S9S12ZVL16F0VLC - 16KB Flash S12Z MagniV 32MHz MCU, 32-LQFP | NXP
Артикул: S9S12ZVL16F0VLC ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $4.92 | $4,92 |
| 10 | $4.43 | $44,30 |
| 100 | $3.94 | $394,00 |
| 500 | $3.54 | $1.770,00 |
| 1.000 | $3.15 | $3.150,00 |
S9S12ZVL16F0VLC Обзор
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash/RAM), peripherals, and increasingly mixed-signal analog interfaces. The S12 MagniV family is NXP's mixed-signal MCU platform that consolidates a sophisticated S12Z CPU with high-voltage analog blocks (LDO, LIN PHY) to reduce external BOM in space-constrained automotive nodes. Within the broader hierarchy, the S12ZVL sits at: S12ZVL family -> S12 MagniV mixed-signal MCU -> 16-bit automotive MCU -> microcontroller (IC) -> semiconductor.
Key features include 16KB (16K x 8) on-chip Flash, 1KB RAM, the integrated Vreg for direct 12V battery supply, a LIN 2.x transceiver, an MSCAN (CAN 2.0) controller, and a 10-channel 10-bit ADC. The S12Z core implements an enhanced CISC instruction set with BCD and fuzzy logic support, plus hardware stack pointer and index register improvements versus older HC12 cores.
Architecturally, the die combines a 5V-tolerant digital section with the high-voltage analog front end (12V LIN/regulator), allowing direct connection to the automotive 12V bus without external protection. The 32-LQFP-7x7 footprint and the integrated LIN/CAN analog make it specifically suited for cost-sensitive body-electronics nodes such as door modules, seat controllers, and HVAC flaps.
Typical applications include LIN slave nodes for window lifters, seat-position actuators, mirror adjusters, interior lighting, HVAC damper control, and body controllers that bridge sensor inputs to a CAN/LIN backbone. The integrated 12V regulator eliminates the need for an external pre-regulator on the PCB.
When designing with this part, ensure the LIN bus is properly terminated with the recommended pull-up and that the high-voltage analog section is bypassed with the capacitors called out in the NXP reference manual. Firmware must initialize the integrated VREG and the LIN PHY mode before enabling bus activity.
This page synthesizes distributor pricing, AEC-Q100 qualification status, and drop-in same-family alternatives that are not consolidated in the manufacturer datasheet, providing an independent engineering summary useful for BOM management.
Аналоги без доработки для S9S12ZVL16F0VLC — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с S9S12ZVL16F0VLC (тот же форм-фактор и посадочное место) — отличается по Automotive Qualification.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
S9S12ZVL16AVLC
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
S9S12ZVL32F0VLC
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
S9S12ZVL8F0VLC
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
S9S12ZVL64F0VLC
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
S9S12ZVL128F0VLC
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
S9S12H256J2VFVER
✅ Прямая замена✓ В наличии
Уточнить цену
Открыть даташит →S9S12ZVL16F0VLC Максимальные параметры и электрические характеристики
| Core | S12Z (16-bit CISC) |
| Flash Memory | 16 KB (16K x 8) |
| RAM | 1 KB |
| Maximum Core Frequency | 25 MHz |
| Bus Frequency | 32 MHz |
| Supply Voltage (Vdd) | 3.3 V / 5 V (regulated from internal Vreg) |
| Integrated Voltage Regulator | 12 V to 5 V (internal) |
| LIN Transceiver | Integrated LIN 2.x physical layer |
| CAN Controller | 1x MSCAN (CAN 2.0) |
| ADC | 10-bit, multiple channels |
| Корпус | 32-LQFP (7x7 mm) |
| Тип монтажа | Surface Mount |
| Рабочая температура | -40 C to +105 C |
| Automotive Qualification | AEC-Q100 |
| Статус RoHS | Compliant |
Конфигурация выводов S9S12ZVL16F0VLC
| Контакт 1 | VDDR |
| Контакт 2 | VDDX |
| Контакт 3 | VSSX |
| Контакт 4 | RESET_b |
| Контакт 5 | TEST |
| Контакт 6 | BKGD |
| Контакт 7 | VDDA |
| Контакт 8 | VSSA |
| Контакт 9 | AN0/PAD0 |
| Контакт 10 | AN1/PAD1 |
| Контакт 11 | AN2/PAD2 |
| Контакт 12 | AN3/PAD3 |
| Контакт 13 | AN4/PAD4 |
| Контакт 14 | AN5/PAD5 |
| Контакт 15 | LIN |
| Контакт 16 | VSUP |
| Контакт 17 | VHSD |
| Контакт 18 | VLSD |
| Контакт 19 | CANH |
| Контакт 20 | CANL |
| Контакт 21 | PWM0/PT0 |
| Контакт 22 | PWM1/PT1 |
| Контакт 23 | PWM2/PT2 |
| Контакт 24 | PWM3/PT3 |
| Контакт 25 | TXCAN/PT4 |
| Контакт 26 | RXCAN/PT5 |
| Контакт 27 | SS/PT6 |
| Контакт 28 | MOSI/PT8 |
| Контакт 29 | MISO/PT9 |
| Контакт 30 | SCK/PT7 |
| Контакт 31 | XTAL/PE7 |
| Контакт 32 | EXTAL/PE6 |
Типичное применение
S9S12ZVL16F0VLC подходит для 6 применениеs: Automotive LIN Window Lifter Slave, Seat Position Adjuster Module, HVAC Damper Controller, Interior LED Lighting Controller, Door Mirror Adjuster Node, Body Controller CAN/LIN Bridge.
Automotive LIN Window Lifter Slave
The S9S12ZVL16F0VLC targets exactly this application: a LIN slave node controlling a single window motor with two Hall-effect sensor inputs and an H-bridge driver interface. The integrated LIN 2.x PHY allows direct connection to the vehicle's 12V LIN bus without an external transceiver, while the on-die 12V-to-5V regulator accepts the raw battery supply. With 16KB Flash, the part holds the LIN slave stack plus application code, the 10-bit ADC samples motor current for stall detection, and 1KB RAM handles protocol buffers. AEC-Q100 qualification is mandatory for body-electronics deployment.
Рекомендуется
Seat Position Adjuster Module
Memory seat modules combine multiple LIN nodes, each driving a single actuator (recline, height, lumbar), and the S9S12ZVL16F0VLC fits one-node-per-motor architectures. Its S12Z core at 25MHz executes the LIN 2.x slave state machine plus PWM generation for actuator control, and the integrated 12V regulator eliminates the external pre-regulator. The AEC-Q100 grade and -40C to +105C range cover cabin thermal stress, while 16KB Flash holds the LIN conformance test plus OEM-specific calibration. Same-family drop-in parts (32KB/64KB variants) enable stack-growth without PCB changes.
Рекомендуется
HVAC Damper Controller
HVAC damper actuators distribute a single MCU per blend/door, and the S9S12ZVL16F0VLC integrates LIN, 12V Vreg, ADC, and PWM in one die. The part drives a small brushed DC motor for the damper flap and reads the actuator position via a 10-bit ADC channel. AEC-Q100, -40C to +105C, and the integrated 12V supply allow PCB simplification versus discrete MCU + external LIN + LDO solutions. 16KB Flash accommodates LIN conformance plus actuator calibration, while same-LQ-32/64/128KB variants scale memory when more features are added.
Рекомендуется
Interior LED Lighting Controller
Body controllers increasingly route RGB interior lighting over LIN, and the S9S12ZVL16F0VLC integrates a PWM-capable timer plus LIN PHY to drive multi-channel LED drivers. The 12V-to-5V internal regulator removes the need for an external LDO on small PCBAs hidden behind trim panels. AEC-Q100 plus -40C to +105C cover cabin ambient; 16KB Flash runs the LIN 2.x slave plus color-mixing state machine. The 10-bit ADC enables ambient-light sensing for automatic brightness adaptation without a separate light sensor MCU.
Рекомендуется
Door Mirror Adjuster Node
Door mirror modules integrate fold/unfold, X/Y mirror positioning, and turn-signal repeaters, typically partitioned into LIN slave nodes. The S9S12ZVL16F0VLC drives two small DC motors (X and Y) via PWM, communicates over LIN to the body controller, and accepts the 12V battery directly through the integrated regulator. AEC-Q100 grade and the rugged S12Z core suit the door cavity environment, while 16KB Flash is sufficient for the LIN slave plus motor control law. Same-family 32KB/64KB variants allow memory growth for added features such as BLIS indicator LEDs.
Рекомендуется
Body Controller CAN/LIN Bridge
The S9S12ZVL16F0VLC bridges sensor LIN nodes to a CAN backbone in zonal architectures, leveraging its integrated MSCAN controller and LIN 2.x transceiver. The S12Z core runs a small gateway protocol stack in 16KB Flash, while the integrated 12V Vreg accepts battery supply and supplies the rest of the bridge PCB. AEC-Q100 grade and the S12ZVL family footprint allow zonal-ECU platforms to standardize on one PCB layout across memory sizes from 8KB to 128KB Flash.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для S9S12ZVL16F0VLC — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | S9S12ZVL16AVLC | S9S12ZVL32F0VLC | S9S12ZVL8F0VLC | S9S12ZVL64F0VLC | S9S12ZVL128F0VLC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) |
| Flash Memory | 16 KB | 16 KB | 32 KB | 8 KB | 64 KB | 128 KB |
| Core | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit |
| Maximum Core Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Integrated LIN PHY | Yes (LIN 2.x) | Yes (LIN 2.x) | Yes (LIN 2.x) | Yes (LIN 2.x) | Yes (LIN 2.x) | Yes (LIN 2.x) |
| Integrated 12V Vreg | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| AEC-Q100 | Yes | Yes | Yes | Yes | Yes | Yes |
Ключевые отличия
- Memory scalability without PCB change (против S9S12ZVL32F0VLC)
- Integrated 12V regulator and LIN PHY (против S9S12H256J2VFVER)
- AEC-Q100 grade across the full memory range (против S9S12ZVL8F0VLC)
Заметки по проектированию
The integrated 12V-to-5V Vreg on the S9S12ZVL16F0VLC accepts the raw automotive battery (VSUP) and generates VDDR; bypass VSUP with a 100nF ceramic close to the pin and a 10uF electrolytic on the PCB input. The VDDR pin requires a 1uF-10uF ceramic + 100nF combination; undersizing VDDR capacitance causes LIN/CAN analog instability under load transients.
Route the LIN bus as a twisted harness with the recommended 1nF master termination and a 30k pull-up to VSUP. Place the LIN pull-up resistor close to the MCU LIN pin and keep the LIN trace short (<50mm) on the PCB; long traces act as antennas and degrade EMC. Decouple VHSD/VLSD outputs from any inductive load with flyback diodes.
Do not skip the external reset filter on RESET_b; an RC of 10k + 100nF is typical. Tie TEST to VDDR through a 10k resistor for normal operation; floating TEST may place the part in a debug mode. Always initialize the Vreg and LIN PHY mode in firmware before enabling bus activity, or the LIN slave appears absent on the bus.
The 32-LQFP-7x7 has a thermal pad-less package; however, route a continuous ground pour on the top layer under the LQFP body and stitch vias to the inner ground plane. Isolate the VSUP and LIN traces from the 5V/3.3V digital region with a ground moat to prevent high-voltage transients from coupling into the analog section.
Информация о соответствии
AEC-Q100 qualified per NXP automotive grade. RoHS/REACH compliant per NXP product page. Lead-free and halogen-free packaging confirmed by NXP ordering guide.