XC6SLX75T-3FG676I - Spartan-6 LXT FPGA | Xilinx
Артикул: XC6SLX75T-3FG676I ✓ АктивенXC6SLX75T-3FG676I Обзор
An FPGA is a semiconductor whose digital logic, I/O paths, memory blocks, and embedded processing elements are configured after manufacture. The Spartan-6 LXT family combines programmable logic with dedicated DSP blocks, block RAM, clock management, and high-speed serial transceivers. This hierarchy places the XC6SLX75T within FPGA and CPLD devices, programmable-logic semiconductors, and the broader embedded-computing market.
The -3 speed grade provides the highest performance among the Spartan-6 LXT speed grades identified for this family. Its 74,637 logic cells and 348 I/Os make it suitable for interfaces, control logic, image processing, industrial automation, communications bridging, and embedded signal-processing systems. The 5,831 CLBs provide substantial parallel-processing capacity, while the 667 MHz internal frequency supports demanding synchronous designs and clocked interfaces.
The 676-pin FCBGA construction provides a high pin count for external memory, parallel buses, high-speed I/O, and dedicated transceiver connections. The 45 nm CMOS process combines relatively high programmable-logic density with low-cost implementation. Spartan-6 devices are also recognized for integrated system connectivity, including high-speed serial transceivers, memory controllers, DSP processing, and Ethernet-related interface capabilities.
Typical applications include industrial control systems, automotive infotainment interfaces, network-bridge designs, video-processing pipelines, test equipment, and embedded communications equipment. The 348 I/Os are especially useful when a design needs multiple parallel buses, control signals, external memory interfaces, or several differential links in one device.
Design work should begin with the 676-ball package pinout, power rails, decoupling requirements, configuration interface, clocking plan, and pin-speed constraints. Signal-integrity checks are particularly important for high-speed transceiver links, while power sequencing and thermal analysis should be completed before layout release. Validate the selected bitstream, I/O standards, and timing constraints on hardware representative of the production design.
This product page combines package, logic-density, speed-grade, and I/O information with practical configuration guidance and drop-in comparison options. It is intended to help engineers shorten device selection, footprint review, migration, and design-planning time before consulting the complete AMD/Xilinx Spartan-6 device documentation.
Аналоги без доработки для XC6SLX75T-3FG676I — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с XC6SLX75T-3FG676I (тот же форм-фактор и посадочное место) — отличается по Device Type, Speed Grade, I/O Count, Operating Temperature, Package.
XC6SLX75T-3FGG676C
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XC6SLX75T-2FG676C
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XC6SLX75T-4FGG676C
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XC6SLX75-2FGG676I
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Открыть даташит →XC6SLX75-3FG676I
✅ Прямая заменаУточнить цену
Открыть даташит →XC6SLX75T-2FGG676I
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XC6SLX75T-3FG676I Максимальные параметры и электрические характеристики
| Device Type | Spartan-6 LXT Field Programmable Gate Array |
| Logic Cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs |
| Internal Frequency | 667 MHz |
| I/O Count | 348 I/Os |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Корпус | 676-pin FCBGA |
| Package Dimensions | 27 x 27 mm |
| Package Pitch | 1.0 mm |
| Speed Grade | -3 |
| Рабочая температура | 0°C to 85°C |
| Тип монтажа | Surface Mount |
| Статус RoHS | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
Руководство по цоколевке XC6SLX75T-3FG676I в корпусе 1.0 mm
Цоколевка для XC6SLX75T-3FG676I (корпус 1.0 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для XC6SLX75T-3FG676I.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
XC6SLX75T-3FG676I подходит для 6 применениеs: Industrial Control and Automation, Automotive Infotainment Bridge, High-Speed Network Interface, Video and Image Processing Pipeline, DSP and Digital Signal Processing, Test and Measurement Equipment.
Industrial Control and Automation
The XC6SLX75T-3FG676I fits industrial controllers that combine machine-control sequencing with parallel sensor and actuator interfaces. Its 348 I/Os provide substantial connectivity for field-bus transceivers, digital I/O modules, encoders, and discrete control signals, while 74,637 logic cells support state machines, protocol handling, and safety-adjacent monitoring logic. The 0°C to 85°C operating range matches the stated industrial temperature class. Engineers should map each I/O standard and power requirement in the exact package file, then verify timing for the selected -3 speed grade. This device is appropriate when one programmable-logic fabric must consolidate functions that would otherwise require several CPLDs and glue logic.
Рекомендуется
Automotive Infotainment Bridge
The XC6SLX75T-3FG676I can implement the programmable logic bridge between automotive infotainment subsystems, where multiple legacy interfaces and video-related data paths must be coordinated. Its 5,831 CLBs and 348 I/Os are suitable for protocol conversion, control routing, and parallel data aggregation, while the 667 MHz internal frequency supports demanding synchronous logic. The -3 speed grade is useful where timing margins are constrained, but automotive production requires separate qualification review of the exact ordering code. Engineers should use the official 676-pin package data for ball assignment, verify transceiver I/O standards, and complete signal-integrity analysis on every high-speed link before hardware release.
Рекомендуется
High-Speed Network Interface
The XC6SLX75T-3FG676I is suitable for network-interface and bridging designs that need extensive parallel logic alongside high-speed serial connectivity. The 348 I/Os can support data buses, control signals, clocks, status indicators, and PHY or transceiver interfaces, while 74,637 logic cells accommodate packet processing, buffering, and protocol state machines. Use the device when deterministic FPGA fabric can simplify a multi-interface pipeline compared with an assembly of fixed-function components. Before layout, verify the specific Spartan-6 transceiver pins, supported I/O standards, clock topology, and reference-circuit requirements from the official documentation. Signal-integrity simulation and eye-diagram testing are especially important where externally exposed links cross connector or PCB boundaries.
Рекомендуется
Video and Image Processing Pipeline
The XC6SLX75T-3FG676I can implement parallel video timing, pixel transport, color conversion, and control pipelines where programmable parallelism is more useful than a fixed image engine. Its 74,637 logic cells and 348 I/Os provide ample resources for wide data paths and timing generators, with the 667 MHz internal frequency supporting synchronous pipeline stages. The architecture is appropriate for camera-adapter boards, industrial vision preprocessing, display-format conversion, and test equipment. Power, clock, and exposed-interface performance can vary by I/O standard and speed grade, so engineers must consult the exact device constraints. Use source-clock and data-clock relationships carefully, constrain every interface, and verify panel or sensor timing with representative hardware rather than relying only on simulation.
Рекомендуется
DSP and Digital Signal Processing
The XC6SLX75T-3FG676I suits parallel DSP, filtering, modulation, and real-time signal-processing implementations that benefit from dedicated Spartan-6 LXT resources combined with general programmable logic. The 5,831 CLBs can implement datapaths, control logic, and interfaces, while the 667 MHz internal frequency provides a high-speed foundation for synchronous arithmetic pipelines. Designers can partition a design between DSP blocks and logic fabric instead of implementing every operation in soft logic. Exact DSP-block count, memory capacity, and multiplier performance depend on the device-level documentation and should be checked against the selected resource configuration. Validate numerical accuracy, pipeline latency, overflow behavior, and clock-domain boundaries in simulation before reserving physical resources on the 676-pin FCBGA.
Рекомендуется
Test and Measurement Equipment
The XC6SLX75T-3FG676I is appropriate for programmable test systems requiring concurrent acquisition logic, pattern generation, timing control, and communications. Its 348 I/Os support dense fixtures and parallel DUT interfaces, while 74,637 logic cells enable reusable timing engines, trigger logic, analysis pipelines, and protocol checkers. The -3 speed grade can improve timing margin in instrumentation designs, although actual throughput remains constrained by the selected I/O standards, board topology, and memory interfaces. Engineers should isolate sensitive analog paths, keep switching clocks away from precision inputs, and use controlled clocking for deterministic acquisition. Validate the complete configuration and timing budget on production-representative hardware, including power cycling, boundary-scan access, and high-temperature operation across the stated 0°C to 85°C range.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для XC6SLX75T-3FG676I — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | XC6SLX75T-3FGG676C | XC6SLX75T-2FG676C | XC6SLX75T-4FGG676C | XC6SLX75-2FGG676I | XC6SLX75-3FG676I | XC6SLX75T-2FGG676I |
|---|---|---|---|---|---|---|---|
| Package | 676-pin FCBGA, 27 x 27 mm, 1.0 mm pitch | 676-pin package - same class | 676-pin package - same class | 676-pin package - same class | 676-pin package - same class | 676-pin package - same class | 676-pin package - same class |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Device Family | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT |
| Speed Grade | -3 | -3 | -2 | -4 | -2 | -3 | -2 |
| Temperature Suffix | I - industrial, 0°C to 85°C | C - commercial | C - commercial | C - commercial | I - industrial | I - industrial | I - industrial |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
Ключевые отличия
- Highest-performance listed LXT speed grade (против XC6SLX75T-2FG676C)
- Industrial temperature coverage (против XC6SLX75T-3FGG676C)
- High-density pin and logic resource balance (против XC6SLX75-2FGG676I)
- Exact industrial-grade ordering route (против XC6SLX75T-4FGG676C)
Заметки по проектированию
Begin PCB layout with the exact 676-pin package files rather than a generic Spartan-6 drawing. The XC6SLX75T-3FG676I uses a 27 x 27 mm FCBGA with 1.0 mm pitch, so fanout, escape routing, via-in-pad strategy, and solder-mask-defined versus solder-mask-defined land patterns must match the selected assembly process. Separate power and ground planes according to the manufacturer pinout, and route configuration pins away from high-speed serial nets to reduce simultaneous-switching noise and accidental configuration disturbance.
Implement the power architecture around the device-specific 1.2 V core requirement and all external supply rails defined in the official documentation. Place bulk, intermediate, and high-frequency decoupling capacitors at their designated pins with very short ground paths. Validate voltage sequencing, startup behavior, current transients, and power-source impedance in simulation; use the -3 speed grade timing results only after confirming that the selected regulator and thermal design sustain the required activity-dependent current.
Treat every high-speed interface as a constrained signal path. Use the package assignment to identify dedicated transceiver and clock pins, keep differential pairs symmetrical, provide continuous reference planes, and control impedance through the complete stack-up. Add receiver and transmitter terminations exactly as required by the selected I/O standard. Post-layout extraction should verify crosstalk, loss, skew, and eye margin rather than relying only on schematic-level timing.
Do not confuse XC6SLX75T-3FG676I with XC6SLX75T-3FGG676C, XC6SLX75T-2FG676C, or the non-T ordering code. The G characters and final temperature suffix affect ordering, qualification, and potentially package assignment even though several candidates are listed in the same 676-pin class. Before substitution, compare the ordering guide, pinout file, speed grade, temperature range, power limits, configuration interface, and lifecycle status. Re-run timing and bitstream generation after every approved change.
Estimate FPGA junction temperature from actual design utilization, switching activity, I/O activity, ambient temperature, and the package thermal model. The 676-pin FCBGA can require dense via arrays and controlled copper spreading to move heat away from the die. Do not assume that a tray-based handling method defines the assembled thermal performance; test the final PCB, enclosure, airflow, and adjacent heat sources. Apply thermal derating wherever the operating environment approaches the stated 85°C upper limit.
Информация о соответствии
The device is an industrial-temperature Spartan-6 LXT FPGA, but no explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations appear in the cited technical records. Confirm the current declarations and automotive qualification status with AMD/Xilinx for the exact ordering code.