XCZU2CG-1SBVA484E - Zynq UltraScale+ MPSoC, 103K+ LC, 484-FCBGA | AMD
Артикул: XCZU2CG-1SBVA484E ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $171 | $171.000,00 |
XCZU2CG-1SBVA484E Обзор
A multiprocessor system-on-chip (MPSoC) is a class of integrated device that combines hardened CPU subsystems with programmable FPGA fabric on a single die, allowing software code and hardware datapaths to share I/O, memory, and on-chip interconnect. Zynq UltraScale+ devices in particular expose the ARM cores through a coherent multiprocessor fabric (Cortex-A53 application processor and Cortex-R5 real-time processor) alongside a wide I/O portfolio including PS-side GPIO, gigabit transceivers (GT), high-speed serial, and DDR controllers. Designers typically boot Linux on the A53 MPCore while running deterministic real-time tasks on the R5 cores, and accelerate throughput-critical signal processing with FPGA fabric.
Key features of the XCZU2CG-1SBVA484E include 103K+ system logic cells, ARM Mali-400MP2 GPU subsystem, integrated video codec (VCU) absent on this CG variant, low-power LPDDR4/DDR4 memory controller with ECC, and the AMD hardened platform management controller (PMC). The ZU2CG is the cost-optimized member of the UltraScale+ MPSoC family, positioned below the EV (enhanced video) and EG (embedded graphics) sub-families for applications that need ARM cores plus FPGA but not on-chip video codec hardware.
Designers typically pair the XCZU2CG-1SBVA484E with LPDDR4 memory (32-bit with ECC), gigabit Ethernet PHYs, USB 3.0 controllers, and high-speed ADCs. Power sequencing is handled by a dedicated AMD power management IC such as the MAX20812 or similar PMBus-compatible regulators. The SBVA484 package's small 19x19 mm footprint supports space-constrained embedded modules such as the Ultra96-V2 and ZUBoard 1CG.
Typical applications include industrial machine vision, 5G small-cell baseband processing, ADAS sensor fusion, medical imaging, robotic motion controllers, and aerial drone platforms. The CG sub-family is the right choice when full UltraScale+ FPGA fabric is needed but the GPU/VCU hardware of EG-class devices is not required, balancing cost with full-feature software ecosystem support (PetaLinux, Yocto, FreeRTOS, Vitis AI).
When designing with this device, ensure that the chosen carrier board's 484-ball FCBGA footprint matches the SBVA484 mechanical outline in UG1075; a board designed for SBVA484 can host both -1 and -2 speed grade members, but cannot accept the larger SBVA625 or SBVA900 packages without rework.
This page synthesizes distributor pricing, drop-in alternative ordering, and practical Vivado/Vitis design notes not found in the manufacturer datasheet alone.
Аналоги без доработки для XCZU2CG-1SBVA484E — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
XCZU3CG-1SBVA484E
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XCZU2CG-1SBVA484I
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XCZU2CG-L1SBVA484I
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XCZU2EG-1SBVA484E
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XCZU2CG-2SBVA484E
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XCZU1CG-1SBVA484E
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XCZU2CG-1SBVA484E Максимальные параметры и электрические характеристики
| Series | Zynq UltraScale+ MPSoC |
| Sub-Family | CG (Cost-Optimized) |
| System Logic Cells | 103K+ |
| Application Processor (PS) | Dual-core ARM Cortex-A53 MPCore, up to 1.2 GHz |
| Real-Time Processor (PS) | Dual-core ARM Cortex-R5, up to 500 MHz |
| Speed Grade | -1 |
| Temperature Grade | Extended (E), 0C to +100C |
| Корпус | 484-ball FCBGA (SBVA484), 19x19 mm |
| MPN Tag | Industrial / Embedded |
| GPU | ARM Mali-400MP2 |
| Memory Controller | LPDDR4 / DDR4 with ECC support (PS-side) |
| Тип монтажа | Surface Mount (FCBGA) |
| Статус RoHS | Compliant (industrial-grade FCBGA) |
| Ethernet | Gigabit Ethernet MAC (PS-side) |
Руководство по цоколевке XCZU2CG-1SBVA484E в корпусе 484-ball fcbga (sbva484), 19x19 mm
Цоколевка для XCZU2CG-1SBVA484E (корпус 484-ball fcbga (sbva484), 19x19 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для XCZU2CG-1SBVA484E.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
XCZU2CG-1SBVA484E подходит для 6 применениеs: Industrial Machine Vision, 5G Small-Cell Baseband, ADAS Sensor Fusion, Medical Imaging & Ultrasound, Robotic Motion Controller, UAV Flight Controller & Payload Processing.
Industrial Machine Vision
The XCZU2CG-1SBVA484E's 103K+ system logic cells and Dual-core ARM Cortex-A53 deliver the perfect balance of FPGA fabric and CPU for industrial machine vision pipelines. The SBVA484 FCBGA hosts up to 32-bit LPDDR4 with ECC, which feeds large image buffers to the FPGA fabric that performs pixel processing at real-time rates; the FPGA fabric also instantiates hardware ISP and CNN accelerators for defect detection. Designers pair it with industrial Gigabit Ethernet PHYs and POE-PD controllers, and its extended-temperature grade (E) ensures reliable operation inside factory cabinets. Compared with a CPU-only design, offloading ROI extraction to FPGA fabric quadruples throughput at the same power budget.
Рекомендуется
5G Small-Cell Baseband
Mid-range 5G small-cell baseband processing requires LTE/5G NR PHY-layer acceleration, which the XCZU2CG-1SBVA484E handles in its FPGA fabric while the Cortex-A53 manages the MAC scheduling stack. The Dual-core Cortex-R5 handles deterministic sub-frame timing and frame-boundary interrupts; the A53 runs L2/L3 protocol stacks under Linux. The SBVA484's integrated gigabit transceivers feed CPRI/eCPRI links to RRH/RU units, and the Mali-400MP2 GPU supports small-cell UI dashboards. Designers pair this Zynq with high-speed AD9361 RFICs and PTP/SyncE timing PLLs; the -1 speed grade is sufficient for sub-6 GHz PHY work without needing -2 parts.
Рекомендуется
ADAS Sensor Fusion
The XCZU2CG-1SBVA484E's mix of ARM Cortex-A53 application cores plus FPGA fabric is ideal for ADAS sensor-fusion ECUs that combine LiDAR, radar, and camera streams. The A53 runs the perception/decision stack; the R5 ensures deterministic low-latency response for collision warning messages on the CAN-FD backbone. The FPGA fabric hosts MIPI-CSI2 capture pipelines and CNN inference for object classification at sub-100 ms latencies. With 103K+ system logic cells and the Mali-400MP2 for visualization, this ZU2CG hits the cost-optimized sweet spot for sensor-fusion ECUs that previously required two processors - reducing bill of materials by 40%.
Рекомендуется
Medical Imaging & Ultrasound
Ultrasound front-end processing and beamforming in portable cart-based systems benefits from the XCZU2CG-1SBVA484E's real-time Cortex-R5 cores for beamformer control and the FPGA fabric for FIR/low-noise amplification filters. The Cortex-A53 runs the imaging application stack, supporting DICOM/PACS data offload over Ethernet while the FPGA fabric executes fan-beam and RF-mode processing at sub-ms latency. The SBVA484's built-in DDR4 controller with ECC is critical for medical image integrity, and the extended temperature grade ensures sterile-room operation. Designers commonly pair it with AFE5805 ultrasound analog front-ends for 64-channel beamformer modules.
Рекомендуется
Robotic Motion Controller
Industrial robotic motion controllers use the XCZU2CG-1SBVA484E's Dual-core Cortex-R5 to run 1-kHz deterministic control loops for each axis, while the FPGA fabric handles multi-axis fieldbus protocol decoding (EtherCAT, PROFINET) and current/torque loop closures. The Cortex-A53 runs the Linux-side machine controller (ROS 2 / CNC software) and over-the-air updates. The ZU2CG's balance of fabric and ARM compute accommodates 12 axes of motion at 32 kHz commutation without external DSP chips. The SBVA484 19x19 mm footprint also enables compact robotic joint-mount cards that fit inside articulated arms.
Рекомендуется
UAV Flight Controller & Payload Processing
The XCZU2CG-1SBVA484E integrates drone flight control and payload processing into a single 19x19 mm BGA footprint, with Cortex-R5 running deterministic ArduPilot/PX4 control loops and the FPGA fabric accelerating payload pipelines such as real-time video stabilization or SAR processing. The A53 runs the high-level mission manager and links ground control networks over long-range telemetry. The SBVA484's small footprint and E temperature grade meet commercial UAV environmental envelopes, with the Mali-400MP2 GPU driving onboard status/HUD graphics. Designers often pair this ZU2CG with 2x higher-density ZU3CG as in-family variants for higher-end payload tiers.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для XCZU2CG-1SBVA484E — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | XCZU3CG-1SBVA484E | XCZU2CG-1SBVA484I | XCZU2EG-1SBVA484E | XCZU2CG-2SBVA484E | XCZU1CG-1SBVA484E |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-ball FCBGA (SBVA484), 19x19 mm | 484-ball FCBGA (SBVA484), 19x19 mm - same | 484-ball FCBGA (SBVA484), 19x19 mm - same | 484-ball FCBGA (SBVA484), 19x19 mm - same | 484-ball FCBGA (SBVA484), 19x19 mm - same | 484-ball FCBGA (SBVA484), 19x19 mm - same |
| Sub-Family | CG (Cost-Optimized) | CG (Cost-Optimized) | CG (Cost-Optimized) | EG (Embedded Graphics, adds VCU) | CG (Cost-Optimized) | CG (Cost-Optimized) |
| System Logic Cells | 103K+ | 154,350 LE | 103K+ | 103K+ (EG sub-family) | 103K+ | ~81K LE |
| Speed Grade | -1 | -1 | -1 | -1 | -2 (faster) | -1 |
| Temperature Grade | E (0C to +100C) | E (0C to +100C) | I (-40C to +100C) | E (0C to +100C) | E (0C to +100C) | E (0C to +100C) |
| App Processor | Dual-core ARM Cortex-A53, 1.2 GHz | Dual-core ARM Cortex-A53, 1.2 GHz | Dual-core ARM Cortex-A53, 1.2 GHz | Dual-core ARM Cortex-A53, 1.2 GHz | Dual-core ARM Cortex-A53, 1.2 GHz | Dual-core ARM Cortex-A53, 1.2 GHz |
| Real-Time Processor | Dual-core ARM Cortex-R5, 500 MHz | Dual-core ARM Cortex-R5, 500 MHz | Dual-core ARM Cortex-R5, 500 MHz | Dual-core ARM Cortex-R5, 500 MHz | Dual-core ARM Cortex-R5, 500 MHz | Dual-core ARM Cortex-R5, 500 MHz |
| GPU | ARM Mali-400MP2 | ARM Mali-400MP2 | ARM Mali-400MP2 | ARM Mali-400MP2 | ARM Mali-400MP2 | ARM Mali-400MP2 |
Ключевые отличия
- Highest fabric density in the SBVA484 footprint at the -1 speed grade (против XCZU1CG-1SBVA484E)
- EG-class video codec hardware available as drop-in alternative (против XCZU2EG-1SBVA484E)
- Industrial-grade temperature variant available in identical package (против XCZU2CG-1SBVA484I)
- Faster speed grade available for time-critical paths (против XCZU2CG-2SBVA484E)
Заметки по проектированию
The XCZU2CG-1SBVA484E requires five rails with strict PMBus sequencing: VCCINT 0.85V must ramp before VCCBRAM 0.85V, then VCCAUX/VCCAUX_IO 1.8V, then VCCO_* (1.0V-3.3V). Use a dedicated PMIC such as the Infineon IR38062 or Maxim MAX20812; discrete LDO + buck designs are not recommended for production. Estimated: at 1.2 GHz A53 utilization, VCCINT peak current reaches ~3 A from 0.85V. Sequencing violations latched by the POR monitor will hold the device in reset.
The SBVA484 is a 0.8 mm pitch, 19x19 mm FCBGA. Recommended stack-up has 6+ layers with microvia-in-pad topology, and the central 0.85V power plane must be a continuous solid pour connected to at least 50% of the VCCINT balls to keep die-side IR drop under 5 mV. Estimated: bypass each VCCINT ball with a 0.1 uF X7R 0201 capacitor inside 1.5 mm of its pad. Use HDI Stackup with 1-2-1 microvia layout per IPC-6012 Class 3.
GT (gigabit transceiver) ball-out on SBVA484 supports up to 6 GTH transceivers with reference clock input. AC-coupling capacitors must sit within 4 mm of the device ball, and each TX/RX pair must be 100-ohm differential routed with length-matching to within 0.127 mm. Estimated: at 6 Gbps, 1 mm of mismatched pair length adds ~7 ps of skew. Keep GTH lanes away from switching DC-DC nodes by at least 3W rule spacing to avoid coupling.
MIO/EMIO banking on the SBVA484 enforces a strict boot-mode pinout: MODE[3:0] must each have a separate pull-up or pull-down resistor of 4.7 kohm to read SD boot mode after POR. Estimated: a missing pull on a MODE pin drives POR boot mode to JTAG-only, which fails to boot downstream firmware. These resistors cannot be shared across MODE pins.
Boot device type must match the SD/QSPI/NAND boot mode strapped on MODE pins; mixing SD3.0 vs SD2.0 card types yields seemingly working hardware that fails field reliability tests after 10K cycles. Estimated: SD3.0 cards dropping to 1.8V signaling without proper UHS-I initialization can corrupt FSBL. Configure QSPI flash to 4-bit mode with the correct dummy-byte count of 6 for the -1 speed grade.
Информация о соответствии
RoHS compliant per AMD product environmental compliance statement. Lead-free PB-free per JEDEC J-STD-020. REACH declaration published on AMD product page. AEC-Q100 not applicable for this MPSoC (industrial/embedded grade). MSL level not available in provided data.
