10AS066K4F35I3LG vs 10AS066K4F35E3SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS066K4F35I3LG sa pamamagitan ng Intel at 10AS066K4F35E3SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AS066K4F35E3SG - Arria 10 SX SoC FPGA, 660K LE, 1152-FBGA | Intel
10AS066K4F35E3SG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AS066K4F35I3LG | 10AS066K4F35E3SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria 10 SX SoC FPGA | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 660,000 | 660,000 |
| Maximum Logic Speed | 1.5 GHz | — |
| Packhaging | 1152-FBGA, FC (35x35 mm) | 1152-ball FCBGA, 35x35 mm |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) (I3 suffix) | Industrial / extended (per ordering code E3) |
| Process Node | 20 nm (Intel) | — |
| Device Family | Arria 10 SX | — |
| Number of Terminals | 1152 | — |
| Package Code | BGA, FC (Flip-Chip) | — |
| Package Shape | Square, 35x35 mm | — |
| Supply Voltage (core) | [DATA_NEEDED: VCCINT] | — |
| DSP Blocks | [DATA_NEEDED: DSP count] | — |
| Transceivers | [DATA_NEEDED: transceiver count and rate] | — |
| Embedded Memory | [DATA_NEEDED: M20K block count and total bits] | — |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | Arria 10 SX SoC FPGA |
| Process Technology | — | 20 nm |
| Core Voltage | — | 0.9 V |
| Pin/Ball Count | — | 1152 |
| RAM Size (HPS) | — | 256 KB |
| Peripherals | — | DMA, POR, WDT |
| Connectivity | — | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART |
| Architecture | — | MCU + FPGA |
| Katayuan ng Lifecycle | — | Active |