10AS032H3F34I2LG vs 10AS032H4F34I3SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032H3F34I2LG sa pamamagitan ng Intel at 10AS032H4F34I3SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AS032H3F34I2LG | 10AS032H4F34I3SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 | 320000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 1.5 GHz | — |
| Packhaging | 1152-FBGA, FC (35x35 mm) | FCBGA-1152 (F34, 35 x 35 mm) |
| Pin/Ball Count | 1152 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA ball grid) |
| Terminal Form | Ball | — |
| Package Code | BGA | F34 |
| Package Shape | Square | — |
| Operating Temperature Grade | Industrial | — |
| Temperature Range | -40C to +100C (junction, per industrial grade) | — |
| Process Node | 20 nm (Arria 10 generation) | — |
| Device Designator | 10AS032H3F34I2LG | — |
| Speed Grade | 2 | H4 |
| Lead-Free / RoHS | Yes (LG suffix) | — |
| Packaging Form | Tray (LG suffix) | — |
| HPS Maximum Frequency | — | 1.5 GHz |
| Process Technology | — | 20 nm |
| Core Voltage | — | 0.9 V |
| Bilang ng Pin | — | 1152 |
| Temperature Grade | — | Industrial (I) |
| Tindminan RoHS | — | Compliant |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory Mbits] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count and rate] |
| PCIe Hard IP | — | [DATA_NEEDED: PCIe hard IP generation/lane count] |