10AS057K2F35E1HG vs 10AS057K2F35I1HG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS057K2F35E1HG sa pamamagitan ng Intel at 10AS057K2F35I1HG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AS057K2F35E1HG - Arria 10 SX SoC FPGA, 570K LE, 1152-FBGA | Intel
10AS057K2F35E1HG ✓ NakahandaIntel
10AS057K2F35I1HG - Arria 10 SX SoC FPGA, 570K LE, 1152-FCBGA | Intel
10AS057K2F35I1HG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AS057K2F35E1HG | 10AS057K2F35I1HG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 SX | — |
| Logic Elements | 570,000 | 570K |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 29.4 Mbits (M20K + MLAB) | M20K blocks |
| DSP Blocks (18x19 Multipliers) | 1,566 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| Transceivers | 24 (up to 17.4 Gbps) | [DATA_NEEDED: transceiver count and data rate] |
| PCIe Hard IP | Gen2/Gen3 x8 | PCI Express Gen3 |
| Memory Interfaces (FPGA side) | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 | — |
| Memory Interfaces (HPS side) | DDR4, DDR3, LPDDR3 | — |
| Packhaging | 1152-ball FC-BGA (F35), 35x35 mm | 1152-FBGA, FC (35x35 mm) |
| Process Technology | 20 nm TSMC | — |
| Operating Temperature Grade | Industrial | — |
| Tindminan RoHS | Compliant | Compliant |
| Supply Voltage (Core) | [DATA_NEEDED: Vcore] | — |
| Device Family | — | Arria 10 SX SoC FPGA |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Fabric Frequency | — | 1.5 GHz |
| User I/O Count | — | 396 |
| Speed Grade | — | K2 (mid) |
| Temperature Grade | — | Industrial (I1: -40C to +100C) |
| Uri ng Pagpapasok | — | Surface Mount (Flip-Chip BGA) |
| Process Node | — | 20 nm |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Hard Memory Controllers | — | DDR4 with hard PHY |
| Lead-Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |