TPS65951A1ZGUR - OMAP PMIC + Audio Codec 169-BGA | Texas Instruments
Артикул: TPS65951A1ZGUR ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $8.12 | $81,20 |
| 100 | $7.25 | $725,00 |
| 500 | $6.58 | $3.290,00 |
| 1.000 | $5.94 | $5.940,00 |
TPS65951A1ZGUR Обзор
A power-management IC (PMIC) is a specialized voltage regulator and power-tree controller that integrates multiple DC-DC converters, LDOs, load switches, sequencing logic, and supervisory functions into a single silicon die. In the power-management hierarchy it sits above discrete regulators, replacing dozens of passive and discrete parts in battery-operated systems, while adding battery-interface, charging support, and GPIO-based control.
Key features of the TPS65951 include several buck (step-down) converter channels and multiple low-dropout linear regulators for the processor core, memory, and I/O rails, integrated power sequencing controlled through an I2C-compatible interface, and a complete audio module: audio codecs, digital filters, input preamplifiers and amplifiers, and Class-D output amplifiers. This integration reduces BOM count, board area, and startup/sequencing design risk in handheld platforms.
Architecturally, the device combines the power silicon, battery supervision, charger handoff logic, and the audio codec on one die, communicating with the host processor over a serial control bus. The Class-D speaker drivers eliminate the need for external audio amplifier ICs in handset designs, while the codec path supports voice and multimedia recording/playback chains.
Typical applications include OMAP-based cellular handsets, portable media players, 3G/4G modem power trees, and other handheld devices where tightly sequenced multi-rail power plus an integrated audio path are required.
Design consideration: because the part is tailored to OMAP power requirements, verify rail voltages, sequencing order, and audio output configuration against the specific application processor datasheet before layout; the 169-ball BGA requires controlled-impedance fanout and careful thermal pad connection per the TI data manual.
Аналоги без доработки для TPS65951A1ZGUR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с TPS65951A1ZGUR (тот же форм-фактор и посадочное место) — отличается по Audio Subsystem, Function, Package, Operating Temperature, Target Processor.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
TPS65951A1ZGU
✅ Прямая замена✓ В наличии
$4.48 / шт.
Открыть даташит →TPS65950A1ZGUR
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
TPS65961A1ZGUR
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
TPS658640ZGUR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
TPS658640ZGUT
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
TPS65951A1ZGUR Характеристики
| Функция | Integrated Power Management IC + Audio Codec Silicon |
| Target Processor | OMAP application processor / modem |
| Диапазон входного напряжения | 2.7 V to 4.5 V |
| Battery Type | Li-ion / Li-ion polymer / cobalt-nickel-manganese cell |
| Audio Subsystem | Codecs, digital filters, input preamplifiers/amplifiers, Class-D output amplifiers |
| Корпус | 169-BGA MicroStar (12 x 12 mm), LFBGA |
| Number of Terminals | 169 |
| Тип монтажа | Surface Mount |
| Рабочая температура | -40C to +85C (industrial grade) |
| Application | Handheld / Mobile Devices |
Руководство по цоколевке TPS65951A1ZGUR в корпусе 169-bga microstar (12 x 12 mm), lfbga
Цоколевка для TPS65951A1ZGUR (корпус 169-bga microstar (12 x 12 mm), lfbga). Нумерация выводов, функции и схемы подключения определены в техническом описании производителя. Обратитесь к нему для точного посадочного места и рекомендаций по пайке.
Нет подробных данных о распиновке для TPS65951A1ZGUR.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
TPS65951A1ZGUR подходит для 6 применениеs: OMAP-Based Cellular Handsets, Voice and Multimedia Audio Subsystems, Li-ion / Li-Polymer Battery-Powered Portables, 3G/4G Modem Power Trees, Portable Media Players and Handheld Devices, Embedded Linux / Application Processor Boards.
OMAP-Based Cellular Handsets
The TPS65951A1ZGUR was designed specifically as the companion PMIC for TI OMAP application processors and modems in mobile cellular handsets. Its several buck converters and multiple LDOs generate the core, memory, and I/O rails with TI-optimized sequencing, while the 2.7 V to 4.5 V input connects directly to a single-cell Li-ion or Li-ion polymer battery. Placed next to the OMAP device and controlled over a serial interface, it removes discrete sequencing logic and dozens of discrete regulators, cutting board area and bring-up risk in handset power trees.
Рекомендуется
Voice and Multimedia Audio Subsystems
The integrated audio module - codecs, digital filters, input preamplifiers and amplifiers, and Class-D output amplifiers - lets one TPS65951A1ZGUR serve the entire handset voice and media audio chain. The codec path handles microphone capture and receiver playback, while the Class-D outputs drive a loudspeaker directly without a separate audio amplifier IC. This reduces BOM count and ensures the audio rails share the PMIC's clean regulated supplies; designers should budget LDO headroom so speaker playback current does not disturb sensitive analog rails.
Рекомендуется
Li-ion / Li-Polymer Battery-Powered Portables
Any single-cell battery product benefits from the TPS65951's direct 2.7 V to 4.5 V battery input, which covers fully charged (about 4.2 V), nominal, and end-of-discharge conditions of Li-ion, Li-ion polymer, and cobalt-nickel-manganese cells. The PMIC maintains regulation across this range without a front-end converter, improving conversion efficiency at mid-charge states. Pair it with a dedicated TI battery charger IC to form a complete charge-and-distribute power stage for handheld devices.
Рекомендуется
3G/4G Modem Power Trees
The TPS65951A1ZGUR can connect to a modem as well as an application processor, providing the sequenced rail set RF and baseband silicon requires. Its multiple LDOs supply noise-sensitive analog and RF blocks with low-ripple linear power, while the buck converters efficiently carry high-current digital rails. Sequencing controlled through the host interface ensures the modem powers up in the correct order for reliable registration - a key risk area in multi-rail modem designs that discrete solutions frequently get wrong.
Рекомендуется
Portable Media Players and Handheld Devices
Beyond cellular handsets, the combination of multi-rail power conversion and a full audio codec in one 12 x 12 mm 169-BGA makes the TPS65951A1ZGUR a compact fit for portable media players and general handheld electronics. One IC replaces the discrete PMIC-plus-audio-codec two-chip approach, reducing board area and assembly cost. Industrial temperature grading of -40C to +85C extends usability beyond consumer-only devices, supporting handheld instrumentation exposed to outdoor temperature extremes.
Рекомендуется
Embedded Linux / Application Processor Boards
Engineers porting OMAP-class application processors onto custom boards can use the TPS65951A1ZGUR to replicate the reference power tree, including processor core, memory, and peripheral rails, with hardware-managed sequencing. The I2C-controlled configuration lets firmware trim rail voltages and read status after boot, aiding power debugging. During layout, follow the TI data manual ball-fanout guidance: short wide traces from buck output balls to ceramic caps and solid ground connectivity under the 169-ball body are essential for clean rail transient response.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для TPS65951A1ZGUR — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | TPS65951A1ZGU | TPS65950A1ZGUR | TPS65961A1ZGUR | TPS658640ZGUR |
|---|---|---|---|---|---|
| Package | 169-BGA MicroStar (12x12 mm) | 169-BGA MicroStar (12x12 mm) - same | 169-BGA MicroStar (12x12 mm) - same footprint | 169-BGA MicroStar (12x12 mm) - same footprint | 169-BGA (ZGU) |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Target Processor | OMAP application processor / modem | OMAP application processor / modem | OMAP (earlier generation) | OMAP (later generation) | General-purpose application processors |
| Battery Chemistry Support | Li-ion / Li-ion polymer / Co-Ni-Mn cell | Same | Li-ion class | Li-ion class | Li-ion class |
| Packaging Delivery | Tape & Reel (R suffix) | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
Ключевые отличия
- Integrated audio codec with Class-D output amplifiers (против TPS658640ZGUR)
- OMAP-specific power sequencing (против TPS658640ZGUR)
- Direct single-cell battery input (против TPS658640ZGUR)
Заметки по проектированию
The 169-ball MicroStar BGA (0.8 mm-class pitch, 12 x 12 mm body) requires via-in-pad or dogbone fanout on the outer rows and careful ball-map planning before routing. Follow the TI TPS65951 data manual (170 pages) layout section: place ceramic input capacitors for each buck converter within 2-3 mm of their VIN balls, and provide a continuous ground plane under the package. Avoid routing noise-sensitive audio traces beneath buck converter switching loops.
The 2.7 V to 4.5 V input is a direct battery connection, so size traces and buck input capacitors for full battery transient events, including GSM-class transmit burst currents that can pull the cell below 3 V momentarily. Verify each LDO remains in regulation at 2.7 V worst-case input, and check dropout margins for rails set near the low end of the battery range before finalizing the power tree.
The integrated Class-D output amplifiers switch at high frequency and can couple into nearby microphone input traces and RF antennas. Keep Class-D speaker routing as a tight differential pair with return path, place ferrite filtering per the datasheet application section where EMI compliance is required, and separate the audio ground region from buck converter hot loops on the PCB stackup.
The TPS65951 is OMAP-generation-specific: its rail set and sequencing map to particular OMAP devices, so do not assume portability to other processors without a full rail-by-rail audit. Confirm the silicon revision (data manual Revision 1.0) against your firmware register expectations, and qualify any substitution (for example TPS65950 vs TPS65951) with a register-map and pinout diff, not just package comparison.
Информация о соответствии
RoHS/lead-free per standard TI manufacturing flow for this device as shown on distributor listings. Formal REACH, halogen-free, and conflict-minerals declarations should be requested from TI.com product page certificates.
