10AS048E3F29I2LG vs 10AS048E1F29I1HG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS048E3F29I2LG sa pamamagitan ng Intel at 10AS048E1F29I1HG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AS048E3F29I2LG - Arria 10 SX SoC FPGA, 480K LE, Dual A9, 780-FBGA | Intel
10AS048E3F29I2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AS048E3F29I2LG | 10AS048E1F29I1HG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 480000 | 480,000 |
| Process Technology | 20 nm (TSMC) | — |
| Core Voltage | 0.9 V | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS CPU Frequency | 1.5 GHz | — |
| Packhaging | 780-FBGA, FC (29x29 mm) | 780-ball FCBGA, 29x29 mm |
| Package Code | F29 | BGA |
| Speed Grade | 3 | — |
| Temperature Grade | Industrial (-40C to +100C TJ) | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount (Flip-Chip BGA) |
| Hanay ng Temperature na Operasyon | -40C to +100C | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| HPS Clock Frequency | — | Up to 1.5 GHz |
| Process Node | — | 20 nm |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Number of Terminals | — | 780 |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |