10AS032H3F34I2LG vs 10AS032H3F34E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032H3F34I2LG sa pamamagitan ng Intel at 10AS032H3F34E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AS032H3F34I2LG | 10AS032H3F34E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 1.5 GHz | — |
| Packhaging | 1152-FBGA, FC (35x35 mm) | — |
| Pin/Ball Count | 1152 | 1152 |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Terminal Form | Ball | — |
| Package Code | BGA | F34 (FCBGA) |
| Package Shape | Square | — |
| Operating Temperature Grade | Industrial | — |
| Temperature Range | -40C to +100C (junction, per industrial grade) | — |
| Process Node | 20 nm (Arria 10 generation) | 20 nm |
| Device Designator | 10AS032H3F34I2LG | — |
| Speed Grade | 2 | H3 |
| Lead-Free / RoHS | Yes (LG suffix) | — |
| Packaging Form | Tray (LG suffix) | — |
| Processor Clock | — | Up to 1.5 GHz |
| Package Size | — | 35 x 35 mm |
| Temperature Grade | — | E2 (Industrial) |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | [DATA_NEEDED: transceiver count and rate] |
| Memory Interface | — | DDR3 / DDR4 with hard controllers |
| Tindminan RoHS | — | Compliant (lead-free) |
| Katayuan ng Lifecycle | — | Active |