10AS032H3F34E2LG vs 10AS032H3F34I2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032H3F34E2LG sa pamamagitan ng Intel at 10AS032H3F34I2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AS032H3F34E2LG | 10AS032H3F34I2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Clock | Up to 1.5 GHz | — |
| Speed Grade | H3 | 2 |
| Package Code | F34 (FCBGA) | BGA |
| Pin/Ball Count | 1152 | 1152 |
| Package Size | 35 x 35 mm | — |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Temperature Grade | E2 (Industrial) | — |
| Process Node | 20 nm | 20 nm (Arria 10 generation) |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | [DATA_NEEDED: transceiver count and rate] | — |
| Memory Interface | DDR3 / DDR4 with hard controllers | — |
| Tindminan RoHS | Compliant (lead-free) | — |
| Katayuan ng Lifecycle | Active | — |
| Maximum HPS Clock Frequency | — | 1.5 GHz |
| Packhaging | — | 1152-FBGA, FC (35x35 mm) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Operating Temperature Grade | — | Industrial |
| Temperature Range | — | -40C to +100C (junction, per industrial grade) |
| Device Designator | — | 10AS032H3F34I2LG |
| Lead-Free / RoHS | — | Yes (LG suffix) |
| Packaging Form | — | Tray (LG suffix) |