10AS032H1F34E1HG vs 10AS032H3F34E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032H1F34E1HG sa pamamagitan ng Intel at 10AS032H3F34E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AS032H1F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel (Altera)
10AS032H1F34E1HG ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | 10AS032H1F34E1HG | 10AS032H3F34E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | Arria 10 SX | — |
| Architecture | 20nm SoC FPGA (FPGA + hard ARM Cortex-A9 subsystem) | — |
| Logic Elements | 320,000 | 320,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz | — |
| On-chip Memory | Approx. 21 Mb (M20K blocks) | — |
| Transceivers | Up to 24 channels, up to 17.4 Gbps | [DATA_NEEDED: transceiver count and rate] |
| DSP Blocks | Variable-precision hardened DSP with floating-point | [DATA_NEEDED: DSP block count] |
| Hard Memory Controllers | DDR4 up to 2133 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Packhaging | 1152-ball FCBGA (35 x 35 mm) | — |
| Operating Temperature (E1 suffix) | 0C to +100C (extended) | — |
| Uri ng Pagpapasok | Surface Mount, flip-chip BGA | Surface Mount (Flip-Chip BGA) |
| Tindminan RoHS | Compliant | Compliant (lead-free) |
| Pin/Ball Count | 1152 | 1152 |
| Family | — | Arria 10 SX SoC FPGA |
| Processor Clock | — | Up to 1.5 GHz |
| Speed Grade | — | H3 |
| Package Code | — | F34 (FCBGA) |
| Package Size | — | 35 x 35 mm |
| Temperature Grade | — | E2 (Industrial) |
| Process Node | — | 20 nm |
| Memory Interface | — | DDR3 / DDR4 with hard controllers |
| Katayuan ng Lifecycle | — | Active |