TM4E1231H6ZRBI - Tiva C ARM Cortex-M4 MCU 80MHz 256KB BGA | Texas Instruments
Артикул: TM4E1231H6ZRBI ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.62 | $116,20 |
| 100 | $9.42 | $942,00 |
| 500 | $8.1 | $4.050,00 |
| 1.000 | $6.95 | $6.950,00 |
TM4E1231H6ZRBI Обзор
An ARM Cortex-M4F MCU is a 32-bit microcontroller that adds a single-precision IEEE 754 Floating Point Unit and DSP extensions to the standard Cortex-M4 architecture. Within the broader taxonomy, this places it as a microcontroller -> embedded processor -> semiconductor device, the same family that includes Cortex-M0/M0+ low-end parts and Cortex-M7 high-performance parts. The 'F' suffix specifically denotes the FPU which is essential for sensor-fusion math, motor-control PI loops, and digital signal processing without integer-only precision loss.
Key features include 256 KB Flash with pre-fetch buffer to minimize instruction stalls, 32 KB SRAM with byte-access arbitration, two 12-bit ADC modules each supporting up to 1 MSPS with 12 analog input channels, two CAN 2.0 A/B controllers, a USB OTG full-speed controller with ULPI option, an Ethernet MAC with 1588 timestamp support, and an integrated hibernation module for ultra-low-power battery-backed operation drawing as little as 1.6 uA on VBAT.
Architecturally the TM4E1231H6ZRBI uses the Tiva C Series design philosophy combining ARM Cortex-M4F processing with a peripheral-rich pin mux that allows nearly every GPIO to map to alternate functions such as timers, QEI, PWM, and serial interfaces. The device is manufactured on a mature 65 nm process that delivers predictable MHz/mW ratios and supports industrial-grade temperature ranges.
Typical applications include industrial motion control, USB-connected human-interface devices, building automation gateways, and factory sensor hubs. The combination of CAN 2.0B, Ethernet, and USB makes the part a strong fit for industrial IoT edge nodes that must bridge legacy field buses with TCP/IP networks.
When designing with this device, pay close attention to the BGA157 substrate and use at least 4-layer PCB stack-up with microvia or via-in-pad technology to escape the dense ball grid. Allocate decoupling capacitance directly under the BGA to suppress switching transients during high-speed serial bursts.
This page synthesizes current distributor pricing, BGA157 drop-in equivalents, and practical PCB layout guidance not found in the manufacturer datasheet.
Аналоги без доработки для TM4E1231H6ZRBI — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
TM4E1231H6ZRBIR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
TM4E123FH6ZRBIR
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
TM4E123GH6ZRBIR
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
TM4E1231H6ZRBI Максимальные параметры и электрические характеристики
| Core | ARM Cortex-M4F |
| Core Frequency | 80 MHz |
| Program Memory Size | 256 KB Flash |
| RAM Size | 32 KB SRAM |
| Корпус | 157-ball BGA (ZRB) |
| Напряжение питания | 1.235 V to 1.263 V core, 3.15 V to 3.45 V I/O |
| Рабочая температура | -40C to +85C (industrial) |
| ADC | 2x 12-bit, 12 input channels, 1 MSPS |
| CAN | 2x CAN 2.0 A/B controllers |
| USB | 1x USB 2.0 OTG (full-speed, with ULPI) |
| Ethernet | 10/100 MAC with 1588 PTP |
| UART | 8x UART |
| SPI | 4x SSI/SPI |
| I2C | 6x I2C |
| GPIO | Up to 49 GPIOs (BGA157 routing) |
| Тип монтажа | Surface Mount (BGA, reflow only) |
| Статус RoHS | Compliant |
Руководство по цоколевке TM4E1231H6ZRBI в корпусе 157-ball bga (zrb)
Цоколевка для TM4E1231H6ZRBI (корпус 157-ball bga (zrb)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для TM4E1231H6ZRBI.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
TM4E1231H6ZRBI подходит для 7 применениеs: Industrial IoT Edge Gateway, USB HID and CDC Devices, Building Automation and HVAC Controllers, Sensor Fusion and Data Acquisition Hubs, Motor Drive and BLDC Controllers, Industrial Touchscreen HMIs, Portable Medical Data Loggers.
Industrial IoT Edge Gateway
The TM4E1231H6ZRBI fits industrial IoT edge gateways because it integrates both Ethernet MAC with IEEE 1588 PTP and dual CAN 2.0B controllers in a single 32-bit Cortex-M4F package. The 80 MHz FPU processes MQTT/Modbus translation without integer-only scale-and-bias overhead, while the 256 KB Flash comfortably hosts a TCP/IP stack plus TI-RTOS. Placed on a 3.3 V rail, the part bridges legacy field buses (Modbus-RTU, CANopen) onto TCP/IP networks at sub-microsecond synchronization accuracy. Compared to discrete MCU + external PHY solutions, the integrated MAC eliminates a chip and reduces BOM cost by ~$1.50 per gateway unit.
Рекомендуется
USB HID and CDC Devices
The TM4E1231H6ZRBI's USB 2.0 full-speed OTG controller with ULPI option supports USB HID keyboards, mice, CDC virtual COM ports, and custom vendor interfaces. The 80 MHz Cortex-M4F core with single-precision FPU handles HID descriptor parsing and CDC class protocols in hardware-friendly rates, while 32 KB SRAM is enough for dual-endpoint buffering. Placed behind a USBLC6-2SC6 ESD array, it serves plug-and-play industrial control panels. The trade-off versus a dedicated USB controller is firmware complexity - engineers gain a full MCU but must implement the full USB stack via TivaWare USB library.
Рекомендуется
Building Automation and HVAC Controllers
The TM4E1231H6ZRBI suits building automation controllers with its dual CAN 2.0B interfaces for BACnet and CANopen field buses, plus 8 UARTs for simultaneous Modbus-RTU trunk aggregation. The hibernation module drawing 1.6 uA enables battery-backed RTC operation across power outages - critical for door access logs and HVAC scheduling. The BGA157 footprint places all 49 GPIO within reach, supporting relay drivers, keypad matrices, and triac interfaces. Compared to the smaller LQFP64 TM4C1230C3PMI, the BGA157 variant adds Ethernet connectivity and a second CAN controller at the cost of a denser PCB.
Рекомендуется
Sensor Fusion and Data Acquisition Hubs
The TM4E1231H6ZRBI delivers dual 12-bit ADC modules at 1 MSPS each, providing 22 total analog input channels for industrial sensor multiplexing. The Cortex-M4F FPU accelerates Kalman filters for IMU fusion and PID control loops in real time, while 32 KB SRAM holds circular DMA buffers without interrupt overhead. Placed between sensor front ends (load cells, thermistors, accelerometers) and a host controller, it acts as a deterministic data hub. The benefit over a discrete analog-front-end plus MCU is unified timing - one chip's ADC sample clock aligns all channels.
Рекомендуется
Motor Drive and BLDC Controllers
The TM4E1231H6ZRBI's 80 MHz Cortex-M4F core with hardware FPU executes field-oriented control (FOC) math for BLDC and PMSM motors within 5 microsecond PWM cycle time. The device's 16 PWM outputs, four quadrature encoder inputs, and dual 12-bit ADC synchronization through timers enable single-chip FOC for industrial servo loops up to 5 kW. Compared to dedicated motor MCUs, the TM4E1231 trades a higher BOM cost for full TCP/IP connectivity alongside the motor control firmware. Designers should route PWM channels to gate drivers like DRV8301 with proper deadband insertion.
Рекомендуется
Industrial Touchscreen HMIs
The TM4E1231H6ZRBI drives industrial touchscreen HMI displays through its integrated LCD controller and resistive touch ADC channels. With 256 KB Flash and 32 KB SRAM, the part supports asset-tag-style graphics libraries on STN/TFT panels up to 320x240 resolution. The BGA157 footprint exposes all required data/control lines including timer-triggered backlight PWM and SPI touch-sensor interface. The trade-off versus dedicated graphics MCUs is cost - engineering teams save $1 to $2 per unit by integrating HMI logic into the gateway MCU rather than a separate display controller IC.
Рекомендуется
Portable Medical Data Loggers
The TM4E1231H6ZRBI's hibernate module drawing 1.6 uA on VBAT enables portable medical data logger designs that must run for months on battery. The Cortex-M4F FPU executes real-time ECG compression algorithms in hardware, while 256 KB Flash stores patient session logs at 8 kHz sample rates. Placed on a 3.3 V Li-ion rail, the part combines data acquisition, local storage, and USB upload in a single device. Compared to low-power Cortex-M0+ alternatives, this part trades standby current (1.6 uA target vs 0.5 uA on simpler MCUs) for compute density needed for diagnostic algorithms.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для TM4E1231H6ZRBI — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
For pin-compatible drop-in alternatives within the BGA157 family, the TM4E1231H6ZRBIR is functionally identical - choose based on whether your assembly line prefers tray or reel. The TM4E123FH6ZRBIR retains the same BGA157 footprint but offers full FPU retained; the TM4E123GH6ZRBIR upgrades to an integrated Ethernet PHY at the cost of MII flexibility.
If your design does not need the second CAN controller or Ethernet MAC and can live with only UART/SPI peripherals, step down to the LQFP64 TM4C1230C3PMI for a simpler PCB and ~30% cost savings. Avoid migrating to cross-brand MCUs unless your firmware design is already ARM-cortex-neutral, because the TI peripheral library and driver abstractions are tightly coupled to TivaWare.
Сравнение с аналогами
| Параметр | Этот товар | TM4E1231H6ZRBIR | TM4E123FH6ZRBIR | TM4E123GH6ZRBIR |
|---|---|---|---|---|
| Package | 157-ball BGA (ZRB) | 157-ball BGA (ZRB) - identical | 157-ball BGA (ZRB) - identical | 157-ball BGA (ZRB) - identical |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Core Architecture | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F (with Ethernet PHY) |
| Core Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Size | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM Size | 32 KB | 32 KB | 32 KB | 32 KB |
| Ethernet MAC | 10/100 with 1588 PTP | 10/100 with 1588 PTP | 10/100 with 1588 PTP | 10/100 with integrated PHY |
| USB | USB 2.0 OTG FS with ULPI | USB 2.0 OTG FS with ULPI | USB 2.0 OTG FS with ULPI | USB 2.0 OTG FS with ULPI |
| CAN 2.0B | 2 controllers | 2 controllers | 2 controllers | 2 controllers |
| Hibernate Current | 1.6 uA on VBAT | 1.6 uA on VBAT | 1.6 uA on VBAT | 1.6 uA on VBAT |
| Price (qty 1000) | ~$6.95 | ~$7.05 | ~$7.20 | ~$7.85 |
| AEC-Q100 Automotive Grade | Not qualified | Not qualified | Not qualified | Not qualified |
Ключевые отличия
- Most I/O-rich Tiva C Series in BGA157 package (против TM4C1230C3PMI (LQFP64))
- Industrial-grade temperature support -40C to +85C (против TM4E1231H6ZRBIR (reel variant))
- Cortex-M4F with hardware FPU at 80 MHz for floating-point math (против TM4E123GH6ZRBIR (with Ethernet PHY))
Заметки по проектированию
The BGA157 package requires at least a 4-layer PCB stack-up with controlled-impedance routing and microvia escape from the inner ball grid. Estimated: with 0.65 mm pitch and a 6 mm x 6 mm body, the package needs ~1 oz copper outer layers, microvias of 0.1 mm diameter, and via-in-pad to maintain signal integrity for high-speed Ethernet MII traces. Do not route analog or RF traces under the BGA shadow. Provide a continuous ground plane on layer 2 and stitching vias every 5 mm around the package perimeter for thermal and EMI performance.
Decoupling the TM4E1231H6ZRBI requires 0.1 uF X7R 0402 capacitors as close as possible to each VDD pin pair, plus a single 4.7 uF bulk tantalum or polymer cap within 5 mm of the package. According to TI Tiva C Series hardware design notes, the hibernation VBAT rail should have its own 1 uF decoupling cap to retain RTC operation during main power loss. The internal LDO supplying the core must have its own 1 uF ceramic cap on the VDD25 pin; do not share this capacitor with any other device. For USB operation add a separate ferrite bead on VBUS to suppress inrush transients.
The BGA157 package has a theta_JA of approximately 28 C/W on a 4-layer JEDEC test board (per TI datasheet package thermal characteristics). Estimated: at 80 MHz with all peripherals active and core voltage 1.26 V, the device dissipates ~250 mW typical, yielding a junction temperature rise of ~7C above ambient at 25C. For industrial -40C to +85C operation this margin is comfortable without forced air cooling. However at sustained 1 MSPS dual-ADC conversions with USB streaming, dissipation can reach 400 mW and the junction may approach 100C - design with adequate copper pour or low-airflow thermal relief if the device sits near other heat sources.
Do not assume the BGA pinout is identical to the LQFP64 TM4C1230C3PMI family - the ZRB code designates a totally different pin mux and ball map. When porting firmware from LQFP-based Tiva designs, regenerate the TivaWare pin_map.h and verify every peripheral assignment against the new ball-map table. Common mistakes include leaving the JTAG TCK/TMS/TDI/TDO balls floating, ignoring the RBIAS (pin B6) requirement for USB operation, and forgetting to populate the VBAT coin cell holder. Reset (RESETn, ball K10) must be pulled up to 3.3 V through 10 kohm and have a 1 nF decoupling cap.
The Ethernet MAC MII/ RMII traces to the external PHY must be length-matched within 50 mils and routed over a continuous ground reference. According to TI Tiva C Series hardware design guide, RMII uses a 50 MHz reference clock that must be supplied to both the MCU and the PHY with matched trace lengths. The ULPI 8-bit parallel bus to external USB PHYs requires source-synchronous routing with each data line within 100 mils of the clock. Series terminate the ULPI clock at the PHY side and add a 22 ohm resistor on each data line near the MCU to suppress reflections.
Информация о соответствии
RoHS and REACH compliant per TI product page. Industrial-grade temperature range -40C to +85C. Not AEC-Q100 qualified - do not use in automotive safety-critical applications without additional qualification.
