10AX090N2F45E2LG vs 10AX090N2F45I2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090N2F45E2LG sa pamamagitan ng Intel at 10AX090N2F45I2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090N2F45E2LG | 10AX090N2F45I2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| User I/O Pins | 768 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Process Technology | 20 nm | 20 nm |
| Packhaging | 1932-ball FCBGA (FBGA) | 1932-BBGA, F45 (FCBGA flip-chip) |
| Package Type | Flip-Chip BGA, surface mount | — |
| Operating Temperature Grade | Enhanced (E2) | — |
| Lead-Free / RoHS | Yes (per part suffix LG) | — |
| Configuration Memory | SRAM-based, volatile (external flash required) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Katayuan ng Lifecycle | Active | — |
| Product Type | — | FPGA (Field Programmable Gate Array) |
| Embedded Memory (Bits) | — | 59,234,104 |
| User I/Os | — | 768 |
| Number of LABs/CLBs | — | 33750 |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Speed Grade | — | -2 |
| Configuration Method | — | JTAG / Serial / Parallel flash |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| GTX/Transceivers | — | [DATA_NEEDED: transceiver count per device variant] |
| Tindminan RoHS | — | Compliant |
| Lead-Free | — | Yes |