FPGA at CPLD
Mga Produkto (7,300+)
XC9572XL-5VQ64C - 72-Macrocell 3.3V CPLD 5ns | AMD Xilinx
The AMD (Xilinx) XC9572XL-5VQ64C is a high-performance 3.3V CPLD with 72 macrocells, 1600 usable gates, 52 user I/O pins, and a maximum propagation delay of 5 ns, housed in a 64-pin TQFP (VQ64) package for commercial temperature ranges. A CPLD (Complex Programmable Logic Device) is a class of programmable logic that sits between simple PAL/GAL devices and large FPGAs in the programmable logic hierarchy. CPLDs use macrocell-based architecture with wide, fast AND/OR arrays that deliver deterministic, pin-to-pin timing, making them ideal for glue logic, state machines, bus interfacing, and power-up management tasks that require guaranteed timing and instant-on behavior. Key features of the XC9572XL family include in-system programmability (ISP) with a minimum of 10,000 program/erase cycles, 3.3V internal supply operation from 3V to 3.6V, and a maximum clock frequency of 178.6 MHz. The device provides 36 inputs and 36 outputs with 52 I/O lines available to the user, organized into four dedicated logic array blocks (function blocks). Architecturally, the XC9572XL consists of function blocks connected by a FastCONNECT switch matrix. Each macrocell includes a registers/flip-flop that can be configured as D, T, or JK type, with individual product-term control of clock, set, and reset. The 5 ns tpd version (-5 speed grade) is the fastest in the XC9572XL lineup, and the low-voltage process reduces power consumption compared to the earlier 5V XC9500 family. Typical applications include telecom and networking line-card glue logic, industrial automation control interfaces, 5G infrastructure board management, medical instrumentation, and legacy FPGA/CPU bus-bridging designs. The instant-on, non-volatile configuration eliminates the external configuration flash required by SRAM FPGAs, simplifying power sequencing. Design consideration: verify both a 3.3V tolerant I/O budget and the 10,000-cycle program/erase endurance limit; frequent field reprogramming beyond the endurance rating can degrade flash cells. Use the AMD iMPACT tool with the standard JTAG chain for in-system programming. This page adds value beyond the manufacturer datasheet by consolidating drop-in alternatives, application guidance, procurement channels, and practical design notes for the XC9572XL-5VQ64C in one place.
XC9572XL-7VQ44C - 72-Macrocell 3.3V CPLD | AMD
AMD XC9572XL-7VQ44C is a 72-macrocell in-system-programmable CPLD operating from a 3.3 V supply, providing 34 user I/O pins, 1,600 usable gates, and four 54V18 function blocks in a 44-pin VQFP package. The -7 speed designation identifies a nominal 5 ns propagation-delay class within the XC9500XL high-performance CPLD family. A complex programmable logic device, or CPLD, is a programmable logic device within the broader FPGA and CPLD category. It combines nonvolatile programmable logic with a relatively simple, deterministic architecture for control logic, interface adaptation, bus decoding, state-machine implementation, and glue logic. Unlike a mask-programmed logic device, a CPLD can be configured or reconfigured by the system designer, making it useful for prototypes, production equipment, and field-updatable embedded systems. The XC9572XL offers individual output enable per output pin, local inversion, input hysteresis on user and boundary-scan pins, bus-hold circuitry on user inputs, and hot-plugging support. Its in-system programming capability supports at least 10,000 program or erase cycles. These features make the device suitable for compact control platforms requiring configurable logic and reusable board-level programming interfaces. Internally, the device contains four 54V18 function blocks and 72 macrocells organized into 1,600 usable gates. The architecture provides a practical balance between logic density, predictable timing, and design simplicity. The 3.3 V operating supply and 34 available I/O positions make the device especially useful in modern embedded control systems where a small FPGA would add unnecessary complexity or cost. Typical uses include industrial control interfaces, peripheral bus decoding, encoder and sensor signal conditioning, display-control logic, communication protocol interfaces, and low-power supervisory sequencers. In each case, the CPLD can consolidate discrete glue logic while preserving a straightforward programming and verification workflow. PCB design should preserve the manufacturer-specified pin assignments, power routing, and programming interface connections. Because the target is a 44-pin VQFP device, adequate escape routing and careful decoupling are essential. Confirm the exact package drawing, voltage ratings, and pin definitions against the manufacturer datasheet before fabrication or replacement. This page combines the XC9572XL technical characteristics, compatible speed-grade alternatives, application guidance, and design-focused comparison points to support device selection, schematic review, PCB planning, and lifecycle risk assessment.
XC9572XL-7VQ64C - 72-Macrocell 3.3V CPLD | AMD
AMD XC9572XL-7VQ64C is a 72-macrocell complex programmable logic device operating from a 3.3 V supply in a 64-pin VQFP package. It combines a 125 MHz device speed rating with a 7.5 ns stated propagation performance, making it suitable for deterministic glue logic, interface control, bus decoding, and legacy system-integration designs. The device belongs to the XC9500XL high-performance CPLD family. A CPLD is a programmable digital logic device that combines a structured array of macrocells with a global interconnect. Unlike a software-driven processor, a CPLD executes combinational and registered logic directly in hardware. Within the semiconductor hierarchy, this part is a complex programmable logic device, a user-programmable logic device, and ultimately an integrated circuit designed for deterministic logic implementation. The XC9500XL architecture provides individual output enable for each output pin, local inversion, input hysteresis on user and boundary-scan inputs, and bus-hold circuitry on user inputs. These features support dependable control of external signals, improved noise tolerance, and stable handling of partially driven buses. The family also supports hot-plugging capability and IEEE boundary-scan-oriented verification functions. For the XC9572XL-7VQ64C, the 72-macrocell architecture provides a practical balance between logic density and design effort. A 7 ns speed grade and 125 MHz maximum operating frequency support communication, control, and data-processing functions that require predictable timing. The 64-pin VQFP package provides 52 user I/O according to the published family listing while leaving dedicated supply and configuration functions. Typical applications include legacy peripheral emulation, printer and industrial-control interfaces, programmable logic glue, bus arbitration, data-format conversion, and system boot or sequencing logic. The in-system programming architecture also supports board-level configuration workflows where a programmed device must be updated without removing it from its assembled circuit. Designers should preserve the XC9500XL power architecture and decoupling strategy, leave configuration and test behavior consistent with the AMD DS057 data sheet, and verify every external interface against the selected package pinout. Device selection also requires checking tool-chain compatibility because this established CPLD family is normally programmed with AMD/Xilinx CPLD development tools and appropriate JTAG programming hardware. This product page combines the AMD family architecture, verified family variants, pin-compatible alternatives, application guidance, and practical implementation considerations in one engineering-focused reference. It supports faster device identification while highlighting the speed-grade and temperature-grade distinctions that can affect an existing design.
XC9572XL-7VQ64I - 3.3V CPLD 72MC 7.5ns 64-TQFP | Xilinx
The AMD/Xilinx XC9572XL-7VQ64I is a 3.3 V in-system programmable CPLD with 72 macrocells, 1600 usable gates, 52 user I/O pins and a maximum propagation delay of 7.5 ns, housed in a 64-pin TQFP (VQ64) package with 0.5 mm lead pitch. A Complex Programmable Logic Device (CPLD) is a family of programmable logic ICs that sits between simple SPLDs (such as GAL and PAL devices) and large FPGAs in the programmable logic hierarchy. CPLDs use a macrocell-based architecture with a deterministic pin-to-pin delay, making them well suited to glue logic, bus interface, state machine and power-sequencing tasks where predictable timing and instant-on operation matter more than logic density. The XC9572XL belongs to the FastFLASH XC9500XL high-performance, low-voltage CPLD family targeted at leading-edge communications and computing systems where device reliability and low power dissipation are important. Key features include individual output enable per output pin with local inversion, input hysteresis on all user and boundary-scan pin inputs, bus-hold circuitry on all user pin inputs, and hot-plugging capability. Every XC9500XL device supports in-system programming (ISP) with a minimum of 10,000 program/erase cycles, and full IEEE Std 1149.1 (JTAG) boundary-scan, giving engineers superior debug and design-iteration capability without removing devices from the board. The -7 speed grade delivers 7.5 ns maximum pin-to-pin propagation delay, and the industrial temperature rating (-40C to +85C) qualifies the part for harsh environments. Lead finish is tin with 0.5 mm lead pitch per the manufacturer product information. Typical applications include communications and networking line-card glue logic, industrial control state machines, bus-interface and address-decode functions, and microprocessor power-management sequencing, where a deterministic 7.5 ns delay and instant power-up behavior outperform FPGA-based solutions. Design consideration: the XC9500XL family is programmed with the legacy Xilinx ISE toolchain, so confirm toolchain availability in your development environment before committing to new designs; bus-hold on unused inputs removes the need for external pull resistors. This page adds value beyond the manufacturer datasheet by synthesizing distributor availability, drop-in same-package alternatives, selection guidance, and practical design notes in one place.
XCKU035-1FBVA676C Kintex UltraScale FPGA 444K Cells | AMD
The AMD Xilinx XCKU035-1FBVA676C is a Kintex UltraScale Field Programmable Gate Array built on TSMC's 20nm process, integrating 444,343 logic cells and 19,456,000 system gates in a 676-ball FCBGA package (27 mm × 27 mm) with 312 user I/Os. It runs a -1 speed grade targeting up to 630 MHz fabric performance, with 12.5 Gb/s capable transceivers (GTH) on select Kintex UltraScale SKUs and 240 DSP48E2 slices optimized for high-throughput fixed- and floating-point arithmetic. The commercial temperature grade (suffix C) supports 0 °C to +85 °C operation with a 0.95 V core voltage. What is an FPGA? A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement custom digital circuits after PCB fabrication by configuring an array of configurable logic blocks (CLBs), dedicated DSP slices, block RAM, and high-speed serial transceivers. Within the broader semiconductor hierarchy, an FPGA sits between general-purpose CPUs/GPUs (fixed instruction set, software-defined) and ASICs (fixed hardware). AMD's Kintex UltraScale family occupies the mid-range position in the UltraScale portfolio, sitting below Virtex UltraScale (highest logic density and bandwidth) and above Artix UltraScale (lowest cost and power). All Xilinx boards shift the value curve toward best-in-class price/performance/watt at 20nm. Key features of the XCKU035-1FBVA676C include up to 1,250 Mbps of DDR4 external memory interface support, integrated PCIe Gen3 hard cores, 4.7 Mb of distributed RAM, 240 DSP slices, and 16 GT transceivers on -1 speed grade parts in the larger Kintex UltraScale family. The device provides 312 high-performance SelectIO pins supporting multiple I/O standards including LVDS, HSTL, SSTL, and differential memory interfaces. The device also exposes 3 MMCM and 8 PLL mixed-mode clock managers for high-frequency clock synthesis and skew management. Architecturally, the Kintex UltraScale device uses UltraScale architecture enhancements over 7-series FPGAs - including new routing interconnect, more efficient clock networks, and improved block RAM and DSP resources. The 20nm planar CMOS process allows higher integration while keeping leakage power low, and the GT(GTH) transceivers support 12.5 Gb/s line rates for backplane and chip-to-chip serial interconnect. The XCKU035-1FBVA676C serves wireless baseband processing, software defined radio, high-definition video processing pipelines, high-speed serial backplane bridging, and PCIe accelerator card designs in the 100K–500K logic-cell density class. When laying out a board with this BGA, allocate 12 power rails (VCCINT, VCCAUX, VCCO, MGTAVCC, MGTAVTT, VBATT, MGTVCCAUX, VCCADC, VCCBRAM, VCCO_HP, VCCAUX_IO, plus GT helper rails) and follow the package-specific K7-PCB decaps guidance in UG583 to control simultaneous switching noise and SSN.
XCKU035-2FBVA676E - 676-pin Kintex UltraScale FPGA | AMD
The AMD (formerly Xilinx) XCKU035-2FBVA676E is a Kintex UltraScale field-programmable gate array (FPGA) IC delivering 355,474 logic cells (194,560 6-input LUTs), 19.45M total on-chip memory bits, and 312 user I/Os, fabricated in a 20 nm CMOS process and housed in a 676-ball flip-chip BGA (FCBGA-676) package. It is a logic-density mid-range device in the Kintex UltraScale family and is targeted at high-throughput DSP, 100G packet processing, and ASIC-prototyping workloads. The "-2" suffix denotes the -2 speed grade (the second-fastest bin in the family), and the "E" suffix denotes the extended (industrial) temperature screening of -40 C to +100 C. A Kintex UltraScale FPGA belongs to the broader UltraScale architecture family, which is positioned between cost-optimized Artix/Spartan devices and the highest-density Virtex UltraScale devices in the AMD product hierarchy. FPGAs (Field-Programmable Gate Arrays) are programmable logic devices containing large arrays of configurable logic blocks (CLBs), block RAM (BRAM), DSP slices, high-speed transceiver tiles (GTX/GTH), and clock-management tiles (CMTs/PLLs/MMCMs). The Kintex UltraScale tier targets price/performance-sensitive applications such as 100G optical line cards, software-defined radio, and high-end DSP prototyping. Key headline specifications include 1,700 Configurable Logic Blocks (CLBs) and 444,343 logic cells in some datasheet groupings (the modern nominal figure is 355,474), up to 19.45 Mbits of distributed + block RAM, 312 user I/Os in the FBVA676 package, and 16.3G transceivers (per UltraScale family documentation). The device integrates 20 CMT clock tiles and 240 DSP slices, providing substantial arithmetic throughput and flexible clocking. Architecturally, the Kintex UltraScale uses the UltraScale routing fabric with stacked 3D silicon interposer-style back-bias routing, supporting up to 16.3 Gb/s transceivers for chip-to-chip and backplane SERDES. The 20 nm node and monolithic die deliver higher performance-per-watt than prior 28 nm 7-series Kintex devices while maintaining PCIe Gen3 hard-IP blocks. Typical applications for the XCKU035-2FBVA676E include 100G Ethernet bridge/router line cards, software-defined radio baseband cards, ASIC prototyping with 100% RTL mapping, high-end video processing, and DSP front-end for radar/medical imaging. The wide logic/memory/transceiver budget makes it the typical "starting point" for ADC-DAC-coupled signal-processing cards. When designing with the XCKU035-2FBVA676E, ensure multi-rail decoupling per the AMD UltraScale PCB Design Guide (UG583) for power-rail sequencing. The industrial temperature screen (E) allows deployment in outdoor telecom and industrial-control applications beyond commercial grade. This page combines verified distributor pricing, drop-in alternative analysis across the Kintex UltraScale family, and practical design notes not consolidated on the AMD datasheet.
XCKU035-2FBVA676I - Kintex UltraScale FPGA, 444K Logic Cells | AMD
The AMD XCKU035-2FBVA676I is a Kintex UltraScale Field Programmable Gate Array (FPGA) with 444,343 logic cells and 19,456,000 bits of block RAM, housed in a 676-ball Flip-Chip BGA package. Built on a 20nm process node and offered at a -2 (mid) speed grade, this device targets mid-range high-performance applications requiring an optimal balance of price, performance, and power efficiency. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed post-manufacture to implement arbitrary digital functions. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit hierarchically under digital semiconductors and ICs. The Kintex UltraScale family from AMD (formerly Xilinx) addresses the spectrum between cost-optimized Artix and high-end Virtex devices, focusing on DSP, memory bandwidth, and transceiver integration. Key features of the XCKU035 include 312 maximum user I/Os, integrated DSP slices for high-throughput signal processing, dedicated block RAM (BRAM) for on-chip data storage, and high-speed serial transceivers suitable for chip-to-chip and backplane links. The device supports multiple configuration modes including JTAG, SPI, and BPI, enabling flexible boot strategies in production systems. The Kintex UltraScale architecture leverages a 20nm planar process with stacked-silicon interconnect (SSI) options in larger family members. The XCKU035 uses monolithic silicon, providing predictable performance and lower cost. The UltraScale architecture introduces enhanced routing, multi-die clocking, and improved DSP and BRAM utilization rates over prior 7-Series FPGAs. Typical applications of the XCKU035-2FBVA676I include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, video broadcast equipment, industrial machine vision, 100G network interface cards, and aerospace telemetry. Its combination of logic density, memory bandwidth, and transceivers makes it well-suited for prototyping ASICs or low-volume production. When designing with the FBVA676 BGA, plan for high-density PCB fabrication with microvia or via-in-pad stackups, controlled-impedance traces for transceivers, and robust power distribution with high-frequency decoupling to satisfy simultaneous switching noise (SSN) requirements. This page synthesizes distributor pricing, FPGA drop-in alternatives within the same 676-BGA footprint, and practical design notes not typically presented in the manufacturer datasheet.
XCKU040-2FFVA1156I - Kintex UltraScale FPGA 520 I/O | AMD
The AMD XCKU040-2FFVA1156I is a Kintex UltraScale FPGA with 520 user I/O, 21,606,000 system logic capacity, 530,250 DSP-equivalent resource units, speed grade -2, in a 1156-ball FCBGA package rated for industrial temperatures of -40C to +100C. A Field Programmable Gate Array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), DSP slices, block RAM, and programmable interconnect that designers configure after manufacturing. Within the power-management hierarchy of digital system ICs, an FPGA sits at the top of the programmable logic taxonomy: programmable logic device (PLD) -> FPGA -> system-on-chip FPGA. FPGAs are used where custom logic, parallelism, or post-deployment reconfigurability is required that fixed-function ASICs or microcontrollers cannot provide. Key features of the XCKU040-2FFVA1156I include the 20nm UltraScale architecture, which lowers total power consumption versus the previous 28nm 7-series generation, a -2 speed grade for high-performance designs, and an industrial (I-suffix) temperature rating of -40C to +100C. The 1156-ball flip-chip BGA provides 520 user I/O for high-bandwidth parallel interfaces, and the fabric includes MMCM and PLL clock management resources. On the technical side, the Kintex UltraScale family focuses on price/performance using monolithic 20nm die. The device core supply operates from 0.922V to 0.979V per the datasheet listing. The UltraScale architecture adds enhanced routing, higher DSP throughput, and improved clocking compared to Kintex-7, making the XCKU040 a popular mid-density choice between the XCKU035 and XCKU060. Typical applications include industrial image processing and machine vision, wireless baseband and RF front-end processing, medical ultrasound, and ASIC prototyping. The 520 I/O count suits multi-camera sensor aggregation and high-width data converters. Design consideration: FCBGA-1156 devices require careful PCB stackup design - escape routing under the 1.0mm ball pitch typically needs via-in-pad or at least 8 layers, and core voltage rails must meet the tight 0.922-0.979V tolerance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
XCKU3P-1FFVA676E - Kintex UltraScale+ FPGA, 676-FCBGA | AMD Xilinx
The AMD Xilinx XCKU3P-1FFVA676E is a Kintex UltraScale+ field-programmable gate array (FPGA) supplied in a 676-ball FCBGA package, with 256 user I/O, 355,950 logic cells and a 667 MHz maximum clock rating as published for this device. The -1 suffix denotes the speed grade, and the A code in the part number identifies the 676-ball package option. A field-programmable gate array is a programmable logic device: an array of configurable logic blocks, block RAM, DSP arithmetic slices and high-speed I/O that is configured at power-up from a bitstream rather than being permanently masked in silicon. FPGAs sit at the top of the programmable-logic hierarchy, above fixed-function ASICs in flexibility and above microcontrollers in datapath throughput. Kintex UltraScale+ occupies the middle of AMD's portfolio, between the cost-optimized Artix-7/Zynq families and the highest-capacity Virtex UltraScale+ devices. The KU3P device combines roughly 355,950 logic cells with the UltraScale+ DSP48E2 arithmetic pipeline and 16.3 Mb of block RAM per slice group, delivering high performance per watt for mid-range designs. Key platform features include SelectIO resources with back-ported I/O, up to 16.3 Gb/s GTY transceivers, and the AXI4 interconnect fabric that links programmable logic to hard DSP blocks and memory. A dedicated security subsystem supports bitstream encryption and authentication for design-IP protection. Mechanically, the 676-FCBGA lands on a 31 x 31 mm substrate and is intended for multilayer boards with via-in-pad and micro-BGA fanout design rules. Because the package offers no user I/O beyond the specified 256 balls, the majority of the board budget is spent on power, clocking, and high-speed routing rather than on peripheral connectivity. Configuration data is loaded through the standard AMD configuration path, and the part is supported by the AMD Vivado design suite. Typical applications for the XCKU3P-1FFVA676E include industrial control and automation platforms, professional broadcast and video infrastructure, aerospace and defence instrumentation, telecom line-card and baseband processing, and test and measurement systems that need a large amount of parallel logic and DSP throughput in a single package. When planning the board, treat power delivery as the primary risk: UltraScale+ devices require multi-rail sequencing, and decoupling must follow the recommended high-frequency capacitor layout from the AMD package pinout and design documentation. Provide a solid ground plane, follow the recommended BGA fanout and via-in-pad geometry, and keep the high-speed transceiver reference design rules intact if the design uses GTY links. This page consolidates distributor availability, verified package and speed-grade data, pin-compatible family alternatives, and practical design guidance in one place so that engineers can qualify the KU3P device quickly, and compare it against the KU5P and -2 speed-grade options before committing to a layout.
XCKU3P-1FFVB676E - Kintex UltraScale+ FPGA | 355K LC | AMD
The AMD Xilinx XCKU3P-1FFVB676E is a Kintex UltraScale+ field-programmable gate array (FPGA) offering 355,950 logic cells, 31,641,600 bits of block RAM, and 1,560 DSP slices, housed in a 676-ball FCBGA package (FFVB676) at the -1 speed grade and the E (extended) temperature tier. It integrates 280 user I/O pins and 24 transceivers supporting up to 16.375 Gbps, making it the mid-density workhorse of the Kintex UltraScale+ family. Kintex UltraScale+ FPGAs occupy a specific tier in AMD's programmable-logic taxonomy: below Virtex UltraScale+ for highest performance and above Artix-7/Artix UltraScale+ for cost-optimized applications. Architecturally, the UltraScale+ generation introduces a register-rich silicon fabric, 3rd-generation SSI (stacked silicon interconnect) techniques, and tightly coupled DSP/BRAM columns, delivering up to 2x the performance-per-watt versus the prior generation for DSP-intensive workloads such as 5G baseband, machine-learning inference, and high-speed instrumentation. Key features of the XCKU3P include 16.375 Gbps GTH transceivers (24 channels), 6.6 Tbps serial bandwidth per device, integrated 100G Ethernet MACs, and a system-monitoring block that tracks on-die voltage and temperature. The device supports DDR4-2400 with on-chip ECC and offers hardware-rooted security via bitstream encryption and authentication using AES-256 and RSA-2048. The 676-ball FCBGA package has a body size of 27 mm × 27 mm with a 1.0 mm ball pitch, suitable for high-density PCB designs using standard BGA assembly. Typical applications span high-performance digital signal processing, 100G Ethernet network interface cards, 4K/8K video processing pipelines, test and measurement instrumentation, software-defined radio (SDR), and radar/EW front-end processing. The combination of high-speed transceivers and abundant DSP resources makes it a strong fit for low-latency, line-rate processing in both wired and wireless infrastructure. When designing with the XCKU3P-1FFVB676E, allocate at least eight PCB layers with continuous GND planes and matched-length pairs for transceivers; the package's 1.0 mm pitch requires HDI stack-ups (microvias). The extended (E) temperature grade supports -40 °C to +100 °C junction, and designers must respect the 2.0 W/cm² package thermal envelope with adequate airflow or heatsinking for sustained workloads. Vivado Design Suite is required for implementation.
XCKU3P-1FFVB676I - Kintex UltraScale+ FPGA | AMD
AMD XCKU3P-1FFVB676I is a Kintex UltraScale+ field-programmable gate array in a 676-pin FCBGA package. The device combines programmable logic, block RAM, DSP resources, high-speed serial connectivity, and general-purpose I/O in a single heterogeneous FPGA. Its XCKU3P designation identifies the high-performance Kintex UltraScale+ product family, while the -1 suffix identifies the -1 speed grade. The FFVB676 package designation identifies the 676-ball flip-chip BGA configuration used by this part. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. FPGA architecture belongs to the broader programmable-logic hierarchy and can be classified as a semiconductor, integrated circuit, and digital logic device. Instead of implementing every digital function with fixed application-specific circuitry, an FPGA combines configurable logic blocks and dedicated hard resources with an interconnect fabric. This enables parallel processing, rapid hardware revision, and high integration in systems that require deterministic real-time behavior. The XCKU3P family targets demanding communications, industrial, networking, signal-processing, and embedded-control systems. A Kintex UltraScale+ FPGA is useful when a design needs substantially more logic and serial throughput than lower-density programmable devices, while retaining a single-package implementation. The device combines a -1 performance grade with a large 676-pin package that provides extensive package I/O and power connectivity. Exact logic-cell, memory, DSP, I/O, and power specifications should be taken from the current AMD Kintex UltraScale+ data sheet for the selected package and speed grade. Use the part in designs that benefit from parallel datapaths, hardware-assisted filtering, protocol termination, high-speed data movement, or adaptive control. Common engineering roles include accelerator logic, video and image processing, industrial control, test instrumentation, communications infrastructure, and high-speed interface bridging. AMD UltraScale+ devices use programmable logic, block RAM, DSP slices, high-speed I/O, and integrated power-management resources, allowing one device to implement control, datapath, and interface functions in parallel rather than requiring several discrete components. The 676-ball FCBGA package is mechanically and electrically demanding. Board design must follow the AMD package pinout files and the device PCB-design guidance, including exact power and ground-plane connections, via arrays, decoupling placement, and ball-grid escape routing. Differential and high-speed interfaces require controlled impedance, careful return-path continuity, and compliance with the stated maximum transition-rate and board-routing constraints. Use the package-device pinout files from AMD when assigning every ball and when cross-checking the schematic, PCB library, and assembly drawings. Thermal design is also central to FPGA implementation because logic utilization, I/O activity, and switching can increase dynamic power. The power budget should be calculated from the actual clocking, memory, DSP, serial-link, and I/O assumptions in the design, including worst-case activity factors. A conservative approach is to use the AMD power estimator and system-design guidance with the exact device, package, speed grade, and utilization. This page identifies the verified commercial configuration and the engineering constraints that should be checked before schematic release. This product record combines the verified XCKU3P-1FFVB676I configuration, package information, related same-footprint variants, selection trade-offs, and practical implementation guidance. It is intended to help engineers identify the correct AMD/Xilinx Kintex UltraScale+ device and prepare a package-compliant, thermally valid, and production-ready FPGA design.
XCKU3P-1FFVD900I - Kintex UltraScale+ FPGA | AMD
The AMD XCKU3P-1FFVD900I is a Kintex UltraScale+ field-programmable gate array with 355,950 logic cells, 20,340 configurable logic blocks, 304 input/outputs, and a nominal 0.85 V supply in a 900-BBGA FCBGA package. The -1 designation identifies the device speed grade, while the D900 package and industrial suffix distinguish its mechanical, thermal, and qualification configuration. A field-programmable gate array is a programmable digital integrated circuit whose configurable logic blocks, interconnects, memory resources, and input/output resources can be tailored after manufacture. The FPGA belongs to the Kintex UltraScale+ product family and sits within the broader semiconductor and programmable-logic hierarchy. This makes it suitable when a design needs substantial parallel processing capacity, flexible interfaces, and a hardware platform that can be revised through downloadable configuration data rather than redesigned as a fixed-function ASIC. The listed device provides 355,950 logic cells organized into 20,340 configurable logic blocks, with 304 input/outputs available for board-level connections. Its 31,641,600 memory bits support data storage and buffering within the programmable fabric. The 0.85 V nominal core voltage reflects the high-performance architecture of the Kintex UltraScale+ family, while the 900-BBGA FCBGA package provides a large pin and interconnect platform suitable for complex systems. The XCKU3P device family is intended for applications requiring high logic density and flexible hardware behavior. Relevant uses include data processing, control systems, communications infrastructure, industrial automation, test and measurement equipment, and embedded signal-processing platforms. Its large programmable fabric allows parallel data paths and multiple control functions to be consolidated without developing a custom silicon device. The principal design consideration is package-level complexity. A 900-BBGA FCBGA requires careful PCB layout, dense escape routing, controlled power delivery, and assembly processes capable of handling fine-pitch balls. Board designers should use the AMD package pinout files and the relevant device documentation to assign every ball, power plane, configuration signal, and high-speed connection correctly. This page combines the device identification, package information, programmable resource counts, sourcing details, family alternatives, and practical design guidance in one engineering-focused reference. It helps designers distinguish speed-grade, package, and suffix differences before committing to a board layout or production configuration.
XCKU3P-1SFVB784E - 355950-Logic-Cell Kintex UltraScale+ FPGA | AMD
The AMD XCKU3P-1SFVB784E is a Kintex UltraScale+ field-programmable gate array with 355,950 logic elements, 20,340 logic blocks, 31,641,600 RAM bits, and 304 user I/O pins in a 784-pin FCBGA package. It uses the -1 speed grade and an E temperature-grade designation, making it suited to demanding programmable-logic, signal-processing, control, and high-speed interface systems. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic can be configured after manufacture. FPGA devices combine programmable logic blocks, block RAM, programmable input/output resources, clocking, and high-speed serial transceivers on one device. The Kintex UltraScale+ family occupies the performance tier between general-purpose UltraScale devices and larger Virtex devices, providing substantial logic and memory capacity for advanced embedded systems. The target device contains 20,340 logic blocks, equivalent to 355,950 logic elements, and 31,641,600 bits of block RAM. Its 304 user I/O positions support digital interfaces, while the UltraScale+ architecture is designed for demanding clock rates, high-speed connectivity, and parallel processing. The listed operating supply range is 0.825 V to 0.876 V for the relevant internal supply condition. The XCKU3P-1SFVB784E combines the -1 performance grade with a 784-pin FCBGA package offering high I/O and power connectivity. This package complexity supports advanced board-level designs but requires a land grid, multilayer PCB construction, careful power delivery, and assembly processes capable of handling a large fine-pitch BGA. A matching FPGA configuration, clocking, memory interface, and board design are essential to achieve predictable performance. Typical uses include high-throughput data acquisition, industrial image and signal processing, communications infrastructure, accelerator control, high-speed networking, radar or aerospace processing, and embedded systems requiring programmable logic. The large RAM and logic resources make the device particularly appropriate for parallel datapaths that cannot be implemented efficiently in a microcontroller or smaller FPGA. Design planning should begin with the UltraScale package pinout files and the AMD FPGA design toolchain. Confirm the required voltage rails, decoupling network, clocking topology, transceiver requirements, configuration method, thermal conditions, and board-layer constraints before schematic capture. Use simulation and timing analysis before programming hardware because high-speed interfaces can expose signal-integrity and clock-distribution issues that are difficult to correct after fabrication. This product page combines the exact device identity, resource counts, package information, sourcing guidance, application analysis, and design-oriented comparison points into one engineering reference for evaluating the XCKU3P-1SFVB784E.
XCKU3P-1SFVB784I - 256-I/O Kintex UltraScale+ FPGA | AMD
AMD XCKU3P-1SFVB784I is a Kintex UltraScale+ field-programmable gate array with 256 I/O, a 784-ball FCBGA package, and an industrial-temperature ordering suffix. It belongs to AMD’s XCKU3P device family and provides programmable logic resources for demanding embedded, communications, industrial, and test systems. The component uses the same device and package identity as the listed XCKU3P-L1SFVB784I while differing in its ordering code. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interfaces, and processing blocks are configured after manufacture. An FPGA sits above basic programmable logic and fixed-function microcontrollers in the hardware hierarchy: configuration software creates a dedicated digital circuit from the FPGA’s configurable logic blocks, block RAM, DSP resources, high-speed I/O, and clocking resources. This makes an FPGA suitable when deterministic parallel processing, flexible interfaces, or field-updatable logic are more important than the simplicity of a microcontroller. The XCKU3P family is positioned for high-end signal-processing and connectivity designs. AMD describes Kintex UltraScale+ devices around a balance of performance, power, memory-interface capability, high-speed connectivity, and cost efficiency. The catalog listing for XCKU3P-1SFVB784I identifies 256 I/O and the 784-BFBGA FCBGA package. Exact logic-cell, memory, transceiver, speed-grade, and electrical details must be confirmed against the device-specific AMD documentation before final design release. The “1” ordering suffix identifies the performance class used for this ordering code, while “SFVB784” identifies the package configuration. The final “I” denotes the industrial-temperature ordering option. Package construction is important for this device because a 784-ball FCBGA requires controlled board assembly, a multilayer PCB, appropriate via and escape routing, and careful power-delivery design to support the FPGA’s high pin count and performance requirements. Typical uses include industrial control and automation, high-speed data acquisition, communications infrastructure, instrumentation, embedded processing, and prototyping systems requiring programmable logic. The 256-I/O interface supports external memory, transceivers, clocks, and application-specific peripherals when the selected device resources and speed grades support those interfaces. Designers should preserve the exact SFVB784 footprint, verify every power rail and decoupling requirement in the AMD pinout and package documentation, and confirm that the selected configuration scheme matches the board’s boot architecture. Device migration also requires checking logical-cell usage, RAM, DSP, transceiver resources, pin constraints, timing closure, and the exact I/O standard rather than relying only on package similarity. This product record combines the exact XCKU3P-1SFVB784I catalog identity, package and I/O information, available manufacturer resources, same-family drop-in candidates, and practical implementation guidance. It is intended to accelerate engineering evaluation while keeping footprint, configuration, thermal, and signal-integrity verification tied to the official AMD documentation.
XCKU3P-2FFVA676E Kintex UltraScale+ FPGA | AMD
AMD XCKU3P-2FFVA676E is a Kintex UltraScale+ field-programmable gate array with 355,950 logic cells, 20,340 configurable logic blocks, and 304 input/output connections in a 676-BBGA FCBGA package. Its nominal core voltage is 0.85 V, making it a high-density programmable-logic device for demanding embedded, digital signal processing, networking, storage, and signal-processing systems. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. Within the broader hierarchy, an FPGA is a programmable-logic IC and a member of the semiconductor family. Unlike a fixed-function application-specific integrated circuit, an FPGA can combine parallel processing, serial connectivity, memory interfaces, and dedicated hardware blocks in one device. The Kintex UltraScale+ family targets designs that require substantially more programmable logic than midrange devices while retaining high-speed serial capabilities. The XCKU3P-2FFVA676E combines 355,950 logic cells with 20,340 configurable logic blocks and 304 I/O locations. Its FCBGA package supports dense board-level integration and is appropriate for sophisticated systems in which pin count, routing capacity, and processing throughput are central design constraints. The -2 ordering designation identifies the device speed option, while the FFVA676E suffix identifies the package and ordering characteristics. Detailed electrical limits, memory organization, and transceiver ratings must be confirmed in the AMD datasheet before schematic release. Programmable resources make the device suitable for parallel datapaths, protocol bridging, real-time filtering, control processing, and hardware-assisted acceleration. The 304 I/O connections provide substantial board-level connectivity for control signals, memory interfaces, clocks, data buses, and high-speed links. Designers should allocate pins according to the UltraScale package pinout files and account for bank-specific supply requirements, reference routing, and high-speed layout constraints. Typical uses include network-interface equipment, industrial imaging and control, test-and-measurement systems, storage controllers, communications infrastructure, and embedded signal-processing platforms. In each case, the FPGA can implement multiple time-critical functions in parallel, reducing reliance on separate programmable controllers or discrete logic devices. The primary design consideration is package-level complexity. A 676-ball FCBGA demands careful escape routing, dense via structures, controlled impedance, clean power delivery, and assembly process capability. Use the AMD package pinout files and board-design guidance to validate every ball assignment, voltage rail, decoupling network, and high-speed interface before fabrication. This product page consolidates the verified device identity, package, programmable-resource figures, compatible same-family ordering options, and practical implementation guidance. It helps engineers compare alternatives and plan a PCB without obscuring the essential distinction between a true pin-compatible option and a broader Kintex UltraScale+ equivalent.
XCKU3P-2FFVA676I - Kintex UltraScale+ FPGA | AMD BGA
The AMD XCKU3P-2FFVA676I is a Kintex UltraScale+ field-programmable gate array in a 676-ball BGA package, designed for systems requiring programmable logic, high-speed digital processing, and flexible hardware acceleration. The device contains 355,950 programmable logic cells and is identified as an industrial-grade FPGA with a -2 speed designation. Its 676-BBGA, FCBGA construction supports dense board-level integration without exposing fine-pitch leads. A field-programmable gate array is a semiconductor whose digital logic, interfaces, and processing blocks are configured after fabrication. The FPGA product hierarchy extends from programmable logic devices to FPGAs, programmable-logic ICs, and semiconductor devices. Within the Kintex UltraScale+ family, this device provides a high-capacity implementation platform for communications, industrial control, data processing, networking, and embedded systems where hardware parallelism can improve throughput and reduce external component count. The 355,950-cell configuration offers substantial logic capacity for designs that combine control logic, data pipelines, serial interfaces, and dedicated accelerator functions. The -2 ordering code denotes the device's speed grade, while the final I character identifies the industrial temperature option. Its BGA package provides a large number of electrical contacts compared with leaded packages, enabling extensive power, ground, configuration, and general-purpose I/O connections within a compact board footprint. Programmable-logic designs are typically created with FPGA development tools, compiled into a configuration bitstream, and loaded into the device through a supported configuration interface. The implementation must account for the BGA's dense ball pitch, power-grid connectivity, decoupling requirements, and high-speed routing constraints. Because configuration and I/O standards are system-dependent, board designers should use the AMD package pinout files and device documentation when assigning every ball and defining power planes. Typical uses include high-throughput signal processing, industrial automation, network-interface functions, test equipment, embedded control, and accelerator modules. The device is especially appropriate when parallel hardware architecture can outperform a sequential processor for repetitive filtering, protocol handling, or data movement. The -2 speed grade and industrial temperature marking make the part relevant to equipment expected to operate across extended industrial temperature conditions. A critical design consideration is that the 676-ball BGA cannot be treated as a simple two-row IC footprint. Follow the AMD package pinout files, provide continuous decoupling near the device, maintain the required power and ground ball assignments, and validate escape routing before fabrication. Signal-integrity and thermal performance depend on the completed stack-up, layer count, return paths, and power-delivery network rather than on the IC alone. This product page organizes the key electrical identity, package details, application guidance, design constraints, comparison information, and same-family migration options into a practical engineering reference. Use the manufacturer documentation for the authoritative pin assignment, complete electrical limits, configuration procedure, and design-support files before releasing a PCB or production design.
XCKU3P-2FFVB676E - Kintex UltraScale+ FPGA | AMD
AMD XCKU3P-2FFVB676E is a Kintex UltraScale+ field-programmable gate array (FPGA) supplied in a 676-ball FCBGA package. The catalog listing identifies the device as a programmable-logic IC with 280 I/O positions, making it suitable for systems that require substantial parallel connectivity, configurable processing blocks, and programmable digital logic. The “XCKU3P” ordering code places it in AMD’s Kintex UltraScale+ FPGA product family, while “-2” identifies the performance grade used in the part designation. An FPGA is a semiconductor whose digital behavior is configured after manufacture. The FPGA hierarchy begins with the individual configurable logic block, expands into an FPGA device, and ultimately belongs to the broader semiconductor and programmable-logic categories. This lets engineers implement parallel datapaths, protocol controllers, signal processing, control logic, and hardware accelerators without relying exclusively on a fixed-function processor. Configurable routing resources connect the selected logic, memory, input/output, clocking, and dedicated hard blocks. The principal catalog-level benefits of XCKU3P-2FFVB676E are its Kintex UltraScale+ family assignment, 280 I/O positions, -2 performance grade, and 676-ball FCBGA construction. The high pin count supports dense board-level integration and broad external connectivity, while the FPGA architecture permits a single physical device to consolidate functions that might otherwise require several programmable or fixed-function components. The exact logic-cell, DSP, memory, transceiver, power, and temperature limits should be confirmed in the applicable AMD family documentation for the selected device and package. The “P” designation in the ordering code should not be interpreted without the AMD ordering guide because its exact commercial meaning depends on the family documentation. Likewise, the “2” speed grade is a family-level ordering designation, not by itself a complete description of operating frequency or performance. Engineers should use the package pinout files, device datasheet, configuration guidance, and power-estimation workflow when preparing a board or selecting a replacement. Typical applications for this device include high-speed data acquisition, industrial control and automation, communications infrastructure, signal-processing systems, test and measurement equipment, and embedded accelerator platforms. In each case, the FPGA is configured to implement the required datapath and control functions, while the 280 I/O positions provide connections to external converters, memories, interfaces, clocks, and control signals. A critical design consideration is that the 676-ball FCBGA footprint requires a dense multilayer PCB with a carefully engineered power-delivery network, decoupling strategy, ball-assignment review, and thermal assessment. Before layout, verify every supply, ground, configuration, clock, and user I/O connection against the current AMD package pinout file rather than inferring connectivity from the commercial ordering code. This product page combines the exact catalog identity, package information, price-evidence rules, replacement analysis, and practical design guidance. It is intended to help engineers identify the correct AMD device, locate authoritative documentation, assess genuine drop-in options, and move from component selection into PCB implementation with fewer specification and compatibility risks.
XCKU3P-2FFVB676I - Kintex UltraScale+ FPGA | AMD
The AMD XCKU3P-2FFVB676I is a Kintex UltraScale+ field-programmable gate array in an FCBGA-676 package, combining 280 I/O with a -2 speed grade for performance-oriented programmable-logic designs. The device belongs to the Kintex UltraScale+ FPGA family and provides 162,720 configurable logic blocks in the device architecture, as reflected in the product listing data. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, signal processing, and I/O behavior can be configured after manufacture. FPGAs occupy the programmable-logic portion of the semiconductor hierarchy, combining large parallel processing resources with programmable interconnect. This makes them useful for demanding digital systems that benefit from hardware parallelism, deterministic interfaces, and field-updatable functionality. The most prominent catalog characteristics are the 280 I/O, the -2 performance grade, and the FCBGA-676 package. The Kintex UltraScale+ designation identifies a high-end AMD/Xilinx FPGA platform, while the KU3P device designation distinguishes the specific configuration within that platform. The -2 suffix selects a particular speed grade, allowing designers to match device timing expectations to a particular system-performance target. The FCBGA-676 package provides a dense, board-level mounting solution with hundreds of connection points. Because such packages contain many power, ground, signal, configuration, and differential I/O balls, the PCB must use a qualified footprint, controlled escape routing, and careful power-plane distribution. AMD also publishes UltraScale package pinout files in TXT and CSV formats, with the file format described in UG575. Typical applications include high-speed signal processing, industrial control, communications infrastructure, test and measurement, embedded vision, and acceleration functions requiring substantial parallel programmable logic. The large I/O count supports systems that need numerous parallel connections, while the Kintex UltraScale+ resource level is suited to consolidated control and datapath designs rather than simple low-complexity programmable logic. A key design consideration is that this is a high-pin-count BGA device requiring careful escape routing, layer planning, decoupling, and thermal management. Do not assign package balls solely from a catalog page; use the AMD UltraScale package pinout files and the device-specific documentation for every power, ground, configuration, and I/O connection before release. This page organizes the exact order code, package information, verified specifications, purchase and lead-time guidance, package-related constraints, and engineering selection considerations. It also distinguishes catalog-confirmed attributes from detailed electrical, timing, and pin-level information that must be established from the appropriate AMD documentation and the final system design.
XCKU3P-2FFVD900E - Kintex UltraScale+ FPGA | AMD
The AMD XCKU3P-2FFVD900E is a Kintex UltraScale+ field-programmable gate array built on a FinFET process, with 355,950 logic elements, 20,340 logic blocks, and 31,641,600 bits of block RAM. The device provides 304 user I/O and uses a 900-ball FCBGA package measuring 31 mm by 31 mm. Its specified core supply voltage is 0.825 V to 0.876 V. A field-programmable gate array, or FPGA, is a programmable digital semiconductor categorized within integrated circuits, semiconductors, and digital logic. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic, block RAM, programmable I/O, and dedicated interface resources on one device. This architecture allows engineers to implement parallel processing, control, networking, signal processing, and hardware acceleration while retaining the flexibility to update designs after manufacture. The Kintex UltraScale+ family combines programmable logic with high-speed connectivity resources. The XCKU3P-2FFVD900E offers 355,950 logic elements organized into 20,340 LAB/CLB blocks and 31,641,600 RAM bits for on-chip storage. Its 304 user I/O support high pin density for parallel interfaces and board-level connectivity. AMD identifies the -2 part as the middle performance option within the device-speed and temperature-grade system. The 900-FCBGA package provides dense access to logic and I/O resources but requires a carefully designed PCB. Power delivery, ground-plane continuity, decoupling, and high-speed signal routing are central implementation concerns because the package exposes hundreds of balls in a 31 mm by 31 mm area. Designers should use the manufacturer pinout files and device documentation when assigning every power, ground, configuration, clock, and user-I/O connection. Typical applications include high-throughput signal processing, network packet handling, industrial control, test and measurement, video infrastructure, and embedded edge processing. The 304 user I/O are useful for parallel data acquisition and external memory connectivity, while the large block-RAM capacity supports buffering, lookup tables, and local data storage. The device is especially relevant when deterministic parallel hardware is more valuable than software-only flexibility. For a new PCB, use the AMD package pinout files, recommended power architecture, and PCB-design guidance before committing the 900-ball land pattern. Confirm the selected board file, power rails, decoupling network, configuration interface, and thermal strategy against the exact -2FFVD900E device. Firmware, bitstream, and board-level constraints must also be checked before hardware production. This product summary combines the device's published logic, memory, I/O, package, and supply information with practical implementation guidance. It also distinguishes the verified same-package speed-grade alternative and highlights where a new design should use the manufacturer pinout and power-design files rather than relying on generic BGA conventions.
XCKU3P-2FFVD900I - 355,950 LEs Kintex UltraScale+ FPGA | AMD
AMD XCKU3P-2FFVD900I is a Kintex UltraScale+ field-programmable gate array with 355,950 logic cells, 12,960 Kb of block RAM, and 1,368 DSP slices in a 900-FCBGA package measuring 31 x 31 mm. The device uses the -2 speed grade and is specified for an industrial junction-temperature range of -40°C to 100°C. A field-programmable gate array, or FPGA, is a programmable semiconductor in which digital logic, interfaces, and parallel processing functions are configured through programmable bitstreams. FPGAs occupy the semiconductor hierarchy above fixed-function logic devices and provide hardware parallelism, reconfigurability, and deterministic real-time operation. The Kintex UltraScale+ family combines FPGA fabric with programmable logic, embedded memory, DSP resources, and high-speed serial connectivity for demanding signal-processing and data-center systems. The XCKU3P device provides 355,950 logic cells for implementing control logic, protocol bridges, packet processors, and parallel algorithms. Its 12,960 Kb of block RAM supports buffering, lookup tables, packet storage, and data-plane scratchpad requirements. The 1,368 DSP slices accelerate fixed-point and floating-point operations associated with filtering, modulation, error correction, and other digital signal-processing workloads. The listing identifies 304 I/O, while the FFVD900 package supports a high-density board layout that requires careful power, thermal, and signal-integrity engineering. The -2 designation identifies the device speed grade, allowing engineers to plan for the timing performance associated with this device within complete FPGA designs. The industrial temperature indication makes the part appropriate for equipment expected to operate across extended industrial temperature conditions, subject to the complete AMD device specifications and board-level thermal design. This device is programmed through the AMD adaptive-computing toolchain and requires a compatible FPGA configuration architecture, clocking, memory interface, and power-delivery system. Typical applications include high-throughput data processing, network packet handling, accelerator control, high-performance signal processing, video infrastructure, and communications equipment. The large logic and DSP resources allow multiple parallel pipelines to operate simultaneously, while block RAM reduces reliance on external memory for short-latency buffering. System clocking and power sequencing remain central because performance depends on the complete board and design implementation rather than on logic-cell counts alone. For a new design, place all power and ground connections directly under their assigned BGA balls, preserve the AMD reference-design layer stack, and keep high-speed routing short. Check junction temperature under the worst-case activity and ambient conditions, provide suitable power-decoupling networks, and validate signal integrity with the package and board models published for the FFVD900 device. Confirm bitstream compatibility and pin assignments in the current package files before releasing PCB artwork. This page combines the verified device specifications, source references, replacement analysis, comparison data, and practical integration guidance needed to evaluate the XCKU3P-2FFVD900I for industrial FPGA and adaptive-computing systems.
XCKU3P-2SFVB784E - Kintex UltraScale+ 304 I/O 784-BFBGA FPGA
The AMD XCKU3P-2SFVB784E is a Kintex UltraScale+ field-programmable gate array in a 784-BFBGA FCBGA package. It provides 304 I/O, approximately 31,641,600 logic cells, and approximately 355,950 LUTs. The -2 speed designation identifies the performance grade used in the AMD Xilinx ordering code, while the SFVB784E portion identifies the device and package configuration. A field-programmable gate array is a programmable digital integrated circuit. An FPGA belongs to the semiconductor and programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, embedded memory, dedicated arithmetic resources, and clocking and routing resources. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed for different algorithms, interfaces, and system architectures after manufacture. The Kintex UltraScale+ family is designed for high-performance programmable systems. In this part, the combination of 304 I/O and a large logic-resource count supports designs requiring substantial parallel processing, broad external connectivity, and high-speed data movement. The 784-BFBGA package provides a dense surface-mount implementation for complex systems rather than a simple discrete-package design. The 784-BFBGA format is intended for high-density PCB layouts. Its ball grid requires careful escape-routing, power-plane distribution, thermal management, and BGA assembly process control. Because the package contains a large programmable device, designers should plan decoupling, regulated supplies, clocking, configuration memory, and download or boot interfaces before finalizing the PCB. Typical uses include high-speed data acquisition, test and measurement, communications infrastructure, industrial control, video processing, and accelerator or prototyping systems. The FPGA's parallel architecture can accelerate workloads that benefit from configurable pipelines, parallel lanes, and hardware-constrained data paths. The exact performance of any such system depends on the selected clocking resources, memory interface implementation, I/O standards, and device configuration. For PCB implementation, use the AMD package pinout and mechanical files for the exact ordering code. Check all power, ground, configuration, clock, and I/O assignments against the manufacturer package documentation before fabrication. Treat the 784-BFBGA footprint as a high-density assembly design rather than a conventional two-row leaded package. This product page organizes the core device identity, package information, application guidance, replacement analysis, and engineering-oriented selection notes for engineers evaluating the XCKU3P-2SFVB784E.
XCKU3P-2SFVB784I - 304 I/O Kintex UltraScale+ FPGA | AMD
The AMD Xilinx XCKU3P-2SFVB784I is a Kintex UltraScale+ field-programmable gate array with 304 I/O, housed in a 784-FCBGA surface-mount package. The device is identified by the XCKU3P family designation, a -2 speed-grade suffix, the SFVB784 package code, and an industrial-temperature suffix I. Its core supply specification is 0.825 V to 0.876 V, and its operating junction-temperature specification is -40°C to 100°C. The device is intended for designs requiring parallel programmable logic, high-speed serial connectivity, embedded processing, and substantial general-purpose FPGA resources. A field-programmable gate array is a semiconductor whose digital functions are defined after manufacture by loading a configuration bitstream. FPGA devices occupy the practical space between fixed-function logic and application-specific integrated circuits. The Kintex UltraScale+ family uses programmable logic blocks, block RAM, DSP resources, high-speed transceivers, and dedicated input/output resources to implement parallel datapaths, control systems, protocol bridges, signal processing, and accelerator logic. The XCKU3P designation identifies a mid-density member of that architecture. The -2 suffix identifies the performance grade of this cataloged device. The SFVB784 designation identifies the 784-FCBGA package, which supports a high pin count for power delivery, configuration signals, user I/O, and high-speed interfaces. With 304 user I/O available, the device is particularly appropriate for systems that need substantial board-level connectivity rather than only a small control interface. Package assignment remains critical: the device must be treated as a complex BGA assembly requiring controlled assembly, inspection, and thermal design. The XCKU3P-2SFVB784I is suitable for industrial communications equipment, test and measurement systems, industrial automation, high-speed data acquisition, signal processing, embedded control, and network infrastructure. Its programmable architecture allows field updates and product differentiation without changing the PCB layout. Designers should balance logic utilization, transceiver requirements, power budgeting, pin assignment, and the thermal constraints of a large BGA package before finalizing the implementation. One important design consideration is that the specified 0.825 V to 0.876 V range is a core supply requirement rather than a complete power-supply specification. A complete board design must follow the AMD power, decoupling, configuration, and package guidelines for this device family. The operating junction-temperature range also requires thermal analysis that includes ambient conditions, board copper, heat sinks, airflow, and power dissipation from the configured design. This product record combines the exact catalog identity, package details, electrical limits, pinout-resource location, sourcing context, and engineering guidance into one reference. It also distinguishes genuine same-footprint alternatives from parts that may use a different package or device architecture, helping designers avoid an apparently similar MPN that cannot replace the target on an existing PCB.
XCKU5P-1FFVA676E - 256 I/O Kintex UltraScale+ | AMD
AMD XCKU5P-1FFVA676E is a Kintex UltraScale+ field-programmable gate array with 256 I/O, 41,984,000 catalog logic cells, 474,600 catalog logic registers, and a 676-ball FCBGA package. The -1 speed designation identifies the device performance grade, while the FFVA676E ordering code identifies the Kintex UltraScale+ family, package construction, and ordering configuration used by this part. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor in which digital logic, block memory, signal processing, and programmable I/O are organized into programmable architecture. Within the semiconductor hierarchy, an FPGA belongs to the programmable-logic device class and combines parallel programmable logic fabric with configurable peripherals. This makes the XCKU5P family suitable when design flexibility, parallel processing, high-speed interfaces, and deterministic hardware operation must coexist in one device. The XCKU5P-1FFVA676E provides 256 I/O in a 676-FCBGA package, giving a board designer access to a substantial pin count for external memory, high-speed serial links, clocks, data acquisition, control interfaces, and general-purpose digital logic. Its catalog figures of 41,984,000 logic cells and 474,600 logic registers describe the density of its programmable architecture, while the Kintex UltraScale+ platform provides resources for demanding parallel-processing and signal-processing designs. The FFVA676E device is associated with the AMD Kintex UltraScale+ product generation and supports an integrated combination of programmable logic and dedicated hardware resources. Designers can allocate logic for control paths, implement parallel algorithms in fabric, use dedicated resources for DSP-style arithmetic, and map high-speed interfaces according to the device architecture. Exact clock, transceiver, memory, power, and I/O standards should be confirmed against the current AMD data sheet before schematic signoff. Typical applications include high-throughput signal processing, industrial imaging, radar and communications infrastructure, test and measurement systems, data acquisition, network acceleration, and embedded control with substantial parallel logic. The 256-I/O count is particularly useful when a design needs substantial board-level connectivity while retaining a single-programmable-device implementation rather than combining an FPGA with multiple support devices. Board planning should prioritize the AMD UltraScale package pinout files, power-decoupling strategy, thermal management, and high-speed layout rules. A 676-FCBGA device normally requires multilayer PCB construction, controlled escape routing, and careful treatment of supply and ground planes. Use the package pinout files and the AMD device documentation when assigning balls, planning power rails, and validating every board-level connection. This product summary combines the exact catalog attributes for the XCKU5P-1FFVA676E with application guidance, package considerations, and clearly defined alternatives. It is intended to accelerate component identification and initial design planning while directing final electrical, thermal, timing, and compliance decisions to the current AMD documentation.
XCKU5P-1FFVB676E - 280-I/O Kintex UltraScale+ FPGA | AMD
The AMD Xilinx XCKU5P-1FFVB676E is a Kintex UltraScale+ field-programmable gate array built on FinFET process technology, with 474,600 logic cells, 280 I/O, 17,280 Kb of block RAM, and 1,824 DSP slices in a 676-pin FCBGA package measuring 27 x 27 mm. The -1 suffix identifies its speed grade, while the E suffix identifies the extended-temperature option. Its operating range is specified from 0°C to 100°C at the junction. A Kintex UltraScale+ FPGA is a programmable semiconductor used to implement digital control, data processing, signal processing, networking, and embedded systems. Within the FPGA hierarchy, it combines configurable logic blocks, block RAM, DSP resources, programmable I/O, dedicated clocking, and high-speed serial transceivers. This balance makes the device useful when designers need substantial parallel processing resources while retaining the flexibility of reconfigurable hardware. The XCKU5P-1FFVB676E provides 474,600 logic cells for control logic and complex digital pipelines, together with 1,824 DSP slices for filtering, modulation, correlation, fixed-point arithmetic, and other multiply-accumulate-intensive tasks. Its 17,280 Kb of block RAM provides on-chip storage for packet buffers, waveform data, lookup tables, and data-plane staging. The 280 I/O expand board connectivity without relying primarily on external serial links. The Kintex UltraScale+ architecture uses a FinFET implementation to combine high logic density with performance and power efficiency. Its device-specific configuration, bitstream, package pinout, and power characteristics must be handled as one design target rather than as interchangeable generic FPGA parameters. UltraScale+ package pinout resources and AMD product documentation should be used to verify each ball assignment, differential-pair polarity, supply requirement, and configuration connection before schematic or PCB signoff. Typical uses include industrial machine vision, high-throughput data acquisition, digital communications, radar and signal-processing front ends, network infrastructure, test equipment, and high-speed protocol bridges. The combination of DSP slices and block RAM makes the device suitable when algorithm behavior or system requirements may evolve faster than a fixed ASIC design cycle. Its 280 I/O also supports parallel sensors, converters, memory interfaces, and board-level control signals. Design planning should account for the 676-ball FCBGA footprint, multilayer PCB construction, controlled-impedance routing, separate power distribution, decoupling, thermal management, and configuration-signal handling. Differential and high-speed interfaces require trace-length matching and reference-plane continuity, while the 27 x 27 mm package demands careful escape routing from its dense ball array. Prototype platforms can reduce hardware risk before a production board is committed. This page combines the verified device identity, package and resource details with practical application guidance, same-package migration options, and engineering-focused design notes. The comparisons emphasize how speed grade, temperature grade, resource capacity, package, and qualification requirements affect replacement decisions rather than treating every Kintex UltraScale+ FPGA as interchangeable.