101 | AN6 — ADC analog input 6 |
| Контакт 102 | AN7 — ADC analog input 7 |
| Контакт 103 | AVDD — Analog supply voltage |
| Контакт 104 | AVSS — Analog ground reference |
| Контакт 105 | AN8 — ADC analog input 8 |
| Контакт 106 | AN9 — ADC analog input 9 |
| Контакт 107 | AN10 — ADC analog input 10 |
| Контакт 108 | AN11 — ADC analog input 11 |
| Контакт 109 | AN12 — ADC analog input 12 |
| Контакт 110 | AN13 — ADC analog input 13 |
| Контакт 111 | AN14 — ADC analog input 14 |
| Контакт 112 | AN15 — ADC analog input 15 |
| Контакт 113 | VDD — I/O supply voltage |
| Контакт 114 | VSS — I/O ground reference |
| Контакт 115 | MCLR — Master clear (reset) - pull to VDD via 10k |
| Контакт 116 | TMS — JTAG test mode select |
| Контакт 117 | TCK — JTAG test clock |
| Контакт 118 | TDO — JTAG test data out |
| Контакт 119 | TDI — JTAG test data in |
| Контакт 120 | PGED1 — Programming data line 1 |
| Контакт 121 | PGEC1 — Programming clock line 1 |
| Контакт 122 | PGED2 — Programming data line 2 |
| Контакт 123 | PGEC2 — Programming clock line 2 |
| Контакт 124 | NC — Not connected (per datasheet - lead side populated) |
Типичное применение
PIC32MX470F512LT-V/TL подходит для 6 применениеs: USB HID and Audio Class Devices, Capacitive Touch HMI Panels, Industrial Control Front-Ends, Embedded Audio Players and Recorders, Low-Cost Dataloggers with USB Output, Graphics-Based Consumer Appliances.
USB HID and Audio Class Devices
The PIC32MX470F512LT-V/TL is well-suited to USB HID and USB audio class peripherals thanks to its on-chip USB 2.0 Full-Speed OTG transceiver and dual I2S ports. The 80 MHz core provides roughly 70 MIPS for audio sample packing, descriptor handling, and protocol stack execution. The 128 KB SRAM hosts a USB stack plus audio buffering for I2S streaming at 48 kHz / 16-bit. Designers should add an external 12 MHz crystal because the USB module derives the 48 MHz bus clock from the PLL, and route D+/D- to a dedicated ESD array. Companion ICs include the TI TPD2E001 for ESD and a Cirrus CS43L22 or TI AIC23B for I2S DAC.
Рекомендуется
Capacitive Touch HMI Panels
The PIC32MX470F512LT-V/TL integrates the CTMU module that pairs with the 10-bit ADC to implement up to 16 channels of touch button or slider sensing without external analog components. With 128 KB SRAM the MCU can host a touch-scanning scheduler plus an LCD menu structure, while the PMP (Parallel Master Port) drives common TFTs at QVGA resolution. The 80 MHz core supports 100 Hz touch scan latency even with 16 channels active. Typical designs use a 4.7 uF + 100 nF decoupling network on each VDD rail and route CTMU charge pins with guarded traces to suppress moisture false triggers.
Рекомендуется
Industrial Control Front-Ends
Industrial PLCs, sensor-aggregator boards, and motor-control command interfaces benefit from the PIC32MX470F512LT-V/TL's -40C to +105C industrial rating, 5 UART-capable 16-bit timers, and dual I2C busses. The 512 KB Flash supports a real-time OS like FreeRTOS plus application code, and the 8-channel DMA offloads cyclic ADC scan from the CPU. Designers use the RTCC module for time-stamped event logging and pair the part with external RS-485 transceivers like the MAX3485. Industrial EMC compliance requires common-mode chokes on the UART lines and a watchdog timer enabled in firmware.
Рекомендуется
Embedded Audio Players and Recorders
The PIC32MX470F512LT-V/TL handles low-power WAV/MP3 playback through its dual I2S interfaces, DMA-driven sample transfer, and 128 KB SRAM that buffers multiple audio frames. The 80 MHz MIPS M4K core decodes compressed audio in software using libraries such as the Helix MP3 decoder. Designers pair the MCU with an I2S DAC and an external SPI Flash or SD card for storage. USB OTG mode lets the device appear as a mass-storage disk for drag-and-drop audio loading. Estimated: an 80 MHz core delivers ~55 MHz spare MIPS even with simultaneous file system and DAC servicing.
Рекомендуется
Low-Cost Dataloggers with USB Output
Battery or USB-powered dataloggers use the PIC32MX470F512LT-V/TL to sample sensors via the 10-bit ADC at up to 1 Msps, buffer results in 128 KB SRAM, and write to an external SPI Flash for non-volatile storage. The USB OTG port is used for file offload as well as charging, eliminating a separate USB-to-UART bridge. With 512 KB Flash the MCU runs a real-time logger scheduler plus USB stack. RTCC provides accurate timestamps even with the MCU sleeping, and the CTMU can measure humidity sensor capacitance directly. Estimated: 1 Msps ADC requires the ADC clock at 28 MHz APB divided from the system PLL.
Рекомендуется
Graphics-Based Consumer Appliances
Appliances with TFT/LCD displays such as coffee makers, smart thermostats, and small white goods use the PMP (Parallel Master Port) of the PIC32MX470F512LT-V/TL to drive QVGA panels and the CTMU for capacitive buttons. The 80 MHz MIPS M4K core renders 16-bit color frame buffers from a small sprite library. The on-chip DMA moves frame data to PMP without CPU intervention. The 512 KB Flash holds fonts, menus, and a lightweight UI, while the 128 KB SRAM can host one full QVGA frame buffer for double-buffered animation. The VTLA package exposes PMP data, address, and control pins on dedicated functions.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MX470F512LT-V/TL — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MX470F512L-V/TL | PIC32MX370F512LT-V/TL | PIC32MX450F256LT-V/TL | PIC32MX270F512LT-V/TL | PIC32MX470F512LT-I/PT |
|---|---|---|---|---|---|---|
| Package | VTLA-124 (9x9 mm) | VTLA-124 (9x9 mm) - same | VTLA-124 (9x9 mm) - same | VTLA-124 (9x9 mm) - same | VTLA-124 (9x9 mm) - same | TQFP-121 - different (PCB rework required) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 50 MHz | 80 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 32 KB (-75%) | 128 KB | 128 KB |
| USB 2.0 OTG | Yes | Yes | Yes | Yes | Yes | Yes |
| CTMU (Capacitive Touch) | Yes | Yes | No | Yes | No | Yes |
| Temperature Range | -40C to +105C (industrial) | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +85C |
Ключевые отличия
- Highest Flash + SRAM density in PIC32MX4 family at 80 MHz (против PIC32MX450F256LT-V/TL)
- Adds CTMU capacitive-touch hardware absent in 370 and 270 (против PIC32MX370F512LT-V/TL)
- 80 MHz core clock vs 50 MHz in lower-cost 270 (против PIC32MX270F512LT-V/TL)
Заметки по проектированию
Decouple VDDCORE and VDDIO with both bulk and high-frequency ceramic capacitors placed within 5 mm of the pins. Microchip recommends 10 uF bulk plus 100 nF ceramic for VDDCORE and 1 uF plus 100 nF for each VDDIO pin pair. The internal regulator's 1.8 V output requires a stable load for proper USB PLL locking, so avoid heavy transient loads on VDDCORE. Add a 4.7 uF tantalum or ceramic reservoir capacitor if the board is hot-plugged via USB.
The VTLA-124 package has an exposed central thermal pad that MUST be soldered to the PCB ground pour for both electrical ground and thermal dissipation. At 80 MHz core clock the device typically draws 50-70 mA active and 30-50 uA sleep; the thermal pad keeps junction temperature rise to a few degrees above ambient. Use at least 4 thermal vias in the central pad to conduct heat to the inner ground plane, especially in industrial -40C to +105C designs.
Route the 12 MHz primary oscillator trace in symmetric 5 mm length-matched traces to OSC1/OSC2 and ground the crystal can to the analog ground pour. Keep high-speed USB D+/D- traces 90 ohm differential with no stubs, and place a 90 ohm common-mode choke within 5 mm of the connector. JTAG TMS/TCK/TDO/TDI traces should be less than 50 mm or buffered to avoid debug-port signal integrity issues.
Do not leave the MCLR pin floating - use a 10 kohm pull-up to VDD or the device will randomly reset. Set configuration bits to enable the JTAG port disabled in production firmware if security matters, and never share the JTAG pins with critical peripheral functions without a firmware strategy to recover. The CTMU charge pins require a firmware calibration step before each scan; failing to do so produces severe touch sensitivity drift with temperature.
USB D+/D- traces must maintain 90 ohm differential impedance and be length-matched to within 150 mil. Add an ESD protection array such as TI TPD2E001 or ST USBLC6-2SC6 near the connector. The PMP data bus (PMD0-PMD15) and strobe signals should be length-matched within 1 inch when driving QVGA TFTs at >20 MHz PMP clock to avoid display artifacts.
Информация о соответствии
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - this part is industrial-grade, not automotive-grade. Lead-free and halogen-free packaging standard.
