AMD

XC6SLX4-3CSG225I - 3840-Cell Spartan-6 FPGA | AMD

Артикул: XC6SLX4-3CSG225I ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
1.2 V Vdss 225-LFBGA CSBGA Package
От $8.8025 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-21
Оптовые цены
Кол-во Цена за ед. Итого
1 $8.8025 $8,80
10 $8.8025 $88,03
100 $8.8025 $880,25
500 $8.8025 $4.401,25
1.000 $8.8025 $8.802,50
ℹ️ Все цены указаны в USD

XC6SLX4-3CSG225I Обзор

The AMD/Xilinx XC6SLX4-3CSG225I is a 3,840-logic-cell Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology and packaged in a 225-ball CSBGA. The -3 performance grade targets demanding timing, while the industrial I suffix identifies the industrial temperature grade. Verified distributor data identifies 132 DSP slices and 221,184 registers, making the device suitable for compact parallel processing, control, signal conditioning, and communications designs.

A field-programmable gate array is a semiconductor whose logic, interconnects, and digital signal-processing resources are configured after manufacture. An FPGA belongs to the broader programmable-logic hierarchy and combines configurable logic blocks with programmable routing. Compared with a fixed application-specific integrated circuit, an FPGA supports design revision, shorter hardware-development cycles, and adaptation to changing algorithms without changing the PCB.

The Spartan-6 family is positioned for low-cost, high-volume embedded systems. Verified data places the XC6SLX4 part within a 45 nm low-power copper process family that emphasizes system integration and power efficiency. The device provides 3,840 logic cells, 221,184 registers, and 132 DSP slices, allowing parallel arithmetic and fixed-point pipelines to be implemented in programmable fabric rather than in external accelerators.

The CSG225 package exposes 225 terminals in a square ball-grid format. Package-specific pin data is available through AMD's Spartan-6 package pinout resources, but the supplied verified data does not include a trustworthy complete 225-ball signal assignment. Designers must therefore use the official package ASCII files and device-specific pin constraints during layout and PCB design.

Typical uses include industrial control, data acquisition, embedded vision, communications gateways, instrumentation, and compact digital signal-processing systems. The -3 speed grade can improve timing margin over slower Spartan-6 grade options when a design approaches its clock-frequency limits, although timing closure still depends on the architecture, interconnect congestion, I/O standards, and selected tool version.

When planning a board, follow AMD's CSG225 package files, verify every power rail and I/O standard, and reserve programming, configuration, clock, and decoupling resources before routing. The supplied evidence identifies a 1.2 V technology level but does not provide a complete recommended power-supply or decoupling table; those values must be taken from the manufacturer datasheet rather than inferred.

Аналоги без доработки для XC6SLX4-3CSG225I — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с XC6SLX4-3CSG225I (тот же форм-фактор и посадочное место) — отличается по Device Type, Package, Logic Cells, Temperature Grade.

AMD
Device Type: Field Programmable Gate Array (FPGA)
Package: 225-CSBGA / 225-LFBGA CSPBGA
Logic Cells: 3840 cells
Сравнить с XC6SLX4-3CSG225I →
AMD
Device Type: Spartan-6 LX field-programmable gate array (FPGA)
Package: 225-CSBGA
Сравнить с XC6SLX4-3CSG225I →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

XC6SLX4-2CSG225I

✅ Прямая замена
AMD
📦 225-LFBGA CSBGA
Spartan-6 LX field-programmable gate array (FPGA) · 3,840 cells · 132 I/O · 375 MHz · 45 nm CMOS · 1.14 V to 1.26 V · 225-CSBGA · CSG225

✓ В наличии

Уточнить цену

Открыть даташит →

XC6SLX4-3CSG225C

✅ Прямая замена
📦 225-LFBGA CSBGA
Temperature suffix changes from industrial I to commercial C; verified comparison data confirms 3,840 cells, 45 nm CMOS, 1.2 V, and 225-pin CSBGA.

📋 Справочный аналог (нет в каталоге)

XC6SLX4-2CSG225C

✅ Прямая замена
AMD
📦 225-LFBGA CSBGA
Field Programmable Gate Array (FPGA) · Spartan-6 LX · 3840 cells · 132 I/O · 225-CSBGA / 225-LFBGA CSPBGA · 225 pins · 45 nm CMOS · -2

✓ В наличии

Уточнить цену

Открыть даташит →

XC6SLX9-3CSG225I

✅ Прямая замена
📦 225-LFBGA CSBGA
Same -3 grade, I suffix, and CSG225 package are indicated, but Spartan-6 LX9 provides more logic resources than the XC6SLX4; exact pin compatibility requires AMD package-file validation.

📋 Справочный аналог (нет в каталоге)

XC6SLX16-3CSG225I

✅ Прямая замена
📦 225-LFBGA CSBGA
Same -3 grade, I suffix, and CSG225 package are indicated, while logic capacity increases from the XC6SLX4's 3,840 cells to the LX16 density; migration requires tool validation.

📋 Справочный аналог (нет в каталоге)

XC6SLX25-3CSG225I

✅ Прямая замена
📦 225-LFBGA CSBGA
Same -3 grade, I suffix, and CSG225 package are indicated, while LX25 has substantially greater logic capacity than 3,840 cells; replacement is migration-dependent.

📋 Справочный аналог (нет в каталоге)

XC6SLX4-3CSG225I Максимальные параметры и электрические характеристики

Device Type Spartan-6 LX FPGA
Logic Cells 3,840 cells
Registers 221,184 registers
DSP Slices 132 slices
Process Technology 45 nm CMOS
Core Technology Voltage 1.2 V
Корпус 225-LFBGA CSBGA
Terminal Count 225 terminals
Package Shape Square BGA
Temperature Grade Industrial
Performance Grade -3
Device Family Spartan-6
Series Spartan-6 LX
Programmability Field-programmable logic
Logic Resource Density 3,840 logic cells
DSP Resource Density 132 DSP slices
Package Mounting Type Surface-mount BGA
Manufacturer AMD/Xilinx

Руководство по цоколевке XC6SLX4-3CSG225I в корпусе surface-mount bga

Цоколевка для XC6SLX4-3CSG225I (корпус surface-mount bga). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса surface-mount bga для XC6SLX4-3CSG225I

Нет подробных данных о распиновке для XC6SLX4-3CSG225I.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

XC6SLX4-3CSG225I подходит для 6 применениеs: Industrial Data Acquisition, Embedded Signal Processing, Communications Gateway, Programmable Logic Controller, Test and Measurement Front End, LED and Display Control.

🏭

Industrial Data Acquisition

XC6SLX4-3CSG225I fits compact industrial acquisition systems that combine parallel digital control with modest preprocessing. Its verified 3,840 logic cells and 221,184 registers can implement acquisition state machines, filtering, thresholding, and data packing, while 132 DSP slices accelerate multiply-accumulate operations. The industrial I grade aligns with factory equipment, subject to system-level EMC, temperature, isolation, and qualification requirements. Place programmable logic close to converters and interface devices to reduce timing uncertainty and keep wide buses traceable. Validate all pins against AMD's CSG225 package ASCII file before assigning I/O standards or planning the board footprint.

⚙️

Embedded Signal Processing

The 132 DSP slices in XC6SLX4-3CSG225I make it suitable for fixed-point filtering, modulation, correlation, and real-time control pipelines without relying entirely on external processors. Its 221,184 registers provide substantial state and sample-storage capacity for logic-based pipelines, although external RAM may still be required for deeper buffers. Engineers can parallelize arithmetic across DSP slices and connect control logic through programmable routing. Timing closure depends heavily on architecture and routing congestion, so post-synthesis estimates should be checked against the -3 target constraints before board release.

🌐

Communications Gateway

XC6SLX4-3CSG225I can implement protocol adaptation, framing, CRC, buffering, and low-rate communications logic in an embedded gateway. Its 3,840 logic cells are sufficient for concurrent state machines and bus bridges when the design does not require hard processors or very high serial bandwidth. The industrial suffix suits factory-floor equipment, while the 225-ball CSBGA supports dense board routing. Clock-domain crossing, I/O voltage standards, pin assignments, and configuration scheme must be planned together; use the official package files rather than treating another Spartan-6 density as automatically pin-compatible.

🔧

Programmable Logic Controller

XC6SLX4-3CSG225I is appropriate for compact PLC and machine-control modules requiring parallel logic, timing, counters, and hardware interfaces. Logic cells and registers can implement deterministic control pipelines, while DSP resources are available for selected motion or signal calculations. The industrial-grade suffix supports deployment in equipment with controlled environmental conditions, but it does not by itself establish functional safety, EMC, or automotive qualification. Engineers should isolate external interfaces, account for I/O tolerances, and validate timing against the industrial temperature range used in the project.

📟

Test and Measurement Front End

XC6SLX4-3CSG225I can coordinate calibration, trigger logic, sample capture, and digital correction in an instrumentation front end. Its FPGA fabric supports flexible timing and test-sequence changes, while 132 DSP slices can accelerate filtering and compensation calculations. Designers should establish clock jitter, trace impedance, grounding, and analog-isolation requirements before assigning FPGA pins. The verified data does not provide a complete recommended decoupling network or operating-temperature limits, so those details must be obtained directly from the AMD family documentation before schematic release.

📺

LED and Display Control

XC6SLX4-3CSG225I can implement refresh timing, pixel mapping, pattern generation, and display sequencing for compact visual systems. Parallel programmable outputs make it useful when timing must be deterministic and display content must change without changing hardware. Logic cells can manage video timing while registers hold scan or frame state; external memory or panel drivers may be needed for larger images. Confirm LVDS or other interface electrical requirements, pin constraints, and panel loading before layout. The 225-ball package also requires careful escape routing and assembly-capable BGA design practices.

Сводка рекомендуемых товаров

Where can I buy XC6SLX4-3CSG225I online?
XC6SLX4-3CSG225I can be purchased from authorized electronics distributors such as DigiKey, Mouser, LCSC, and specialist FPGA suppliers. DigiKey and Mouser list the part as an AMD/Xilinx FPGA, while LCSC reports an in-stock listing starting at $8.8025 as of 2026-10-22. Buyers should confirm authorized status, date code, warranty, and current inventory before placing an order.
What is the price of XC6SLX4-3CSG225I?
The verified LCSC listing for XC6SLX4-3CSG225I starts at $8.8025 per unit as of 2026-10-22. DigiKey and Mouser provide quotation and purchasing pages, but their snippets do not expose numeric prices. Consequently, the provided pricing tiers retain the verified $8.8025 reference at quantities 1, 10, 100, 500, and 1000 rather than inventing volume discounts.
Is XC6SLX4-3CSG225I in stock?
LCSC explicitly labels XC6SLX4-3CSG225I in stock in the supplied search result, so that listing represents current availability as of 2026-10-22. DigiKey states that the component ships today and Mouser provides an inventory and pricing page. Stock is volatile, however, and production, industrial, and automotive programs should request a written supply commitment before treating distributor inventory as sufficient.
What are the key specifications of XC6SLX4-3CSG225I?
The XC6SLX4-3CSG225I contains 3,840 logic cells, 221,184 registers, and 132 DSP slices in a 225-LFBGA CSBGA package. Verified family information identifies 45 nm CMOS fabrication and a 1.2 V technology level. Its -3 suffix denotes the performance grade, while I denotes the industrial temperature grade. Full electrical limits and timing tables must be obtained from the manufacturer datasheet.
Where can I download the XC6SLX4-3CSG225I datasheet PDF?
A directly accessible XC6SLX4-3CSG225I datasheet PDF is available through Datasheet.Technology, while the general XC6SLX4 family documentation is also indexed by AllDatasheet. AMD's official Spartan-6 package pinout page provides authoritative ASCII package files for board-layout work. Use manufacturer documentation for released design constraints, and treat third-party mirrors as convenient access copies.
Where can I find the XC6SLX4-3CSG225I pinout?
The authoritative pinout location is AMD's Spartan-6 Package Device Pinout Files page, which provides package files in ASCII format. The verified component data identifies the device as a 225-terminal CSBGA but does not enumerate all 225 ball assignments. Designers should not infer ball locations from the five-digit MPN; use the package file for XC6SLX4 CSG225 and cross-check the selected I/O standards.
What can replace XC6SLX4-3CSG225I?
The closest verified same-footprint replacement is XC6SLX4-2CSG225I, which retains the XC6SLX4 device, 3,840 logic cells, 225-LFBGA package, and industrial-grade ordering code while changing the performance grade from -3 to -2. It is suitable only when the original design closes timing at the slower grade. Larger Spartan-6 devices in the same package are not automatic drop-in replacements because their resources and configuration may differ.
Is XC6SLX4-2CSG225I the same as XC6SLX4-3CSG225I?
No. XC6SLX4-2CSG225I and XC6SLX4-3CSG225I share the Spartan-6 LX XC6SLX4 identity and 225-LFBGA package, but their -2 and -3 performance grades differ. The -3 target offers the higher timing grade, so replacing it with -2 can reduce available timing margin. Confirm all constraints and rerun implementation and timing analysis before approving the substitution.
When should I choose XC6SLX4-3CSG225I instead of XC6SLX4-2CSG225I?
Choose XC6SLX4-3CSG225I when the design requires the faster -3 Spartan-6 performance grade or lacks margin when implemented for -2. The verified listings confirm that XC6SLX4-2CSG225I shares the 3,840-cell XC6SLX4 family identity and 225-LFBGA format, making board reuse practical. Nevertheless, package sameness does not guarantee timing equivalence, so critical interfaces must be analyzed with the actual synthesis result.
Is XC6SLX4-3CSG225I suitable for industrial applications?
XC6SLX4-3CSG225I carries the I ordering suffix, and a verified component listing identifies it as industrial grade. It is therefore aligned with industrial-temperature designs when all other electrical and qualification requirements are satisfied. The supplied data does not explicitly state RoHS, REACH, or AEC-Q100 status, so those compliance claims must not be inferred from the industrial suffix.
What is the difference between XC6SLX4-3CSG225I and XC6SLX4-3CSG225C?
The verified comparison data describes XC6SLX4-3CSG225I as a 3,840-cell, 45 nm Spartan-6 FPGA in a 225-pin CSBGA, while XC6SLX4-3CSG225C uses the C commercial-grade suffix. Their package and device resources align, but their temperature grades differ. A mechanical replacement may fit the PCB, yet commercial-versus-industrial suitability must match the deployment environment and qualification requirements.
What is the best AMD/Xilinx equivalent for XC6SLX4-3CSG225I?
XC6SLX4-2CSG225I is the best verified same-footprint alternative because it preserves the XC6SLX4 resource level and 225-LFBGA package while changing only the visible performance grade. It is not a perfect functional equivalent for timing-sensitive designs. XC6SLX9, XC6SLX16, and XC6SLX25 parts listed by one search result have more logic resources and should not be treated as drop-in replacements without a complete design and tool compatibility review.
What are the main uses of a 3,840-cell Spartan-6 FPGA?
A 3,840-cell Spartan-6 FPGA is useful for compact control, data acquisition, parallel logic, communications, instrumentation, and embedded signal-processing designs. The verified XC6SLX4 configuration includes 132 DSP slices, enabling parallel multiply-accumulate pipelines alongside programmable control logic. Device selection still depends on I/O count, clock requirements, timing closure, memory resources, tool support, and long-term procurement.
How many logic cells, DSP slices, and terminals does XC6SLX4-3CSG225I have?
XC6SLX4-3CSG225I provides 3,840 logic cells, 132 DSP slices, and 225 terminals. The same verified distributor description identifies 221,184 registers and a 225-LFBGA CSBGA package. These values place the part in the compact Spartan-6 LX FPGA class and allow preliminary resource budgeting before the design is entered into the appropriate AMD implementation tools.
Can a 225-LFBGA Spartan-6 FPGA replace XC6SLX4-3CSG225I without PCB changes?
A mechanical PCB match is possible only when the replacement is the same XC6SLX4 device in the same 225-LFBGA package and has acceptable electrical and timing characteristics. Verified search results list XC6SLX4-2CSG225I as the nearest candidate, but its slower performance grade may fail timing. Package match alone is insufficient; configuration compatibility, pin constraints, power behavior, and timing must also be checked.

Справочные инженерные данные для XC6SLX4-3CSG225I — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose XC6SLX4-3CSG225I for compact FPGA designs that specifically need the -3 performance grade and industrial-temperature ordering option. XC6SLX4-2CSG225I is the closest verified mechanical alternative when slower timing is acceptable, but timing must be revalidated. XC6SLX4-3CSG225C shares the -3 grade and package but changes the temperature grade to commercial, so it is inappropriate when industrial conditions are required. XC6SLX4-2CSG225C combines both slower performance and commercial-grade differences. The LX9, LX16, and LX25 alternatives may provide more capacity in CSG225, but larger Spartan-6 devices are migration candidates rather than automatically equivalent replacements. Confirm the official ball map, power architecture, I/O standards, configuration method, timing closure, tool support, lifecycle commitment, and long-term supply before approval.

Сравнение с аналогами

Параметр Этот товар XC6SLX4-2CSG225I XC6SLX4-3CSG225C XC6SLX4-2CSG225C XC6SLX9-3CSG225I XC6SLX16-3CSG225I
Brand AMD AMD AMD AMD AMD AMD
Package 225-LFBGA CSBGA 225-LFBGA CSBGA 225-LFBGA CSBGA 225-LFBGA CSBGA 225-pin CSBGA 225-pin CSBGA
Performance Grade -3 -2 -3 -2 -3 -3
Temperature Grade Industrial I Industrial I Commercial C Commercial C Industrial I Industrial I
Device Family Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX
Special Qualification Industrial grade; AEC-Q100 status unknown Industrial grade; AEC-Q100 status unknown Commercial grade; AEC-Q100 status unknown Commercial grade; AEC-Q100 status unknown Industrial grade; AEC-Q100 status unknown Industrial grade; AEC-Q100 status unknown

Ключевые отличия

  • Faster -3 performance grade within the same XC6SLX4 resource baseline (против XC6SLX4-2CSG225I)
  • Industrial temperature-grade ordering option (против XC6SLX4-3CSG225C)
  • Balanced resource density for compact parallel processing (против XC6SLX16-3CSG225I)

Заметки по проектированию

Do not assign CSG225 ball numbers from memory. AMD's Spartan-6 Package Device Pinout Files page provides the authoritative ASCII package data for board layout. Download the XC6SLX4 CSG225 file, select the exact device and package in the implementation flow, and cross-check every migration candidate. This is especially important for the LX9, LX16, and LX25 alternatives, whose larger resource sets can alter usable pin assignments even when the mechanical package matches.

Treat XC6SLX4-2CSG225I as a timing-sensitive substitution, not an unconditional drop-in replacement. It preserves the verified 3,840-cell XC6SLX4 identity and 225-LFBGA package, but the -2 performance grade is slower than -3. After conversion, rerun synthesis, implementation, static timing, and bitstream generation. Likewise, changing the I industrial suffix to C removes the original temperature-grade alignment and can invalidate the deployment requirement.

Preserve BGA assembly constraints and power-plane continuity when laying out the 225-ball package. The supplied data confirms CSBGA construction but does not provide ball pitches, stack-up recommendations, via rules, or the manufacturer decoupling network. Obtain those values from official AMD documentation rather than estimating them. Keep sensitive clock and configuration paths short, and avoid routing high-speed interfaces through fragmented power or ground planes.

Do not infer a complete regulator design from the verified 1.2 V technology voltage. The target requires separate planning for core and I/O supplies, sequencing, tolerances, transient response, and current based on utilization and speed grade. Those limits were not included in the supplied data. Use the Spartan-6 family datasheet and the exact device power report, then validate the selected regulators and decoupling against worst-case industrial conditions.

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Без свинца
Unknown
Без галогенов
Unknown
Конфликтные минералы
Unknown

The supplied sources identify the device as an industrial-grade AMD/Xilinx Spartan-6 FPGA but do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Compliance must be confirmed from current AMD documentation.

Данные проверены: 2026-10-22 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

AMD AMD/Xilinx XC6SLX4-3CSG225I XC6SLX4-2CSG225I XC6SLX4-3CSG225C XC6SLX4-2CSG225C XC6SLX9-3CSG225I XC6SLX16-3CSG225I XC6SLX25-3CSG225I Spartan-6 Spartan-6 LX Field-programmable gate array FPGA Programmable logic FPGA & CPLD 45 nm CMOS 1.2 V 3,840 logic cells 221,184 registers 132 DSP slices 225-LFBGA CSBGA Industrial temperature grade Digital signal processing
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