XCKU3P-2SFVB784I - 304 I/O Kintex UltraScale+ FPGA | AMD
MPN: XCKU3P-2SFVB784I ✓ NakahandaXCKU3P-2SFVB784I Ulas
A field-programmable gate array is a semiconductor whose digital functions are defined after manufacture by loading a configuration bitstream. FPGA devices occupy the practical space between fixed-function logic and application-specific integrated circuits. The Kintex UltraScale+ family uses programmable logic blocks, block RAM, DSP resources, high-speed transceivers, and dedicated input/output resources to implement parallel datapaths, control systems, protocol bridges, signal processing, and accelerator logic. The XCKU3P designation identifies a mid-density member of that architecture.
The -2 suffix identifies the performance grade of this cataloged device. The SFVB784 designation identifies the 784-FCBGA package, which supports a high pin count for power delivery, configuration signals, user I/O, and high-speed interfaces. With 304 user I/O available, the device is particularly appropriate for systems that need substantial board-level connectivity rather than only a small control interface. Package assignment remains critical: the device must be treated as a complex BGA assembly requiring controlled assembly, inspection, and thermal design.
The XCKU3P-2SFVB784I is suitable for industrial communications equipment, test and measurement systems, industrial automation, high-speed data acquisition, signal processing, embedded control, and network infrastructure. Its programmable architecture allows field updates and product differentiation without changing the PCB layout. Designers should balance logic utilization, transceiver requirements, power budgeting, pin assignment, and the thermal constraints of a large BGA package before finalizing the implementation.
One important design consideration is that the specified 0.825 V to 0.876 V range is a core supply requirement rather than a complete power-supply specification. A complete board design must follow the AMD power, decoupling, configuration, and package guidelines for this device family. The operating junction-temperature range also requires thermal analysis that includes ambient conditions, board copper, heat sinks, airflow, and power dissipation from the configured design.
This product record combines the exact catalog identity, package details, electrical limits, pinout-resource location, sourcing context, and engineering guidance into one reference. It also distinguishes genuine same-footprint alternatives from parts that may use a different package or device architecture, helping designers avoid an apparently similar MPN that cannot replace the target on an existing PCB.
Mga alternatibo na pwedeng ilagay na XCKU3P-2SFVB784I — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok XCKU3P-2SFVB784I (parehas na form factor at footprint) — pagkakaiba sa Temperature Grade, Package, Package Type, Speed Grade, User I/O.
XCKU3P-L1SFVB784I
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
XCKU3P-L2SFVB784E
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
XCKU035-L1SFVA784I
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
XCKU5P-2SFVB784I
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
XCKU3P-2SFVB784I Mga Pinakamataas na Rating at Electrical Characteristics
| Device Type | Kintex UltraScale+ FPGA |
| Manufacturer | AMD / Xilinx |
| User I/O | 304 I/O |
| Logic Resources | 31641600 |
| DSP Resources | 355950 |
| Core Supply Voltage | 0.825 V to 0.876 V |
| Temperature ng Junction na Operasyon | -40°C to 100°C |
| Packhaging | 784-FCBGA |
| Package Dimensions | 23 x 23 mm |
| Uri ng Pagpapasok | Surface Mount |
| Speed Grade | -2 |
| Temperature Grade | I |
| Product Family | Kintex UltraScale+ |
| Programmable Device Type | FPGA |
Gabay sa Pin Configuration ng XCKU3P-2SFVB784I 23 x 23 mm
Pin configuration para sa XCKU3P-2SFVB784I (23 x 23 mm package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa XCKU3P-2SFVB784I.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
XCKU3P-2SFVB784I ay nararapat para sa 6 aplikasyons: Industrial Automation and Control, Test and Measurement Systems, High-Speed Data Acquisition, Network and Communications Equipment, Video and Image Processing, Embedded Control and DSP Acceleration.
Industrial Automation and Control
The AMD XCKU3P-2SFVB784I fits industrial automation systems that combine deterministic parallel control, communications, and programmable signal handling. Its 304 user I/O provides substantial connectivity for sensor inputs, actuator outputs, fieldbus interfaces, and machine-control logic, while the Kintex UltraScale+ architecture supports reconfigurable control paths. The -40°C to 100°C operating junction-temperature range supports industrial environmental goals, although the complete assembly still requires system-level qualification. Engineers should allocate pins through the SFVB784 package data, budget the 0.825 V to 0.876 V core supply, and verify timing under the configured operating frequency. This device is particularly appropriate when field updates, parallel accelerator logic, and high I/O density matter more than the power efficiency of a smaller programmable device.
Inirekomenda
Test and Measurement Systems
The XCKU3P-2SFVB784I is well suited to programmable test and measurement equipment that requires many acquisition and control connections plus flexible digital logic. Its 304 user I/O can support instruments, trigger systems, interface converters, and timing-control logic around a central FPGA fabric. The listed 355950 DSP resources are useful when instrumentation algorithms need parallel filtering, modulation, correlation, or signal transformation. Designers can organize the design into acquisition, processing, and output stages, then use AMD timing analysis to close each stage. Board implementation must pay close attention to 784-FCBGA assembly, power sequencing, and thermal margins. Compared with a fixed instrument controller, the FPGA permits reusable hardware across multiple test platforms and enables field-upgradeable measurement algorithms without redesigning the PCB.
Inirekomenda
High-Speed Data Acquisition
The AMD XCKU3P-2SFVB784I can form the core of a parallel or mixed-signal data-acquisition platform because it combines 304 user I/O with programmable logic and DSP resources. The SFVB784 package offers extensive external connectivity for multiple converters, clocks, triggers, and data lanes, while the 31641600 listed logic-resource value supports buffering, packetization, and real-time control. A practical design can use parallel ADC outputs for initial capture, block RAM for staging, and DSP pipelines for filtering or decimation. Engineers should use the official package pinout to distinguish user pins from power and configuration balls, and they should validate every high-speed interface against target trace lengths and device timing. The principal trade-off is the complexity of a large BGA assembly and its power requirements compared with a smaller FPGA.
Inirekomenda
Network and Communications Equipment
The XCKU3P-2SFVB784I supports network and communications equipment that needs configurable packet handling, protocol conversion, and extensive board-level I/O. Programmable logic can implement bridging, framing, traffic classification, and interface adaptation, while the listed DSP resources support datapath operations. The 304 user I/O are useful for multiple standard interfaces, status signals, and control paths around high-speed communication cores. A sound design partitions the FPGA into serial or parallel interface logic, shared buffering, and system control, with each boundary reviewed through AMD implementation reports. Power and thermal analysis should reflect actual utilization rather than a worst-case assumption across every resource. For networking products, the device is advantageous when software-defined behavior and field updates are important; it is less attractive when a small fixed controller would meet the system requirements.
Inirekomenda
Video and Image Processing
The AMD XCKU3P-2SFVB784I is applicable to video and image-processing systems requiring parallel pixel transport, programmable filtering, and real-time control. Its 304 user I/O can accommodate video interfaces, synchronization signals, memory-control paths, and auxiliary digital connections, while the listed 355950 DSP resources support multiplication, correlation, and other parallel arithmetic. Designers can implement line buffers, color conversion, scaling, or feature extraction and use clocking resources to maintain deterministic throughput. The architecture is useful where product behavior must change through firmware or bitstream updates, reducing the need for a new ASIC or fixed-function board. Implementation must account for memory bandwidth, external memory timing, and BGA power integrity. The device is best chosen when programmable throughput and I/O density outweigh the board complexity associated with a 23 x 23 mm FCBGA.
Inirekomenda
Embedded Control and DSP Acceleration
The XCKU3P-2SFVB784I can combine embedded control functions with dedicated DSP acceleration in industrial or embedded products. The Kintex UltraScale+ fabric supports state machines, control loops, and communication protocols, while the listed DSP-resource count allows parallel arithmetic to be added without relying only on a soft processor. Engineers can divide a design into real-time control, high-throughput math, and external I/O, then connect them through dedicated internal resources. The 304 user I/O provide flexibility for mixed sensor, actuator, and communication requirements. Timing closure should focus on the critical control and accelerator paths, while power budgeting should reflect actual switching activity. This combination is attractive for adaptive machines, condition-monitoring products, and custom signal processors because the FPGA permits functional updates without changing the hardware platform.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for XCKU3P-2SFVB784I — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | XCKU3P-L1SFVB784I | XCKU3P-L2SFVB784E | XCKU035-L1SFVA784I | XCKU5P-2SFVB784I |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 784-FCBGA (SFVB784) | 784-FCBGA (SFVB784) | 784-FCBGA (SFVB784) | 784-FCBGA (SFVA784) | 784-FCBGA (SFVB784) |
| Device Family | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU035 | Kintex UltraScale+ XCKU5P |
| Speed Designator | -2 | -L1 | -L2 | -L1 | -2 |
Pangunahing mga Pagkakaiba
- Exact -2 performance-grade ordering option (kumpara saXCKU3P-L1SFVB784I)
- Industrial-temperature junction specification (kumpara saXCKU3P-L2SFVB784E)
- Lower I/O count than the larger XCKU035 candidate (kumpara saXCKU035-L1SFVA784I)
- XCKU3P resource configuration with matching SFVB784 package (kumpara saXCKU5P-2SFVB784I)
Talaan ng Disenyo
Treat the 0.825 V to 0.876 V range as the specified core-supply window, not as a complete board rail specification. Follow the AMD Kintex UltraScale+ power guide for auxiliary supplies, sequencing, ramp control, decoupling, and configuration behavior. Place required decoupling capacitors according to the official power-document layout rather than relying on generic BGA practice, because high-current core and I/O transitions can create local voltage disturbance.
Calculate power dissipation from the actual implemented design and verify that the worst-case junction temperature remains below 100°C. Include FPGA core power, I/O power, configuration activity, memory and transceiver activity, plus the thermal contribution from the PCB. The 23 x 23 mm 784-FCBGA can conduct heat through a substantial BGA area, but enclosure temperature, airflow, copper layers, and adjacent heat sources determine the final margin.
Use the SFVB784 package drawing and official AMD pinout files to define every BGA ball, including dedicated power, ground, configuration, and user I/O positions. Provide dense, low-impedance power planes through the package and route high-speed interfaces with controlled length and reference planes. Plan X-ray inspection and adequate assembly process controls because a 784-BGA with fine-pitch connections is sensitive to solder volume, warpage, and assembly cleanliness.
Do not approve a substitute solely because the package has the same ball count. Confirm the exact package code, speed grade, temperature grade, electrical limits, configuration interface, and timing margin. XCKU3P-L1SFVB784I is package-matched but uses a different speed designation, while XCKU035-L1SFVA784I has a different SFVA package code and a different I/O count. Each change requires bitstream, timing, and board-level verification.
Impormasyon ng Pagsunod sa Kautusan
No explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations were identified for this exact MPN. Industrial-grade ordering and AEC-Q100 status must not be inferred from the I suffix.
