10AX090R2F40I2SG vs 10AX090R2F40I1SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090R2F40I2SG sa pamamagitan ng Intel at 10AX090R2F40I1SG sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090R2F40I2SG | 10AX090R2F40I1SG |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LEs) | 900,000 | — |
| Embedded Memory (bits) | 59,234,304 | — |
| Adaptive Logic Modules (ALMs) | 342,000 | — |
| DSP Blocks | 1,518 | [DATA_NEEDED: variable-precision DSP block count] |
| 18x19 Multipliers | 3,748 | — |
| Transceiver Count | 24 (28.05 Gbps) | — |
| Maximum User I/O | 342 | — |
| Packhaging | 1517-BBGA, FCBGA (40x40 mm) | 1517-ball FCBGA (F40) |
| Core Voltage | 0.87 V to 0.98 V | — |
| Temperature na Operasyon | -40C to +100C (TJ) | — |
| Temperature Grade | Industrial | Industrial (-40 °C to +100 °C) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA, reflow) |
| Process Node | TSMC 20 nm | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 900,000 |
| Embedded Memory Bits | — | 59,234,304 |
| User I/Os | — | 342 |
| Transceivers | — | [DATA_NEEDED: transceiver count and max data rate] |
| Process Technology | — | 20 nm TSMC |
| Package Size | — | 40 mm × 40 mm |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | 2 (mid-tier) |
| Configuration | — | AES-256 / SHA-256 encrypted bitstream support |
| Memory Controller Hard IP | — | DDR4, DDR3, LPDDR3, QDR IV |
| PCIe Hard IP | — | PCI Express Gen3 x8 |
| Level ng MSL | — | MSL3 (JEDEC J-STD-020) |