10AX090R2F40I2SG vs 10AX090R2F40E1SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090R2F40I2SG sa pamamagitan ng Intel at 10AX090R2F40E1SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090R2F40I2SG | 10AX090R2F40E1SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LEs) | 900,000 | — |
| Embedded Memory (bits) | 59,234,304 | — |
| Adaptive Logic Modules (ALMs) | 342,000 | — |
| DSP Blocks | 1,518 | [DATA_NEEDED: variable-precision DSP count] |
| 18x19 Multipliers | 3,748 | — |
| Transceiver Count | 24 (28.05 Gbps) | [DATA_NEEDED: GX transceiver count] |
| Maximum User I/O | 342 | — |
| Packhaging | 1517-BBGA, FCBGA (40x40 mm) | 1517-ball FCBGA (F40), 40 x 40 mm |
| Core Voltage | 0.87 V to 0.98 V | 0.9 V |
| Temperature na Operasyon | -40C to +100C (TJ) | — |
| Temperature Grade | Industrial | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Node | TSMC 20 nm | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 900,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Bits | — | 59,234,304 |
| User I/O Count | — | 342 |
| Max Transceiver Data Rate | — | 28.3 Gbps |
| Hard Memory Controllers | — | Yes |
| Hard PCIe Gen3 IP | — | Yes (x8) |
| Hard 100G Ethernet MAC | — | Yes |
| Process Technology | — | 20 nm |
| Operating Temperature Grade | — | Enhanced (E1) |
| Lead-Free | — | Yes |