10AS032H2F34I1HG vs 10AS032H2F34E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032H2F34I1HG sa pamamagitan ng Intel at 10AS032H2F34E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AS032H2F34I1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel
10AS032H2F34I1HG ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | 10AS032H2F34I1HG | 10AS032H2F34E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 SX | Arria 10 SX |
| Logic Elements | 320K | 320,000 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Hard Processor Frequency | 1.5 GHz | — |
| Process Technology | TSMC 20 nm | — |
| Packhaging | 1152-BBGA, FCBGA (35x35 mm) | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| Device Family Member | 10AS032 | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| PCIe Hard IP | [DATA_NEEDED: PCIe Gen3 hard IP count] | — |
| DSP Blocks | [DATA_NEEDED: variable-precision DSP block count] | Variable-precision, IEEE 754 single-precision FP support |
| On-chip Memory | [DATA_NEEDED: M20K block RAM total bits] | — |
| Memory Controller | Hard DDR3/DDR4 controller (HPS) | — |
| Temperature na Operasyon | Industrial -40C to +100C | — |
| Speed Grade | 2 (mid-speed) | 2 |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Device Tier | — | 10AS032 (mid-density) |
| Configuration | — | SoC FPGA (HPS + FPGA fabric) |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | — | 1.5 GHz |
| Temperature Grade | — | E2 (commercial/extended) |
| On-chip Memory (M20K blocks) | — | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] |
| Transceivers | — | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] |
| Memory Controller Hard IP | — | DDR4, DDR3, QDRII+, RLDRAM3 |
| Process Node | — | 20 nm |
| Tindminan RoHS | — | Compliant |
| Form of Terminal | — | Ball (BGA) |
| Terminal Pitch | — | 1 mm |