XC5VLX30-3FF676C - 30,720-Cell FPGA | AMD | Industrial
Артикул: XC5VLX30-3FF676C ✗ Снят с производстваXC5VLX30-3FF676C Обзор
A field-programmable gate array is a programmable-logic semiconductor that combines configurable logic blocks, programmable interconnect, input/output resources, and embedded memory into one reconfigurable device. Within the product hierarchy, an FPGA is a programmable-logic IC, a semiconductor, and a flexible alternative to a large fixed-function ASIC. It allows designers to implement parallel processing, protocol bridging, interface control, and high-speed digital logic in a single integrated circuit.
The XC5VLX30 includes 30,720 logic cells organized into 2,400 configurable logic blocks. Its 400 I/O pins provide substantial connectivity for external memory, data converters, networking interfaces, and control logic. The -3 suffix denotes the device's performance grade within the Virtex-5 LX ordering system, while the 676-ball package supports dense, high-pin-count board-level integration. The FCBGA construction also provides numerous short electrical connections for demanding digital routing requirements.
The XC5VLX30 is fabricated using 65 nm CMOS technology and is built around a 1 V core-voltage architecture. This combination supports high programmable logic density while preserving the operating characteristics expected from a high-performance FPGA family. Device interchangeability must still account for the speed grade, package suffix, temperature grade, and power requirements rather than treating every similarly numbered Virtex-5 device as electrically identical.
Typical applications include telecommunications line-card and switching equipment, industrial control systems, network interface equipment, high-speed test and measurement platforms, signal-processing installations, and embedded control systems requiring reconfigurable parallel logic. The large pin count is particularly useful when a design must connect several memory devices, high-speed transceivers, parallel buses, or multiple independent I/O interfaces.
PCB implementation requires careful attention to the 676-ball package geometry, power-plane continuity, decoupling, and high-speed signal routing. Follow the AMD Virtex-5 package pinout files for the exact ball assignments and differential-pair constraints. Verify the required configuration voltage, clock topology, memory interface routing, and thermal conditions in the applicable Virtex-5 device documentation before releasing a layout.
This page combines exact ordering information, a practical application view, same-footprint device alternatives, and design guidance for engineers evaluating the XC5VLX30-3FF676C in a new programmable-logic platform.
Аналоги без доработки для XC5VLX30-3FF676C — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
XC5VLX30-3FFG676C
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XC5VLX30-2FF676C
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Открыть даташит →XC5VLX30-1FF676C
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Открыть даташит →XC5VLX30-1FFG676C
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XC5VLX30-3FFV676C
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XC5VLX30-3FF676C Максимальные параметры и электрические характеристики
| Device Type | 1 Virtex-5 LX FPGA |
| Logic Cells | 30,720 cells |
| Configurable Logic Blocks | 2,400 CLBs |
| Maximum Frequency | 1,098 MHz |
| Input/Output Pins | 400 I/O pins |
| Core Voltage | 1 V |
| Process Technology | 65 nm CMOS |
| Package Type | 676-ball FCBGA |
| Package Code | FBGA-676 |
| Package Dimensions | 27 mm x 27 mm |
| Package Pin Count | 676 balls |
| Terminal Form | 1 ball surface-mount terminal |
| Способ монтажа | Surface mount |
| Lead-Free Status | Lead free |
| Device Family | 1 Virtex-5 LX family |
| Programmable Logic Type | 1 FPGA device |
Руководство по цоколевке XC5VLX30-3FF676C в корпусе 676 balls
Цоколевка для XC5VLX30-3FF676C (корпус 676 balls). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для XC5VLX30-3FF676C.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
XC5VLX30-3FF676C подходит для 6 применениеs: Telecommunications Line-Card Control, Industrial Control and Automation, Network Interface Equipment, Test and Measurement Platforms, High-Speed Signal Processing, Embedded Reconfigurable Control.
Telecommunications Line-Card Control
The XC5VLX30 fits telecommunications line-card control because its 2,400 configurable logic blocks can implement parallel switching, framing, aggregation, and control functions. The 400 I/O pins allow the device to connect directly to several backplane signals, memory interfaces, status buses, and network-facing logic. Its 1 V core architecture should be paired with correctly partitioned auxiliary and I/O supplies, while the 676-ball FCBGA provides the routing density required for high-performance line cards. Timing closure should be based on the -3 speed grade and actual I/O standards rather than the 1,098 MHz device-class figure alone.
Рекомендуется
Industrial Control and Automation
The AMD XC5VLX30-3FF676C is suitable for industrial automation controllers that combine deterministic parallel logic with numerous field-bus and I/O connections. Its 2,400 configurable logic blocks can host protocol engines, motion-control sequencing, safety interlocks, and machine-state logic in one programmable-logic device. The 400 available I/O pins reduce external glue logic when connecting sensors, actuators, encoders, and communications transceivers. Engineers should confirm the required temperature grade, select power rails for the core and I/O banks, and validate timing margins for every industrial interface before schematic release.
Рекомендуется
Network Interface Equipment
The XC5VLX30's combination of 30,720 logic cells and 400 I/O pins makes it appropriate for network-interface and packet-processing equipment. Parallel datapaths can implement framing, classification, buffering control, traffic management, and interface adaptation while the FPGA handles timing-sensitive logic adjacent to external PHYs. The 676-ball FCBGA reduces package count compared with several smaller devices, but it demands fine-pitch assembly and careful length matching. Designers should use the package pinout files to locate dedicated clock and I/O resources and should complete signal-integrity analysis on every high-speed interface.
Рекомендуется
Test and Measurement Platforms
In automated test equipment, the XC5VLX30-3FF676C can implement parallel acquisition logic, trigger generation, sequence control, pattern processing, and instrument-bus management. Its 2,400 configurable logic blocks offer substantial parallelism for coordinating multiple channels, while 400 I/O pins support external converters, memories, and synchronization logic. The 65 nm CMOS implementation is appropriate for fixed-function high-speed control within an FPGA-based platform. Power sequencing, auxiliary supply requirements, and clock jitter must be validated with the device documentation, especially where the instrument combines analog measurement circuitry with the FPGA.
Рекомендуется
High-Speed Signal Processing
The AMD XC5VLX30-3FF676C can implement parallel digital signal-processing pipelines, adaptive filters, correlation functions, and real-time data transformation. Its 30,720 logic cells support parallel lanes and arithmetic datapaths, and its 400 I/O pins allow direct connection to converters, memory, and custom interface logic. The -3 performance grade is the appropriate starting point for designs requiring greater timing margin than the -1 or -2 grades. Actual throughput remains dependent on architecture, clocking, memory interfaces, and routing, so designers should use post-place-and-route timing results rather than the listed maximum frequency as a system-level guarantee.
Рекомендуется
Embedded Reconfigurable Control
The XC5VLX30-3FF676C supports embedded control systems that benefit from reconfigurable hardware, parallel peripheral emulation, and programmable timing. Its configurable logic blocks can accelerate deterministic control tasks while the surrounding processor or subsystem manages configuration, diagnostics, and supervisory functions. The 400 I/O pins provide ample connectivity for encoders, counters, communication links, and custom accelerators. Because the FCBGA package has 676 balls and measures 27 mm by 27 mm, board designers should plan fine-pitch assembly, dense via-in-pad structures where permitted, multilayer power distribution, and full BGA inspection coverage.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для XC5VLX30-3FF676C — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | XC5VLX30-3FFG676C | XC5VLX30-2FF676C | XC5VLX30-1FF676C | XC5VLX30-1FFG676C | XC5VLX30-3FFV676C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-ball FCBGA | 676-ball FCBGA - same package family | 676-ball FCBGA - same package family | 676-ball FCBGA - same package family | 676-ball FCBGA - same package family | 676-ball FCBGA - same package family |
| Logic Cells | 30,720 cells | 30,720 cells | 30,720 cells | 30,720 cells | 30,720 cells | 30,720 cells |
| Configurable Logic Blocks | 2,400 CLBs | 2,400 CLBs | 2,400 CLBs | 2,400 CLBs | 2,400 CLBs | 2,400 CLBs |
| Speed Grade | -3 | -3 | -2 | -1 | -1 | -3 |
| Process Technology | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
Ключевые отличия
- Highest listed performance grade within the compared Virtex-5 LX-30 options (против XC5VLX30-2FF676C)
- Retains the complete 30,720-cell configuration (против XC5VLX30-3FFG676C)
- Higher performance grade than lower-speed family alternatives (против XC5VLX30-1FF676C)
Заметки по проектированию
Use the AMD Virtex-5 package device pinout file for the exact 676-ball assignment before routing the PCB. Separate the 1 V core rail from auxiliary and I/O supplies, provide local high-frequency decoupling at supply balls, and avoid placing sensitive routes beneath switching or high-current paths. The 27 mm by 27 mm FCBGA requires assembly capability suitable for fine-pitch BGA inspection and rework.
Assign external clock, differential I/O, and memory interfaces according to the package and device constraints rather than treating all 400 user I/O pins as electrically identical. Match external clock and data traces to the selected interface standard, maintain continuous reference planes, and use the design tool's timing analysis to verify setup and hold margins. The listed 1,098 MHz maximum is a device-class figure, not a guarantee for every implemented path.
Plan power-up and configuration sequencing across the core, auxiliary, and I/O domains. Follow the manufacturer's recommended supply topology and decoupling values, and confirm the current required by the selected configuration and I/O state. Avoid enabling outputs prematurely during configuration, because an undriven or incorrectly powered I/O bank can compromise system reliability or damage adjacent circuitry.
Do not substitute between XC5VLX30 ordering suffixes based only on the family name. Compare the -3 speed designation, final package suffix, temperature grade, lead-free status, and exact ballout. Similarly, do not interpret 30,720 logic cells as guaranteed usable registers or block RAM; synthesis utilization depends on the design architecture, resource mix, clocking, and timing constraints.
Информация о соответствии
The device listing identifies the XC5VLX30-3FF676C as lead free. RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals classifications require confirmation from the applicable manufacturer documentation.